CN113364961A - Photosensitive element of camera module, camera module and electronic equipment - Google Patents
Photosensitive element of camera module, camera module and electronic equipment Download PDFInfo
- Publication number
- CN113364961A CN113364961A CN202110748522.XA CN202110748522A CN113364961A CN 113364961 A CN113364961 A CN 113364961A CN 202110748522 A CN202110748522 A CN 202110748522A CN 113364961 A CN113364961 A CN 113364961A
- Authority
- CN
- China
- Prior art keywords
- camera module
- photosensitive element
- lens
- planar lens
- optical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 claims abstract description 65
- 238000006243 chemical reaction Methods 0.000 claims abstract description 21
- 230000003321 amplification Effects 0.000 claims abstract description 8
- 238000003199 nucleic acid amplification method Methods 0.000 claims abstract description 8
- 239000003086 colorant Substances 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 18
- 238000000034 method Methods 0.000 description 11
- 238000003384 imaging method Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 7
- 230000009471 action Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 230000003313 weakening effect Effects 0.000 description 3
- 230000000737 periodic effect Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
Abstract
The application discloses photosensitive element of module of making a video recording, module and electronic equipment make a video recording relates to optics technical field, wherein the photosensitive element of module of making a video recording includes: the optical device comprises a planar lens with a light gathering function, a first optical element for selecting colors of optical signals and a circuit layer; the planar lens is arranged on the circuit layer; the first optical element is arranged between the planar lens and the circuit layer; the optical signal is refracted to the circuit layer through the planar lens and the first optical element, and the circuit layer is used for converting the optical signal refracted by the planar lens and the first optical element into an electric signal and performing amplification processing and analog-to-digital conversion processing on the electric signal.
Description
Technical Field
The application relates to the technical field of optics, especially, relate to a photosensitive element of module of making a video recording, module and electronic equipment make a video recording.
Background
With the rapid development of electronic devices, a photographing function has become one of basic function configurations of electronic devices such as an intelligent terminal. When the existing camera shooting assembly shoots under strong light, the problem of diffraction or multiple reflection of light rays may exist due to the hardware configuration of a photosensitive element (sensor), so that petal ghost exists in a shot image, and the shooting effect is influenced.
Disclosure of Invention
The embodiment of the application provides a photosensitive element of module of making a video recording, module and electronic equipment make a video recording to there is petal "ghost" in the image that the present module of making a video recording was shot to the solution, influences the problem of shooting effect.
In order to solve the technical problem, the present application is implemented as follows:
in a first aspect, an embodiment of the present application provides a photosensitive element of a camera module, including:
a planar lens having a light condensing function;
a circuit layer on which the planar lens is disposed;
a first optical element for color selection of an optical signal, the first optical element disposed between the planar lens and the circuit layer;
the optical signal is refracted to the circuit layer through the planar lens and the first optical element, and the circuit layer is used for converting the optical signal refracted by the planar lens and the first optical element into an electric signal and performing amplification processing and analog-to-digital conversion processing on the electric signal.
In a second aspect, an embodiment of the present application further provides a camera module, including the photosensitive element of the camera module as described in the first aspect.
In a third aspect, an embodiment of the present application further provides an electronic device, including the camera module according to the second aspect.
In this way, in the above scheme of the present application, a planar lens having a light-gathering function is disposed in a photosensitive element of the camera module, so that the planar lens can refract an optical signal of a lens assembly of the camera module onto the photosensitive element, refract the optical signal onto the first optical element to perform color selection of the optical signal, and perform processing on a photoelectric signal through the circuit layer, thereby implementing a shooting function; meanwhile, the reflection and/or diffraction of the optical signal on the lens surface of the photosensitive element can be reduced through the planar lens, so that petal ghost on a shot image can be weakened, and the shooting effect is improved.
Drawings
Fig. 1 is a schematic view illustrating a photosensitive element of a camera module according to an embodiment of the present disclosure;
FIG. 2 is a second schematic view of a photosensitive element of the camera module according to the embodiment of the present application;
fig. 3 is a third schematic view of a photosensitive element of the camera module according to the embodiment of the present application;
fig. 4 is a schematic diagram of a camera module according to an embodiment of the present application.
Description of reference numerals:
11. a planar lens;
12. a circuit layer; 121. a photoelectric conversion sublayer; 122. an electrical signal processing sublayer;
13. an infrared filter layer;
14. a first optical element;
41. a photosensitive element;
42. a lens assembly;
43. a housing;
44. a flexible circuit board.
Detailed Description
Exemplary embodiments of the present application will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present application are shown in the drawings, it should be understood that the present application may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
As shown in fig. 1, an embodiment of the present application provides a photosensitive element of a camera module, including: a planar lens 11 having a light condensing function, a first optical element 14 for color selection of a light signal, and a circuit layer 12.
The planar lens 11 is arranged on the circuit layer 12; the first optical element 14 is disposed between the planar lens 11 and the circuit layer 12; the optical signal is refracted onto the circuit layer 12 through the planar lens 11 and the first optical element 14, and the circuit layer 12 is configured to convert the optical signal refracted by the planar lens 11 and the first optical element 14 into an electrical signal and perform amplification processing and analog-to-digital conversion processing on the electrical signal.
Alternatively, the planar lens 11 having a light condensing (or referred to as light collecting) function may be a lens which can condense incident light and is planar on an incident light surface and an emergent light surface.
Alternatively, the circuit layer 12 may convert the optical signal refracted by the planar lens 11 and the first optical element 14 into an analog electrical signal, amplify the analog electrical signal, and perform analog-to-digital conversion on the amplified analog electrical signal to obtain a digital electrical signal.
Alternatively, the planar lens 11 may include a plurality of lens units arranged in an array, and accordingly the circuit layer 12 may be provided with a plurality of circuit units arranged in an array; one circuit unit corresponds to one lens unit, and the circuit unit can convert optical signals refracted by the corresponding lens unit into electric signals and perform amplification processing and analog-to-digital conversion processing on the electric signals.
In this embodiment, a planar lens 11 with a light-gathering function is disposed in a photosensitive element of the camera module, so that the planar lens 11 can refract an optical signal of a lens assembly of the camera module onto the photosensitive element, refract the optical signal onto a first optical element for color selection of the optical signal, and process a photoelectric signal through a circuit layer 12, thereby implementing a shooting function; meanwhile, the reflection and/or diffraction of optical signals on the surface of the lens of the photosensitive element can be reduced through the planar lens 11, so that petal ghost images on the shot images can be weakened, the light energy utilization rate is improved, and the shooting effect is improved.
Alternatively, the planar lens 11 may be a graded index planar lens.
The gradient-index planar lens is of a flat plate structure in geometric shape, and the change of the refractive index can be realized through doping inside the lens, so that the direction of light rays is changed, and the light collecting effect is achieved. Alternatively, the graded index profile may be parabolic or hyperbolic.
For example: the graded-index planar lens can be prepared by an ion doping process (e.g., similar to the ion doping technique in semiconductor manufacturing processes). Alternatively, the graded-index planar lens may be a graded-index planar microlens array.
In the embodiment, the graded-index planar lens is arranged in the photosensitive element of the camera module, so that on one hand, a better imaging effect can be ensured, and a shooting function is realized; on the other hand, the periodic structure of the wavelength magnitude on the surface of the photosensitive element is eliminated, so that the reflection/diffraction light of the micro-lens array on the surface of the photosensitive element can be weakened, namely, the petal ghost phenomenon existing in the conventional photosensitive element is solved on the cause of the petal ghost, the light energy utilization rate is improved, and the aims of weakening the petal ghost on the shot image and improving the shooting effect are fulfilled.
Alternatively, the planar lens 11 may be a fresnel planar lens.
In the embodiment, the Fresnel plane lens is arranged in the photosensitive element of the camera module, so that on one hand, a better imaging effect can be ensured, and a shooting function is realized; on the other hand, the periodic structure of the wavelength magnitude on the surface of the photosensitive element is eliminated, so that the reflection/diffraction light of the micro-lens array on the surface of the photosensitive element can be weakened, namely, the petal ghost phenomenon existing in the conventional photosensitive element is solved on the cause of the petal ghost, the light energy utilization rate is improved, and the aims of weakening the petal ghost on the shot image and improving the shooting effect are fulfilled.
As one implementation, the photosensitive element further includes: and the plane lens 11 is positioned between the circuit layer 12 and the infrared filter.
Alternatively, the infrared Filter may also be referred to as an infrared light Cut Filter (IRCF), and the infrared light Cut Filter may be obtained by plating an IR film on a substrate, such as a scheme of spin coating a resin, a pigment, and the like, and the embodiments of the present application are not limited thereto.
In the embodiment, the infrared filter can filter out infrared rays and eliminate the influence of infrared rays on imaging, so that the shooting effect is improved; on the basis of arranging the plane lens with the light-gathering function in the photosensitive element of the camera module, on one hand, a better imaging effect can be ensured, and a shooting function is realized; on the other hand, the reflection/diffraction light of the micro-lens array on the surface of the photosensitive element can be weakened, and the petal 'ghost' phenomenon caused by further reflection of the reflection/diffraction light by the infrared filter can be avoided fundamentally, so that the aims of weakening the petal 'ghost' on the shot image and improving the shooting effect are fulfilled.
As another implementation, as shown in fig. 2, the first surface of the planar lens 11 is provided with an infrared filter layer 13 (alternatively referred to as an IR layer); wherein the first surface is a surface of the planar lens 11 facing away from the circuit layer 12.
For example: the infrared filter layer 13 may be plated on the first surface of the planar lens 11 by a plating process, which may reduce the need to additionally dispose a substrate for plating an IR film, and may also prevent the relative position between the IR layer and the lens assembly from changing, thereby preventing the failure of the infrared cut-off filtering function due to the incidence of large-angle infrared light.
In this embodiment, the infrared filter layer can filter out infrared light and eliminate the influence of infrared light on imaging, thereby improving the shooting effect; moreover, the infrared filter layer 13 is plated on the first surface of the planar lens 11, so that petal ghost caused by reflection of the infrared filter structure on optical signals can be further avoided, the petal ghost phenomenon existing in the current photosensitive element is solved on the cause of the petal ghost, and the shooting effect is further ensured.
Optionally, the focal length of this plane lens can be 1 ~ 3 microns, if this focal length can be about 2 microns, specifically can set up according to the shooting performance demand of the module of making a video recording, and this embodiment of the application does not use this as the limit.
Alternatively, as shown in fig. 3, the circuit layer 12 includes: a photoelectric conversion sublayer 121, and an electric signal processing sublayer 122.
The photoelectric conversion sublayer 121 is located between the planar lens 11 and the electrical signal processing sublayer 122, and the photoelectric conversion sublayer 121 is electrically connected to the electrical signal processing sublayer 122. The photoelectric conversion sublayer 121 is configured to convert an optical signal refracted by the planar lens 11 and the first optical element 14 into an electrical signal; the electrical signal processing sublayer 122 is configured to perform amplification processing and analog-to-digital conversion processing on the electrical signal.
Specifically, the photoelectric conversion sublayer 121 is configured to convert an optical signal refracted by the planar lens 11 and the first optical element 14 into an analog electrical signal; the electrical signal processing sublayer 122 is configured to amplify the analog electrical signal, and perform analog-to-digital conversion on the amplified analog electrical signal to obtain a digital electrical signal.
For example: the photoelectric conversion sublayer 121 may be provided with a plurality of photodiodes, the photodiodes are arranged in an array, and the photodiodes are electrically connected to the electrical signal processing sublayer 122, so that the photodiodes can convert optical signals refracted by the planar lens 11 into electrical signals, collect, amplify and record the electrical signals, and transmit the electrical signals to the electrical signal processing sublayer 122 for amplification processing and analog-to-digital conversion processing of the electrical signals, thereby implementing imaging processing.
Optionally, the first optical element 14 is a color filter, that is, the color filter is disposed between the planar lens 11 and the circuit layer 12.
In this embodiment, the color filter 14 may split RGB of the optical signal refracted by the planar lens 11, so as to record the photographing color, thereby implementing color restoration and ensuring the imaging effect.
In the embodiment of the application, the planar lens 11 with the light gathering function is arranged in the photosensitive element of the camera module, so that the planar lens 11 can refract the lens component of the camera module to the optical signal on the photosensitive element, refract the optical signal to the first optical element for color selection of the optical signal, and process the photoelectric signal through the circuit layer 12, thereby realizing the shooting function; meanwhile, the reflection and/or diffraction of optical signals on the surface of the lens of the photosensitive element can be reduced through the planar lens 11, so that petal ghost on a shot image can be weakened, the light energy utilization rate is improved, and the shooting effect is improved;
in addition, the infrared filter layer 13 is plated on the first surface of the planar lens 11 in the embodiment of the present application, so as to weaken petal "ghost" phenomenon or other parasitic light which may be caused by further reflection of reflected and/or diffracted light by an infrared cut-off filter independently disposed in a conventional camera module, and also reduce the thickness of the camera module (i.e. the size of the camera module in the optical axis direction) to some extent, and reduce the cost of the infrared cut-off filter independently disposed.
It should be noted that the direction of the arrows in fig. 1 to fig. 3 in the embodiments of the present application may represent the propagation sequence of the optical signal among the planar lens 11, the first optical element 14, and the circuit layer 12 of the photosensitive element, and is not limited to the propagation path of the optical signal in the photosensitive element.
As shown in fig. 4, an embodiment of the present application further provides a camera module, which includes the photosensitive element 41 of the camera module.
The module of making a video recording in this application embodiment can realize the same function of the photosensitive element of the above-mentioned module of making a video recording to can reach the same technological effect, for avoiding repetition, here is no longer repeated.
Optionally, the camera module further includes: a lens assembly 42 and a housing 43.
The lens assembly 42 is disposed on the housing 43; the photosensitive element 41 is disposed inside the housing 43, and the photosensitive element 41 is located in the optical axis direction of the lens assembly 42, so as to ensure that the optical signal refracted from the lens assembly can be refracted onto the photosensitive element 41, thereby implementing an imaging function.
Optionally, the camera module may further include a flexible circuit board 44, a portion of the flexible circuit board 44 is located outside the housing 43, and another portion of the flexible circuit board 44 is located inside the housing 43 and electrically connected to the photosensitive element 41, so that the flexible circuit board disposed outside the housing 43 may be connected to a Central Processing Unit (CPU) in the electronic device, and the camera module may transmit an electrical signal to the CPU.
The embodiment of the application also provides an electronic device which comprises the camera module.
Optionally, this electronic equipment can be the electronic equipment that has the module of making a video recording wantonly, like cell-phone, panel computer, unmanned aerial vehicle, security protection control etc. and this is not limited to this in this application embodiment.
The electronic equipment in the embodiment of the application can realize the same functions of the camera module and achieve the same technical effects, and is not repeated here for avoiding repetition.
The embodiments in the present specification are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.
While preferred embodiments of the present application have been described, additional variations and modifications of these embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including the preferred embodiment and all such alterations and modifications as fall within the true scope of the embodiments of the application.
Finally, it should also be noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or terminal that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or terminal. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or terminal that comprises the element.
While the foregoing is directed to the preferred embodiment of the present application, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the principles of the disclosure and, therefore, the scope of the disclosure is to be defined by the appended claims.
Claims (10)
1. The utility model provides a photosensitive element of module of making a video recording which characterized in that includes:
a planar lens having a light condensing function;
a circuit layer on which the planar lens is disposed;
a first optical element for color selection of an optical signal, the first optical element disposed between the planar lens and the circuit layer;
the optical signal is refracted to the circuit layer through the planar lens and the first optical element, and the circuit layer is used for converting the optical signal refracted by the planar lens and the first optical element into an electric signal and performing amplification processing and analog-to-digital conversion processing on the electric signal.
2. The photosensitive element of the camera module of claim 1, wherein the planar lens is a graded index planar lens;
alternatively, the first and second electrodes may be,
the plane lens is a Fresnel plane lens.
3. A photosensitive element of a camera module according to claim 1 or 2, wherein the first surface of the planar lens is provided with an infrared filter layer;
wherein the first surface is a surface of the planar lens facing away from the circuit layer.
4. A photosensitive element of a camera module according to claim 1 or 2, characterized in that the photosensitive element further comprises:
and the plane lens is positioned between the circuit layer and the infrared filter.
5. The photosensitive element of the camera module according to claim 1 or 2, wherein the circuit layer comprises: a photoelectric conversion sublayer and an electric signal processing sublayer;
the photoelectric conversion sublayer is positioned between the planar lens and the electric signal processing sublayer;
the photoelectric conversion sub-layer is used for converting optical signals refracted by the planar lens and the first optical element into electric signals; the electric signal processing sublayer is used for carrying out amplification processing and analog-to-digital conversion processing on the electric signal.
6. The photosensitive element of the camera module of claim 5, wherein a plurality of photodiodes are disposed on the photoelectric conversion sub-layer, and the plurality of photodiodes are arranged in an array.
7. A photosensitive element of a camera module according to claim 1 or 2, wherein the first optical element is a color filter.
8. A camera module, characterized in that it comprises a photosensitive element of a camera module according to any one of claims 1 to 7.
9. The camera module of claim 8, further comprising: a lens assembly and a housing;
the lens assembly is arranged on the shell;
the photosensitive element is arranged inside the shell, and the photosensitive element is located in the optical axis direction of the lens component.
10. An electronic device characterized by comprising the camera module according to claim 8 or 9.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110748522.XA CN113364961A (en) | 2021-07-02 | 2021-07-02 | Photosensitive element of camera module, camera module and electronic equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110748522.XA CN113364961A (en) | 2021-07-02 | 2021-07-02 | Photosensitive element of camera module, camera module and electronic equipment |
Publications (1)
Publication Number | Publication Date |
---|---|
CN113364961A true CN113364961A (en) | 2021-09-07 |
Family
ID=77537883
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202110748522.XA Pending CN113364961A (en) | 2021-07-02 | 2021-07-02 | Photosensitive element of camera module, camera module and electronic equipment |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN113364961A (en) |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1938615A (en) * | 2004-04-13 | 2007-03-28 | 松下电器产业株式会社 | Condensing element and solid state imaging device |
CN101098415A (en) * | 2006-06-30 | 2008-01-02 | 松下电器产业株式会社 | Solid-state imaging element and solid-state imaging device |
CN101446679A (en) * | 2007-11-29 | 2009-06-03 | 松下电器产业株式会社 | Solid-state imaging device |
CN202221761U (en) * | 2011-09-13 | 2012-05-16 | 宇达电脑(上海)有限公司 | Image sensor capable of improvement in sharpness of prime lens |
CN104576631A (en) * | 2014-12-05 | 2015-04-29 | 复旦大学 | Photoelectric detection integrated chip |
US20170310907A1 (en) * | 2016-04-20 | 2017-10-26 | Microsoft Technology Licensing, Llc | Flat lens imaging devices and systems |
CN110971800A (en) * | 2019-12-17 | 2020-04-07 | Oppo广东移动通信有限公司 | Camera lens, camera assembly and electronic equipment |
CN111095270A (en) * | 2019-06-05 | 2020-05-01 | 深圳市汇顶科技股份有限公司 | Optical image acquisition device and electronic equipment |
DE102019008472A1 (en) * | 2019-01-18 | 2020-07-23 | Cubert GmbH | Multi-lens camera system and method for hyperspectral recording of images |
CN211744556U (en) * | 2019-09-27 | 2020-10-23 | 深圳传音控股股份有限公司 | Camera module and terminal adopting same |
CN112492188A (en) * | 2020-12-15 | 2021-03-12 | 维沃移动通信有限公司 | Camera module and electronic equipment |
-
2021
- 2021-07-02 CN CN202110748522.XA patent/CN113364961A/en active Pending
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1938615A (en) * | 2004-04-13 | 2007-03-28 | 松下电器产业株式会社 | Condensing element and solid state imaging device |
CN101098415A (en) * | 2006-06-30 | 2008-01-02 | 松下电器产业株式会社 | Solid-state imaging element and solid-state imaging device |
CN101446679A (en) * | 2007-11-29 | 2009-06-03 | 松下电器产业株式会社 | Solid-state imaging device |
CN202221761U (en) * | 2011-09-13 | 2012-05-16 | 宇达电脑(上海)有限公司 | Image sensor capable of improvement in sharpness of prime lens |
CN104576631A (en) * | 2014-12-05 | 2015-04-29 | 复旦大学 | Photoelectric detection integrated chip |
US20170310907A1 (en) * | 2016-04-20 | 2017-10-26 | Microsoft Technology Licensing, Llc | Flat lens imaging devices and systems |
DE102019008472A1 (en) * | 2019-01-18 | 2020-07-23 | Cubert GmbH | Multi-lens camera system and method for hyperspectral recording of images |
CN111095270A (en) * | 2019-06-05 | 2020-05-01 | 深圳市汇顶科技股份有限公司 | Optical image acquisition device and electronic equipment |
CN211744556U (en) * | 2019-09-27 | 2020-10-23 | 深圳传音控股股份有限公司 | Camera module and terminal adopting same |
CN110971800A (en) * | 2019-12-17 | 2020-04-07 | Oppo广东移动通信有限公司 | Camera lens, camera assembly and electronic equipment |
CN112492188A (en) * | 2020-12-15 | 2021-03-12 | 维沃移动通信有限公司 | Camera module and electronic equipment |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US9521319B2 (en) | Array cameras and array camera modules including spectral filters disposed outside of a constituent image sensor | |
US9825078B2 (en) | Camera device having an image sensor comprising a conductive layer and a reflection layer stacked together to form a light pipe structure accommodating a filter unit | |
KR100590124B1 (en) | Solid state imaging device | |
US9525005B2 (en) | Image sensor device, CIS structure, and method for forming the same | |
US20060086957A1 (en) | CMOS image sensor using reflection grating and method for manufacturing the same | |
CN112712039B (en) | Fingerprint module and electronic equipment | |
US10170516B2 (en) | Image sensing device and method for fabricating the same | |
KR20040060509A (en) | Cmos image sensor | |
CN111163255A (en) | Image sensing module | |
CN111025528A (en) | Imaging system, camera module and mobile terminal | |
US9013612B2 (en) | Image sensors with antireflective layers | |
CN113286067A (en) | Image sensor, image pickup apparatus, electronic device, and imaging method | |
CN113055575B (en) | Image sensor, camera module and electronic equipment | |
CN112379501B (en) | Lens module and imaging system | |
KR102447477B1 (en) | Camera module | |
US20130141626A1 (en) | Image pickup device, image pickup module, and camera | |
CN113364961A (en) | Photosensitive element of camera module, camera module and electronic equipment | |
US10957727B2 (en) | Phase detection pixels with diffractive lenses | |
CN211480030U (en) | Thin optical fingerprint identification device | |
CN113645376B (en) | Microlens array camera module and manufacturing method thereof | |
CN113079297A (en) | Sensitization chip, module and electronic equipment make a video recording | |
JPH0265386A (en) | Solid-state image pickup element | |
JP2876838B2 (en) | Solid-state imaging device | |
JP2017158148A (en) | Imaging module and imaging apparatus | |
JP2016225392A (en) | Microlens for solid state imaging device and formation method of microlens for solid state imaging device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210907 |
|
RJ01 | Rejection of invention patent application after publication |