CN110653439B - Printed circuit board soldering system - Google Patents
Printed circuit board soldering system Download PDFInfo
- Publication number
- CN110653439B CN110653439B CN201910780917.0A CN201910780917A CN110653439B CN 110653439 B CN110653439 B CN 110653439B CN 201910780917 A CN201910780917 A CN 201910780917A CN 110653439 B CN110653439 B CN 110653439B
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- CN
- China
- Prior art keywords
- tin
- cylinder
- soldering iron
- suction pipe
- air suction
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a soldering tin system of a printed circuit board, which structurally comprises a tin feeder, a cylinder, a soldering iron assembly, a cleaner, a teaching box, a machine body, a jig and a moving shaft, wherein the jig is arranged in the middle of the top end surface of the machine body, the cleaner and the teaching box are arranged on one side of the jig, the cleaner is arranged right below the moving shaft, the tin feeder and the cylinder are arranged on the moving shaft, the tin feeder is arranged right above the cylinder, the soldering iron assembly is fixed on the moving shaft, and the soldering iron assembly, the tin feeder and the cylinder are communicated through a pipeline.
Description
Technical Field
The invention relates to the field of circuit boards, in particular to a printed circuit board soldering tin system.
Background
The soldering tin essence of circuit board forms the metallurgical connection between the metal substrate, maintain its chemical property of stabilizing it behind the soldering tin, printed circuit board often has the solder ball to exist on the surface of soldering iron after soldering tin finishes, it is liquid under high temperature state, can influence next soldering tin, can adopt rosin paste to get rid of usually, but rosin paste is heated and can produce toxic gas with the tin contact, need take the protecting mask, still let be infected with rosin on the soldering iron easily, soldering tin can be infected with the surface at the tin point, lead to the tin point grey dark dull lustrous that the welding came out.
Disclosure of Invention
Aiming at the defects of the prior art, the invention is realized by the following technical scheme: the utility model provides a printed circuit board soldering tin system, its structure is including sending tin ware, cylinder, flatiron subassembly, purger, teaching box, organism, smelting tool, removal axle, settle in the middle of organism top face is positive has the smelting tool, one side of smelting tool is equipped with purger, teaching box, the purger is located under the removal axle, remove epaxial installation and send tin ware, cylinder, send the tin ware to be located directly over the cylinder, the flatiron subassembly is fixed epaxially in the removal, the flatiron subassembly with send tin ware, cylinder to pass through the pipeline intercommunication.
As a further optimization of the technical scheme, the soldering iron assembly comprises an inlet pipe orifice, a sleeve and a soldering iron head, wherein the soldering iron head is sleeved with the sleeve, the topmost end of the sleeve is the inlet pipe orifice, and the soldering iron head is communicated with the tin feeder and the air cylinder.
As a further optimization of the technical scheme, the soldering iron head comprises a sharp nozzle, a tin sucker, an air pipeline and a cylinder, wherein the tin sucker is arranged at one end of the cylinder and is in threaded connection with the cylinder, the sharp nozzle is arranged at the other end of the tin sucker, the sharp nozzle is communicated with the tin sucker, and the air pipeline is communicated with the pipeline.
As a further optimization of the technical scheme, the tip nozzle is of a conical structure, the middle of the tip nozzle is provided with an air suction pipe, and the air suction pipe is communicated with the tin sucker.
As the further optimization of this technical scheme, tin sucker comprises receiving tin chamber, tympanic membrane, the body of revolving, air vent, the body of revolving is the cylinder, revolve the body in the middle of for receiving the tin chamber, the bottom of receiving the tin chamber is equipped with an air vent, air vent and gas pipe intercommunication, receive tin intracavity top and install the tympanic membrane.
As a further optimization of the technical scheme, the contour of the tin containing cavity is a hemisphere.
As a further optimization of the technical scheme, the drumhead is composed of fiber rods and a drumhead, more than two fiber rods are arranged on the drumhead, the fiber rods are uniformly distributed and support the drumhead together, and the fiber rods are made of copper materials.
As a further optimization of the technical scheme, the length of the air suction pipe is greater than the highest height of the sharp nozzle, and the tail end of the air suction pipe is inserted into the tin containing cavity.
Advantageous effects
Compared with the prior art, the printed circuit board soldering system has the following advantages:
1. the air cylinder is mainly used for extracting air in the tin suction device, so that the negative pressure phenomenon near the sharp nozzle is more obvious, liquid tin solder beads can be sucked, and the adverse effect of the liquid tin solder beads on the next tin soldering is prevented.
2. The conical structural design of the sharp nozzle facilitates the sliding of the liquid solder ball to the position of the air suction pipe along the surface of the sharp nozzle under the vertical state of the soldering bit, thereby improving the receiving and sucking effects.
3. The size of the air suction pipe is designed, so that the liquid soldering tin beads entering the tin containing cavity are suspended at the port of the air suction pipe due to the height difference between the air suction pipe and the bottom surface of the sharp nozzle, the liquid soldering tin beads are not easy to be reversely discharged, and the air suction pipe cannot be blocked.
4. According to the hemispherical design of the tin containing cavity, the liquid solder balls can slide along the inner wall of the tin containing cavity after entering, and the fiber rod of the tympanic membrane is made of copper, so that the liquid solder balls are convenient to adhere and are not easy to flow, and the storage effect is improved.
Drawings
Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:
fig. 1 is a schematic perspective view of a soldering system for a printed circuit board according to the present invention.
Fig. 2 is a schematic perspective view of the soldering iron assembly according to the present invention.
Fig. 3 is a cross-sectional schematic view of the soldering iron assembly of the present invention.
FIG. 4 is a cross-sectional view of the solder sucker.
FIG. 5 is a cross-sectional view of the solder sucker.
Fig. 6 is a schematic perspective view of the air intake duct of the present invention.
Fig. 7 is a schematic plan view of a tympanic membrane according to the present disclosure.
In the figure: the soldering iron comprises a tin feeder 1, a cylinder 2, a soldering iron assembly 3, a cleaner 4, a teaching box 5, a machine body 6, a smelting tool 7, a moving shaft 8, a pipe inlet 31, a sleeve 32, a soldering iron head 33, a tip a, a tin sucker b, an air pipeline c, a cylinder d, an air suction pipe a1, a tin containing cavity b1, an eardrum b2, a rotary body b3, an air vent b4, a fiber rod b2-1 and a drum surface b 2-2.
Detailed Description
In order to make the technical means, the original characteristics, the achieved purposes and the effects of the invention easy to understand, the following description and the accompanying drawings further illustrate the preferred embodiments of the invention.
Examples
Referring to fig. 1-7, the invention provides a printed circuit board soldering system, which structurally comprises a tin feeder 1, a cylinder 2, a soldering iron assembly 3, a cleaner 4, a teaching box 5, a machine body 6, a jig 7 and a moving shaft 8, wherein the jig 7 is arranged in the middle of the top end surface of the machine body 6, the cleaner 4 and the teaching box 5 are arranged on one side of the jig 7, the cleaner 4 is positioned under the moving shaft 8, the tin feeder 1 and the cylinder 2 are mounted on the moving shaft 8, the tin feeder 1 is positioned above the cylinder 2, the soldering iron assembly 3 is fixed on the moving shaft 8, and the soldering iron assembly 3 is communicated with the tin feeder 1 and the cylinder 2 through pipelines.
The soldering iron assembly 3 is composed of a pipe inlet 31, a sleeve 32 and a soldering iron head 33, the sleeve 32 is sleeved on the soldering iron head 33, the pipe inlet 31 is arranged at the topmost end of the sleeve 32, and the soldering iron head 33 is communicated with the tin feeder 1 and the cylinder 2.
The soldering iron head 33 is composed of a tip a, a tin absorber b, an air pipeline c and a cylinder d, the cylinder d is provided with the air pipeline c, one end of the cylinder d is provided with the tin absorber b, the tin absorber b is in threaded connection with the cylinder d, the tip a is installed at the other end of the tin absorber b, the tip a is communicated with the tin absorber b, and the air pipeline c is communicated with the pipeline.
The tip mouth a is in a conical structure, the air suction pipe a1 is arranged in the middle of the tip mouth a, the air suction pipe a1 is communicated with the tin sucker b, tin is in a molten liquid state after soldering is finished, and the tin can slide to the position of the air suction pipe a1 along the surface of the tip mouth a in a vertical state of the soldering iron head 33, so that air suction and recovery are facilitated.
Tin sucker b comprises tin chamber b1, tympanic membrane b2, spiral body b3, air vent b4, spiral body b3 is the cylinder, spiral body b3 is in the middle of exactly for receiving tin chamber b1, the bottom of receiving tin chamber b1 is equipped with an air vent b4, air vent b4 and trachea c intercommunication, receive tin chamber b1 in the top install tympanic membrane b 2.
The tin containing cavity b1 is hemispherical in outline, and after the tin is sucked in through negative pressure, the tin is not easy to stick to the outside, and can slide along the inner wall of the tin containing cavity b1, so that the problem of blockage of the air suction pipe a1 is avoided.
The tympanic membrane b2 comprises a fiber rod b2-1 and a drumhead b2-2, wherein more than two fiber rods b2-1 are arranged on the drumhead b2-2, the fiber rods b2-1 are uniformly distributed and jointly support the drumhead b2-2, the fiber rods b2-1 are made of copper materials, soldering tin can adhere to the copper, and the adsorption is good and cannot flow around.
The length of the air suction pipe a1 is greater than the highest height of the tip a, so that the tail end of the air suction pipe a1 extends into the tin containing cavity b1, and the solder cannot easily slide out of the air suction pipe a1 again once entering the tin containing cavity b1 due to the height difference between the air suction pipe a1 and the bottom surface of the tip a, and the next solder is influenced.
After soldering, the surface of the soldering iron head of the printed circuit board is always provided with solder balls which are in a liquid state under a high temperature state, the air cylinder 2 operates to extract air from the tympanic membrane b2 of the tin receiving cavity b1 away from the bottom of the tin receiving cavity b1 through an air pipeline, the tympanic membrane b2 deforms, and air inside the air suction pipe a1 is also synchronously extracted, because the tip a is in a conical structure, the tin is in a molten liquid state after soldering is finished, the soldering iron head 33 can slide to the position of the air suction pipe a1 along the surface of the tip a under a vertical state, the liquid solder balls are sucked into the tin receiving cavity b1 from the air suction pipe a1 under negative pressure, firstly, the contour of the tin receiving cavity b1 is a semi-sphere, the solder balls slide along the inner wall of the tin receiving cavity b1, secondly, once the solder balls enter the tin receiving cavity b1, the solder balls are difficult to go out from the air suction pipe a1 again, and the height difference between the bottom surface 1 of the air suction pipe a and, the port of the air suction pipe a1 is in a suspended state, soldering tin is not easy to go out, liquid soldering tin beads entering the tin accommodating cavity b1 fall on the tympanic membrane b2, the fiber rod b2-1 made of copper materials is adopted, the soldering tin can be adhered to copper, the adsorbability is good, the flowing around is avoided, and the storage effect of the liquid soldering tin beads is improved.
While there have been shown and described what are at present considered the fundamental principles of the invention, the essential features and advantages thereof, it will be understood by those skilled in the art that the present invention is not limited by the embodiments described above, which are merely illustrative of the principles of the invention, but rather, is capable of numerous changes and modifications in various forms without departing from the spirit or essential characteristics thereof, and it is intended that the invention be limited not by the foregoing descriptions, but rather by the appended claims and their equivalents.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (1)
1. A printed circuit board soldering system is characterized in that: the tin soldering iron comprises a tin feeding device (1), a cylinder (2), a soldering iron assembly (3), a cleaning device (4), a teaching box (5), a machine body (6), a smelting tool (7) and a moving shaft (8), wherein the smelting tool (7) is arranged in the middle of the top end surface of the machine body (6), the cleaning device (4) and the teaching box (5) are arranged on one side of the smelting tool (7), the cleaning device (4) is positioned under the moving shaft (8), the tin feeding device (1) and the cylinder (2) are arranged on the moving shaft (8), the tin feeding device (1) is positioned right above the cylinder (2), the soldering iron assembly (3) is fixed on the moving shaft (8), and the soldering iron assembly (3) is communicated with the tin feeding device (1) and the cylinder (2) through pipelines; the soldering iron assembly (3) consists of a pipe inlet (31), a sleeve (32) and a soldering iron head (33), the sleeve (32) is sleeved on the soldering iron head (33), the pipe inlet (31) is formed in the topmost end of the sleeve (32), and the soldering iron head (33) is communicated with the tin feeder (1) and the cylinder (2); the soldering iron head (33) consists of a sharp nozzle (a), a tin absorber (b), an air pipeline (c) and a cylinder (d), wherein the cylinder (d) is provided with the air pipeline (c), one end of the cylinder (d) is provided with the tin absorber (b), and the other end of the tin absorber (b) is provided with the sharp nozzle (a); the tip (a) is of a conical structure, the middle of the tip (a) is provided with an air suction pipe (a1), and the air suction pipe (a1) is communicated with the tin sucker (b); the tin sucker (b) comprises a tin containing cavity (b1), a tympanic membrane (b2), a rotary body (b3) and a vent hole (b4), wherein the rotary body (b3) is a cylinder, the tin containing cavity (b1) is arranged in the middle of the rotary body (b3), the bottom of the tin containing cavity (b1) is provided with the vent hole (b4), the vent hole (b4) is communicated with a gas pipeline (c), and the top of the tin containing cavity (b1) is provided with the tympanic membrane (b 2); the tin containing cavity (b1) is hemispherical in outline; the tympanic membrane (b2) consists of a fiber rod (b2-1) and a drumhead (b2-2), wherein the drumhead (b2-2) is provided with more than two fiber rods (b2-1) which support the drumhead (b2-2) together; the length of the air suction pipe (a1) is greater than the highest height of the tip (a);
the surface of the soldering iron head of the printed circuit board after soldering is finished usually has solder balls which are in liquid state under the high temperature state, the air cylinder (2) is operated to extract air of a tympanic membrane (b2) of a tin receiving cavity (b1) from the bottom of the tin receiving cavity (b1) through an air pipeline, the tympanic membrane (b2) deforms and also synchronously extracts air in the air suction pipe (a1), because the tip (a) is in a conical structure, tin is in molten liquid state after soldering is finished, the soldering iron head (33) can slide to the position of the air suction pipe (a1) along the surface of the tip (a) under the vertical state, the liquid solder balls can be sucked into the tin receiving cavity (b1) from the air suction pipe (a1) under the negative pressure state, firstly, the tin receiving cavity (b1) is in a hemispherical shape, the solder balls can slide along the inner wall of the tin receiving cavity (b1) after entering, and secondly, once the solder balls enter the tin receiving cavity (b1), the solder can not easily go out from the air suction pipe (a1) again, the height difference between the bottom surfaces of the air suction pipe (a1) and the sharp nozzle (a) is small, the port of the air suction pipe (a1) is in a suspended state, the solder can not easily go out, the liquid solder ball finally entering the tin containing cavity (b1) can fall on the tympanic membrane (b2), the fiber rod (b2-1) made of copper material is adopted, the solder can be adhered on the copper, the adsorbability is good, the liquid solder ball can not flow around, and the storage effect of the liquid solder ball is improved.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910780917.0A CN110653439B (en) | 2019-08-22 | 2019-08-22 | Printed circuit board soldering system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910780917.0A CN110653439B (en) | 2019-08-22 | 2019-08-22 | Printed circuit board soldering system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110653439A CN110653439A (en) | 2020-01-07 |
| CN110653439B true CN110653439B (en) | 2021-06-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910780917.0A Active CN110653439B (en) | 2019-08-22 | 2019-08-22 | Printed circuit board soldering system |
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| CN (1) | CN110653439B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113369628B (en) * | 2021-08-12 | 2021-10-26 | 南通丰页印刷机械有限公司 | Welding equipment of printed circuit board for manufacturing electrical elements |
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| CN205967723U (en) * | 2016-08-30 | 2017-02-22 | 东莞市德尔能新能源股份有限公司 | Full automatic welding tin welding equipment |
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| TWI232846B (en) * | 2002-12-20 | 2005-05-21 | Ind Tech Res Inst | Structure and method for micro-structure |
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| CN208743869U (en) * | 2018-07-13 | 2019-04-16 | 深圳润通智能科技有限公司 | A kind of novel tin soldering machine |
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| CN110653439A (en) | 2020-01-07 |
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