CN113369628B

CN113369628B - Welding equipment of printed circuit board for manufacturing electrical elements

Info

Publication number: CN113369628B
Application number: CN202110921647.8A
Authority: CN
Inventors: 赖燕如
Original assignee: Nantong Fengye Printing Machinery Co ltd
Current assignee: Nantong Fengye Printing Machinery Co ltd
Priority date: 2021-08-12
Filing date: 2021-08-12
Publication date: 2021-10-26
Anticipated expiration: 2041-08-12
Also published as: CN113369628A

Abstract

The invention discloses a welding device of a printed circuit board for manufacturing an electrical element, belonging to the technical field of welding and manufacturing an electronic component and the printed circuit board, wherein a die disc is arranged at the other end of a spray pipe and consists of a pair of horn-shaped die sections which are connected in a rotating way, before welding, the die disc is placed at a preset welding hole and is completely butted, a feeding gun is matched with the spray pipe to inject a proper amount of tin paste into a pad cavity of the die disc, then a semiconductor refrigerating sheet is matched with a heat conduction pipe to heat the die disc to promote the tin paste to be melted to form a welding spot, then the semiconductor refrigerating sheet is used to refrigerate the die disc to promote the cooling and forming of the welding spot, the melting and cooling operation can be realized in the welding process, the operation is simple, the die disc is used as a welding template to promote the fixed-point forming of the tin paste, the phenomena of false welding and outward protrusion due to excessive welding materials are not easy to cause, and the formed welding spots are independent, the bridging of welding spots is not easy to cause, and the welding quality is improved.

Description

Welding equipment of printed circuit board for manufacturing electrical elements

Technical Field

The invention relates to the technical field of welding and manufacturing of electronic parts and printed circuit boards, in particular to welding equipment of a printed circuit board for manufacturing an electrical element.

Background

Printed circuit boards are important electronic components, support for electronic components, and carriers for electrical interconnection of electronic components. It is called a "printed" circuit board because it is made using electronic printing. The circuit board is not used because it is initially without parts after printing, and electronic parts are required to be soldered to the printed circuit board to constitute an electric component.

At present, most people directly place a printed circuit board on a workbench and then weld electronic parts on the printed circuit board. There are two different welding methods in the prior art: one is to apply solder paste to the printed circuit board and then place the printed circuit board in a reflow oven where it is heated. As the printed circuit board is heated, the solder paste is melted to form a solder joint; and the other is that the melted solder is directly dotted on the printed circuit board to form a welding spot.

The first method is relatively complicated in operation, the second method is relatively simple in operation, but molten solder is directly supplied, if the operation is slightly improper, for example, too much or too little feeding is performed, a phenomenon of insufficient soldering or outward protrusion of the surface of a wrapped soldering point is easily caused, too much solder is used, if the solder overflows a soldering pad, accumulation is caused near the soldering point, bridging is a relatively serious soldering defect, and two soldering points which should not be in electrical connection originally have electrical connection, so that the soldering effect is not ideal.

Therefore, we propose a soldering apparatus for printed circuit board for electric component manufacturing to effectively solve some problems existing in the prior art.

Disclosure of Invention

1. Technical problem to be solved

The invention aims to provide a welding device of a printed circuit board for manufacturing an electrical element, which aims to solve the problems in the prior art, a die disc is arranged at the other end of a spray pipe, a feeding gun is matched with the spray pipe to inject a proper amount of solder paste into a pad cavity of the die disc, a semiconductor refrigerating sheet is used for heating the die disc to promote the solder paste to be melted to form a welding spot, the semiconductor refrigerating sheet is used for refrigerating the die disc to promote the cooling and forming of the welding spot, the die disc is used as a welding template to promote the fixed-point forming of the solder paste, the phenomena of insufficient soldering and outward protrusion due to excessive solder are not easily caused, the formed welding spot is independent, the bridging of the welding spot is not easily caused, and the welding quality is improved.

2. Technical scheme

In order to solve the above problems, the present invention adopts the following technical solutions.

The utility model provides an electrical component makes welding equipment of printed circuit board for manufacturing, including control the platform and install in the control box of controlling a top portion, the top portion of controlling still installs the feed rifle that is connected with the control box, the feed rifle discharge end is connected with the mould dish through the spray tube, the mould dish is inhaled by a pair of tubaeform mould lamella magnetism that rotates the linking and is constituteed, tubaeform mould lamella bottom is equipped with thermal-insulated flexible pad, and form the welding disk chamber between a pair of tubaeform mould lamella, be equipped with the position sleeve on one of them tubaeform mould lamella, be equipped with the refrigeration cover on the position sleeve, the one end that the spray tube kept away from the feed rifle passes through refrigeration cover, position sleeve and extend to welding disk intracavity portion in proper order, refrigeration cover inside is equipped with the installation cavity of setting separately with the spray tube through the arc spacer, inlay through the installation semiconductor refrigeration piece through the baffle in the installation cavity, the baffle divides the installation cavity into heating chamber and refrigeration chamber, refrigeration cover outer wall is equipped with respectively with the heating chamber, The one-way admission valve that the refrigeration chamber is linked together still runs through in the position sleeve and is equipped with the heat pipe that is connected with the mould dish is inside, and the heat pipe upper end is linked together with heating chamber, refrigeration chamber respectively through a pair of thermal-insulated pipe, and a pair of thermal-insulated pipe department all installs the solenoid valve, and keeps away from and be equipped with one-way air outlet valve on the loudspeaker form mould lamella of heat pipe one end department, controls the bench and still be equipped with the spacing anchor clamps that are used for the printed circuit board bearing.

Furthermore, a connecting block is arranged at the rotary joint of the pair of heat-insulating flexible cushions, and the pair of connecting blocks are rotatably connected through a connecting shaft.

Furthermore, the inner walls of the ends, far away from the connecting shaft, of the pair of horn-shaped mould halves are respectively coated with magnetic absorption layers which are magnetically absorbed mutually.

Furthermore, the upper ends of the pair of horn-shaped mould sections are respectively provided with a plugging sleeve which is mutually attached, and the plugging sleeve is provided with an inserting hole.

Furthermore, one section of the spray pipe located inside the positioning sleeve is a rigid pipe, one section of the spray pipe located outside the positioning sleeve is a flexible pipe, and the side wall of the spray pipe located at the top end of the positioning sleeve is provided with a control valve.

Furthermore, a joint rod I is arranged on the outer end wall of the refrigerating sleeve, a lead connected with the semiconductor refrigerating sheet is arranged in the joint rod I, and a storage battery connected with the lead is arranged in the control box.

Furthermore, the top end part of the control table is provided with a hanging hole corresponding to one position of the connecting rod, the conducting wire penetrates through the hanging hole to be connected with the storage battery, the inner wall of the hanging hole is provided with a magnetic suction sheet, and one side wall of the connecting rod is embedded with a magnetic material.

Further, a heat conduction cavity communicated with each other is formed inside the pair of horn-shaped mould sections, heat conduction filler is filled in the heat conduction cavity, and the heat conduction filler comprises porous heat conduction materials and graphite heat conduction particles filled in the porous heat conduction materials.

Furthermore, the inner ends of the pair of horn-shaped mould sections are provided with elastic bag layers, and the elastic bag layers are filled with gas.

Furthermore, the limiting clamp comprises a pair of bearing plates which are slidably connected to the console, a pair of connecting rods II are arranged at the outer ends of the pair of bearing plates, and flexible extrusion bags are arranged at the inner ends of the connecting rods II.

3. Advantageous effects

Compared with the prior art, the invention has the advantages that:

(1) this scheme is through setting up the mould dish at the spray tube other end, the mould dish comprises the loudspeaker form mould lamella that a pair of rotation links up, before welding, place the mould dish in the welding spot that beats in advance and the butt joint is complete, utilize for the material rifle and spray tube cooperation to pour into the pad intracavity of mould dish with the tin cream in proper amount, recycle semiconductor refrigeration piece and heat pipe cooperation, the mould dish is heated, promote the melting of tin cream and form the solder joint, recycle semiconductor refrigeration piece refrigerates the mould dish, in order to promote the cooling shaping of solder joint, can realize the melting in welding process, the cooling operation, moreover, the steam generator is simple in operation, utilize the mould dish as welding stencil, promote the fixed point shaping of tin cream, be difficult for causing the rosin joint and because of the too much outside bulge phenomenon of solder, and the fashioned solder joint is independent, be difficult for causing the bridging of solder joint, improve welding quality.

(2) This scheme all pastes to cover on the one end inner wall that the connecting axle was kept away from to a pair of loudspeaker form mould lamella and inhales the layer with the magnetism that sets up of mutual magnetism, sets the mould dish to a pair of loudspeaker form mould lamella of rotatable linking, and on the one hand is after the welding is accomplished, and one of them loudspeaker form mould lamella is opened in the external rotation, can dismantle the mould dish from the solder joint, and on the other hand is in the welding front, easily locates the participating in outside of electronic component with the mould dish cover, and magnetism is inhaled and is set up the fixed linking of easily a pair of loudspeaker form mould lamella.

(3) This scheme all is equipped with the shutoff cover of laminating each other in the upper end of a pair of loudspeaker form lamella, the patchhole has been seted up on the shutoff cover, when installing electronic component, participate in electronic component and insert through the shutoff cover and locate in the welding hole, when needs carry out electric connection to two electronic component, can insert the laminating printed circuit board of participating in of two electronic component respectively and locate in the different welding hole, participate in two again and be connected through conductive pin, conductive pin runs through the shutoff cover and inserts equally and locate in the welding hole, and will insulate against heat the flexible pad and set flexible structure into, easily insulate against heat the flexible pad and participate in the flexible linking with electronic component, it participates in the flexible sealed linking back with electronic component to insulate against heat the flexible pad, difficult lead to the fact the tin cream to spill over from the pad intracavity.

(4) The scheme is that a first connecting rod is arranged on the outer end wall of a refrigeration sleeve, a lead connected with a semiconductor refrigeration piece is arranged in the first connecting rod, a storage battery connected with the lead is installed in a control box, a hanging hole corresponding to the position of the first connecting rod is formed in the top end portion of a control table, the lead penetrates through the hanging hole and is connected with the storage battery, a magnetic suction piece is arranged on the inner wall of the hanging hole, a magnetic material is embedded in the side wall of the first connecting rod, and when the refrigerator is not used, the first connecting rod and a mold disc at the bottom end of the first connecting rod are easily hung at the top of the control table.

(5) This scheme all sets up the heat conduction chamber of mutual intercommunication in a pair of loudspeaker form mould lamella is inside, and the heat conduction intracavity is filled has the heat conduction filler, and the heat conduction filler includes porous heat conduction material and fills in the inside graphite heat conduction granule of porous heat conduction material, improves the heat conduction effect, is favorable to the quick switching of refrigeration, heating.

(6) This scheme all sets up elasticity bag layer in the inner of a pair of loudspeaker form mould lamella, and elasticity bag in situ portion fills has gas, when heating, does benefit to and improves the heat conduction effect, and when the cooling, gaseous because of cooling shrinkage, easily elasticity bag layer breaks away from the solder joint.

(7) Spacing anchor clamps in this scheme include that the slip links up in controlling a pair of bearing plate on the bench, and the outer end of a pair of bearing plate all is equipped with a pair of pole two that links up, and the inner of pole two that links up is equipped with the flexonics bag, utilizes the autoslide of a pair of bearing plate to be suitable for and carry on spacingly to the printed circuit board of different footpath sizes, the flexonics bag directly squeezes the contact with printed circuit board, plays the guard action.

Drawings

FIG. 1 is a first diagram illustrating a state of the present invention during welding;

FIG. 2 is a partially broken away view of the combination of the die plate and the locating sleeve of the present invention;

FIG. 3 is a schematic structural view of the joint between the mold plate and the positioning sleeve;

FIG. 4 is a second diagram illustrating the state of the present invention during welding;

FIG. 5 is an enlarged partial schematic view of the die plate of FIG. 4 in an open position;

FIG. 6 is a third schematic view of the present invention in a welding state;

FIG. 7 is an enlarged partial schematic view of the die plate of FIG. 6 in a closed position;

FIG. 8 is an inside view of the combination of the die plate and the locating sleeve of the present invention;

FIG. 9 is an internal view of the mold plate and locating sleeve combination of the present invention;

FIG. 10 is a schematic diagram of the difference between a qualified spot welded according to the present invention and an unqualified spot welded according to the present invention.

The reference numbers in the figures illustrate:

the device comprises a control table 1, a feeding gun 2, a spray pipe 3, a mould disc 4, a trumpet-shaped mould clack 401, an elastic bag 4011 layer, a heat insulation flexible pad 402, a sealing sleeve 403, a heat conduction filler 404, a positioning sleeve 5, a refrigeration sleeve 501, a first connecting rod 6, a first lead 7, a bearing plate 8, a second connecting rod 9, a flexible extrusion bag 10, a semiconductor refrigeration sheet 11 and a heat conduction pipe 12.

Detailed Description

The drawings in the embodiments of the invention will be combined; the technical scheme in the embodiment of the invention is clearly and completely described; obviously; the described embodiments are only some of the embodiments of the invention; but not all embodiments, are based on the embodiments of the invention; all other embodiments obtained by a person skilled in the art without making any inventive step; all fall within the scope of protection of the present invention.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "top/bottom", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "sleeved/connected," "connected," and the like are to be construed broadly, e.g., "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Example 1:

referring to fig. 1-3, a welding device for a printed circuit board for manufacturing an electrical component includes a console 1 and a control box installed on a top portion of the console 1, a feeding gun 2 connected to the control box is further installed on the top portion of the console 1, a discharging end of the feeding gun 2 is connected to a mold 4 through a nozzle 3, the mold 4 is magnetically attracted by a pair of horn-shaped mold sections 401 rotatably connected to each other, a connecting block is disposed at a position where a pair of heat-insulating flexible pads 402 are rotatably connected to each other, the connecting blocks are rotatably connected to each other through a connecting shaft, and a magnetic attraction layer is attached to an inner wall of one end of each pair of horn-shaped mold sections 401, which is far away from the connecting shaft, so that the mold 4 can be easily detached and installed.

Referring to fig. 3-6, a heat insulation flexible pad 402 is disposed at the bottom end of a horn-shaped mold section 401, a solder pad cavity is formed between a pair of horn-shaped mold sections 401, a positioning sleeve 5 is disposed on one horn-shaped mold section 401, a cooling sleeve 501 is disposed on the positioning sleeve 5, one end of a nozzle 3 away from a feeding gun 2 sequentially penetrates through the cooling sleeve 501 and the positioning sleeve 5 and extends into the solder pad cavity, when an electronic component is mounted, a hole is formed at a specific position on a printed circuit board to form a solder hole, a mold 4 is attached to the printed circuit board and placed outside the solder hole, the feeding gun 2 and the nozzle 3 are matched to inject solder paste into the solder pad cavity, the feeding gun 2 performs an intelligent feeding operation through a control box, as in the prior art, the solder paste is melted and then formed into a solder joint, the mold 4 is configured into a pair of horn-shaped mold sections 401 which are rotatably connected, on one hand, after the welding is completed, one of them loudspeaker form mould lamella 401 is opened in the rotation outwards, easily dismantles mould 4 from the solder joint, and on the other hand is when the welding, establishes the relation and can carry out nimble adjustment to the cover between mould 4 and the electronic component of treating the installation, and magnetism is inhaled and is set up the fixed linking of easily a pair of loudspeaker form mould lamella 401.

Referring to fig. 5 and 7, the upper ends of a pair of horn-shaped mold sections 401 are respectively provided with a plugging sleeve 403 which is attached to each other, the plugging sleeve 403 is provided with an insertion hole, pins of an electronic component to be welded are inserted into the welding holes through the plugging sleeve 403, when the two electronic components need to be electrically connected, the pins of the two electronic components can be respectively attached to a printed circuit board and inserted into different welding holes, and then the two pins are connected through conductive pins which penetrate through the plugging sleeve 403 and are also inserted into the welding holes, the conductive pins are made of conductive materials to realize the electrical connection of the two electronic components, the heat-insulating flexible pad 402 is set to be a flexible structure, the heat-insulating flexible pad 402 is easily flexibly connected with the pins of the electronic component, and after the heat-insulating flexible pad 402 is flexibly sealed and connected with the electronic component, solder paste is not easily overflowed from the pad cavity.

One section that spray tube 3 is located 5 inside of position sleeve is rigid pipe, one section that spray tube 3 is located the 5 outsides of position sleeve is soft pipe, and the lateral wall that spray tube 3 is located 5 top portions of position sleeve installs the control valve, through the cooperation of control valve and feed rifle 2, realizes pouring into appropriate amount tin cream for the pad intracavity, and adopts soft pipe, is favorable to the technical staff when handheld refrigeration cover 501, conveniently carries out welding operation to the welding hole of different positions.

Referring to fig. 7-9, an installation cavity separated from the spray pipe 3 is formed in the refrigeration sleeve 501 through an arc-shaped spacer, a semiconductor refrigeration piece 11 is embedded in the installation cavity through a partition plate, a connecting rod one 6 is arranged on the outer end wall of the refrigeration sleeve 501, a lead 7 connected with the semiconductor refrigeration piece 11 is arranged in the connecting rod one 6, the lead 7 penetrates through the top of the console 1 and is connected with a control box, a storage battery connected with the lead 7 is installed in the control box, the semiconductor refrigeration piece 11 is powered by the lead 7, the installation cavity is separated into a heating cavity and a refrigeration cavity by the partition plate, the refrigeration end of the semiconductor refrigeration piece 11 is communicated with the refrigeration cavity, the heating end of the semiconductor refrigeration piece 11 is communicated with the heating cavity, and the heating end and the heating cavity are not interfered with each other;

the outer wall of the refrigeration sleeve 501 is respectively provided with a one-way air inlet valve communicated with the heating cavity and the refrigeration cavity, the positioning sleeve 5 is internally provided with a heat conduction pipe 12 communicated with the interior of the mould 4 in a penetrating way, the upper end of the heat conduction pipe 12 is respectively communicated with the heating cavity and the refrigeration cavity through a pair of heat insulation guide pipes, the pair of heat insulation guide pipes are respectively provided with an electromagnetic valve, the heat insulation guide pipes are made of heat insulation materials and have heat insulation performance, when the electromagnetic valves at the two heat insulation guide pipes are switched on and off, heating and refrigerating channels can be switched quickly, a one-way air outlet valve is arranged on the horn-shaped mould valve 401 at one end far away from the heat conduction pipe 12, by utilizing the one-way circulation of air, when heating, the heated air is guided into the mould 4 through the heat conduction pipe 12 to extrude cold air in the mould 4, when refrigerating, the cooled air is guided into the mould 4 to extrude hot air in the mould 4, thereby improving the heating performance, The refrigeration effect, in turn, enables a faster heat transfer, where it is necessary to supplement that the skilled person can install a micro air intake pump at the one-way air intake valve to speed up the gas circulation.

Referring to fig. 9, heat conducting cavities communicated with each other are formed inside a pair of horn-shaped mold sections 401, heat conducting fillers 404 are filled in the heat conducting cavities, each heat conducting filler 404 includes a porous heat conducting material and graphite heat conducting particles filled in the porous heat conducting material, so that a heat conducting effect is easily improved, after solder paste is filled in a pad cavity of a mold 4, an electromagnetic valve at a heat insulating conduit connected with a heating cavity is opened, heat is transferred into the heat conducting cavities by using the cooperation of a semiconductor refrigerating sheet 11 and a heat conducting pipe 12, so that solder paste in the pad cavity is melted to form a welding spot, after the solder paste is completely melted, the electromagnetic valve is closed, the electromagnetic valve at the heat insulating conduit connected with the refrigerating cavity is opened, so that the inside of the mold 4 is refrigerated, the cooling of the welding spot is promoted, the welding efficiency is improved, and after the welding spot is cooled, the mold 4 is outwardly removed.

A pair of loudspeaker form mould section 401's the inner all is equipped with elasticity cyst layer 4011, elasticity cyst layer 4011 adopts elasticity heat conduction material to make, the inside packing of elasticity cyst layer 4011 has gas, when heating, do benefit to and improve heat conduction effect, when the cooling, the inside gas of elasticity cyst layer 4011 is because of cooling shrinkage, elasticity cyst layer 4011 receives cold contraction, easily elasticity cyst layer 4011 breaks away from the solder joint, technical staff in the art still can scribble the release agent on elasticity cyst layer 4011 inner wall, easily desorption.

Please refer to fig. 1, it should be added that a hanging hole corresponding to a position of a connecting rod 6 is formed at a top end of the console 1, a lead 7 is connected to the battery through the hanging hole, a magnetic sheet is disposed on an inner wall of the hanging hole, a magnetic material is embedded in a side wall of the connecting rod 6, when the console is not in use, the connecting rod 6 and a mold 4 at a bottom end thereof are easily hung at the top of the console 1, which is not explicitly marked in the drawing.

The control platform 1 is further provided with a limiting clamp for supporting the printed circuit board, the limiting clamp comprises a pair of bearing plates 8 which are connected to the control platform 1 in a sliding mode, the bearing plates 8 can be adjusted in a displacement mode through electric push rods, a pair of linking rods two 9 are arranged at the outer ends of the pair of bearing plates 8, flexible extrusion bags 10 are arranged at the inner ends of the linking rods two 9, the printed circuit boards with different sizes are limited by the aid of automatic sliding of the pair of bearing plates 8, and the flexible extrusion bags 10 are in direct extrusion contact with the printed circuit boards to achieve a protection effect.

Compared with the prior art, the device aims at the welding equipment and the method of the printed circuit board, the device arranges the die disc 4 at the other end of the spray pipe 3, the die disc 4 consists of a pair of horn-shaped die sections 401 which are connected in a rotating way, the die disc 4 which is completely butted is arranged at a welding hole which is punched in advance, the material feeding gun 2 is matched with the spray pipe 3 to inject a proper amount of solder paste into a pad cavity of the die disc 4, the semiconductor refrigerating sheet 11 is matched with the heat conduction pipe 12 to transfer heat into the heat conduction cavity to promote the solder paste in the pad cavity to be melted to form a welding spot, after the solder paste is completely melted, the semiconductor refrigerating sheet 11 is used to refrigerate the interior of the die disc 4 to promote the cooling and forming of the welding spot, the operation is simple, the die disc 4 is used as a template to promote the forming of the solder paste, the false soldering is not easy to cause and the welding spot is not easy to bulge outwards due to too much solder, and the formed welding spot is independent, the bridging of welding spots is not easy to cause, and the welding quality is improved.

The components used in the present invention are all standard components or components known to those skilled in the art, and the structure and principle thereof can be known to those skilled in the art through technical manuals or through routine experiments.

The above; but are merely preferred embodiments of the invention; the scope of the invention is not limited thereto; any person skilled in the art is within the technical scope of the present disclosure; the technical scheme and the improved concept of the invention are equally replaced or changed; are intended to be covered by the scope of the present invention.

Claims

1. A welding equipment of printed circuit board for manufacturing electric elements, comprising a console (1) and a control box installed at the top end part of the console (1), characterized in that: the control device is characterized in that a feeding gun (2) connected with a control box is further mounted at the top end of the control platform (1), a die disc (4) is connected to the discharge end of the feeding gun (2) through a spray pipe (3), the die disc (4) is formed by a pair of horn-shaped die plates (401) which are rotatably connected through magnetic attraction, a heat insulation flexible pad (402) is arranged at the bottom end of each horn-shaped die plate (401), a welding disc cavity is formed between each pair of horn-shaped die plates (401), a positioning sleeve (5) is arranged on one horn-shaped die plate (401), a refrigerating sleeve (501) is arranged on each positioning sleeve (5), and one end, far away from the feeding gun (2), of each spray pipe (3) penetrates through the refrigerating sleeve (501) and the positioning sleeve (5) in sequence and extends into the welding disc cavity;

the inside installation cavity that separates the setting through arc spacer with spray tube (3) that is equipped with of refrigeration cover (501), inlay through the baffle in the installation cavity and establish and install semiconductor refrigeration piece (11), the baffle separates into heating chamber and refrigeration chamber with the installation cavity, and the refrigeration end and the refrigeration chamber of semiconductor refrigeration piece (11) are linked together, and the end and the chamber of heating of semiconductor refrigeration piece (11) are linked together, refrigeration cover (501) outer wall is equipped with respectively with the one-way admission valve that heats chamber, refrigeration chamber and is linked together, still run through in position sleeve (5) and be equipped with heat pipe (12) that are connected with mould dish (4) inside, heat pipe (12) upper end is linked together with heating chamber, refrigeration chamber respectively through a pair of thermal-insulated pipe, and a pair of thermal-insulated pipe department all installs the solenoid valve, and keep away from being equipped with one-way air outlet valve on loudspeaker form mould lamella (401) of heat pipe (12) one end department, the control platform (1) is further provided with a limiting clamp for supporting the printed circuit board, the upper ends of the horn-shaped mould sections (401) are provided with plugging sleeves (403) which are attached to each other, and the plugging sleeves (403) are provided with insertion holes.

2. The soldering apparatus for a printed circuit board for electric component manufacture according to claim 1, wherein: the rotary joint of the pair of heat-insulating flexible cushions (402) is provided with a joint block, and the joint blocks are rotatably connected through a connecting shaft.

3. The soldering apparatus for a printed circuit board for electric component manufacture according to claim 2, wherein: and magnetic absorption layers which are arranged in a magnetic absorption mode are attached to the inner walls of the ends, far away from the connecting shaft, of the pair of horn-shaped mould halves (401).

4. The soldering apparatus for a printed circuit board for electric component manufacture according to claim 1, wherein: one section that spray tube (3) are located position sleeve (5) inside is rigid pipe, one section that spray tube (3) are located the position sleeve (5) outside is soft pipe, the lateral wall that spray tube (3) are located position sleeve (5) top portion installs the control valve.

5. The soldering apparatus for a printed circuit board for electric component manufacture according to claim 1, wherein: the refrigeration device is characterized in that a joint rod I (6) is arranged on the outer end wall of the refrigeration sleeve (501), a lead (7) connected with the semiconductor refrigeration sheet (11) is arranged in the joint rod I (6), and a storage battery connected with the lead (7) is installed in the control box.

6. The soldering apparatus for a printed circuit board for electric component manufacture according to claim 5, wherein: the top end of the console (1) is provided with a hanging hole corresponding to the position of the joint rod I (6), the lead (7) penetrates through the hanging hole to be connected with the storage battery, the inner wall of the hanging hole is provided with a magnetic suction sheet, and the side wall of the joint rod I (6) is embedded with a magnetic material.

7. The soldering apparatus for a printed circuit board for electric component manufacture according to claim 1, wherein: the pair of horn-shaped mould halves (401) are internally provided with heat conducting cavities which are communicated with each other, heat conducting fillers (404) are filled in the heat conducting cavities, and each heat conducting filler (404) comprises a porous heat conducting material and graphite heat conducting particles filled in the porous heat conducting material.

8. The soldering apparatus for a printed circuit board for electric component manufacture according to claim 1, wherein: the inner ends of the horn-shaped mould sections (401) are provided with elastic bag layers (4011), and gas is filled in the elastic bag layers (4011).

9. The soldering apparatus for a printed circuit board for electric component manufacture according to claim 1, wherein: the limiting clamp comprises a pair of bearing plates (8) which are connected to the console (1) in a sliding mode, a pair of connecting rods (9) are arranged at the outer ends of the bearing plates (8), and flexible squeezing bags (10) are arranged at the inner ends of the connecting rods (9).