CN113365418A - Flexible circuit board and manufacturing method thereof - Google Patents
Flexible circuit board and manufacturing method thereof Download PDFInfo
- Publication number
- CN113365418A CN113365418A CN202110601079.3A CN202110601079A CN113365418A CN 113365418 A CN113365418 A CN 113365418A CN 202110601079 A CN202110601079 A CN 202110601079A CN 113365418 A CN113365418 A CN 113365418A
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- trace
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- groove
- flexible substrate
- circuit board
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 239000000758 substrate Substances 0.000 claims abstract description 63
- 229910052751 metal Inorganic materials 0.000 claims description 33
- 239000002184 metal Substances 0.000 claims description 33
- 238000000059 patterning Methods 0.000 claims description 9
- 238000009413 insulation Methods 0.000 claims description 3
- 238000004806 packaging method and process Methods 0.000 claims description 3
- 238000010030 laminating Methods 0.000 abstract 2
- 238000000034 method Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 238000005452 bending Methods 0.000 description 3
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The utility model provides a flexible circuit board, flexible circuit board includes first flexible substrate and the second flexible substrate of laminating with this first flexible substrate, first flexible substrate includes first flexible base member layer, forms and is in at least one first line recess and at least one first electrically conductive line of walking on the first flexible base member layer, first electrically conductive line setting is walked in corresponding first line recess on the cross section of first line recess, the opening size of first line recess is no longer than the size of first line recess middle part, just the bottom size of first line recess opening is no longer than the size of first line recess middle part, the surface of first electrically conductive line with the surface laminating of first line recess. The present disclosure also provides a method of manufacturing a flexible circuit board.
Description
Technical Field
The present disclosure relates to circuit technology, and in particular, to a flexible circuit board and a method of manufacturing the flexible circuit board.
Background
With the popularization of wearable devices, the application of flexible circuit boards is also more and more extensive. As the flexible circuit board needs to be bent during use, the conductive traces in the flexible circuit board also have a risk of breaking. Therefore, how to avoid the conductive traces from breaking in the bending process of the flexible circuit board becomes a technical problem to be solved in the field.
Disclosure of Invention
An object of the present disclosure is to provide a flexible circuit board and a method of manufacturing the flexible circuit board.
As an aspect of the present disclosure, a flexible circuit board is provided, where the flexible circuit board includes a first flexible substrate and a second flexible substrate attached to the first flexible substrate, where the first flexible substrate includes a first flexible substrate layer, at least one first trace groove formed on the first flexible substrate layer, and at least one first conductive trace, the first conductive trace is disposed in the corresponding first trace groove, on a cross section of the first trace groove, an opening size of the first trace groove is not greater than a size of a middle portion of the first trace groove, a bottom size of the opening of the first trace groove is not greater than a size of the middle portion of the first trace groove, and an outer surface of the first conductive trace is attached to a surface of the first trace groove.
Optionally, the first conductive trace includes a first organic conductive layer, a first metal conductive layer, and a first organic conductive core, the first organic conductive layer is attached to a surface of the corresponding first trace groove, the first organic conductive layer defines a first accommodating space, the first metal conductive layer is disposed in the first accommodating space, the first metal conductive layer defines a second accommodating space, and the first organic conductive core is accommodated in the second accommodating space.
Optionally, the first flexible substrate includes at least one first routing group, each first routing group includes a plurality of first conductive routing lines which have the same extending direction and are arranged in parallel, and the plurality of first conductive routing lines in the same first routing group are electrically connected to each other.
Optionally, the first wire group further includes at least one first connecting wire, and the first connecting wire is connected between two adjacent first conductive wires.
Optionally, the first flexible substrate includes at least one second routing group, the second routing group includes a plurality of first routing lines and at least one second connection routing line, in the same second routing group, the plurality of first routing lines are sequentially arranged along the same extending direction, a gap exists between adjacent ends of two adjacent first routing lines, a width direction of the gap intersects with the extending direction of the first routing lines, and the two adjacent first routing lines are electrically connected through the second connection routing lines.
Optionally, the second flexible substrate includes a second flexible base layer, at least one second trace groove formed on the second flexible base layer, and at least one second conductive trace, the second conductive trace is disposed in the corresponding second trace groove, each first conductive trace corresponds to at least one second conductive trace, and the second conductive trace is electrically connected to the corresponding first conductive trace.
Optionally, on the cross section of the second trace groove, the size of the opening of the second trace groove is not greater than the size of the middle of the second trace groove, the size of the bottom of the opening of the second trace groove is not greater than the size of the middle of the second trace groove, and the outer surface of the second conductive trace is attached to the surface of the second trace groove.
Optionally, the second conductive trace includes a second organic conductive layer, a second metal conductive layer, and a second organic conductive core, the second organic conductive layer is attached to the surface of the corresponding second trace groove, the second organic conductive layer defines a third receiving space, the second metal conductive layer is disposed in the third receiving space, the second metal conductive layer defines a fourth receiving space, and the second organic conductive core is received in the fourth receiving space.
As a second aspect of the present disclosure, there is provided a manufacturing method of a flexible circuit board, wherein the manufacturing method includes:
providing a first flexible substrate body;
forming at least one first wiring groove on the first flexible substrate body, wherein the opening size of the first wiring groove is not more than the size of the middle part of the first wiring groove on the cross section of the first wiring groove, and the bottom size of the opening of the first wiring groove is not more than the size of the middle part of the first wiring groove;
forming corresponding first conductive wires in each first wire groove respectively, wherein the outer surfaces of the first conductive wires are attached to the surfaces of the first wire grooves to obtain a first flexible substrate;
and forming a second flexible substrate on the first flexible substrate to perform insulation packaging on the first conductive routing.
Optionally, the step of forming a corresponding first conductive trace in each first trace groove respectively includes:
forming a first organic conductive layer on the first flexible substrate body formed with the first routing groove;
patterning the first organic conducting layer to obtain corresponding first organic conducting layers in the first wiring grooves respectively, wherein the first organic conducting layers are attached to the surfaces of the corresponding first wiring grooves, and a first accommodating space is defined by the first organic conducting layers;
forming a metal conductive layer;
patterning the metal conducting layers to form corresponding first metal conducting layers in the first accommodating spaces respectively, wherein the first metal conducting layers define second accommodating spaces;
forming a second organic conductive layer;
and patterning the second organic conductive layer to form a first organic conductive core in each of the second accommodating spaces, respectively.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
fig. 1 is a schematic diagram of one embodiment of a flexible circuit board provided by the present disclosure;
fig. 2 is a schematic structural diagram of the first flexible substrate after the first conductive trace is removed;
fig. 3 is a schematic top view of a flexible circuit board provided by the present disclosure;
FIG. 4 is a schematic diagram of a first wire set;
FIG. 5 is a schematic diagram of a second wire group;
fig. 6 is a schematic view illustrating a second connection trace of the second traces disposed on the second flexible substrate;
FIG. 7 is a schematic diagram of another embodiment of a flexible circuit board provided by the present disclosure;
fig. 8 is a flow chart of a manufacturing method provided by the present disclosure.
Detailed Description
The following detailed description of embodiments of the invention refers to the accompanying drawings. It should be understood that the detailed description and specific examples, while indicating the present invention, are given by way of illustration and explanation only, not limitation.
As an aspect of the present disclosure, a flexible circuit board is provided, as shown in fig. 1 and 3 (fig. 1 is a cross-sectional view of fig. 3), which includes a first flexible substrate 100 and a second flexible substrate 200 attached to the first flexible substrate 100, wherein the first flexible substrate 100 includes a first flexible base layer 110, at least one first trace groove 110a (see fig. 2) formed on the first flexible base layer 110, and at least one first conductive trace 120, and the first conductive trace 120 is disposed in the corresponding first trace groove. As shown in fig. 2, in the cross section of the first trace groove 110a, an opening dimension d1 of the first trace groove 110a does not exceed a dimension d2 of the middle portion of the first trace groove 110a, a bottom dimension d3 of the first trace groove opening 110a does not exceed a dimension d2 of the middle portion of the first trace groove 110a, and the outer surface of the first conductive trace 120 is attached to the surface of the first trace groove.
In this disclosure, because the width of the middle portion of the first wire groove is the largest, and the width of the opening and the bottom surface of the first wire groove are both smaller, when the flexible circuit board is bent, the first conductive wire 120 is not easy to fall off from the first wire groove, so that the phenomena of circuit breaking and the like of the flexible circuit board in the use process can be avoided, and the service life of the product comprising the flexible circuit board is prolonged.
In the present disclosure, the specific structure of the first conductive trace 120 is not particularly limited, and as an alternative embodiment, as shown in fig. 1, the first conductive trace 120 includes a first organic conductive layer 121, a first metal conductive layer 122, and a first organic conductive core 123. The first organic conductive layer 121 is attached to the surface of the corresponding first trace groove, the first organic conductive layer 121 defines a first accommodating space, the first metal conductive layer 122 is disposed in the first accommodating space, the first metal conductive layer 122 defines a second accommodating space, and the first organic conductive core 123 is accommodated in the second accommodating space.
The first organic conductive layer 121 and the first organic conductive core 123 are made of organic material (for example, PEDOT) doped metal nano conductive particles, have good flexibility, and are not easily broken under the bending action. Meanwhile, the first metal conductive layer 122 is disposed to reduce the resistance of the first conductive trace.
In order to further avoid the occurrence of circuit disconnection during the use of the flexible circuit board, as an optional implementation manner, as shown in fig. 4, the first flexible substrate 100 includes at least one first routing group, each first routing group includes a plurality of first conductive traces 120 that extend in the same direction and are arranged in parallel, and the plurality of first conductive traces 120 in the same first routing group are electrically connected to each other.
The electrical signals transmitted by the first conductive traces 120 in the same first trace group are the same, and even if one of the first conductive traces is broken at some position, the other first conductive traces electrically connected to the broken first conductive trace 120 can still complete the transmission of the signals, thereby ensuring the normal operation of the flexible circuit board.
For example, in the embodiment shown in fig. 4, one first trace group includes two first conductive traces 120, and when one of the second conductive traces 120 is broken at a, the other first conductive trace can still function to transmit an electrical signal.
In the present disclosure, an electrical connection manner of two first conductive traces in the same first trace group is not particularly limited, and optionally, as shown in fig. 4, the first trace group further includes at least one first connection trace 310, and the first connection trace 310 is connected between two adjacent first conductive traces 120.
As another embodiment of the present disclosure, the flexible circuit board includes at least one second routing group, as shown in fig. 5, the second routing group includes a plurality of first routing lines 120 and at least one second connection routing line 320, in the same second routing group, the plurality of first routing lines 120 are sequentially arranged along the same extending direction, a gap exists between adjacent ends of two adjacent first routing lines 120, a width direction of the gap intersects with an extending direction of the first routing lines 120, and the two adjacent first routing lines 120 are electrically connected through the second connection routing line 220. In such an embodiment, the second connection trace 320 can be disposed on a portion of the flexible circuit board that is often bent during use, so as to avoid the first trace 120 from being broken due to the frequent bending.
In the present disclosure, the second connection trace 320 may be disposed in the first flexible substrate 100, and the second connection trace 320 may also be disposed in the second flexible substrate 200. Shown in fig. 6 (this fig. 6 is a schematic sectional view II-II of fig. 5) is a schematic view of the second connection trace 320 being provided in the second flexible substrate 200.
The second flexible substrate 200 mainly serves to insulate and encapsulate the first flexible substrate, and therefore, in the present disclosure, the specific structure of the second flexible substrate 200 is not particularly limited as long as the first flexible substrate can be encapsulated.
As an alternative embodiment, the second flexible substrate 200 may be an insulating film layer.
As another optional implementation, the second flexible substrate 200 includes a second flexible base layer 210, at least one second trace groove formed on the second flexible base layer 210, and at least one second conductive trace 220, the second conductive trace 220 is disposed in the corresponding second trace groove, at least one second conductive trace corresponds to each first conductive trace 120, and the second conductive trace 220 is electrically connected to the corresponding first conductive trace 120.
The second conductive trace 220 is provided to further avoid the circuit disconnection in the flexible circuit board, specifically, the signal transmitted in the second conductive trace 220 is the same as the signal transmitted in the first conductive trace 120 electrically connected to the second conductive trace 220, and the second conductive trace 220 can still transmit the signal when the first conductive trace 120 is partially broken.
In the present disclosure, the specific structure of the second conductive trace 220 is not particularly limited. For example, the second conductive trace 220 can be made of a metal material.
As an optional implementation manner, the structure of the second conductive trace is the same as that of the first conductive trace. That is, on the cross section of the second trace groove, the opening size of the second trace groove does not exceed the size of the middle part of the second trace groove, the bottom size of the second trace groove opening does not exceed the size of the middle part of the second trace groove, and the outer surface of the second conductive trace 220 is attached to the surface of the second trace groove.
Further, as shown in fig. 7, the second conductive trace 220 includes a second organic conductive layer 221, a second metal conductive layer 222, and a second organic conductive core 223, the second organic conductive layer 221 is attached on a surface of the corresponding second trace groove, the second organic conductive layer 221 defines a third receiving space, the second metal conductive layer 222 is disposed in the third receiving space, the second metal conductive layer 222 defines a fourth receiving space, and the second organic conductive core 223 is received in the fourth receiving space.
As a second aspect of the present disclosure, there is provided a manufacturing method of a flexible circuit board, wherein, as shown in fig. 8, the manufacturing method includes:
in step S210, a first flexible substrate body is provided;
in step S220, at least one first trace groove is formed on the first flexible substrate body, and on a cross section of the first trace groove, an opening size of the first trace groove does not exceed a size of a middle portion of the first trace groove, and a bottom size of the first trace groove opening does not exceed a size of the middle portion of the first trace groove;
in step S230, forming corresponding first conductive traces in each first trace groove, respectively, and attaching an outer surface of the first conductive trace to a surface of the first trace groove to obtain a first flexible substrate;
in step S240, a second flexible substrate is formed on the first flexible substrate to perform insulation packaging on the first conductive trace.
The flexible circuit board provided by the first aspect of the disclosure can be formed by using the manufacturing method, and the principle and the beneficial effects of the flexible circuit board are described in detail in the first aspect, and are not described in detail herein.
In the present disclosure, the second flexible substrate may be formed on the first flexible substrate by means of insulating layer coating or imprinting.
As an alternative implementation, the step S230 of forming a corresponding first conductive trace in each of the first trace grooves includes:
in step S231, forming a first organic conductive layer on the first flexible substrate body formed with the first trace groove;
in step S232, patterning the first organic conductive layer to obtain corresponding first organic conductive layers in the first routing grooves, where the first organic conductive layers are attached to the surfaces of the corresponding first routing grooves, and a first accommodating space is defined by the first organic conductive layers;
in step S233, a metal conductive layer is formed;
in step S234, performing a patterning process on the metal conductive layers to form corresponding first metal conductive layers in the first accommodating spaces, respectively, wherein the first metal conductive layers define second accommodating spaces;
in step S235, a second organic conductive layer is formed;
in step S236, the second organic conductive layer is patterned to form first organic conductive cores in the respective second receiving spaces.
As described above, the first and second organic conductive layers may be made of PEDOT material doped with nano-metal conductive particles.
The conductive metal layer may be formed of a metal or alloy having good conductivity, such as copper or aluminum.
In the present disclosure, step S220 is not particularly limited. As an alternative embodiment, step S220 may include:
forming an inorganic layer on the first flexible substrate body in a chemical vapor deposition mode, wherein the inorganic layer is made of silicon nitride and/or silicon dioxide;
patterning the inorganic layer into a hard mask by a photolithography process;
dry etching is carried out on the first flexible substrate body under the action of the hard mask, and the first wiring groove is formed on the first flexible substrate by controlling process parameters in the dry etching process;
and removing the hard mask.
When the structure of the second conductive trace on the second flexible substrate is the same as the structure of the first conductive trace on the first flexible conductive substrate, the second flexible substrate can be formed by the same process as the first flexible substrate.
It is to be understood that the above embodiments are merely exemplary embodiments that are employed to illustrate the principles of the present disclosure, and that the present disclosure is not limited thereto. It will be apparent to those skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope of the disclosure, and these are to be considered as the scope of the disclosure.
Claims (10)
1. The flexible circuit board is characterized in that the first flexible substrate comprises a first flexible substrate layer, at least one first wiring groove and at least one first conductive wiring, the at least one first wiring groove is formed in the first flexible substrate layer, the first conductive wiring is arranged in the corresponding first wiring groove, the size of the opening of the first wiring groove is not larger than the size of the middle of the first wiring groove on the cross section of the first wiring groove, the size of the bottom of the opening of the first wiring groove is not larger than the size of the middle of the first wiring groove, and the outer surface of the first conductive wiring is attached to the surface of the first wiring groove.
2. The flexible circuit board of claim 1, wherein the first conductive trace comprises a first organic conductive layer attached to a surface of the corresponding first trace groove, the first organic conductive layer defining a first receiving space, a first metal conductive layer disposed in the first receiving space, the first metal conductive layer defining a second receiving space, and a first organic conductive core received in the second receiving space.
3. The flexible circuit board according to claim 1, wherein the first flexible substrate includes at least one first routing group, each of the first routing groups includes a plurality of first conductive traces extending in a same direction and arranged in parallel, and the plurality of first conductive traces in the same first routing group are electrically connected to each other.
4. The flexible circuit board according to claim 3, wherein the first wire group further includes at least one first connection wire, and the first connection wire is connected between two adjacent first conductive wires.
5. The flexible circuit board according to claim 1, wherein the flexible circuit board includes at least one second routing group, the second routing group includes a plurality of first routing lines and at least one second connection routing line, in the same second routing group, the plurality of first routing lines are sequentially arranged along a same extending direction, a gap exists between adjacent ends of two adjacent first routing lines, a width direction of the gap intersects with an extending direction of the first routing lines, two adjacent first routing lines are electrically connected through the second connection routing line, and the second connection routing line is arranged in the first flexible substrate and/or the second flexible substrate.
6. The flexible circuit board according to any one of claims 1 to 5, wherein the second flexible substrate includes a second flexible base layer, at least one second trace groove formed on the second flexible base layer, and at least one second conductive trace, the second conductive trace is disposed in the corresponding second trace groove, at least one second conductive trace corresponds to each first conductive trace, and the second conductive trace is electrically connected to the corresponding first conductive trace.
7. The flexible circuit board according to claim 6, wherein in a cross section of the second trace groove, an opening of the second trace groove has a size not exceeding a size of a middle portion of the second trace groove, a bottom size of the opening of the second trace groove does not exceed a size of the middle portion of the second trace groove, and an outer surface of the second conductive trace is attached to a surface of the second trace groove.
8. The flexible circuit board of claim 7, wherein the second conductive trace comprises a second organic conductive layer attached to a surface of the corresponding second trace groove, the second organic conductive layer defining a third receiving space, a second metal conductive layer disposed in the third receiving space, the second metal conductive layer defining a fourth receiving space, and a second organic conductive core received in the fourth receiving space.
9. A method of manufacturing a flexible circuit board, comprising:
providing a first flexible substrate body;
forming at least one first wiring groove on the first flexible substrate body, wherein the opening size of the first wiring groove is not more than the size of the middle part of the first wiring groove on the cross section of the first wiring groove, and the bottom size of the opening of the first wiring groove is not more than the size of the middle part of the first wiring groove;
forming corresponding first conductive wires in each first wire groove respectively, wherein the outer surfaces of the first conductive wires are attached to the surfaces of the first wire grooves to obtain a first flexible substrate;
and forming a second flexible substrate on the first flexible substrate to perform insulation packaging on the first conductive routing.
10. The manufacturing method according to claim 9, wherein the step of forming the corresponding first conductive trace in each of the first trace grooves respectively comprises:
forming a first organic conductive layer on the first flexible substrate body formed with the first routing groove;
patterning the first organic conducting layer to obtain corresponding first organic conducting layers in the first wiring grooves respectively, wherein the first organic conducting layers are attached to the surfaces of the corresponding first wiring grooves, and a first accommodating space is defined by the first organic conducting layers;
forming a metal conductive layer;
patterning the metal conducting layers to form corresponding first metal conducting layers in the first accommodating spaces respectively, wherein the first metal conducting layers define second accommodating spaces;
forming a second organic conductive layer;
and patterning the second organic conductive layer to form a first organic conductive core in each of the second accommodating spaces, respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110601079.3A CN113365418A (en) | 2021-05-31 | 2021-05-31 | Flexible circuit board and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110601079.3A CN113365418A (en) | 2021-05-31 | 2021-05-31 | Flexible circuit board and manufacturing method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN113365418A true CN113365418A (en) | 2021-09-07 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110601079.3A Pending CN113365418A (en) | 2021-05-31 | 2021-05-31 | Flexible circuit board and manufacturing method thereof |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5717556A (en) * | 1995-04-26 | 1998-02-10 | Nec Corporation | Printed-wiring board having plural parallel-connected interconnections |
| US6490169B1 (en) * | 1999-12-15 | 2002-12-03 | Yazaki Corporation | Conductive circuit structure having an electrically conductive surface fixed by collar walls |
| CN1798481A (en) * | 2004-12-27 | 2006-07-05 | 三之星机带株式会社 | Method for producing inorganic pattern on polyimide resin |
| CN103338589A (en) * | 2013-05-30 | 2013-10-02 | 南昌欧菲光科技有限公司 | Flexible circuit connecting component |
-
2021
- 2021-05-31 CN CN202110601079.3A patent/CN113365418A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5717556A (en) * | 1995-04-26 | 1998-02-10 | Nec Corporation | Printed-wiring board having plural parallel-connected interconnections |
| US6490169B1 (en) * | 1999-12-15 | 2002-12-03 | Yazaki Corporation | Conductive circuit structure having an electrically conductive surface fixed by collar walls |
| CN1798481A (en) * | 2004-12-27 | 2006-07-05 | 三之星机带株式会社 | Method for producing inorganic pattern on polyimide resin |
| CN103338589A (en) * | 2013-05-30 | 2013-10-02 | 南昌欧菲光科技有限公司 | Flexible circuit connecting component |
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