CN111303782A - Packaging adhesive film for photovoltaic module and preparation method thereof - Google Patents
Packaging adhesive film for photovoltaic module and preparation method thereof Download PDFInfo
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- CN111303782A CN111303782A CN202010291118.XA CN202010291118A CN111303782A CN 111303782 A CN111303782 A CN 111303782A CN 202010291118 A CN202010291118 A CN 202010291118A CN 111303782 A CN111303782 A CN 111303782A
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- Prior art keywords
- adhesive film
- film layer
- photovoltaic module
- layer
- film
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- 239000002313 adhesive film Substances 0.000 title claims abstract description 222
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 44
- 238000002360 preparation method Methods 0.000 title claims abstract description 11
- 238000002310 reflectometry Methods 0.000 claims abstract description 25
- 239000002994 raw material Substances 0.000 claims abstract description 20
- 238000004132 cross linking Methods 0.000 claims abstract description 17
- 238000002156 mixing Methods 0.000 claims abstract description 11
- 238000005096 rolling process Methods 0.000 claims abstract description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 27
- 239000000945 filler Substances 0.000 claims description 14
- 239000004408 titanium dioxide Substances 0.000 claims description 13
- 239000008393 encapsulating agent Substances 0.000 claims description 9
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 8
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 8
- 239000011159 matrix material Substances 0.000 claims description 7
- 239000011521 glass Substances 0.000 claims description 6
- 239000011324 bead Substances 0.000 claims description 4
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 4
- 239000010456 wollastonite Substances 0.000 claims description 4
- 229910052882 wollastonite Inorganic materials 0.000 claims description 4
- 239000010445 mica Substances 0.000 claims description 3
- 229910052618 mica group Inorganic materials 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims description 3
- 239000005083 Zinc sulfide Substances 0.000 claims description 2
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 2
- 239000002131 composite material Substances 0.000 claims description 2
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims description 2
- 239000000347 magnesium hydroxide Substances 0.000 claims description 2
- 229910001862 magnesium hydroxide Inorganic materials 0.000 claims description 2
- 229920006280 packaging film Polymers 0.000 claims description 2
- 239000012785 packaging film Substances 0.000 claims description 2
- 239000002245 particle Substances 0.000 claims description 2
- 229910052984 zinc sulfide Inorganic materials 0.000 claims description 2
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 claims description 2
- 239000000454 talc Substances 0.000 claims 1
- 229910052623 talc Inorganic materials 0.000 claims 1
- 239000000203 mixture Substances 0.000 abstract description 12
- 238000000034 method Methods 0.000 abstract description 7
- 239000003431 cross linking reagent Substances 0.000 description 23
- 238000001125 extrusion Methods 0.000 description 20
- 239000000463 material Substances 0.000 description 16
- 230000005855 radiation Effects 0.000 description 15
- 150000001412 amines Chemical class 0.000 description 12
- 239000004611 light stabiliser Substances 0.000 description 12
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 12
- 239000005038 ethylene vinyl acetate Substances 0.000 description 11
- 229940116351 sebacate Drugs 0.000 description 11
- 235000010215 titanium dioxide Nutrition 0.000 description 11
- KDGNCLDCOVTOCS-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy propan-2-yl carbonate Chemical compound CC(C)OC(=O)OOC(C)(C)C KDGNCLDCOVTOCS-UHFFFAOYSA-N 0.000 description 10
- 239000011342 resin composition Substances 0.000 description 10
- CXMXRPHRNRROMY-UHFFFAOYSA-L sebacate(2-) Chemical compound [O-]C(=O)CCCCCCCCC([O-])=O CXMXRPHRNRROMY-UHFFFAOYSA-L 0.000 description 9
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 description 7
- SFDGJDBLYNJMFI-UHFFFAOYSA-N 3,1-benzoxazin-4-one Chemical compound C1=CC=C2C(=O)OC=NC2=C1 SFDGJDBLYNJMFI-UHFFFAOYSA-N 0.000 description 7
- 229920001577 copolymer Polymers 0.000 description 7
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 6
- 238000001816 cooling Methods 0.000 description 6
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 5
- 239000002250 absorbent Substances 0.000 description 4
- 230000002745 absorbent Effects 0.000 description 4
- 239000012752 auxiliary agent Substances 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 4
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 4
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- -1 polyethylenes Polymers 0.000 description 3
- 238000010248 power generation Methods 0.000 description 3
- DMWVYCCGCQPJEA-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)-2,5-dimethylhexane Chemical compound CC(C)(C)OOC(C)(C)CCC(C)(C)OOC(C)(C)C DMWVYCCGCQPJEA-UHFFFAOYSA-N 0.000 description 2
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 2
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 2
- 239000004595 color masterbatch Substances 0.000 description 2
- 238000007334 copolymerization reaction Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- WOXXJEVNDJOOLV-UHFFFAOYSA-N ethenyl-tris(2-methoxyethoxy)silane Chemical compound COCCO[Si](OCCOC)(OCCOC)C=C WOXXJEVNDJOOLV-UHFFFAOYSA-N 0.000 description 2
- 229920006225 ethylene-methyl acrylate Polymers 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 239000003999 initiator Substances 0.000 description 2
- 229920001684 low density polyethylene Polymers 0.000 description 2
- 239000004702 low-density polyethylene Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 229920010126 Linear Low Density Polyethylene (LLDPE) Polymers 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 244000028419 Styrax benzoin Species 0.000 description 1
- 235000000126 Styrax benzoin Nutrition 0.000 description 1
- 235000008411 Sumatra benzointree Nutrition 0.000 description 1
- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 description 1
- CSCPPACGZOOCGX-UHFFFAOYSA-N acetone Substances CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 1
- 239000002318 adhesion promoter Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 229960002130 benzoin Drugs 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- MBGQQKKTDDNCSG-UHFFFAOYSA-N ethenyl-diethoxy-methylsilane Chemical compound CCO[Si](C)(C=C)OCC MBGQQKKTDDNCSG-UHFFFAOYSA-N 0.000 description 1
- 229920005680 ethylene-methyl methacrylate copolymer Polymers 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 235000019382 gum benzoic Nutrition 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 125000002816 methylsulfanyl group Chemical group [H]C([H])([H])S[*] 0.000 description 1
- 239000012768 molten material Substances 0.000 description 1
- 125000004573 morpholin-4-yl group Chemical group N1(CCOCC1)* 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/04—Homopolymers or copolymers of ethene
- C09J123/06—Polyethene
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/04—Homopolymers or copolymers of ethene
- C09J123/08—Copolymers of ethene
- C09J123/0807—Copolymers of ethene with unsaturated hydrocarbons only containing more than three carbon atoms
- C09J123/0815—Copolymers of ethene with aliphatic 1-olefins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/04—Homopolymers or copolymers of ethene
- C09J123/08—Copolymers of ethene
- C09J123/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
- C09J123/0853—Vinylacetate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/04—Homopolymers or copolymers of ethene
- C09J123/08—Copolymers of ethene
- C09J123/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
- C09J123/0869—Acids or derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/054—Optical elements directly associated or integrated with the PV cell, e.g. light-reflecting means or light-concentrating means
- H01L31/0547—Optical elements directly associated or integrated with the PV cell, e.g. light-reflecting means or light-concentrating means comprising light concentrating means of the reflecting type, e.g. parabolic mirrors, concentrators using total internal reflection
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2237—Oxides; Hydroxides of metals of titanium
- C08K2003/2241—Titanium dioxide
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
- C08K2003/265—Calcium, strontium or barium carbonate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/322—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of solar panels
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/52—PV systems with concentrators
Abstract
The invention discloses a packaging adhesive film for a photovoltaic module and a preparation method thereof. The packaging adhesive film for the photovoltaic module at least comprises two adhesive film layers, wherein the adhesive film layer with the highest reflectivity in each adhesive film layer is arranged close to a cell, and the reflectivity of the adhesive film layer with the highest reflectivity to light with the wavelength range of 400nm-1100nm is larger than or equal to 90%. The packaging adhesive film for the photovoltaic module is prepared by the following method: uniformly mixing the raw materials of each layer of the packaging adhesive film for the photovoltaic module, adding the raw materials into different extruders, injecting the mixture into the same die head, extruding the mixture by a T die head, rolling and pre-crosslinking. The photovoltaic packaging adhesive film has a multilayer structure, can solve the problems of low reflection efficiency, high cost and the like, and is simple and efficient in preparation process.
Description
Technical Field
The invention belongs to the technical field of photovoltaic modules, and particularly relates to a packaging adhesive film for a photovoltaic module and a preparation method thereof.
Background
Photovoltaic power generation is more and more popular due to the characteristics of cleanness, environmental protection, reproducibility and the like, and is rapidly developed in recent years. The encapsulant film used for the photovoltaic module has an important influence on the performance and service life of the photovoltaic module.
The most common solar photovoltaic module structure at present is glass/packaging adhesive film/battery piece/packaging adhesive film/glass, in the above photovoltaic module structure, the adhesive film for the front side generally requires higher light transmittance so that more sunlight can be absorbed by the battery piece, and the adhesive film for the back side generally requires higher reflectivity so that the sunlight leaking from the battery piece is reflected to the battery piece through the adhesive film for the back side to be reused, so as to improve the power generation efficiency and reduce the power generation cost. The conventional method is as disclosed in patent JP1994177412A, the effect of increasing the power of the photovoltaic module can be achieved by adding a high-reflection filler into the packaging adhesive film, but the method has the defect of high price, and therefore, the method is not applied on a large scale. With the release of "531 new politics" in the photovoltaic industry, the need for cost reduction in the industry is more and more urgent.
Therefore, based on the defects of the prior art and the needs of industry development, the invention develops the packaging adhesive film for the photovoltaic module and the preparation method thereof, the adhesive film has a multilayer structure, different reflective fillers are selected according to the functions of different layers, the adhesive film cost can be obviously reduced, and the preparation and processing mode is simple.
Disclosure of Invention
Aiming at the technical problems in the prior art, the invention provides a packaging adhesive film for a photovoltaic module and a preparation method thereof. The photovoltaic packaging adhesive film has a multilayer structure, can solve the problems of low reflection efficiency, high cost and the like, and is simple and efficient in preparation process.
In order to achieve the purpose, the invention adopts the following technical scheme:
a packaging adhesive film for a photovoltaic module is used for a lower adhesive film of a photovoltaic module cell, and at least comprises two adhesive film layers, wherein the adhesive film layer with the highest reflectivity in each adhesive film layer is arranged close to the cell, and the reflectivity of the adhesive film layer with the highest reflectivity to light with the wavelength range of 400nm-1100nm is more than or equal to 90%.
Preferably, the packaging adhesive film for the photovoltaic module comprises a first adhesive film layer and a second adhesive film layer, wherein the first adhesive film layer is a reflective adhesive film layer, and the reflectivity of the first adhesive film layer to light with the wavelength range of 400nm-1100nm is larger than or equal to 90%.
More preferably, the reflectivity of the first adhesive film layer to light with the wavelength range of 400nm-700nm is more than or equal to 90%.
Preferably, the second adhesive film layer is a transparent layer or a reflective adhesive film layer.
More preferably, when the second adhesive film layer is a reflective adhesive film layer, the reflectivity of the first adhesive film layer is greater than that of the second adhesive film layer. Most preferably, the second adhesive film layer has a reflectance of 40-65% in a wavelength range of 400nm-1100 nm.
More preferably, the transparent layer includes a matrix resin, and the reflection of light is not required without adding a white filler.
Preferably, the packaging adhesive film for the photovoltaic module further comprises a third adhesive film layer, the first adhesive film layer and the third adhesive film layer are respectively arranged on two sides of the second adhesive film layer, and the third adhesive film layer is a reflective adhesive film layer or a transparent layer.
More preferably, the reflectivity of the first adhesive film layer is greater than or equal to the reflectivity of the third adhesive film layer.
Preferably, the reflective film layer comprises a matrix resin and a reflective filler, wherein the reflective filler is selected from one or more of titanium dioxide, calcium carbonate, wollastonite, mica powder, magnesium hydroxide, aluminum hydroxide, composite titanium white, talcum powder, barium sulfate, glass beads and zinc sulfide.
Preferably, the particle size D50 of the reflective filler is less than or equal to 1 μm.
More preferably, the reflective filler of the first adhesive film layer is titanium dioxide; the reflective filler of the second adhesive film layer or the third adhesive film layer is calcium carbonate, wollastonite, talcum powder, mica powder or glass beads.
Preferably, the matrix resin is one or more polymers selected from the group consisting of: ethylene-vinyl acetate copolymers, metallocene-catalyzed polyethylenes, metallocene-catalyzed ethylene butene copolymers, metallocene-catalyzed ethylene octene copolymers, metallocene-catalyzed ethylene pentene copolymers, ethylene propylene copolymers, ethylene methyl acrylate copolymers, ethylene methyl methacrylate copolymers. More preferably, the matrix resin is EVA or POE.
Preferably, the first adhesive film layer and the second adhesive film layer further comprise a tackifier, a crosslinking agent and an auxiliary agent.
Preferably, the adhesion promoter may be one or more of a silane coupling agent and an alkoxysilane oligomer.
Preferably, the crosslinking agent may be one or more of a peroxide crosslinking agent and a photoinitiator.
Preferably, the auxiliary agent may be one or more of an antioxidant, a hindered amine light stabilizer, an ultraviolet absorber and a plasticizer.
Preferably, the pre-crosslinking degree of the packaging adhesive film for the photovoltaic module is 0.5-70%. The packaging adhesive film has some differences in heat resistance according to different formulations, for example, when some adhesive films with non-low fluidity are selected, the adhesive film with high reflectivity overflows in the laminating process of the adhesive film to pollute the battery piece, and the pre-crosslinking reduces the fluidity of the adhesive film to further solve the overflow problem.
The invention also provides a preparation method of the packaging adhesive film for the photovoltaic module, which comprises the following specific steps: respectively and uniformly mixing the raw materials of each layer of the packaging adhesive film for the photovoltaic module, adding the raw materials into different extruders, injecting the raw materials into the same die head, extruding the raw materials by a T die head, rolling the raw materials and pre-crosslinking the raw materials to obtain the packaging adhesive film for the photovoltaic module.
Preferably, the temperature of the extruder is 60-110 ℃, and the temperature of the T die head is 70-110 ℃.
Preferably, the pre-crosslinking mode is ultraviolet crosslinking, irradiation crosslinking or microwave crosslinking.
The packaging adhesive film for the photovoltaic module has a multilayer structure, and the fillers with different reflectivity are matched for use, so that the cost of the packaging adhesive film for the photovoltaic module can be obviously reduced, and the reflectivity of the packaging adhesive film for the photovoltaic module is improved, so that the effect of improving the power of the photovoltaic module is achieved.
Drawings
Fig. 1 is a schematic view of a packaging adhesive film for a photovoltaic module according to an embodiment.
FIG. 2 is a second schematic view of a packaging film for photovoltaic module according to the embodiment.
Description of reference numerals:
100-packaging adhesive film, 101-first adhesive film layer, 102-second adhesive film layer, and 103-third adhesive film layer.
Detailed Description
The following specific examples are further illustrative of the methods and techniques provided by the present invention and should not be construed as limiting the invention thereto.
Fig. 1 to 2 schematically show a cross section of the structure of the photovoltaic encapsulation adhesive film of the present embodiment. The thicknesses of the structures in fig. 1 to 2 are shown as an example, and the dimensions of the structures of the photovoltaic encapsulation film of the present invention are not limited to the dimensions shown in fig. 1 to 2.
The reagents, materials, and the like used in the present embodiment are commercially available unless otherwise specified. In the embodiment, the titanium dioxide is D50 not more than 1 mu m, a Screen 3# filter Screen (with the aperture of about 10 mu m) is adopted for testing, and the filtering pressure value is less than 0.5bar/g (a color master batch with the concentration of 70% is prepared by mixing the titanium dioxide with Linear Low Density Polyethylene (LLDPE) by a double-screw extruder, and the color master batch is diluted to the filtering pressure value of 8% by taking Low Density Polyethylene (LDPE) as base resin according to the requirements of European standard EN13900-5: 2005).
In each example of the present embodiment, the reflective adhesive film layer includes, by weight, 100 parts of a matrix resin, 5 to 50 parts of a reflective filler, 0.01 to 5 parts of a crosslinking agent, 0.01 to 10 parts of a tackifier, and 0 to 5 parts of an auxiliary agent. In the transparent layer, 100 weight portions of matrix resin, 0.01 to 5 weight portions of cross-linking agent, 0.01 to 10 weight portions of tackifier and 0 to 5 weight portions of auxiliary agent.
Fig. 1 shows an example of a photovoltaic encapsulation adhesive film, and the encapsulation adhesive film 100 includes a first adhesive film layer 101 and a second adhesive film layer 102.
Example 1
A structure of a packaging adhesive film 100 for a photovoltaic module is shown in FIG. 1, which includes a first adhesive film layer 101 and a second adhesive film layer 102, wherein the first adhesive film layer 101 is a reflective adhesive film layer, and the second adhesive film layer 102 is a transparent layer.
The first adhesive film layer 101 is a reflective adhesive film layer, and is composed of the following raw materials: the VA accounts for 33 percent of the mass fraction of the ethylene-vinyl acetate copolymer, titanium dioxide, a cross-linking agent of tert-butyl peroxyisopropyl carbonate, an auxiliary cross-linking agent of trimethylolpropane triacrylate and a tackifier of gamma-aminopropyltriethoxysilane.
The second adhesive film layer 102 is a transparent layer and is composed of 24 mass percent of ethylene-vinyl acetate copolymer of VA, a crosslinking agent of tert-butyl peroxyisopropyl carbonate, an auxiliary crosslinking agent of trimethylolpropane triacrylate, a hindered amine light stabilizer of bis-2, 2,6, 6-tetramethylpiperidinol sebacate, an ultraviolet absorber of 2, 2-tetramethylenebis (3, 1-benzoxazine-4-one), and a tackifier of gamma-aminopropyltriethoxysilane.
Respectively and fully mixing the resin composition of the first adhesive film layer 101 and the resin composition of the second adhesive film layer 102, and then adding the mixture into different extruders, wherein the temperatures of the extruders are 85 ℃ and the temperature of a T die head is 90 ℃; and melting the extrusion material of the first adhesive film layer 101 and the extrusion material of the second adhesive film layer 102, then entering a T-die head through a distributor for extrusion film forming, cooling and conveying the molten extrusion film to the position below an electron radiation device with 80keV energy, performing electron radiation on the adhesive film, wherein the intensity is 30kGy, and winding the irradiated adhesive film to obtain the double-layer co-extrusion packaging adhesive film E1. The thickness of the E1 adhesive film is 0.5mm, the thickness of the first adhesive film layer 101 is 0.1mm (calculated by a distributor), the thickness of the second adhesive film layer 102 is 0.4mm (calculated by a distributor), and the pre-crosslinking degree of the E1 adhesive film is 10%.
Example 2
A packaging adhesive film 100 for a photovoltaic module is shown in FIG. 1 and includes a first adhesive film layer 101 and a second adhesive film layer, wherein the first adhesive film layer 101 and the second adhesive film layer 102 are both reflective adhesive film layers.
The first adhesive film layer 101 is composed of the following raw materials: the VA accounts for 28 percent of the mass fraction of the ethylene-vinyl acetate copolymer, titanium dioxide, a cross-linking agent of 2, 5-dimethyl-2, 5-di (tert-butylperoxy) hexane, a compound of assistant cross-linking agent trimethylolpropane trimethacrylate/pentaerythritol triacrylate (the mass ratio is 3: 2), a hindered amine light stabilizer of bis-2, 2,6, 6-tetramethylpiperidinol sebacate and a tackifier of vinyltrimethoxysilane.
The second adhesive film layer 102 is composed of 33% of ethylene-vinyl acetate copolymer, calcium carbonate, crosslinking agent tert-butyl peroxyisopropyl carbonate, auxiliary crosslinking agent triallyl isocyanurate, hindered amine light stabilizer bis-2, 2,6, 6-tetramethylpiperidinol sebacate, ultraviolet absorbent 2, 2-tetramethylenebis (3, 1-benzoxazine-4-one), and tackifier gamma-aminopropyltriethoxysilane by mass percentage of VA.
Respectively and fully mixing the resin composition of the first adhesive film layer 101 and the resin composition of the second adhesive film layer 102, and adding the mixture into different extruders, wherein the temperatures of the extruders are both 80 ℃, and the temperature of a T die head is 95 ℃; and melting the extrusion materials of the first adhesive film layer 101 and the extrusion materials of the second adhesive film layer 102, then entering a T-shaped die head through a distributor for extrusion film forming, cooling and conveying the molten extrusion films to the lower part of an electronic radiation device with 1.0MeV energy, performing electronic radiation on the adhesive films, wherein the intensity is 20kGy, and performing coiling after radiation to obtain the double-layer co-extrusion packaging adhesive film E2. The thickness of the E2 adhesive film was 0.7mm, the thickness of the first adhesive film layer 101 was 0.3mm (calculated by the dispenser), the thickness of the second adhesive film layer 102 was 0.4mm (calculated by the dispenser), and the pre-crosslinking degree of the E2 adhesive film was 40%. The E2 first adhesive film layer 101 and the E2 second adhesive film layer 102 with corresponding thicknesses are separately extruded, and the reflectivity (400-1100 nm) is 93% and 50% respectively.
Example 3
A packaging adhesive film for a photovoltaic module is structurally shown in figure 2 and comprises a first adhesive film layer 101, a second adhesive film layer 102 and a third adhesive film layer 103, wherein the first adhesive film layer 101 and the second adhesive film layer 102 are both reflecting adhesive film layers, and the third adhesive film layer 103 is a transparent layer.
The first adhesive film layer 101 is composed of the following raw materials: metallocene catalyzed polyethylene, tert-butyl peroxyisopropyl carbonate, titanium dioxide, a sensitizer triallyl isocyanurate/pentaerythritol triacrylate compound (the mass ratio is 3: 2), a hindered amine light stabilizer bis-2, 2,6, 6-tetramethylpiperidinol sebacate and vinyl trimethoxy silane.
The second adhesive film layer 102 is composed of 33% of ethylene-vinyl acetate copolymer with the mass fraction of VA, glass beads (the refractive index is 1.93), an auxiliary crosslinking agent triallyl isocyanurate, a hindered amine light stabilizer bis-2, 2,6, 6-tetramethylpiperidinol sebacate, an ultraviolet absorbent 2, 2-tetramethylenebis (3, 1-benzoxazine-4-one), and a tackifier vinyl triethoxysilane oligomer.
The third adhesive film layer 103 is composed of metallocene-catalyzed ethylene-butylene copolymer, a cross-linking agent of isopropyl tert-butyl peroxycarbonate, an auxiliary cross-linking agent of trimethylolpropane triacrylate, hindered amine light stabilizer of bis-2, 2,6, 6-tetramethylpiperidinol sebacate, an ultraviolet absorber of 2, 2-tetramethylenebis (3, 1-benzoxazine-4-one), a tackifier of gamma-methacryloxypropyltrimethoxysilane and vinyl tris (2-methoxyethoxy) silane monomer copolymerization mixture.
Respectively and fully mixing the resin compositions of the first adhesive film layer 101, the second adhesive film layer 102 and the third adhesive film layer 103, and then adding the mixture into different extruders, wherein the temperatures of the extruders are all 80 ℃, and the temperature of a T die head is 95 ℃; and melting the extrusion material of the first adhesive film layer 101, the extrusion material of the second adhesive film layer 102 and the extrusion material of the third adhesive film layer 103, then feeding the molten materials into a T-shaped die head through a distributor to be extruded into a film, cooling the film, conveying the film to the lower part of an electronic radiation device with 0.8MeV energy, performing electronic radiation on the film, wherein the intensity is 250kGy, and coiling the film after radiation to obtain the three-layer co-extrusion packaging adhesive film E3. The thickness of the E3 adhesive film was 0.7mm, the thickness of the first adhesive film layer 101 was 0.3mm (calculated by dispenser), the thickness of the second adhesive film layer 102 was 0.3mm (calculated by dispenser), the thickness of the third adhesive film layer 103 was 0.1mm (calculated by dispenser), and the pre-crosslinking degree of the E3 adhesive film was measured to be 70%. The E3 first adhesive film layer 101 and the E3 second adhesive film layer 102 with corresponding thicknesses are separately extruded, and the reflectivity (400-1100 nm) is 92% and 55%, respectively.
Example 4
A packaging adhesive film 100 for a photovoltaic module is structurally shown in FIG. 2 and comprises a first adhesive film layer 101, a second adhesive film layer 102 and a third adhesive film layer 103, wherein the first adhesive film layer 101, the second adhesive film layer 102 and the third adhesive film layer 103 are all reflective adhesive film layers.
The first adhesive film layer 101 is composed of the following raw materials: the VA accounts for 33 percent of the mass of the ethylene-vinyl acetate copolymer, the tert-butyl peroxyisopropyl carbonate, the titanium dioxide, a compound of sensitizer triallyl isocyanurate/pentaerythritol triacrylate (the mass ratio is 3: 2), the hindered amine light stabilizer bis-2, 2,6, 6-tetramethyl piperidinol sebacate and vinyl trimethoxy silane.
The second glue film layer 102 is composed of ethylene methyl acrylate copolymer, barium sulfate, auxiliary crosslinking agent triallyl isocyanurate, hindered amine light stabilizer bis-2, 2,6, 6-tetramethylpiperidinol sebacate, ultraviolet absorbent 2, 2-tetramethylenebis (3, 1-benzoxazine-4-one), and tackifier vinyltriethoxysilane oligomer.
The third adhesive film layer 103 is composed of a copolymer mixture of ethylene-vinyl acetate copolymer with a VA mass fraction of 28%, wollastonite, a crosslinking agent of tert-butyl peroxyisopropyl carbonate, an auxiliary crosslinking agent of trimethylolpropane triacrylate, a hindered amine light stabilizer of bis-2, 2,6, 6-tetramethylpiperidinol sebacate, an ultraviolet absorber of 2, 2-tetramethylenebis (3, 1-benzoxazine-4-one), a tackifier of gamma-methacryloxypropyltrimethoxysilane and vinyl tris (2-methoxyethoxy) silane monomers.
Respectively and fully mixing the resin compositions of the first adhesive film layer 101, the second adhesive film layer 102 and the third adhesive film layer 103, and then adding the mixture into different extruders, wherein the temperatures of the extruders are 85 ℃ and the T die head temperature is 95 ℃; and melting the extruded materials of the first adhesive film layer 101, the extruded materials of the second adhesive film layer 102 and the extruded materials of the third adhesive film layer 103, then feeding the melted materials into a T-shaped die head through a distributor to be extruded into a film, cooling the film and conveying the film to the lower part of an electronic radiation device with 0.8MeV energy, performing electronic radiation on the film, wherein the intensity is 30kGy, and performing winding after radiation to obtain the three-layer co-extrusion packaging adhesive film E4. The thickness of the E4 adhesive film was 0.7mm, the thickness of the first adhesive film layer 101 was 0.3mm (calculated by dispenser), the thickness of the second adhesive film layer 102 was 0.2mm (calculated by dispenser), the thickness of the third adhesive film layer 103 was 0.2mm (calculated by dispenser), and the pre-crosslinking degree of the E4 adhesive film was measured to be 30%. The E4 first adhesive film layer 101, the E4 second adhesive film layer 102 and the E4 second adhesive film layer 103 with corresponding thicknesses are separately extruded, and the reflectivity (400-1100 nm) is 92%, 65% and 40% respectively.
Example 5
The packaging adhesive film 100 for the photovoltaic module is structurally shown in fig. 2 and comprises a first adhesive film layer 101, a second adhesive film layer 102 and a third adhesive film layer 103, wherein the first adhesive film layer 101 and the third adhesive film layer 103 are identical in component and thickness, and the three adhesive film layers are all reflective adhesive film layers.
The first adhesive film layer 101 is composed of the following raw materials: VA is a compound (mass ratio is 1: 3) of 28% of ethylene-vinyl acetate copolymer, tert-butyl peroxyisopropyl carbonate, titanium dioxide, sensitizer triallyl isocyanurate/pentaerythritol triacrylate, hindered amine light stabilizer bis-2, 2,6, 6-tetramethyl piperidinol sebacate and a monomer copolymerization mixture of vinyl trimethoxy silane and methyl vinyl diethoxy silane.
The second glue film layer 102 is composed of metallocene-catalyzed ethylene octene copolymer, barium sulfate, auxiliary crosslinking agent triallyl isocyanurate, hindered amine light stabilizer bis-2, 2,6, 6-tetramethylpiperidinol sebacate, ultraviolet absorbent 2, 2-tetramethylenebis (3, 1-benzoxazine-4-one), and tackifier vinyltriethoxysilane oligomer.
Respectively and fully mixing the resin composition of the first adhesive film layer 101 and the resin composition of the second adhesive film layer 102, and then adding the mixture into different extruders, wherein the temperatures of the extruders are both 80 ℃, and the temperature of a T die head is 95 ℃; the extrusion material of the first adhesive film layer 101 is melted and then divided into two layers by a distributor, the two layers and the melted extrusion material of the second adhesive film layer 102 enter a T-shaped die head together for extrusion film forming, the film is conveyed to the lower part of an electronic radiation device with 0.6MeV energy through cooling, the radiation pre-crosslinking surface is subjected to electronic radiation, the intensity is 20kGy, and the three-layer co-extrusion packaging adhesive film E5 is obtained through coiling after radiation. The thickness of the E5 adhesive film was 0.5mm, the thickness of the first adhesive film layer 101 was 0.2mm (calculated by dispenser), the thickness of the second adhesive film layer 102 was 0.1mm (calculated by dispenser), the thickness of the third adhesive film layer 103 was 0.2mm (calculated by dispenser), and the pre-crosslinking degree of the E5 adhesive film was measured to be 4%. The E5 first adhesive film layer 101 and the E5 second adhesive film layer 102 with corresponding thicknesses are separately extruded, and the reflectivity (400-1100 nm) is 91% and 44% respectively.
Example 6
A packaging adhesive film 101 for a photovoltaic module comprises a first adhesive film layer 101 and a second adhesive film layer 102, wherein the first adhesive film layer 101 is a reflective adhesive film layer, and the second adhesive film layer 102 is a transparent layer.
The first adhesive film layer 101 is composed of the following raw materials: the VA accounts for 33 percent of ethylene-vinyl acetate copolymer, titanium dioxide, photoinitiator benzophenone, photoinitiator 2-methyl-2- (4-morpholinyl) -1- [4- (methylthio) phenyl ] -1-acetone, thermal initiator tert-butyl peroxyisopropyl carbonate, thermal initiator 2, 5-dimethyl-2, 5-di (tert-butylperoxy) hexane, auxiliary crosslinking agent trimethylolpropane triacrylate and tackifier gamma-aminopropyltriethoxysilane.
The second film layer 102 is composed of ethylene-vinyl acetate copolymer with a VA mass fraction of 28%, a crosslinking agent of tert-butyl peroxyisopropyl carbonate, photoinitiator benzoin dimethyl ether, an auxiliary crosslinking agent of trimethylolpropane triacrylate and a tackifier of gamma-aminopropyltriethoxysilane.
Mixing the first glueRespectively and fully mixing the resin composition of the film layer 101 and the resin composition of the second adhesive film layer 102, and then adding the mixture into different extruders, wherein the temperatures of the extruders are 85 ℃ and the temperature of a T die head is 90 ℃; the extruded material of the first adhesive film layer 101 and the extruded material of the second adhesive film layer 102 are melted and then enter a T die head through a distributor to be extruded and formed into a film, and the irradiation intensity is 1800W/m in a drying tunnel at 70 DEG C2Irradiating the two sides of the adhesive film by an ultraviolet lamp for 100s, cooling, slitting, coiling, and rolling to obtain the double-layer co-extrusion packaging adhesive film E6. The thickness of the E6 adhesive film is 0.3mm, the thickness of the first adhesive film layer 101 is 0.2mm (calculated by a distributor), the thickness of the second adhesive film layer 102 is 0.1mm (calculated by a distributor), and the pre-crosslinking degree of the E6 adhesive film is 10%.
The above description of the embodiments is only intended to facilitate the understanding of the method of the invention and its core ideas. It should be noted that, for those skilled in the art, it is possible to make various improvements and modifications to the present invention without departing from the principle of the present invention, and those improvements and modifications also fall within the scope of the claims of the present invention.
Claims (11)
1. A packaging adhesive film for a photovoltaic module is used for a lower adhesive film of a photovoltaic module cell, and is characterized by at least comprising two adhesive film layers, wherein the adhesive film layer with the highest reflectivity in each adhesive film layer is arranged close to the cell, and the reflectivity of the adhesive film layer with the highest reflectivity to light with the wavelength range of 400nm-1100nm is more than or equal to 90%.
2. The packaging adhesive film for the photovoltaic module according to claim 1, comprising a first adhesive film layer and a second adhesive film layer, wherein the first adhesive film layer is a reflective adhesive film layer, and the reflectivity of the first adhesive film layer to light with a wavelength range of 400nm-1100nm is not less than 90%.
3. The encapsulant film for photovoltaic module as claimed in claim 2, wherein the first film layer has a reflectance of 90% or more with respect to light having a wavelength of 400nm to 700 nm.
4. The encapsulant film for photovoltaic module as claimed in claim 2, wherein the second film layer is a transparent layer or a reflective film layer.
5. The encapsulant film as claimed in claim 2, wherein when the second film layer is a reflective film layer, the reflectivity of the first film layer is greater than the reflectivity of the second film layer.
6. The encapsulant film for photovoltaic module as claimed in claim 2, further comprising a third film layer, wherein the first and third film layers are disposed on two sides of the second film layer, and the third film layer is a reflective film layer or a transparent layer.
7. The encapsulant film for photovoltaic modules as claimed in claim 2, wherein the reflective film layer comprises a matrix resin and a reflective filler, and the reflective filler is selected from one or more of titanium dioxide, calcium carbonate, wollastonite, mica powder, magnesium hydroxide, aluminum hydroxide, composite titanium dioxide, talc, barium sulfate, glass beads and zinc sulfide.
8. The photovoltaic packaging film of claim 7, wherein the reflective filler of the first film layer is titanium dioxide.
9. The encapsulant film for photovoltaic module as claimed in claim 7, wherein the reflective filler has a particle size D50 ≤ 1 μm.
10. The encapsulant film for photovoltaic modules according to any one of claims 1 to 9, wherein the pre-crosslinking degree of the encapsulant film for photovoltaic modules is 0.5 to 70%.
11. The preparation method of the packaging adhesive film for the photovoltaic module as claimed in any one of claims 1 to 10, comprising the following steps: respectively and uniformly mixing the raw materials of each layer of the packaging adhesive film for the photovoltaic module, adding the raw materials into different extruders, injecting the raw materials into the same die head, extruding the raw materials by a T die head, rolling the raw materials and pre-crosslinking the raw materials to obtain the packaging adhesive film for the photovoltaic module.
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