CN113364952A - Substrate OIS magnetic-driven mechanism and camera module adopting same - Google Patents

Substrate OIS magnetic-driven mechanism and camera module adopting same Download PDF

Info

Publication number
CN113364952A
CN113364952A CN202110601872.3A CN202110601872A CN113364952A CN 113364952 A CN113364952 A CN 113364952A CN 202110601872 A CN202110601872 A CN 202110601872A CN 113364952 A CN113364952 A CN 113364952A
Authority
CN
China
Prior art keywords
ois
sensor
substrate
camera
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202110601872.3A
Other languages
Chinese (zh)
Inventor
钞晨
王林
吴雨函
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chengdu Yixun Photoelectric Technology Co ltd
Original Assignee
Chengdu Yixun Photoelectric Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chengdu Yixun Photoelectric Technology Co ltd filed Critical Chengdu Yixun Photoelectric Technology Co ltd
Priority to CN202110601872.3A priority Critical patent/CN113364952A/en
Publication of CN113364952A publication Critical patent/CN113364952A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50Constructional details
    • H04N23/54Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • H04M1/0202Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026Details of the structure or mounting of specific components
    • H04M1/0264Details of the structure or mounting of specific components for a camera module assembly
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50Constructional details
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50Constructional details
    • H04N23/55Optical parts specially adapted for electronic image sensors; Mounting thereof
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/60Control of cameras or camera modules
    • H04N23/68Control of cameras or camera modules for stable pick-up of the scene, e.g. compensating for camera body vibrations
    • H04N23/681Motion detection
    • H04N23/6812Motion detection based on additional sensors, e.g. acceleration sensors
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/60Control of cameras or camera modules
    • H04N23/68Control of cameras or camera modules for stable pick-up of the scene, e.g. compensating for camera body vibrations
    • H04N23/682Vibration or motion blur correction
    • H04N23/685Vibration or motion blur correction performed by mechanical compensation
    • H04N23/687Vibration or motion blur correction performed by mechanical compensation by shifting the lens or sensor position
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M2250/00Details of telephonic subscriber devices
    • H04M2250/12Details of telephonic subscriber devices including a sensor for measuring a physical value, e.g. temperature or motion

Landscapes

  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Adjustment Of Camera Lenses (AREA)

Abstract

The invention belongs to the technical field of imaging equipment, and discloses a substrate OIS magnetic-driven mechanism and a camera module adopting the same, wherein the substrate OIS magnetic-driven mechanism is arranged in the camera module and used for providing motion compensation for a sensor; and a plurality of coils are arranged on the OIS base, and OIS magnets corresponding to the coils are fixed in the camera. In order to solve the problem that the height of the existing motor is higher, the OIS magnet is arranged on the bottom cover at the lowest part, the magnet and the coil can present an ideal shape in the plane direction, and meanwhile, the height of the magnet can be greatly reduced to reduce the overall height, so that the height of the motor is reduced.

Description

Substrate OIS magnetic-driven mechanism and camera module adopting same
Technical Field
The invention belongs to the technical field of imaging equipment, and particularly relates to a substrate OIS magnetic-driven mechanism and a camera module adopting the same.
Background
The VCM motor is a device that converts electric energy into mechanical energy and realizes linear and limited swing angle motion. The device generates regular movement by utilizing the interaction between the magnetic field from the permanent magnetic steel and the magnetic poles in the magnetic field generated by the conductor of the electrified coil. Because the voice coil motor is a non-commutation type power device, the positioning accuracy is completely dependent on the feedback and control system, and is independent of the voice coil motor. The VCM motor changes the smart phone camera from fixed focus to automatic focusing, and simultaneously endows a small or miniature camera with an anti-shake function, and the VCM motor has the greatest effect that the camera can automatically focus and also can provide motion compensation.
The VCM of the mobile phone camera needs DriverIC to complete focusing and anti-shake, the current VCM controls the magnitude of VCM power supply current through the DriverIC to determine the moving distance of a lens carried by the VCM, and therefore the VCM is adjusted to a proper position to shoot a clear image. The VCM motor is actually moved by the principle that an energized coil is subjected to a force in a magnetic field, and precise control needs to be performed by some external component, wherein the magnitude and time of the current is controlled and outputted by a DriveIC, thereby controlling the position to which the voice coil driver needs to reach. In the mobile phone, all control information of the drive IC is given by the SoC, and control logic and specific parameters are acquired by repeated teaching in the design and manufacturing process of an engineer.
In the current VCM motor market, a common VCM motor (open-loop motor) occupies most of the market share, up to 80%, and a closed-loop motor occupies 6%. Although both the closed-loop motor and the OIS motor are paid great attention and pursued, the OIS motor has the problems of tight resource, technical shortage, complex manufacturing process, high production difficulty, low yield, high cost, lagging focusing speed, high power consumption and the like in the aspect of mass production and quantity marketing. Wherein, the main factor who brings this problem is that present OIS motor mostly adopts the design of camera lens anti-shake, and this structure must lead to the electromagnetism anti-shake subassembly that is equipped with alone to occupy a large amount of inner spaces, and complicated structural design and motion control must bring bigger hindrance for assembly manufacturing process, make its yields lower, and manufacturing cost is higher.
Disclosure of Invention
In order to solve the problems in the prior art, the invention provides a substrate OIS magnetic-driven mechanism and a camera module adopting the same, which can effectively reduce the size of the whole camera module.
The technical scheme adopted by the invention is as follows:
the invention discloses a substrate OIS magnetic-driven mechanism which is arranged in a camera module and used for providing motion compensation for a sensor, and comprises an OIS base, wherein the OIS base is movably connected with the camera module, and the sensor is arranged on the OIS base;
and a plurality of coils are arranged on the OIS base, and OIS magnets corresponding to the coils are fixed in the camera.
The invention relates to a fixing mechanism applied in a camera (especially a micro camera module), which forms an anti-shake module together with other magnetic components. The anti-shake is that a lens or a sensor is specially connected, so that the lens or the sensor keeps a certain degree of freedom in a camera, and can directionally move in a certain range under the pushing of other action bodies, so that the shaking of the external fixing equipment of the camera can be compensated for actions, and the sensor can receive external light rays in a relatively static state.
To realize the active optical anti-shake function, an action component (generally, an electromagnetic actuation combination of a magnet and an electric coil) needs to be arranged in the camera to push the lens and/or the sensor to perform active action, and meanwhile, the lens and/or the sensor needs to be kept to have a certain range of freedom of movement in the camera module. The OIS optical anti-shake technology in the prior art is mainly directed to lens anti-shake, and has mature technical application and low cost for lens anti-shake (especially for miniature camera modules) due to the same actuating principle as the existing AF auto-focusing technology.
However, in order to reduce the size of many electronic devices (especially handheld terminal devices such as mobile phones), on the premise of ensuring that the size of important components such as batteries is not changed, the size of other internal components needs to be controlled, wherein the size of the camera is controlled as a key. The imaging quality of optical camera module is relevant with multiple factors such as sensor size, camera lens module, anti-shake technique and integrated algorithm, in case reduce the volume of whole camera module, will certainly lead to the fact the influence to the imaging quality. In order to further reduce the influence on the imaging quality, the optical anti-shake component which occupies a large space originally needs to be structurally adjusted, so that a sensor anti-shake technology is provided.
The sensor anti-shake principle is similar to the lens anti-shake principle, and since the entering light firstly passes through the lens module and then enters the sensor, the motion compensation can be realized by adjusting the motion direction of the lens or the motion direction of the sensor, but since the sensor has a smaller size, the sensor anti-shake mechanism is easier to optimize than the lens anti-shake mechanism, and since the weight is also obviously smaller than the lens module, the motion control is relatively simple.
The OIS base is a component for supporting the sensor, and the OIS base and the camera are movably connected, so that the OIS base can have a certain degree of freedom in the camera module and can perform spatial displacement. Since motion compensation needs to be given to the sensor, motion control is realized by matching a plurality of coils arranged on the OIS base with an external OIS magnet.
Wherein, the coil is connected with external circuit, can produce the steady magnetic field through circular telegram control, and OIS magnet is mostly the permanent magnet, then can produce effective magnetic field environment near the coil. When current passes through the coil, a magnetic field is generated due to electromagnetic effect, acting force can be generated to perform directional movement, and therefore the OIS base carrying the sensor moves. The specific control signal is a corresponding control command generated by the external processor according to motion data transmitted by a gyroscope arranged in the same terminal equipment with the camera, and the anti-shake component of each camera can be debugged after assembly, so that a better anti-shake effect is realized.
Different from prior art, because camera structural design characteristics, the OIS base that carries the sensor often sets up in the bottom of whole camera, and owing to have thinner thickness and great terminal surface, then originally the mode that the magnet side direction set up on the lens module is not applicable to this scheme. In order to realize better displacement control and volume control, can provide more direct effort with the coil integration on the OIS base, set up the magnet in the casing bottom of camera module simultaneously to close to corresponding coil department, can have better space utilization, and can not take place the subassembly with sensor or AF module and disturb, therefore magnet and coil can present ideal shape in the plane direction, in order to reach the effect that reduces overall height. Note that the height refers to a dimension in the axial direction of the camera.
It should be noted that the motion control of the magnet and the coil belongs to the commonly used electromagnetic control means in the prior art, but the position of the magnet and the coil needs to be adjusted due to different camera structures, so that the corresponding technical effect can be achieved. Because whole OIS base is the dull and stereotyped structure that resin material injection molding formed, its quality is lighter compared with the lens module, though can set up OIS magnet on OIS base, the coil sets up in camera module bottom, nevertheless because OIS magnet can bring the effect of gaining weight of showing to OIS base, will add design cost and material cost additional to its motion control, so generally set up the coil on OIS base is the best scheme.
With reference to the first aspect, the present invention provides a first implementation manner of the first aspect, where the OIS chassis includes a body formed by injection molding and a metal conductor disposed in the body, and an external circuit and a sensor are connected through the metal conductor; the other side of the body is provided with an annular groove arranged around the outer edge of the sensor, and a plurality of coils are arranged in the annular groove at equal central angles.
Whole OIS base is the resin and pours the piece, inside has the entity circuit structure, can connect the external line and carry out data transmission and power supply to the sensor (including the data transmission function in this embodiment, but because the entity circuit volume is great, then generally only as the power supply line, the control circuit is realized with outside FPC soft board), simultaneously in order to reduce the thickness of whole OIS base, the event is equipped with the annular groove on the opposite side terminal surface that is equipped with the sensor, the interior edge of annular groove is greater than or just in time equals the outer edge size of the required installation position of sensor, make a plurality of coils that the back set up can set up around sensor circumference.
In combination with the first embodiment of the first aspect, the present invention provides a second embodiment of the first aspect, wherein a bottom plate is arranged in the annular groove, and the coil is arranged on the bottom plate and connected with a circuit in the bottom plate.
The so-called chassis is a circular PCB structure for connecting an external control circuit, inputting a control current to the coil, and performing motion detection through a plurality of sensor pairs on the chassis.
In combination with the second embodiment of the first aspect, the present invention provides the third embodiment of the first aspect, further comprising a bottom cover, the OIS magnet being disposed on the bottom cover.
The bottom is the bottom structure of whole module of making a video recording, forms complete module main part frame construction of making a video recording with the shell lock on upper portion, different with prior art, because the anti-shake part setting in the VCM motor is in camera lens department, then the sensor generally all sets up on the bottom, leads to not only needing to set up the PCB board on the bottom, still need connect outside winding displacement, leads to its one side outside still to be equipped with the structure that is used for loading the winding displacement alone. Simultaneously because sensor, coil, magnet all set up on the bottom, for the ease of the installation, can adopt double-deck or multilayer structure stack, not only can cause the high increase of whole module of making a video recording, can increase the technology degree of difficulty and manufacturing cost simultaneously when the assembly. And by adopting the anti-shake structure of the sensor, the same or better motion compensation control can be achieved by only arranging the OIS magnet on the bottom cover and controlling the current of the coil on the OIS base. Meanwhile, the design of a multi-layer bottom cover or bottom plate structure is avoided, and the manufacturing process is simplified, so that the manufacturing cost is reduced, and the product yield is improved.
With reference to the third embodiment of the first aspect, the present invention provides a fourth embodiment of the first aspect, wherein an inner flexible board located on the same plane as the sensor is further disposed on the OIS chassis, and the external control circuit, the sensor and the backplane are connected through the inner flexible board.
With reference to the first aspect and the first to fourth embodiments thereof, the present invention provides a fifth embodiment of the first aspect, wherein a hall sensor is disposed in a middle portion of an inner ring of the single or multiple coils.
It is worth to be noted that the hall sensor is connected with an external control circuit, and sends the motion information of the OIS base to the outside, thereby forming closed-loop control.
In a second aspect, the invention further provides a camera module, which adopts the substrate OIS magnetic-driven mechanism in the claims, and further comprises a shell and a bottom plate which are mutually buckled, wherein an AF module is arranged in the shell, the OIS base is movably connected with the shell, and light rays incident from the AF module enter the sensor;
the shell is internally provided with an FPC soft board connected with an external control circuit, and the FPC soft board is arranged in the shell in a surrounding mode by taking the incident light direction as an axis.
The existing camera module also has the power supply circuit and the control circuit which are independently arranged, wherein the control circuit is connected by adopting an FPC (flexible printed circuit) soft board, but the FPC soft board in the prior art is limited in the arrangement position due to the limitation of the set lens OIS mechanism, and is divided into a plurality of circuits for independent transmission, so that the difficulty of the assembly process is increased. Because the OIS anti-shake magnet assembly is arranged at the bottom, the occupied space is small, the complex flat cable can be arranged into an integrated structure and can be arranged in the shell under the condition of not changing the volume of the original camera module, and a special fixing and bonding process is not required to be arranged, so that the process difficulty and steps are reduced, the manufacturing cost is saved, and the yield is improved.
The invention has the beneficial effects that:
the OIS magnet is arranged on the lowest cover plate, and does not generate component interference with the image sensor or the AF driving unit, so that the magnet and the coil can present an ideal shape in the plane direction to achieve the effect of reducing the overall height
Drawings
Fig. 1 is an axial schematic view of an assembled state of an entire camera module in embodiment 2 of the present invention;
fig. 2 is a side view schematically illustrating an assembled state of the entire camera module in embodiment 2 of the present invention;
fig. 3 is a schematic side view of the entire camera module in a disassembled state according to embodiment 2 of the present invention;
fig. 4 is a schematic axial view of the entire camera module in a disassembled state according to embodiment 2 of the present invention;
fig. 5 is a schematic side view of a bottom view angle in a state where the entire camera module is detached in embodiment 2 of the present invention;
FIG. 6 is a partial component mounting axial side schematic view of the entire substrate OIS magnetomotive mechanism in embodiment 1 of the present invention;
FIG. 7 is a partially disassembled axial side schematic view of the entire substrate OIS magnetomotive mechanism in embodiment 1 of the present invention;
FIG. 8 is a schematic axial view of a circuit board and a bottom cover on which separate coils are disposed in accordance with embodiment 1 of the present invention;
FIG. 9 is a schematic axial view of another angle between the circuit board and the bottom cover of the coil in accordance with embodiment 1 of the present invention;
fig. 10 is an assembled state front view with the AF module removed in embodiment 2 of the present invention;
fig. 11 is a schematic cross-sectional view of the invention taken along section line a-a in fig. 10.
In the figure: the sensor comprises a shell 1, a 2-AF module, a 3-FPC soft board, a 3.1-inner soft board, a 4-OIS base, a protective cover 5, a bottom cover 6, an elastomer 7, a sensor 8, an OIS magnet 9, a bottom plate 10, a coil 11 and a Hall sensor 12.
Detailed Description
The invention is further explained below with reference to the drawings and the specific embodiments.
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present application, presented in the accompanying drawings, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present application, it should be noted that if the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are used for indicating the orientation or positional relationship based on the orientation or positional relationship shown in the drawings or the orientation or positional relationship which is usually placed when the product of the application is used, the description is only for convenience and simplicity, and the indication or suggestion that the referred device or element must have a specific orientation, be constructed in a specific orientation and be operated, and thus, should not be construed as limiting the present application. Furthermore, the appearances of the terms "first," "second," and the like in the description herein are only used for distinguishing between similar elements and are not intended to be construed as indicating or implying relative importance.
Furthermore, the terms "horizontal", "vertical" and the like when used in the description of the present application do not require that the components be absolutely horizontal or overhanging, but may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.
In the description of the present application, it should also be noted that, unless otherwise explicitly stated or limited, the terms "disposed," "mounted," "connected," and "connected" should be interpreted broadly, e.g., as being fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.
Example 1:
the embodiment discloses a substrate OIS magnetic motive mechanism, sets up the assembly order of adjusting interior mechanism in the module of making a video recording of a sensor 8 anti-shake to reduce the thickness of whole module of making a video recording.
Specifically, as shown in fig. 6 to 9, two main components, that is, the OIS chassis 4 and the bottom cover 6 are shown, the bottom cover 6 is a bottom baffle of the entire camera module, the circuit and the sensor 8 in the prior art are both disposed at the position, and due to the fact that the number of wires is large, the assembly difficulty is large due to the adoption of a multi-layer structure design in the prior art.
The OIS base 4 is movably connected with the camera module, and the sensor 8 is arranged on the OIS base 4; a plurality of coils 11 are provided on the OIS chassis 4, and an OIS magnet 9 corresponding to the coils 11 is fixed in the camera. The OIS base 4 is used for supporting parts of the sensor 8, and the OIS base 4 and the camera are movably connected, so that the OIS base 4 can have a certain degree of freedom in the camera module and can perform spatial displacement. Since motion compensation needs to be given to the sensor 8, motion control is achieved by a plurality of coils 11 provided on the OIS chassis 4 in cooperation with the external OIS magnet 9. The coil 11 is connected to an external circuit and can generate a stable magnetic field by energization control, and the OIS magnet 9 is mostly a permanent magnet and can generate an effective magnetic field environment in the vicinity of the coil 11.
When a current passes through the coil 11, which generates a magnetic field due to electromagnetic effects, a force can be generated to move directionally, thereby moving the OIS base 4 carrying the sensor 8. The specific control signal is a corresponding control command generated by the external processor according to motion data transmitted by a gyroscope arranged in the same terminal equipment with the camera, and the anti-shake component of each camera can be debugged after assembly, so that a better anti-shake effect is realized.
In order to realize better displacement control and volume control, more direct acting force can be provided by integrating the coil 11 on the OIS base 4, and meanwhile, the magnet is arranged at the bottom of the shell of the camera module and close to the corresponding coil 11, so that better space utilization rate can be achieved, and component interference with the sensor 8 or the AF module 2 can not occur, therefore, the magnet and the coil 11 can be in an ideal shape in the plane direction, and the effect of reducing the overall height can be achieved. Note that the height refers to a dimension in the axial direction of the camera.
The whole OIS base 4 is a resin casting, has a solid circuit structure inside, can be connected with an external circuit to carry out data transmission and power supply on the sensor 8, and simultaneously reduces the thickness of the whole OIS base 4. Specifically, the OIS chassis 4 includes a body formed by injection molding and a metal conductor disposed in the body, and connects the external circuit and the sensor 8 through the metal conductor; an annular groove arranged around the outer edge of the sensor 8 is arranged on the other side of the body, and a plurality of coils 11 are arranged in the annular groove at equal central angles. The inner edge of the annular groove is larger than or exactly equal to the outer edge dimension of the desired mounting location for the sensor 8, so that a plurality of back-disposed coils 11 can be circumferentially disposed around the sensor 8. And a bottom plate 10 is arranged in the annular groove, and the coil 11 is arranged on the bottom plate 10 and is connected with a circuit in the bottom plate 10. The so-called base plate 10 is a circular PCB structure, and the base plate 10 is used for connecting an external control circuit, inputting a control current to the coil 11, and performing motion detection through a plurality of sensor 8 pairs on the base plate 10.
The OIS base 4 is also provided with an inner soft board 3.1 which is positioned on the same plane with the sensor 8, the outer control circuit, the sensor 8 and the bottom board 10 are connected through the inner soft board 3.1, and the middle part of the inner ring of the partial coil 11 is provided with a Hall sensor 128. The hall sensor 128 is connected with an external control line, and transmits the motion information of the OIS base 4 to the outside, thereby forming closed-loop control.
Example 2:
the present embodiment discloses a camera module structure, which has the fixing structure of the suspended image sensor 8 in embodiment 1.
Specifically, the camera module is designed as an anti-shake structure of the sensor 8, and as shown in fig. 1 to 4, the split structure diagram of fig. 4 is not sequentially split according to the covering order of the structure, so it should be noted that the whole camera module is composed of the housing 1 and the bottom cover 6, and the bottom cover 6 is a single plate structure and is fastened on the bottom opening of the housing 1.
The main functional components in the housing 1 include the AF module 2, the sensor 8, and the above-described suspended fixing structure, the sensor 8 is provided on the OIS chassis 4, and the protective cover 5 is provided on the sensor 8. The AF module 2 is arranged on the shell 1 and is provided with a single FPC flat cable connected with an external control circuit and a power supply circuit. The AF module 2 has an automatic zoom mechanism therein, and can autonomously complete the lens axis reciprocating motion in the housing 1. And the elastomer 7 of the OIS is arranged at the upper part of the shell 1, and the lower part of the elastomer 7 is also provided with a gasket connected with the shell 1 for supporting and fixing.
In this embodiment, the suspension mechanism includes an OIS chassis 4 connected to a projectile 7, which is the same as in embodiment 1 above, and a metal plate, a metal inner body, a sensor 8, and a PCB with a coil 11 at the bottom are connected to form an integrated structure by a resin injection molding process. And an FPC soft board 3 structure is arranged around the OIS base 4, and the FPC soft board 3 is connected with one side end face of the OIS base 4 provided with a sensor 8 and used for power supply and control signal input.
And a plurality of OIS magnets 9 are further provided on the bottom cover 6, which correspond to coils 11 provided on the OIS base 4, and a specific current is input to the coils 11 through an external control circuit, so that a specific magnetic field is generated to cause the OIS base 4 to perform directional movement on the magnets, thereby forming motion compensation.
The present invention is not limited to the above-described alternative embodiments, and various other forms of products can be obtained by anyone in light of the present invention. The above detailed description should not be taken as limiting the scope of the invention, which is defined in the claims, and which the description is intended to be interpreted accordingly.

Claims (7)

1. A substrate OIS magnetic motive mechanism is arranged in a camera module to provide motion compensation for a sensor (8), and is characterized in that: the camera shooting device comprises an OIS base (4), wherein the OIS base (4) is movably connected with a camera shooting module, and a sensor (8) is arranged on the OIS base (4);
a plurality of coils (11) are arranged on the OIS base (4), and an OIS magnet (9) corresponding to the coils (11) is fixed in the camera.
2. A substrate OIS magnetomotive mechanism according to claim 1, further comprising: the OIS base (4) comprises a body formed by injection molding and a metal conductor arranged in the body, and an external circuit and the sensor (8) are connected through the metal conductor; an annular groove arranged around the outer edge of the sensor (8) is arranged on the other side of the body, and a plurality of coils (11) are arranged in the annular groove at equal central angles.
3. A substrate OIS magnetomotive mechanism according to claim 2, further comprising: a bottom plate (10) is arranged in the annular groove, and the coil (11) is arranged on the bottom plate (10) and is connected with a circuit in the bottom plate (10).
The so-called chassis is a circular PCB structure for connecting an external control circuit, inputting a control current to the coil, and performing motion detection through a plurality of sensor pairs on the chassis.
4. A substrate OIS magnetomotive mechanism according to claim 3, further comprising: further comprising a bottom cover (6), the OIS magnet (9) being arranged on the bottom cover (6).
5. A substrate OIS magnetically actuated mechanism according to claim 4, further comprising: the OIS base (4) is further provided with an inner soft board (3.1) which is positioned on the same plane with the sensor (8), and an external control circuit, the sensor (8) and the bottom board (10) are connected through the inner soft board (3.1).
6. A substrate OIS magnetically actuated mechanism according to any of claims 1 to 5, wherein: the middle part of the inner ring of one or more coils (11) is provided with a Hall sensor (12).
7. The utility model provides a module of making a video recording which characterized in that: a substrate OIS magnetomotive mechanism according to claim 6 is used.
CN202110601872.3A 2021-05-31 2021-05-31 Substrate OIS magnetic-driven mechanism and camera module adopting same Pending CN113364952A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110601872.3A CN113364952A (en) 2021-05-31 2021-05-31 Substrate OIS magnetic-driven mechanism and camera module adopting same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110601872.3A CN113364952A (en) 2021-05-31 2021-05-31 Substrate OIS magnetic-driven mechanism and camera module adopting same

Publications (1)

Publication Number Publication Date
CN113364952A true CN113364952A (en) 2021-09-07

Family

ID=77530460

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202110601872.3A Pending CN113364952A (en) 2021-05-31 2021-05-31 Substrate OIS magnetic-driven mechanism and camera module adopting same

Country Status (1)

Country Link
CN (1) CN113364952A (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111123464A (en) * 2020-01-16 2020-05-08 成都易迅光电科技有限公司 VCM motor's integral type supporting structure that has a circuit
CN111146921A (en) * 2020-01-16 2020-05-12 成都易迅光电科技有限公司 Double-layer base structure of VCM motor
CN111654603A (en) * 2020-05-27 2020-09-11 维沃移动通信有限公司 Imaging device, electronic apparatus, and method for controlling imaging device
CN112752005A (en) * 2020-12-30 2021-05-04 上海比路电子股份有限公司 Driving device for moving image sensor sight zooming function
CN214675366U (en) * 2021-05-31 2021-11-09 成都易迅光电科技有限公司 Substrate OIS magnetic-driven mechanism and camera module adopting same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111123464A (en) * 2020-01-16 2020-05-08 成都易迅光电科技有限公司 VCM motor's integral type supporting structure that has a circuit
CN111146921A (en) * 2020-01-16 2020-05-12 成都易迅光电科技有限公司 Double-layer base structure of VCM motor
CN111654603A (en) * 2020-05-27 2020-09-11 维沃移动通信有限公司 Imaging device, electronic apparatus, and method for controlling imaging device
CN112752005A (en) * 2020-12-30 2021-05-04 上海比路电子股份有限公司 Driving device for moving image sensor sight zooming function
CN214675366U (en) * 2021-05-31 2021-11-09 成都易迅光电科技有限公司 Substrate OIS magnetic-driven mechanism and camera module adopting same

Similar Documents

Publication Publication Date Title
CN104423003B (en) Camera module
CN214591657U (en) Camera module and electronic equipment
US11487078B2 (en) Lens assembly driving apparatus, photographing module and electronic device
CN112637470B (en) Camera module and electronic equipment
CN109061979A (en) Lens module
CN113163100A (en) Sensor-Shift camera module
KR20140077301A (en) Camera Module
CN112865400A (en) Motor anti-shake mechanism, lens driving device, camera device, and electronic product
CN212115124U (en) Voice coil motor for camera module
CN214675366U (en) Substrate OIS magnetic-driven mechanism and camera module adopting same
CN113382144B (en) Sensor displacement type anti-shake camera module, camera anti-shake system and mobile terminal
CN210038301U (en) Lens driving device and periscopic lens mechanism
CN214591665U (en) Sensor-Shift camera module
CN113364952A (en) Substrate OIS magnetic-driven mechanism and camera module adopting same
CN114666486B (en) Camera module and electronic equipment
CN214959788U (en) Self-rotating sensor displacement anti-shake structure
WO2023000487A1 (en) Autofocus anti-shake periscope motor having laser etching conductive circuit
CN214591666U (en) Camera module with independent AF module and OIS module
CN116261023A (en) Anti-shake camera module
CN220985765U (en) Driving device, camera module and electronic equipment
CN219842587U (en) Lens driving device, camera and electronic equipment
KR102270776B1 (en) Camera Module
CN220040850U (en) Lens driving device based on SMA assembly
CN218217524U (en) Lens mounting structure, camera module and electronic equipment
CN210038297U (en) Base for periscopic lens driving device

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination