CN113369717A - Laser processing system and method - Google Patents
Laser processing system and method Download PDFInfo
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- CN113369717A CN113369717A CN202110769407.0A CN202110769407A CN113369717A CN 113369717 A CN113369717 A CN 113369717A CN 202110769407 A CN202110769407 A CN 202110769407A CN 113369717 A CN113369717 A CN 113369717A
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- mirror
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
Abstract
The invention discloses a laser processing system and a method, comprising the following steps: laser instrument, deflection mirror, wedge mirror group and focusing mirror, the laser instrument is used for producing the laser beam, the deflection mirror set up in the light path low reaches of laser instrument, the deflection mirror is used for adjusting the flight angle of laser beam, the wedge mirror group set up in the light path low reaches of deflection mirror, the wedge mirror group is used for making the laser beam carry out translational motion, the focusing mirror set up in the light path low reaches of wedge mirror group, the focusing mirror is used for focusing the laser beam. The method adopts the laser processing system. The system and method may be used to perform laser rotational atherectomy.
Description
Technical Field
The invention relates to the field of laser processing, in particular to a laser processing system and a laser processing method.
Background
The laser drilling device can be divided into a galvanometer scanning type drilling system, a three-optical-wedge rotary scanning drilling system and a dove prism rotary scanning drilling system by using optical devices and different working principles in the laser drilling device.
The galvanometer scanning punching system is the most mature punching system, the processing range is large, and the control is simple. However, due to the limitation of mechanical resolution, it is difficult for the galvanometer scanning system to precisely machine micro-holes with a diameter smaller than 0.2 mm.
The three-optical-wedge rotary scanning punching system needs to ensure synchronous rotation of three optical wedges and simultaneously needs to accurately control relative angles between the optical wedges, if the control precision is not good, the roundness and the taper of punching are affected, the requirement on the rotation control precision of a motor is extremely high, and an algorithm for controlling the radius and the taper of punching at the same time is very complex, for example, the published text with the Chinese patent application publication number of CN 103056519A.
The manufacturing and mounting errors of the dove prism have a great influence on the roundness and taper of the punched hole, and therefore, a complicated compensation optical system is required to compensate for the manufacturing and mounting errors of the system. This not only greatly increases the volume and weight of the system, but also increases the manufacturing difficulty and production cost of the system. Such as U.S. patent publication No. US7842901B 2.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: at least one technical problem addressed above is solved.
The solution of the invention for solving the technical problem is as follows:
a laser machining system, comprising: laser instrument, deflection mirror, wedge mirror group and focusing mirror, the laser instrument is used for producing the laser beam, the deflection mirror set up in the light path low reaches of laser instrument, the deflection mirror is used for adjusting the flight angle of laser beam, the wedge mirror group set up in the light path low reaches of deflection mirror, the wedge mirror group is used for making the laser beam carry out translational motion, the focusing mirror set up in the light path low reaches of wedge mirror group, the focusing mirror is used for focusing the laser beam.
As a further improvement of the above technical solution, a beam expander is further disposed in the optical path between the laser and the deflection mirror.
As a further improvement of the above technical solution, the deflection mirror includes an adjustment member, and a mirror provided on the adjustment member, and the adjustment member adjusts an angle at which the mirror is tilted about an x-axis and/or a y-axis.
As a further improvement of the above technical solution, the x-axis and the y-axis are perpendicular to each other.
As a further improvement of the above technical solution, the wedge-shaped mirror group includes a first wedge-shaped mirror and a second wedge-shaped mirror that are disposed from upstream to downstream along the optical path, and the first wedge-shaped mirror and the second wedge-shaped mirror are disposed in central symmetry with each other.
As a further improvement of the technical scheme, a reflector is further arranged between the focusing mirror and the wedge-shaped mirror group, and light rays emitted from the wedge-shaped mirror group are reflected to the focusing mirror through the reflector.
As a further improvement of the above technical solution, the reflective mirror is light-permeable, and a detector is disposed on a backlight side of the reflective mirror, and the detector is configured to detect a position of the laser light that has passed through the reflective mirror.
As a further improvement of the above technical solution, a PBS splitting lens and a quarter wave plate are further disposed on a light path between the laser and the deflection mirror, and laser light generated by the laser sequentially passes through the PBS splitting lens, the quarter wave plate, the deflection mirror, the quarter wave plate, the PBS splitting lens, the wedge-shaped mirror group, and the focusing mirror.
As a further improvement of the above technical solution, a distance between the first wedge mirror and the second wedge mirror is adjustable.
The invention also provides a laser processing method of the laser processing system combined by any technical scheme, which comprises the following steps of determining the radius and the taper of laser rotary cutting; the wedge-shaped mirror group is adjusted according to the taper to enable the laser to translate to a proper position, and the angle of the emergent angle of the deflection mirror is adjusted according to the radius; under the condition of keeping the size of the emergent angle of the deflection mirror, adjusting the deflection mirror to enable the emergent laser to rotate around the optical axis, and adjusting the wedge-shaped mirror group to enable the wedge-shaped mirror group to rotate, wherein the rotating frequency of the wedge-shaped mirror group is the same as that of the emergent laser on the deflection mirror; the laser is turned on.
The invention has the beneficial effects that: after the laser beam that the laser instrument produced, the laser beam shines on the deflection mirror, through the wedge mirror group after the deflection mirror reflection laser beam, the wedge mirror group carries out the translation adjustment back to the laser beam, and through focusing mirror focus and realize laser cutting processing, its laser beam processing's adjustment is very convenient moreover, simple structure.
When the laser is needed to be used for rotary cutting processing, a user can adjust the swing angle of the deflection mirror, in order to realize the rotary cutting of the laser, the user can keep the size of the emergent angle of the laser beam unchanged, so that the emergent laser rotates clockwise or anticlockwise around the optical axis, and the wedge-shaped lens group is adjusted to enable the wedge-shaped lens group to rotate synchronously with the incident laser, so that the rotary cutting of the laser is realized.
Drawings
In order to more clearly illustrate the technical solution in the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly described below. It is clear that the described figures are only some embodiments of the invention, not all embodiments, and that a person skilled in the art can also derive other designs and figures from them without inventive effort.
FIG. 1 is a schematic diagram of the optical path structure of the present invention;
in the drawings: the device comprises a laser 1, a deflection mirror 2, an adjusting component 22, a reflector 21, a wedge-shaped mirror group 3, a first wedge-shaped mirror 31, a second wedge-shaped mirror 32, a focusing mirror 4, a beam expanding mirror 5, a detector 6, a reflector 7, a PBS (polarizing beam splitter) lens 8 and a quarter wave plate 9.
Detailed Description
The conception, the specific structure, and the technical effects produced by the present invention will be clearly and completely described below in conjunction with the embodiments and the accompanying drawings to fully understand the objects, the features, and the effects of the present invention. It is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and those skilled in the art can obtain other embodiments without inventive effort based on the embodiments of the present invention, and all embodiments are within the protection scope of the present invention. In addition, all the coupling/connection relationships mentioned herein do not mean that the components are directly connected, but mean that a better coupling structure can be formed by adding or reducing coupling accessories according to specific implementation conditions. All technical characteristics in the invention can be interactively combined on the premise of not conflicting with each other.
Referring to fig. 1, a laser processing system includes: laser instrument 1, beat mirror 2, wedge mirror group 3 and focusing mirror 4, laser instrument 1 is used for producing the laser beam, beat mirror 2 set up in laser instrument 1's light path low reaches, beat mirror 2 is used for adjusting the flight angle of laser beam, wedge mirror group 3 set up in the light path low reaches of beat mirror 2, wedge mirror group 3 is used for making the laser beam carry out translation motion, focusing mirror 4 set up in the light path low reaches of wedge mirror group 3, wedge mirror group 3 is rotatory around the optical axis, focusing mirror 4 is used for focusing the laser beam.
The laser cutting machining method comprises the following steps that after the laser beam is generated by the laser 1, the laser beam irradiates the deflection mirror 2, after the laser beam is reflected by the deflection mirror 2, the laser beam passes through the wedge-shaped lens group 3, and after the laser beam is subjected to translation adjustment by the wedge-shaped lens group 3, the laser beam is focused by the focusing lens 4 to realize laser cutting machining; when the rotary cutting machining by using the laser is needed, a user can adjust the swing angle of the deflection mirror 2, for example, when a round hole needs to be cut, the user adjusts the exit angle of the laser beam reflected by the deflection mirror 2 by adjusting the deflection mirror 2, the larger the exit angle is, the larger the rotary cutting radius is, and on the contrary, the smaller the exit angle is, the smaller the rotary cutting radius is; in order to achieve rotary cutting of the laser, a user can keep the size of the exit angle of the laser beam unchanged, and make the exit laser rotate clockwise or counterclockwise around the optical axis, and adjust the wedge-shaped lens group 3 to make the wedge-shaped lens group 3 rotate synchronously with the incident laser, thereby achieving rotary cutting of the laser.
In actual use, the laser 1 can generate a laser beam and irradiate the deflection mirror 2 at a certain angle.
In addition, the deflecting mirror 2 can adjust the flying angle of the laser beam, for example, the emitting angle of the laser beam is towards the optical axis but continuously changes the direction, and simultaneously, the preferred wedge-shaped mirror group 3 rotates synchronously with the light beam emitted from the deflecting mirror 2 in coordination with the rotation of the wedge-shaped mirror group 3 around the optical axis, so that the laser rotary cutting function can be realized.
In some embodiments, the optical path between the laser 1 and the deflection mirror 2 is further provided with a beam expander 5. The structure is simple and the arrangement is convenient. By the arrangement of the beam expander 5, the diameter of the laser beam can be effectively expanded, and the divergence angle of the laser beam is reduced, so that the expanded beam can be focused to be smaller.
In some embodiments, the deflection mirror 2 comprises an adjustment member 22, a mirror 21 arranged on the adjustment member 22, the adjustment member 22 adjusting the angle at which the mirror 21 is tilted about the x-axis and/or the y-axis.
When the laser beam adjusting device is used, a user changes the adjusting component 22 to enable the reflecting mirror 21 arranged on the adjusting component 22 to incline, and the emitting angle of the laser beam reflected by the reflecting mirror 21 is adjusted.
For example, the adjustment member 22 may be a member capable of accurately adjusting the tilt angle of the mirror 21, such as a piezoelectric ceramic, a voice coil motor, or a magnetostrictive material.
In practical use, in order to perform rotational atherectomy of the laser, the user may adjust the adjustment member 22 to tilt the mirror 21, the tilt angle is kept constant, and the user may adjust the direction of the tilt angle, for example, to continuously rotate the mirror 21 around the optical axis, thereby performing rotational atherectomy of the laser.
In some embodiments, the x-axis and the y-axis are perpendicular to each other. The structure is simple, the arrangement is convenient, and the user can conveniently adjust the orientation of the reflector 21 and the size of the inclination angle of the reflector 21.
In some embodiments, the wedge mirror group 3 includes a first wedge mirror 31 and a second wedge mirror 32 disposed upstream to downstream along the optical path, and the first wedge mirror 31 and the second wedge mirror 32 are disposed in central symmetry with each other.
Optionally, the first wedge mirror 31 and the second wedge mirror 32 have the same size and specification, but the first wedge mirror 31 and the second wedge mirror 32 are placed in opposite directions, and the second wedge mirror 32 downstream of the optical path is used for correcting the change of the incident light by the first wedge mirror 31 upstream of the optical path, so that the angle of the emergent light of the second wedge mirror 32 downstream of the optical path is the same as the angle of the incident light to the first wedge mirror 31, thereby implementing the translation of the laser beam.
Preferably, the first wedge mirror 31 is made of quartz or optical glass. Optionally, the first wedge mirror 31 has an outer diameter of 5mm to 30mm and a thickness of 3mm to 8 mm. The wedge angle of the first wedge mirror 31 is 6 ° to 12 °.
Accordingly, the second wedge mirror 32 can be made of the same material and have the same specification as the first wedge mirror 31. The user can select the specification and material of the first wedge-shaped mirror 31 and the second wedge-shaped mirror 32 according to actual conditions.
In some embodiments, a reflective mirror 7 is further disposed between the focusing mirror 4 and the wedge-shaped mirror group 3, and light emitted from the wedge-shaped mirror group 3 is reflected to the focusing mirror through the reflective mirror 7.
In some embodiments, the mirror 7 is light permeable, and the backlight side of the mirror 7 is provided with a detector 6, the detector 6 being adapted to detect the position of the laser light transmitted through the mirror 7.
In actual use, the user can select the reflector 7. For example, the user may select the reflective mirror 7 with a light transmittance of 1% to 10%, and the larger the light transmittance is, the smaller the energy contained in the laser light reflected by the reflective mirror 7 is. Therefore, the user can select different reflectors 7 according to actual conditions, such as the material and the volume of materials to be processed.
In some embodiments, a PBS splitting lens 8 and a quarter wave plate 9 are further disposed on a light path between the laser 1 and the deflection mirror 2, and laser light generated by the laser 1 sequentially passes through the PBS splitting lens 8, the quarter wave plate 9, the deflection mirror 2, the quarter wave plate 9, the PBS splitting lens 8, the wedge lens group 3, and the focusing mirror 4.
When the linear polarizer laser is used, laser generated by the laser 1 is linearly polarizer light, cannot pass through the PBS beam splitting lens 8 when passing through the PBS beam splitting lens 8 for the first time, and laser beams are reflected under the beam splitting action of the PBS beam splitting prism. The refracted laser light passes through the quarter-wave plate 9, and the phase difference between the laser light entering and exiting the quarter-wave plate 9 is pi/2, resulting in that the laser light is delayed by a quarter period of delay, one period being 2 pi. After the laser passes through the quarter-wave plate 9 for the second time, the phase difference between the laser emitted from the quarter-wave plate 9 and the laser beam firstly incident on the quarter-wave plate 9 is pi, that is, a half-period delay is generated, and the laser passing through the quarter-wave plate 9 for the two times can completely pass through the PBS splitting lens 8.
Preferably, the laser beam first entering the PBS splitting lens 8 makes an angle of 90 ° with the exit of the PBS splitting lens 8. Thus, the user can make the laser beam vertically incident on the deflection mirror 2, and can conveniently adjust the angle of the deflection mirror 2, for example, make the laser beam incident on the deflection mirror 2 along the optical axis.
In some embodiments, the distance between the first wedge mirror 31 and the second wedge mirror 32 is adjustable. The translation distance of the laser beam can be adjusted by adjusting the distance between the first wedge-shaped mirror 31 and the second wedge-shaped mirror 32, the farther the distance between the first wedge-shaped mirror 31 and the second wedge-shaped mirror 32 is, the larger the translation distance is, and the taper size during laser rotary cutting can be adjusted by adjusting the translation distance of the laser beam.
The invention also provides a laser processing method of the laser processing system combined by any technical scheme, which comprises the following steps of determining the radius and the taper of laser rotary cutting; the wedge-shaped mirror group 3 is adjusted according to the taper to enable the laser to be translated to a proper position, and the angle of the emergent angle of the deflection mirror 2 is adjusted according to the radius; under the condition of keeping the size of the exit angle of the deflection mirror 2, adjusting the deflection mirror 2 to enable the exit angle to rotate around the optical axis, and adjusting the wedge-shaped mirror group 3 to enable the wedge-shaped mirror group 3 to rotate, wherein the rotation frequency of the exit angle of the laser emitted from the deflection mirror 2 is the same as that of the exit angle of the laser emitted from the wedge-shaped mirror group 3; the laser 1 is turned on.
The rotary cutting radius is R, the R ═ f × tan β 1 ═ f × tan2w, the f is the focal length of the focusing mirror 4, the β 1 is the exit angle of the beam reflected by the deflecting mirror 2, and the w is the inclination angle of the mirror 2; the machining taper angle is theta, and the theta is aretsn [ (L1tan beta 1-L2tan beta 2-L3tan beta 1-R)/f]Wherein L1 is the distance between the deflection mirror 2 and the wedge-shaped mirror group 3, in this embodiment, the distance between the deflection mirror 2 and the first wedge-shaped mirror 31, L2 is the distance between the first wedge-shaped mirror 31 and the second wedge-shaped mirror 32 in the wedge-shaped mirror group 3,the distance between the wedge-shaped lens group 3 and the focusing lens 4, in this embodiment, the distance between the second wedge-shaped lens 32 and the focusing lens 4, R is the rotary cutting radius, and f is the focal length of the focusing lens 4; the included angle between the emergent ray of the wedge-shaped mirror 2 and the optical axis is beta 2
Where n2 is the index of refraction of the first wedge mirror 31 and α is the wedge angle of the wedge mirror 2.
In this embodiment, the first wedge-shaped mirror 31 and the second wedge-shaped mirror 32 have the same specification and material, and have opposite refraction directions.
Since the figures and the text have already been discussed in relation to the laser machining system, the discussion of the laser machining system is not repeated here.
While the preferred embodiments of the present invention have been illustrated and described, it will be understood by those skilled in the art that the present invention is not limited to the details of the embodiments shown and described, but is capable of numerous equivalents and substitutions without departing from the spirit of the invention as set forth in the claims appended hereto.
Claims (10)
1. A laser machining system, comprising:
a laser (1), the laser (1) being adapted to generate a laser beam;
the laser comprises a laser device (1), a deflection mirror (2), a laser beam control device and a laser control system, wherein the deflection mirror (2) is arranged on the downstream of a light path of the laser device (1), and the deflection mirror (2) is used for adjusting the flight angle of the laser beam;
the wedge-shaped mirror group (3) is arranged on the downstream of the optical path of the deflection mirror (2), and the wedge-shaped mirror group (3) is used for enabling the laser beam to perform translational motion;
the focusing mirror (4), the focusing mirror (4) set up in the light path low reaches of wedge mirror group (3), focusing mirror (4) are used for focusing the laser beam.
2. The laser processing system according to claim 1, characterized in that the optical path between the laser (1) and the deflection mirror (2) is further provided with a beam expander mirror (5).
3. Laser machining system according to claim 1, characterized in that the deflection mirror (2) comprises an adjustment member (22), a mirror (21) arranged on the adjustment member (22), the adjustment member (22) adjusting the angle at which the mirror (21) is tilted about the x-axis and/or the y-axis.
4. The laser machining system of claim 3, wherein the x-axis and the y-axis are perpendicular to each other.
5. The laser processing system of claim 1, wherein the wedge mirror group (3) comprises a first wedge mirror (31) and a second wedge mirror (32) arranged upstream to downstream along the optical path, the first wedge mirror (31) and the second wedge mirror (32) being arranged centrosymmetrically to each other.
6. A laser processing system according to claim 3, wherein a reflecting mirror (7) is further arranged between the focusing mirror (4) and the wedge-shaped mirror group (3), and light emitted from the wedge-shaped mirror group (3) is reflected onto the focusing mirror (4) via the reflecting mirror (7).
7. Laser machining system according to claim 6, characterized in that the mirror (7) is light-permeable, and that the backlight side of the mirror (7) is provided with a detector (6), which detector (6) is adapted to detect the position of the laser light transmitted through the mirror (21).
8. The laser processing system according to claim 1, wherein a PBS splitting lens (8) and a quarter wave plate (9) are further disposed in a light path between the laser (1) and the deflection mirror (2), and laser light generated by the laser (1) sequentially passes through the PBS splitting lens (8), the quarter wave plate (9), the deflection mirror (2), the quarter wave plate (9), the PBS splitting lens (8), the wedge-shaped mirror group (3) and the focusing mirror (4).
9. Laser machining system according to claim 5, characterized in that the distance between the first wedge mirror (31) and the second wedge mirror (32) is adjustable.
10. A laser machining method using the laser machining system according to any one of claims 1 to 9, comprising the steps of determining a radius and a taper of the laser rotational cut; the wedge-shaped mirror group (3) is adjusted according to the taper to enable the laser to be translated to a proper position, and the angle of the emergent angle of the deflection mirror (2) is adjusted according to the radius; under the condition of keeping the size of the exit angle of the deflection mirror (2), adjusting the deflection mirror (2) to enable the exit laser to rotate around the optical axis, and adjusting the wedge-shaped mirror group (3) to enable the wedge-shaped mirror group (3) to rotate, wherein the rotation frequency of the exit angle is the same as that of the exit angle on the deflection mirror (2); the laser (1) is turned on.
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| CN202110769407.0A CN113369717A (en) | 2021-07-07 | 2021-07-07 | Laser processing system and method |
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| CN202110769407.0A CN113369717A (en) | 2021-07-07 | 2021-07-07 | Laser processing system and method |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102554465A (en) * | 2012-02-08 | 2012-07-11 | 中国科学院福建物质结构研究所 | Rotary optical design applied to laser machining |
| DE102011011734A1 (en) * | 2011-02-10 | 2012-08-16 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Apparatus, arrangement and method for interference structuring of flat samples |
| CN103302403A (en) * | 2012-03-15 | 2013-09-18 | 三星钻石工业股份有限公司 | Processing method of processed object and splitting method |
| CN106392310A (en) * | 2016-11-01 | 2017-02-15 | 武汉华工激光工程有限责任公司 | Optical device for rotary-cut punching |
| CN110587155A (en) * | 2019-08-29 | 2019-12-20 | 武汉安扬激光技术有限责任公司 | Laser processing device for cutting inverted taper hole or groove and using method thereof |
-
2021
- 2021-07-07 CN CN202110769407.0A patent/CN113369717A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102011011734A1 (en) * | 2011-02-10 | 2012-08-16 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Apparatus, arrangement and method for interference structuring of flat samples |
| CN102554465A (en) * | 2012-02-08 | 2012-07-11 | 中国科学院福建物质结构研究所 | Rotary optical design applied to laser machining |
| CN103302403A (en) * | 2012-03-15 | 2013-09-18 | 三星钻石工业股份有限公司 | Processing method of processed object and splitting method |
| CN106392310A (en) * | 2016-11-01 | 2017-02-15 | 武汉华工激光工程有限责任公司 | Optical device for rotary-cut punching |
| CN110587155A (en) * | 2019-08-29 | 2019-12-20 | 武汉安扬激光技术有限责任公司 | Laser processing device for cutting inverted taper hole or groove and using method thereof |
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