CN110971800A - Camera lens, camera assembly and electronic equipment - Google Patents
Camera lens, camera assembly and electronic equipment Download PDFInfo
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- CN110971800A CN110971800A CN201911300984.4A CN201911300984A CN110971800A CN 110971800 A CN110971800 A CN 110971800A CN 201911300984 A CN201911300984 A CN 201911300984A CN 110971800 A CN110971800 A CN 110971800A
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
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Abstract
The application discloses camera lens, camera subassembly and electronic equipment. Specifically, this application provides a camera lens, includes: a lens body; the infrared light filtering film layer is arranged on one side of the lens main body; the optical adhesive layer is arranged on one side, away from the infrared light filtering film layer, of the lens main body and can absorb infrared light; the antireflection film layer is arranged on one side, far away from the lens main body, of the optical adhesive layer, and the average light transmittance of the camera lens in a visible light waveband of 430-640nm is not less than 85%. Therefore, the camera lens has the infrared cut-off effect simultaneously, when the camera lens is used as the lens of the camera assembly, an infrared cut-off filter does not need to be arranged in the camera assembly independently, the overall height of the camera assembly is reduced, and the using performance of the camera assembly is improved.
Description
Technical Field
The application relates to the technical field of electronic equipment, in particular to a camera lens, a camera assembly and electronic equipment.
Background
At present, electronic products such as camera assemblies (e.g., mobile phone camera assemblies, computer camera assemblies, etc.) and digital cameras used in electronic devices generally adopt a charge-coupled device image Sensor (CCD) or a complementary metal oxide semiconductor image Sensor (CMOS) to perform image sensing, the image Sensor (Sensor) converts light guided from a lens into an electrical signal, and then converts the electrical signal into a digital signal through an internal DA, and the digital signal is subjected to a series of amplification processing and storage processing and then transmitted to a screen to form an image. Because the light transmitted from the lens can also have part of infrared light besides visible light, the part of infrared light can be perceived by the image sensor although the part of infrared light is invisible to human eyes, and after a series of conversion, the part of infrared light can form a virtual image on the finally formed image, so that the problem that the image seen by human eyes is inconsistent with the image sensed by the image sensor occurs, and the shooting performance of the camera assembly is affected. At present, an infrared cut filter is generally disposed between a lens and an image sensor, and the infrared cut filter can cut infrared light and highly transmit visible light, so that the infrared light can be prevented from forming a virtual image on the image sensor, the influence of the infrared light on imaging can be improved, and the imaging of the visible light can not be influenced.
However, current camera lenses, camera assemblies, and electronic devices still remain to be improved.
Disclosure of Invention
The present application is based on the discovery and recognition by the inventors of the following facts and problems:
in current electronic devices, an infrared cut filter, for example, a blue glass infrared cut filter, is usually disposed between a lens and an image sensor, and the infrared cut filter can cut off infrared light, so that infrared light can be prevented from forming a virtual image on the image sensor, the influence of infrared light on imaging is improved, and the shooting effect of a camera assembly is improved. However, the inventor finds that the current ir-cut filter for the camera assembly is usually of a separate structure, and after the ir-cut filter is arranged in the camera assembly, the back focus of the camera assembly is long, which results in a large overall thickness of the camera assembly, which is not favorable for the light, thin and compact design of the camera assembly, and light may be reflected between the ir-cut filter and the image sensor many times, which results in light spots and affects the shooting effect. Therefore, if a new camera assembly structure can be provided, the effect of cutting off infrared light can be realized without arranging a separate infrared cut-off filter, the overall height of the camera assembly can be reduced, the service performance of the camera assembly is improved, and the problems can be solved to a great extent.
The present application is directed to solving, at least to some extent, one of the technical problems in the related art.
In one aspect of the present application, a camera lens is presented. This camera lens includes: a lens body; the infrared light filtering film layer is arranged on one side in the thickness direction of the lens body; the optical adhesive layer is arranged on one side, away from the infrared light filtering film layer, of the lens main body and can absorb infrared light; the antireflection film layer is arranged on one side, far away from the lens main body, of the optical adhesive layer, and the average light transmittance of the camera lens in a visible light waveband of 430-640nm is not less than 85%. Therefore, the camera lens has the infrared cut-off effect simultaneously, when the camera lens is used as the lens of the camera assembly, an infrared cut-off filter does not need to be arranged in the camera assembly independently, the overall height of the camera assembly is reduced, and the using performance of the camera assembly is improved.
In another aspect of the present application, the present application provides a camera assembly comprising: the method comprises the following steps: a lens; the lens assembly is arranged between the lens and the image sensor, the lens assembly comprises a plurality of lenses which are arranged at intervals, and at least one lens is the front camera lens. Therefore, the camera assembly has all the characteristics and beneficial effects of the camera lens, which are not described in detail herein. Generally speaking, in the camera component, the filter membrane with the infrared cut-off function is integrated on the lens, so that the camera component has a better infrared cut-off effect, reduces the overall height of the camera component and improves the service performance of the camera component.
In yet another aspect of the present application, the present application proposes an electronic device comprising: a housing defining an accommodating space; the main board and the memory are positioned in the accommodating space; the screen is arranged in the accommodating space and is connected with the main board; the camera assembly is arranged in the accommodating space, and a lens of the camera assembly is arranged on the shell. Therefore, the electronic device has all the features and advantages of the camera assembly described above, and the details are not repeated herein. Generally speaking, the camera assembly of the electronic equipment is light and thin in structure and good in shooting effect.
Drawings
FIG. 1 shows a schematic view of a camera lens according to an example of the present application;
FIG. 2 shows a schematic cross-sectional view of a camera lens according to an example of the present application;
FIG. 3 shows a schematic structural view of a camera assembly according to an example of the present application; and
fig. 4 shows a schematic structural diagram of an electronic device according to an example of the application.
Description of reference numerals:
110: a lens body; 120: an infrared light filtering film layer; 130: an optical adhesive layer; 140: an anti-reflection film layer; 100: a camera lens; 200: a lens; 300: an image sensor; 400: a lens assembly; 410: a lens; 1000: a camera assembly; 1100: an electronic device; 1200: a housing.
Detailed Description
Examples of the present application are described in detail below, and are illustrated in the accompanying drawings. The examples described below with reference to the drawings are illustrative and intended to be used for explaining the present application and are not to be construed as limiting the present application.
In one aspect of the present application, a camera lens is presented. According to some examples of the present application, referring to fig. 1 and 2 (fig. 2 is a schematic cross-sectional structure along the AA' direction in fig. 1), the camera lens 100 includes: the lens comprises a lens body 110, an infrared filter film layer 120, an optical adhesive layer 130 and an antireflection film layer 140, wherein the infrared filter film layer 120 is arranged on one side (referring to the thickness direction shown in fig. 2) along the thickness direction of the lens body 110, the optical adhesive layer 130 is arranged on one side of the lens body 110 far away from the infrared filter film layer 120, and the optical adhesive layer 130 can absorb infrared light; the antireflection film layer 140 is disposed on a side of the optical adhesive layer 130 away from the lens main body 110, wherein an average light transmittance of the camera lens 1000 in a visible light band of 430-640nm is not less than 85%. From this, this camera lens 100 has infrared effect of cutting off simultaneously, when using this camera lens 100 as the lens of camera subassembly, need not to set up infrared filter alone in the camera subassembly, has reduced the whole height of camera subassembly, has improved the performance of camera subassembly to do not influence the light transmission performance and the shooting performance of this camera lens 100 itself.
For convenience of understanding, the following is a brief description of the principle of the dual pass filter that can achieve the above beneficial effects:
as described above, at present, after an individual ir cut filter is disposed in a camera assembly, the back focus of the camera assembly is long, which results in a large overall thickness of the camera assembly, and is not favorable for the light and thin design and the miniaturization design of the camera assembly. And in this application, will have the infrared filter coating integration of infrared light cut-off effect on camera assembly's lens, camera assembly can include the lens subassembly for example, can have the lens of a plurality of shapes difference in the lens subassembly, and infrared filter coating can integrate on arbitrary one face of arbitrary lens, as long as have infrared cut-off effect can. Therefore, an infrared cut-off filter structure which is arranged independently can be simply and conveniently omitted, the overall height of the camera assembly is reduced, and the use performance of the camera assembly is improved. In addition, according to the camera lens, the infrared filtering film layer with the infrared light cut-off effect is arranged on one side of the lens main body of the camera lens, the optical adhesive layer and the antireflection film layer are formed on one side, away from the infrared filtering film layer, of the lens main body, the optical adhesive layer can well absorb infrared light, the influence of the incident angle of light on the central wavelength of the infrared cut-off of the camera lens is small, and the infrared cut-off effect of the camera lens is further improved; this antireflection rete can further improve this camera lens in the transmissivity of visible light wave band, improves the shooting effect of camera subassembly to this antireflection rete can also protect the optical cement layer betterly, has further improved the performance of this camera lens. Specifically, the average light transmittance of the camera lens in the visible light waveband of 430-640nm is not less than 85%, and the light transmittance of the camera lens is higher, namely, after the film layer with the infrared cut-off effect is arranged on the surface of the lens main body, the transmittance and the use performance of the lens main body can not be obviously influenced.
According to some examples of the present application, referring to fig. 1, the infrared filter film layer 120 may be disposed on a surface of the lens body 110 in a thickness direction of the lens body 110, that is, the surface of the lens body 110 in the thickness direction may be coated or formed with an optical glue having an infrared absorption property, so as to form the infrared filter film layer 120; specifically, the optical adhesive layer 130 may be disposed on a surface of the lens body 110 away from the infrared filter layer 120, that is, the optical adhesive may be coated on a surface of the lens body 110 away from the infrared filter layer 120, so as to form the optical adhesive layer 130; specifically, the antireflection film layer 140 may be disposed on the surface of the optical adhesive layer 130 away from the lens body 110, and the surface of the optical adhesive layer 130 away from the lens body 110 may be coated to form the antireflection film layer 140, so that the antireflection film layer 140 not only can reduce light reflection, but also can protect the optical adhesive layer 130.
According to some examples of the present application, referring to fig. 1 and 2, the shape, material, and the like of the lens body 110 are not particularly limited, for example, the lens body 110 may be circular, for example, the lens body 110 may be a convex lens or a concave lens, and may also be an irregular shaped structure, and the like. Specifically, the lens assembly of the camera head assembly may include a plurality of lenses, and any one of the lenses may be the camera lens 100 described in this application; specifically, in order to facilitate the formation of the infrared filtering film layer 120 and other structures on the surface of the lens body 110, a lens with a relatively flat outer surface in the lens assembly may be selected as the lens body 110, and the infrared filtering film layer 120 and other structures may be formed on the surface of the lens body.
According to some examples of the present application, the specific material, structure, and the like of the infrared filter film layer 120 are not particularly limited as long as they have a good infrared cut effect and do not affect the transmission of visible light. Specifically, the infrared filter layer 120 may be an optical coating structure formed on the surface of the lens body 110; specifically, the infrared filter layer 120 may include a plurality of first dielectric sublayers (not shown in the drawings) stacked together, and the first dielectric sublayers may include a first odd sublayer and a first even sublayer, wherein the first odd sublayer and the first even sublayer have different refractive indexes, so that the infrared filter layer 120 may better cut off infrared light through the first odd sublayer and the first even sublayer having different refractive indexes. Specifically, the material forming the first odd sub-layer at least comprises silicon dioxide and magnesium fluoride, and the material forming the first even sub-layer at least comprises titanium dioxide, trititanium pentoxide, zirconium dioxide and tantalum pentoxide. Thereby, the infrared cut effect of the infrared filter layer 120 is further improved. Specifically, the materials of the first odd-numbered sublayer and the first even-numbered sublayer can be selected by designing the optical film system, and the like, and the number of layers, the thickness of the single layer, and the like of the first odd-numbered sublayer and the first even-numbered sublayer can be adjusted, so that the finally formed infrared filter layer 120 has a good infrared cut-off effect, and the transmission of visible light is not affected.
Specifically, the total thickness of the infrared filter film layer 120 is in a range of 3 to 6 μm. For example, the total thickness of the infrared filter layer 120 may be 4 μm, may be 5 μm, may be 5.5 μm, and the like. The infrared filter film layer 120 having the thickness described above can cut off infrared light well, and does not affect the transmission of visible light.
Specifically, the material forming the infrared filter layer 120 may also include an optical glue having an infrared absorption property. Therefore, the infrared filter film layer 120 may also have a better infrared cut-off effect.
According to some examples of the present application, the camera lens 100 further includes an optical adhesive layer 130, and the optical adhesive layer 130 may absorb infrared light, so that an infrared cut-off effect of the camera lens 100 may be improved. Specifically, the optical adhesive layer 130 can also absorb ultraviolet light at the same time, so that interference of the ultraviolet light on spectral information acquired by the image sensor can be avoided, and the shooting effect of the camera assembly can be further improved. Specifically, the optical adhesive layer 130 may have two light absorption peaks, that is, the optical adhesive layer 130 may absorb infrared light and ultraviolet light at the same time, the wavelength range of the infrared band absorbed by the optical adhesive layer 130 may be 600-780nm, the wavelength range of the ultraviolet band absorbed by the optical adhesive layer 130 may be 350-420nm, and the light transmittances of the optical adhesive layer 130 in the infrared band and the ultraviolet band may not be greater than 1%, for example, the light transmittances of the optical adhesive layer 130 in the infrared band and the ultraviolet band may not be greater than 0.8%, and may not be greater than 0.5%. From this, the infrared absorption performance and the ultraviolet absorption performance preferred of this optical cement layer 130 can further improve the infrared effect of cutting off of this camera lens 100 to make this camera lens 100 have the ultraviolet effect of cutting off, can further improve the shooting effect of camera subassembly. Specifically, the light transmittance of the optical adhesive layer 130 in the visible light band of 450-600nm may be not less than 88%, for example, may be 90%. Therefore, the optical adhesive layer 130 has a high light transmittance in the visible light band, so that the light transmittance of the camera lens 100 in the visible light band can be improved, and the shooting effect of the camera assembly using the camera lens 100 can be further improved.
According to some examples of the present application, the material forming the optical adhesive layer 130 is not particularly limited as long as it has infrared absorption properties. Specifically, the material forming the optical adhesive layer 130 may include: an ethylene oxide compound and a coloring compound that can adjust the absorption characteristics of the optical adhesive layer 130 to light, for example, by selecting an appropriate coloring compound, the optical adhesive layer 130 can have good infrared absorption performance and ultraviolet absorption performance. Specifically, the thickness range of the optical adhesive layer 130 may include 1-10 μm, for example, the thickness of the optical adhesive layer 130 may be 2 μm, may be 4 μm, may be 5 μm, may be 6 μm, may be 7 μm, may be 8 μm, may be 9 μm, and the like. Therefore, when the thickness of the optical adhesive layer 130 is within the above range, the infrared cut-off effect and the visible light transmittance of the camera lens 100 can be better improved, and the thickness of the camera lens 100 is not significantly increased, which is beneficial to the light and thin design of the camera assembly.
Specifically, as mentioned above, the infrared filter layer 120 may also be formed by an optical glue having an infrared absorption effect; specifically, the material forming the infrared filter film layer 120 and the material forming the optical adhesive layer 130 may be the same, that is, the components, the performance, and the like of the optical adhesive forming the infrared filter film layer 120 may be the same as those of the optical adhesive layer 130 described above, and are not described herein again. From this, all set up the rete that has the infrared effect of cutting off through the both sides at lens main part 100, can further improve this camera lens 100's infrared effect of cutting off.
It should be noted that, the camera lens 100 in this application absorbs infrared light (or can absorb infrared light and ultraviolet light simultaneously) through the optical adhesive layer 130, and the infrared cut-off effect and the ultraviolet cut-off effect of the camera lens 100 in this application are less affected by the incident angle, for example, the incident angle is in the range of 0 to 30 degrees, and the offset of the central cut-off wavelength of the camera lens 100 in this application is not greater than 5nm, so the camera lens 100 in this application has good infrared cut-off effect and ultraviolet cut-off effect, and the usability of the camera assembly using the camera lens 100 can be further improved.
According to some examples of the present application, the camera lens 100 further includes an antireflection film layer 140, and the antireflection film layer 140 is disposed on a side of the optical adhesive layer 130 away from the lens body 110. When the infrared filtering film layer 120 includes an optical coating structure, the antireflection film layer 140 can reduce the problem that the transmittance is affected due to the serious light reflection caused by the mismatch of refractive indexes of the infrared filtering film layer 120 and air; the antireflection film layer 140 can further improve the transmittance of the camera lens 100 in the visible light band, improve the shooting effect of the camera assembly, and protect the optical adhesive layer 130.
Specifically, the antireflection film layer 140 may include a plurality of second dielectric sublayers (not shown) stacked together, the second dielectric sublayers including a second odd-numbered sublayer and a second even-numbered sublayer, and the refractive indices of the second odd-numbered sublayer and the second even-numbered sublayer are different. Specifically, the material forming the second odd sub-layer at least comprises silicon dioxide and magnesium fluoride, and the material forming the second even sub-layer at least comprises titanium dioxide, trititanium pentoxide, zirconium dioxide and tantalum pentoxide. This further improves the light transmittance of the camera lens 100 in the visible light band. Specifically, the materials of the second odd-numbered sublayer and the second even-numbered sublayer can be selected through the design of an optical film system, and the like, and the number of layers, the thickness of the single layer, and the like of the second odd-numbered sublayer and the second even-numbered sublayer are adjusted, so that the finally formed antireflection film layer 140 has a better light transmittance in the visible light band. Specifically, the light transmittance of the antireflection film layer 140 in the visible light band may be not less than 98%. Specifically, the total thickness of the anti-reflection film layer 140 may range from 0.2 μm to 1 μm, for example, the total thickness of the anti-reflection film layer 140 may be 0.4 μm, may be 0.5 μm, may be 0.6 μm, may be 0.8 μm, and the like. Therefore, the antireflection film layer 140 with the above performance parameters can better reduce the problem that the transmittance is affected due to the serious light reflection caused by the mismatch of the refractive indexes of the infrared filtering film layer 120 and the air, so that the transmittance of the camera lens 100 in the visible light band can be further improved, and the shooting effect of the camera assembly can be improved.
To sum up, in the camera lens 100 of the present application, the infrared filter film layer 120 with the infrared light cut-off effect is integrated on the lens main body 110, the optical adhesive layer 130 with the infrared absorption performance is disposed on the side of the lens main body 110 away from the infrared filter film layer 120, and the anti-reflection sublayer 140 with the anti-reflection effect is disposed on the side away from the infrared filter film layer 120, the camera lens 100 has a good infrared cut-off effect, when the camera lens 100 is used as a lens of a camera assembly, an infrared filter does not need to be disposed in the camera assembly separately, the overall height of the camera assembly is reduced, and the usability of the camera assembly is improved.
In another aspect of the present application, a camera assembly is presented. According to some examples of the present application, referring to fig. 3, a camera head assembly 1000 includes: the lens assembly 400 includes a plurality of spaced apart lenses 410, at least one of the lenses 410 is a camera lens as described above, for example, in the camera head assembly 1000, any one of the lenses 410 in the lens assembly 400 may be a camera lens with an infrared cut-off effect as described above. Thus, the camera assembly 1000 has all the features and benefits of the camera lens described above, and will not be described herein again. In general, in the camera assembly 1000, the filter film with the infrared cut-off function is integrated on the camera lens 410, so that the camera assembly 1000 has a better infrared cut-off effect, the overall height of the camera assembly 1000 is reduced, and the use performance of the camera assembly 1000 is improved.
In yet another aspect of the present application, an electronic device is presented. According to some examples of the present application, referring to fig. 4, the electronic device 1100 includes: the camera module 1000 includes a housing 1200, a main board and a memory, a screen (not shown in the figure), and the housing 1200 defines an accommodating space, the main board and the memory are located inside the accommodating space, the screen is disposed in the accommodating space and connected to the main board, the camera module 1200 is disposed in the accommodating space, and a lens of the camera module 1200 is disposed on the housing 1200. Accordingly, the electronic device 1100 has all the features and advantages of the camera head assembly 1000 described above, and thus the description thereof is omitted. In general, the camera assembly 1000 of the electronic device 1100 is light and thin, and has a good photographing effect.
For example, the electronic device may be any of various types of computer system devices that are mobile or portable and that perform wireless communications. In particular, the electronic device may be a mobile or smart phone (e.g., iPhone, Android, based), a portable gaming device (e.g., Nintendo DS, PlayStationPortable, Game Advance, iPhone), a laptop, a PDA, a portable Internet appliance, a music player and data storage device, other handheld devices, and the like.
In the description herein, references to the description of the terms "example," "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the example or example is included in at least one example or example of the application. In this specification, a schematic representation of the above terms does not necessarily refer to the same example or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more examples or examples. Moreover, various examples or examples and features of different examples or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature.
Although examples of the present application have been shown and described above, it is understood that the above examples are illustrative and are not to be construed as limiting the present application and that variations, modifications, substitutions and alterations in the above examples may be made by those of ordinary skill in the art within the scope of the present application.
Claims (10)
1. A camera lens, comprising:
a lens body;
the infrared light filtering film layer is arranged on one side in the thickness direction of the lens body;
the optical adhesive layer is arranged on one side, away from the infrared light filtering film layer, of the lens main body and can absorb infrared light;
the antireflection film layer is arranged on one side, far away from the lens main body, of the optical adhesive layer, and the average light transmittance of the camera lens in a visible light waveband of 430-640nm is not less than 85%.
2. The camera lens of claim 1, wherein the infrared filter layer comprises a plurality of first media sublayers in a layered arrangement, the first media sublayers comprising a first odd sublayer and a first even sublayer, the first odd sublayer and the first even sublayer having different refractive indices;
the material for forming the first odd sub-layer at least comprises silicon dioxide and magnesium fluoride, and the material for forming the first even sub-layer at least comprises titanium dioxide, trititanium pentoxide, zirconium dioxide and tantalum pentoxide.
3. The camera lens according to claim 1, wherein the total thickness of the infrared filter film layer ranges from 3 to 6 μ ι η.
4. The camera lens according to claim 1, wherein the optical adhesive layer can absorb the infrared light and the ultraviolet light, the wavelength range of the infrared band absorbed by the optical adhesive layer is 600-780nm, the wavelength range of the ultraviolet band absorbed by the optical adhesive layer is 350-420nm,
the light transmittance of the optical adhesive layer in the infrared band and the ultraviolet band is not more than 1%.
5. The camera lens according to claim 4, wherein the thickness of the optical glue layer is in the range of 1-10 μm.
6. The camera lens according to claim 4, wherein the material forming the optical glue layer comprises: an oxirane compound and a coloring compound;
the light transmittance of the optical adhesive layer in a visible light waveband of 450-600nm is not less than 88%.
7. The camera lens according to any one of claims 4 to 6, wherein the material forming the infrared filter film layer comprises an optical glue having infrared absorption property, and the material forming the infrared filter film layer and the material forming the optical glue layer are the same.
8. The camera lens of claim 1, wherein the anti-reflective film layer comprises a plurality of stacked second media sub-layers, the second media sub-layers comprising a second odd sub-layer and a second even sub-layer, the second odd sub-layer and the second even sub-layer having different refractive indices;
the material for forming the second odd sub-layer at least comprises silicon dioxide and magnesium fluoride, and the material for forming the second even sub-layer at least comprises titanium dioxide, trititanium pentoxide, zirconium dioxide and tantalum pentoxide;
the total thickness of the anti-reflection film layer ranges from 0.2 to 1 μm.
9. A camera head assembly, comprising:
a lens;
the lens assembly is arranged between the lens and the image sensor, wherein the lens assembly comprises a plurality of lenses which are arranged at intervals, and at least one lens is the lens of the camera lens in any one of claims 1-8.
10. An electronic device, comprising:
a housing defining an accommodating space;
the main board and the memory are positioned in the accommodating space;
the screen is arranged in the accommodating space and is connected with the main board; and
the camera assembly of claim 9, disposed in the receiving space, and a lens of the camera assembly is disposed on the housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911300984.4A CN110971800A (en) | 2019-12-17 | 2019-12-17 | Camera lens, camera assembly and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911300984.4A CN110971800A (en) | 2019-12-17 | 2019-12-17 | Camera lens, camera assembly and electronic equipment |
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| CN110971800A true CN110971800A (en) | 2020-04-07 |
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| CN201911300984.4A Pending CN110971800A (en) | 2019-12-17 | 2019-12-17 | Camera lens, camera assembly and electronic equipment |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113364961A (en) * | 2021-07-02 | 2021-09-07 | 维沃移动通信有限公司 | Photosensitive element of camera module, camera module and electronic equipment |
| CN113556418A (en) * | 2021-07-22 | 2021-10-26 | 维沃移动通信有限公司 | Electronic device |
| WO2022067951A1 (en) * | 2020-09-29 | 2022-04-07 | 诚瑞光学(深圳)有限公司 | Camera lens |
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| US20190361193A1 (en) * | 2018-05-22 | 2019-11-28 | Triple Win Technology(Shenzhen) Co.Ltd. | Lens module and method for assembling the same |
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Application publication date: 20200407 |