CN113365434B - New energy automobile lithium battery, circuit board and manufacturing method thereof - Google Patents
New energy automobile lithium battery, circuit board and manufacturing method thereof Download PDFInfo
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- CN113365434B CN113365434B CN202110615998.6A CN202110615998A CN113365434B CN 113365434 B CN113365434 B CN 113365434B CN 202110615998 A CN202110615998 A CN 202110615998A CN 113365434 B CN113365434 B CN 113365434B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
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Abstract
The application provides a lithium battery and a circuit board of a new energy automobile and a manufacturing method of the lithium battery and the circuit board. The manufacturing method of the circuit board comprises the following steps: carrying out surface treatment on the semi-finished product circuit board; carrying out molding processing on the semi-finished circuit board after surface treatment; carrying out electrical test on the molded semi-finished circuit board; performing deionization washing operation on the semi-finished circuit board after the electrical property test; carrying out adhesive tape sticking operation on the semi-finished product circuit board subjected to the deionization washing operation; performing quality inspection on the semi-finished circuit board after the operation of sticking the adhesive tape; and packaging the semi-finished circuit board after the quality inspection to obtain the circuit board. When the bonding pad is used, the adhesive tape can be used after being torn, and meanwhile the adhesive tape can be used for cleaning the bonding pad when being bonded and separated with the bonding pad, so that the stability and the conductivity of bonding connection of the bonding pad are improved, and the problem that the stability of the bonding connection of the bonding pad is poor or even the bonding pad fails is solved.
Description
Technical Field
The invention relates to the technical field of circuit board manufacturing, in particular to a lithium battery of a new energy automobile, a circuit board and a manufacturing method of the lithium battery.
Background
Modern automobiles have been developed from complete mechanization in the past into mechanical and electronic combination, and from a simple vehicle, a multifunctional platform integrating transportation, entertainment, office and the like is formed. The cost of the automotive electronics occupying the whole vehicle is increasing, such as a vehicle body sensor, a GPS navigation, an automotive instrument panel, a central control, a vehicle lamp and an engine. With the development of automobiles towards two important directions of new energy automobiles and automatic driving systems, the domestic requirements of the automobile printed circuit board on new energy automobile power systems and ADAS systems are greatly increased.
The traditional manufacturing method of the printed circuit board directly packages and delivers after the step of deionized water, and the cleanliness of the bonding pad of the manufactured printed circuit board does not reach the requirement of less than or equal to 10RFU, so that the stability of the bonding connection of the bonding pad is poor and even the bonding pad fails.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provides a lithium battery and a circuit board of a new energy automobile with good stability of bonding connection of a bonding pad and a manufacturing method of the lithium battery and the circuit board.
The purpose of the invention is realized by the following technical scheme:
a method of manufacturing a wiring board, comprising:
carrying out surface treatment on the semi-finished product circuit board;
carrying out forming processing on the semi-finished circuit board after surface treatment;
carrying out electrical test on the molded semi-finished circuit board;
performing deionization washing operation on the semi-finished circuit board after the electrical property test;
carrying out tape pasting operation on the semi-finished circuit board subjected to the deionization washing operation;
performing quality inspection on the semi-finished circuit board subjected to the tape pasting operation;
and packaging the semi-finished circuit board after the quality inspection to obtain the circuit board.
In one embodiment, the step of surface treating the semi-finished circuit board comprises one of the following steps:
performing gold immersion operation on the copper surface of the semi-finished circuit board to form a plating layer on the copper surface of the semi-finished circuit board;
or, carrying out tin spraying operation on the copper surface of the semi-finished product circuit board;
or forming an organic protective film on the copper surface of the semi-finished circuit board.
In one embodiment, before the step of surface-treating the semi-finished wiring board, the manufacturing method further includes:
and carrying out hole plugging operation on the semi-finished circuit board.
In one embodiment, the step of performing the hole plugging operation on the semi-finished circuit board specifically comprises:
and carrying out aluminum sheet hole plugging operation on the semi-finished circuit board.
In one embodiment, after the step of performing the plugging operation on the semi-finished circuit board and before the step of performing the surface treatment on the semi-finished circuit board, the manufacturing method further includes:
and carrying out solder mask operation on the semi-finished circuit board.
In one embodiment, the step of performing molding processing on the surface-treated semi-finished circuit board specifically includes:
and carrying out routing processing on the semi-finished circuit board after the surface treatment.
In one embodiment, the step of routing the surface-treated semi-finished circuit board includes:
positioning the semi-finished circuit board after surface treatment;
carrying out one-time routing operation on the positioned semi-finished circuit board;
carrying out secondary routing on the semi-finished circuit board after the primary routing operation so as to route an annular tape at the position of a pad of the semi-finished circuit board, where the tape is to be pasted; the annular adhesive tape is arranged around the position of the bonding pad, the annular adhesive tape surrounds the bonding area of the semi-finished product circuit board, and the area of the bonding area is larger than that of the position of the bonding pad.
In one embodiment, the adhesive tape comprises a tape main body and a stripping part, wherein the tape main body is adhered to an area surrounded by the annular tape attaching area, and the stripping part protrudes out of the edge of the tape main body.
A circuit board is manufactured by adopting the manufacturing method of the circuit board in any embodiment.
A new energy automobile lithium battery comprises the circuit board.
Compared with the prior art, the invention has at least the following advantages:
firstly, carrying out surface treatment on a semi-finished product circuit board to form a protective layer on the surface of a copper layer of the semi-finished product circuit board; then, carrying out forming processing on the semi-finished product circuit board after surface treatment; then, carrying out electrical test on the molded semi-finished circuit board; then, performing deionization washing operation on the semi-finished circuit board after the electrical property test; then, carrying out tape attaching operation on the semi-finished product circuit board subjected to the deionization washing operation to enable the tape to be attached to a bonding pad of the circuit board; then, performing quality inspection on the semi-finished circuit board subjected to the tape attaching operation; finally, packaging the semi-finished circuit board after quality inspection to obtain a finished circuit board product; because the operation of sticking the adhesive tape is carried out after the operation of deionization washing, when using, the adhesive tape can be used after being torn, and the adhesive tape can clean the bonding pad when being bonded and separated with the bonding pad, thereby improving the stability and the conductivity of the bonding connection of the bonding pad, and solving the problems of poor stability and even failure of the bonding connection of the bonding pad.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
FIG. 1 is a schematic flow chart of a method for manufacturing a circuit board according to an embodiment;
fig. 2 is a schematic view after the operation of step S109 of the method of manufacturing the wiring board shown in fig. 1;
FIG. 3 is a schematic view of another embodiment of the manufacturing method of the wiring board shown in FIG. 1 after the operation of step S109;
fig. 4 is a schematic diagram of another embodiment of the manufacturing method of the wiring board shown in fig. 1 after the operation of step S109.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
The present application provides a method of manufacturing a circuit board, including: carrying out surface treatment on the semi-finished product circuit board; carrying out molding processing on the semi-finished circuit board after surface treatment; carrying out electrical test on the molded semi-finished circuit board; performing deionization washing operation on the semi-finished circuit board after the electrical property test; carrying out adhesive tape sticking operation on the semi-finished product circuit board subjected to the deionization washing operation; performing quality inspection on the semi-finished circuit board after the operation of sticking the adhesive tape; and packaging the semi-finished circuit board after the quality inspection to obtain the circuit board.
The manufacturing method of the circuit board comprises the following steps of firstly, carrying out surface treatment on a semi-finished circuit board to form a protective layer on the surface of a copper layer of the semi-finished circuit board; then, carrying out forming processing on the semi-finished circuit board after surface treatment; then, carrying out electrical test on the molded semi-finished circuit board; then, performing deionization washing operation on the semi-finished circuit board after the electrical property test; then, carrying out tape sticking operation on the semi-finished product circuit board subjected to the deionization washing operation to make the tape stick to a bonding pad of the circuit board; then, performing quality inspection on the semi-finished circuit board subjected to the tape pasting operation; finally, packaging the semi-finished circuit board after quality inspection to obtain a finished circuit board product; because the operation of sticking the adhesive tape is carried out after the operation of deionization washing, when using, the adhesive tape can be used after being torn, and the adhesive tape can clean the bonding pad when being bonded and separated with the bonding pad, thereby improving the stability of the bonding connection of the bonding pad, and solving the problems of poor stability and even failure of the bonding connection of the bonding pad.
As shown in fig. 1, the method for manufacturing a wiring board of an embodiment is used for manufacturing a wiring board. In one embodiment, a method of manufacturing a wiring board includes some or all of the following steps:
and S101, performing surface treatment on the semi-finished circuit board.
In this embodiment, the surface of the semi-finished circuit board is treated to form a protective layer on the surface of the copper layer of the semi-finished circuit board, so as to protect the copper layer on the surface of the semi-finished circuit board from oxidation.
And S103, forming and processing the semi-finished circuit board after surface treatment.
In this embodiment, the surface-treated semi-finished circuit board is subjected to a molding process to process a circuit board meeting the shape requirement. Specifically, the semi-finished circuit board after surface treatment is molded by a machining mode.
And S105, carrying out electrical property test on the molded semi-finished circuit board.
In this embodiment, an electrical test is performed on the molded semi-finished circuit board to detect the electrical performance of the molded semi-finished circuit board, so as to screen and remove the defective products of the electrical performance of the molded semi-finished circuit board. If the semi-finished circuit board after the forming processing is unqualified in the result of the electrical property test, classifying the semi-finished circuit board as a defective product; and if the electrical property test result of the semi-finished circuit board after the molding processing is qualified, classifying the semi-finished circuit board as a genuine product.
And S107, performing deionization washing operation on the semi-finished circuit board after the electrical property test.
In this embodiment, the electrical test circuit board is deionized and washed to reliably clean the electrical test circuit board, thereby improving the cleanliness of the circuit board.
And S109, carrying out tape pasting on the semi-finished product circuit board subjected to the deionization washing operation.
In this embodiment, the tape attaching operation is performed on the semi-finished circuit board after the deionization washing operation, so that the tape is adhered to the bonding pad on the surface of the semi-finished circuit board after the deionization washing operation. Because the adhesive tape is adhered to the surface of the bonding pad, the adhesive tape can be torn and separated from the bonding pad during subsequent use, and meanwhile, the surface of the bonding pad is cleaned, so that the cleanliness of the bonding pad is further improved.
And S111, performing quality inspection on the semi-finished circuit board subjected to the tape attaching operation.
In this embodiment, the quality of the semi-finished circuit board after the tape attaching operation is inspected to inspect the quality of the semi-finished circuit board after the tape attaching operation, so as to inspect and screen the semi-finished circuit board with defects such as tape warpage or tape not tightly attached to the bonding pad on the surface of the semi-finished circuit board, or damage on the surface of the semi-finished circuit board, and improve the qualified rate of the circuit board.
And S113, packaging the semi-finished circuit board after quality inspection to obtain the circuit board.
Firstly, carrying out surface treatment on a semi-finished product circuit board to form a protective layer on the surface of a copper layer of the semi-finished product circuit board; then, carrying out forming processing on the semi-finished product circuit board after surface treatment; then, carrying out electrical test on the molded semi-finished circuit board; then, performing deionization washing operation on the semi-finished circuit board after the electrical property test; then, carrying out tape attaching operation on the semi-finished product circuit board subjected to the deionization washing operation to enable the tape to be attached to a bonding pad of the circuit board; then, performing quality inspection on the semi-finished circuit board subjected to the tape pasting operation; finally, packaging the semi-finished circuit board after quality inspection to obtain a finished circuit board product; because the operation of sticking the adhesive tape is carried out after the operation of deionization washing, when using, the adhesive tape can be used after being torn, and the adhesive tape can clean the bonding pad when being bonded and separated with the bonding pad, thereby improving the stability and the conductivity of the bonding connection of the bonding pad, and solving the problems of poor stability and even failure of the bonding connection of the bonding pad.
Further, the adhesive tape covers and is adhered to the surface of the bonding pad, so that the adhesive tape is reliably adhered to the surface of the bonding pad, the situation that the surface of the bonding pad is partially exposed is avoided, and meanwhile, the adhesive tape can be used for cleaning the surface of the bonding pad integrally. Furthermore, the projection area of the adhesive tape on the circuit board is larger than the surface area of the bonding pad, so that the adhesive tape can better cover the surface of the bonding pad. As shown in fig. 2, in one embodiment, the tape 20 includes a tape main body 22 and a peeling portion 24, the tape main body covers and adheres to the surface of the bonding pad 30, the peeling portion protrudes from one side of the tape main body, and the peeling portion has no adhesiveness, and when the tape is torn, the peeling portion is used for tearing, which is convenient and fast. In this embodiment, the projected area of the tape body on the circuit board is larger than the area of the bonding pad, so that the tape body can better cover and adhere to the surface of the bonding pad.
Further, the end of the peeling part far away from the adhesive tape main body is warped to the plane of the adhesive tape main body, so that the adhesive tape main body can be quickly grabbed and torn through the peeling part. In this embodiment, the peeling part is disposed toward the routing direction of the outer shape of the circuit board so as not to cover the adjacent other pads. Furthermore, the stripping part is arranged to avoid the connecting rod of the circuit board so as to prevent the stripping part from influencing the external connection of other elements of the connecting rod.
In order to reliably connect the tape main body and the peeling part, as shown in fig. 3, the tape 20 further includes a reinforcing part 26 connected to the tape main body and the peeling part, respectively, and the thickness of the reinforcing part is greater than or equal to the thickness of the peeling part, so that the tape main body is directly connected to the peeling part and is also connected to the peeling part through the reinforcing part, thereby preventing the problem of tearing at the joint of the tape main body and the peeling part due to excessive stress, and further reliably connecting the tape main body to the peeling part. In this embodiment, the tape main body, the peeling portion, and the reinforcing portion are integrally formed, so that the tape is more compact in structure, and the tape main body and the peeling portion are reliably connected to the reinforcing portion. Furthermore, the thickness of the adhesive tape is less than or equal to 0.1mm, so that the adhesive tape meets the standard requirement.
In one embodiment, the step of surface treating the semi-finished circuit board comprises one of the following steps:
and performing gold immersion operation on the copper surface of the semi-finished circuit board to form a plating layer on the copper surface of the semi-finished circuit board, so that the plating layer has better oxidation resistance, weldability and reliability. Or carrying out tin spraying operation on the copper surface of the semi-finished circuit board so as to form a flat or even solder layer on the copper surface of the circuit board and protect the copper surface. Or, forming an organic protective film on the copper surface of the semi-finished circuit board, namely forming the organic protective film on the copper surface through chemical reaction to prevent the copper surface from being oxidized. In this embodiment, the step of performing surface treatment on the semi-finished circuit board specifically includes: and performing gold immersion operation on the copper surface of the semi-finished circuit board to form a plating layer with better oxidation resistance, weldability and reliability on the copper surface of the semi-finished circuit board.
In order to avoid the problem of solder flux or surface solder paste remaining in the holes to cause cold joint or short circuit, in one embodiment, before the step of performing surface treatment on the semi-finished circuit board, the manufacturing method further comprises: and carrying out hole plugging operation on the semi-finished product circuit board so as to avoid the problem of insufficient soldering or short circuit caused by residual soldering flux or surface solder paste in the holes. In one embodiment, the step of performing the hole plugging operation on the semi-finished circuit board specifically comprises: and carrying out aluminum sheet hole plugging operation on the semi-finished circuit board, so that the structure of the semi-finished circuit board is simpler and is easy to realize.
In one embodiment, after the step of performing the plugging operation on the semi-finished circuit board and before the step of performing the surface treatment on the semi-finished circuit board, the manufacturing method further includes: and performing solder mask operation on the semi-finished circuit board so as to cover the circuits and the copper surfaces which are not required to be welded on the semi-finished circuit board with insulating materials, thereby playing roles of protecting the circuits and insulating.
In one embodiment, after the step of performing the solder resist operation on the semi-finished wiring board and before the step of performing the surface treatment on the semi-finished wiring board, the manufacturing method further includes: and performing character operation on the semi-finished circuit board subjected to resistance welding to print a mark symbol on the surface of the semi-finished circuit board, so that the assembly and identification of subsequent products are facilitated.
In one embodiment, the step of performing molding processing on the surface-treated semi-finished circuit board specifically comprises: and carrying out routing processing on the surface-treated semi-finished circuit board so as to route routing holes on the surface-treated semi-finished circuit board. It is understood that, in other embodiments, the surface-treated semi-finished circuit board is not limited to be formed by routing, but may be formed by punching or micro-engraving.
In one embodiment, the step of routing the surface-treated semi-finished circuit board includes: firstly, positioning a semi-finished product circuit board after surface treatment to make the semi-finished product circuit board static relative to a processing base; secondly, performing primary routing operation on the positioned semi-finished circuit board to process a shape routing groove on the surface of the semi-finished circuit board; and finally, carrying out secondary routing on the semi-finished circuit board after the primary routing operation so as to route an annular tape at the position of the to-be-bonded adhesive tape at the bonding pad position of the semi-finished circuit board. The annular adhesive tape is arranged around the position of the bonding pad, the annular adhesive tape surrounds the bonding area of the semi-finished circuit board, and the area of the bonding area is larger than that of the position of the bonding pad, so that the adhesive tape covers and is bonded to the bonding area, and the bonding pad is better welded and protected. In this embodiment, the annular tape is a band-shaped annular bonding region, so that the annular tape and the adhesive tape can be bonded well.
In one embodiment, the adhesive tape comprises an adhesive tape main body and a stripping part, wherein the adhesive tape main body is adhered to an area surrounded by the annular tape pasting area, and the stripping part protrudes out of the edge of the adhesive tape main body, so that the adhesive tape covers and is adhered to the area surrounded by the annular tape pasting area, the surface of the bonding pad is prevented from being partially exposed, and meanwhile, the adhesive tape main body can be used for cleaning the surface of the bonding pad integrally. In this embodiment, the peeling portion protrudes from an edge of one side of the tape main body. Furthermore, the projection area of the tape main body on the circuit board is larger than the surface area of the bonding pad, so that the tape main body can better cover the surface of the bonding pad.
In one embodiment, before the step of taping the semi-finished circuit board after the deionization washing operation, the method for manufacturing a circuit board further includes: an adhesive tape was prepared. Further, the step of preparing the adhesive tape comprises: firstly, providing a base material; secondly, coating a first adhesive layer on one surface of the adhesive tape main body of the base material, and adhering the base material to the surface of the bonding pad through the first adhesive layer, wherein the base material comprises a stripping part and the adhesive tape main body which are connected; then, performing semi-curing treatment on the first bonding layer to ensure that the first bonding layer is reliably formed on the adhesive tape main body; then attaching a protective film to one surface of the first adhesive layer, which is far away from the base material; then, stamping the base material to enable the joint of the stripping part and the adhesive tape main body to form a bending structure and enable the end part of the stripping part far away from the adhesive tape main body to warp; and finally, tearing off the protective film to enable the welding layer of the adhesive tape main body to cover and be adhered to the adhesion area. In order to better perform the tape pasting operation on the semi-finished circuit board after the deionized washing operation, further, the step of performing the stamping operation on the base material specifically comprises the following steps: carry out the punching press operation to the substrate, carry out the flattening to the sticky tape main part of substrate simultaneously and handle, make the sticky tape main part more level and smooth, avoid the sticky tape main part defects such as fold or perk to appear, and then make first adhesive linkage bond in bonding pad better.
In the present embodiment, although the projected area of the tape main body on the circuit board is larger than the surface area of the bonding pad, and the tape main body is partially bonded to the circuit board except for the bonding pad, the surface of the bonding pad and the area adjacent thereto can be cleaned well, but in the bonding process, air bubbles or wrinkles are likely to remain between the tape main body and the circuit board, and the reliability of bonding pad bonding and cleaning is poor, as shown in fig. 4, the tape main body 22 further includes a pad adhesive portion 22a for bonding to the bonding pad and a peripheral adhesive portion 22b protruding from the pad adhesive portion for bonding to the bonding pad, the peripheral adhesive portion for bonding to the circuit board adjacent to the bonding pad, and the peeling portion is connected to the peripheral adhesive portion, and the peeling portion is connected to the tape main body. In this embodiment, the vent hole 222 is formed at a portion of the peripheral bonding portion adjacent to the pad bonding portion, and when the tape body is bonded to the circuit board and pressed, air bubbles near the vent hole between the tape body and the circuit board can be discharged through the vent hole, so that not only the surface of the bonding pad and the adjacent area thereof can be cleaned well, but also the problem of easy residual air bubbles or wrinkles between the tape body and the circuit board is avoided. Because the venthole is opened in the position that the sticky portion of adjacent pad of periphery bonding portion, avoid the venthole to open the edge part position of setting in periphery bonding portion and easily split the problem. In this embodiment, the pad adhesive portion, the peripheral edge adhesive portion, and the peeling portion are integrally formed, so that the structure of the tape is more compact. Furthermore, the air outlet can be a waist-shaped hole or an elliptical hole, so that the air outlet is less stressed and is not easy to crack.
Although the annular tape sticking area is formed by routing, the surface of the annular tape sticking area is smooth, local burrs are not prone to being protruded too much, and the condition that the adhesive tape is adhered is influenced. In order to make the tape main body adhere to the region surrounded by the annular tape region better through the first adhesive layer and make the tape main body adhere to the surface of the bonding pad reliably at the same time, further, an adhesion reinforcing layer corresponding to the annular tape region is coated and formed on the side of the first adhesive layer, which is away from the tape main body, the first adhesive layer is connected to the tape main body through the adhesion reinforcing layer, the tape main body adheres to the region surrounded by the annular tape region better through the first adhesive layer, and the tape main body adheres to the surface of the bonding pad reliably at the same time. In order to reliably connect the first adhesive layer and the adhesion reinforcing layer, the step of stamping the base material not only forms a bending structure at the joint of the stripping part and the adhesive tape main body, but also forms a connecting groove on one surface of the first adhesive layer, which is far away from the adhesive tape main body. After the step of tearing the protective film, the method of manufacturing a wiring board further includes: forming an adhesion reinforcing layer; embedding the adhesion reinforcing layer in the connecting groove and connecting the adhesion reinforcing layer with the first bonding layer, so that the first bonding layer is reliably connected with the adhesion reinforcing layer; the part of the bonding reinforcing layer protruding out of the surface of the first bonding layer is coated with a second bonding layer, and the second bonding layer is correspondingly bonded with the annular tape sticking area, so that the adhesive tape main body is bonded with the semi-finished product circuit board through the first bonding layer and the second bonding layer respectively.
Further, the end of the peeling part far away from the adhesive tape main body is warped to the plane of the adhesive tape main body, so that the adhesive tape main body can be quickly grabbed and torn through the peeling part. In this embodiment, the peeling part is disposed toward the routing direction of the outer shape of the circuit board so as not to cover the adjacent other pads. Furthermore, the stripping part is arranged to avoid the connecting rod of the circuit board so as to prevent the stripping part from influencing the external connection of other elements of the connecting rod.
Further, after the step of performing the punching operation on the base material and before the step of tearing the protective film, the step of preparing the adhesive tape further includes: providing a reinforcing part of the adhesive tape; the reinforcing portion is bonded to the tape main body and the peeling portion, respectively, so that the tape main body is reliably connected to the peeling portion via the reinforcing portion.
In order to ensure that the adhesive tape main body is reliably connected with the peeling part, the adhesive tape further comprises a reinforcing part, the reinforcing part is respectively connected with the adhesive tape main body and the peeling part, the thickness of the reinforcing part is larger than or equal to that of the peeling part, the adhesive tape main body is directly connected with the peeling part and is also connected with the peeling part through the reinforcing part, so that the problem that the joint of the adhesive tape main body and the peeling part is torn due to overlarge stress is avoided, and the adhesive tape main body is further reliably connected with the peeling part. In this embodiment, the tape main body, the peeling portion, and the reinforcing portion are integrally formed, so that the tape is more compact in structure, and the tape main body and the peeling portion are reliably connected to the reinforcing portion. Furthermore, the thickness of the adhesive tape is less than or equal to 0.1mm, so that the adhesive tape meets the standard requirement. In this embodiment, the adhesive tape may be a gold adhesive tape or other adhesive tapes, so that the adhesive tape is better adhered to the bonding pad, and because the adhesive tape has better oxidation resistance, the adhesive tape better protects the bonding pad, and is easy to peel off to clean the bonding pad, and the cleaning effect of the adhesive tape is better.
Further, the step of carrying out tape pasting operation on the semi-finished circuit board subjected to the deionization washing operation specifically comprises the following steps: the semi-finished circuit board after the deionized washing operation is subjected to tape pasting operation by adopting automatic tape pasting equipment, so that the labor cost is reduced, the precision of tape pasting is improved, and the misoperation of manual tape pasting is avoided. In this embodiment, automatic coating machine equipment is used for carrying out the material loading in batches to the sticky tape, makes the change cycle of sticky tape longer, and the time of material loading is shorter, has improved the material loading efficiency of sticky tape greatly.
Further, after the step of taping the semi-finished circuit board after the deionization washing operation and before the step of performing quality inspection on the semi-finished circuit board after the taping operation, the method for manufacturing a circuit board further includes: and pressing the semi-finished circuit board after the operation of sticking the adhesive tape so as to remove air between the adhesive tape and the circuit board, so that the adhesive tape is smoothly stuck on the surface of the semi-finished circuit board, and the defects of local upwarping or wrinkling and the like at the bonding part of the adhesive tape and the semi-finished circuit board are avoided.
The application also provides a circuit board manufactured by adopting the manufacturing method of the circuit board in any embodiment. Further, a method for manufacturing a wiring board, comprising: carrying out surface treatment on the semi-finished product circuit board; carrying out molding processing on the semi-finished circuit board after surface treatment; carrying out electrical test on the molded semi-finished circuit board; performing deionization washing operation on the semi-finished circuit board after the electrical property test; carrying out adhesive tape sticking operation on the semi-finished product circuit board subjected to the deionization washing operation; performing quality inspection on the semi-finished circuit board after the operation of sticking the adhesive tape; and packaging the semi-finished circuit board after the quality inspection to obtain the circuit board.
Firstly, carrying out surface treatment on a semi-finished product circuit board to form a protective layer on the surface of a copper layer of the semi-finished product circuit board; then, carrying out forming processing on the semi-finished product circuit board after surface treatment; then, carrying out electrical test on the molded semi-finished circuit board; then, performing deionization washing operation on the semi-finished circuit board after the electrical property test; then, carrying out tape attaching operation on the semi-finished product circuit board subjected to the deionization washing operation to enable the tape to be attached to a bonding pad of the circuit board; then, performing quality inspection on the semi-finished circuit board subjected to the tape pasting operation; finally, packaging the semi-finished circuit board after quality inspection to obtain a finished circuit board product; because the operation of sticking the adhesive tape is carried out after the operation of deionization washing, when using, the adhesive tape can be used after being torn, and the adhesive tape can clean the bonding pad when being bonded and separated with the bonding pad, thereby improving the stability of the bonding connection of the bonding pad, and solving the problems of poor stability and even failure of the bonding connection of the bonding pad.
The application also provides a new energy automobile lithium battery, including foretell circuit board.
Compared with the prior art, the invention has at least the following advantages:
firstly, carrying out surface treatment on a semi-finished product circuit board to form a protective layer on the surface of a copper layer of the semi-finished product circuit board; then, carrying out forming processing on the semi-finished product circuit board after surface treatment; then, carrying out electrical test on the molded semi-finished circuit board; then, performing deionization washing operation on the semi-finished circuit board after the electrical property test; then, carrying out tape attaching operation on the semi-finished product circuit board subjected to the deionization washing operation to enable the tape to be attached to a bonding pad of the circuit board; then, performing quality inspection on the semi-finished circuit board subjected to the tape attaching operation; finally, packaging the semi-finished circuit board after quality inspection to obtain a finished circuit board product; because the operation of sticking the adhesive tape is carried out after the operation of deionization washing, when in use, the adhesive tape can be used after being torn, and meanwhile, the adhesive tape can clean the bonding pad when being bonded and separated with the bonding pad, thereby improving the stability and the conductivity of the bonding connection of the bonding pad, and solving the problems of poor stability and even failure of the bonding connection of the bonding pad.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that various changes and modifications can be made by those skilled in the art without departing from the spirit of the invention, and these changes and modifications are all within the scope of the invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (9)
1. A method of manufacturing a wiring board, comprising:
carrying out surface treatment on the semi-finished product circuit board;
carrying out molding processing on the semi-finished circuit board after surface treatment;
carrying out electrical test on the molded semi-finished circuit board;
performing deionization washing operation on the semi-finished circuit board after the electrical property test;
carrying out adhesive tape sticking operation on the semi-finished product circuit board subjected to the deionization washing operation;
performing quality inspection on the semi-finished circuit board after the operation of sticking the adhesive tape;
packaging the semi-finished circuit board after quality inspection to obtain a circuit board;
the adhesive tape comprises an adhesive tape main body and a stripping part, wherein the adhesive tape main body is adhered to a region surrounded by the annular tape sticking region, and the stripping part protrudes out of the edge of the adhesive tape main body; before the step of performing tape-on operation on the semi-finished circuit board subjected to the deionization washing operation, the manufacturing method of the circuit board further comprises the following steps: preparing an adhesive tape; the step of preparing the adhesive tape comprises: firstly, providing a base material; secondly, coating a first bonding layer on one surface of the adhesive tape main body of the base material; then performing semi-curing treatment on the first bonding layer; then attaching a protective film to one surface of the first adhesive layer, which is far away from the base material; then, stamping the base material to enable the joint of the stripping part and the adhesive tape main body to form a bending structure, and simultaneously forming a connecting groove on one surface of the first bonding layer, which is far away from the adhesive tape main body; then tearing the protective film; finally, forming an adhesion reinforcing layer; and embedding the adhesion reinforcing layer in the connecting groove and connecting the adhesion reinforcing layer with the first bonding layer, wherein a second bonding layer is coated on the part of the adhesion reinforcing layer protruding out of the surface of the first bonding layer, and the second bonding layer is correspondingly bonded with the annular tape sticking area.
2. A method for manufacturing a wiring board according to claim 1, wherein the step of surface-treating the semi-finished wiring board comprises one of the following steps:
performing gold immersion operation on the copper surface of the semi-finished circuit board to form a plating layer on the copper surface of the semi-finished circuit board;
or, carrying out tin spraying operation on the copper surface of the semi-finished product circuit board;
or forming an organic protective film on the copper surface of the semi-finished circuit board.
3. The method of manufacturing a wiring board according to claim 1, wherein before the step of surface-treating the semi-finished wiring board, the method further comprises:
and carrying out hole plugging operation on the semi-finished circuit board.
4. A method for manufacturing a wiring board according to claim 3, wherein the step of performing the plugging operation on the semi-finished wiring board comprises the steps of:
and carrying out aluminum sheet hole plugging operation on the semi-finished circuit board.
5. A method for manufacturing a wiring board according to claim 3, wherein after the step of performing the plugging operation on the semi-finished wiring board and before the step of performing the surface treatment on the semi-finished wiring board, the method further comprises:
and carrying out solder mask operation on the semi-finished circuit board.
6. The method for manufacturing a wiring board according to claim 1, wherein the step of molding the surface-treated semi-finished wiring board comprises:
and carrying out routing processing on the semi-finished circuit board after the surface treatment.
7. A method for manufacturing a wiring board according to claim 6, wherein the step of routing the surface-treated semi-finished wiring board comprises:
positioning the semi-finished circuit board after surface treatment;
carrying out one-time routing operation on the positioned semi-finished circuit board;
carrying out secondary routing on the semi-finished circuit board after the primary routing operation so as to route an annular tape at the position of a pad of the semi-finished circuit board, where the tape is to be pasted; the annular adhesive tape is arranged around the position of the bonding pad, the annular adhesive tape surrounds the bonding area of the semi-finished product circuit board, and the area of the bonding area is larger than that of the position of the bonding pad.
8. A wiring board produced by the method for producing a wiring board according to any one of claims 1 to 7.
9. A lithium battery for a new energy automobile, characterized by comprising the circuit board of claim 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110615998.6A CN113365434B (en) | 2021-06-02 | 2021-06-02 | New energy automobile lithium battery, circuit board and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110615998.6A CN113365434B (en) | 2021-06-02 | 2021-06-02 | New energy automobile lithium battery, circuit board and manufacturing method thereof |
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| Publication Number | Publication Date |
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| CN113365434A CN113365434A (en) | 2021-09-07 |
| CN113365434B true CN113365434B (en) | 2022-12-09 |
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| JP4482271B2 (en) * | 2002-12-03 | 2010-06-16 | 三井化学株式会社 | Adhesive tape for wafer processing |
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| US5731243A (en) * | 1995-09-05 | 1998-03-24 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of cleaning residue on a semiconductor wafer bonding pad |
| JP2005203749A (en) * | 2003-12-15 | 2005-07-28 | Furukawa Electric Co Ltd:The | Tape for wafer processing and manufacturing method thereof |
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| CN113365434A (en) | 2021-09-07 |
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