KR102270776B1 - Camera Module - Google Patents

Abstract

A camera module according to an embodiment of the present invention includes a printed circuit board on which an image sensor is mounted; a housing unit disposed above the printed circuit board; a holder module disposed to be spaced apart from an inner bottom surface of the housing unit by a predetermined distance, a first coil wound around an outer circumferential surface, and including at least one lens therein; a wiring unit disposed above the holder module and including an electronic circuit pattern layer; a plate member coupled to the bottom surface of the holder module; and a plurality of wire springs having one end connected to the wiring unit and the other end connected to the plate member.

Description

Camera Module

The present invention relates to a camera module.

Since it is difficult to apply a technology such as VCM used in an existing general camera module to a camera module for ultra-small size and low power consumption, research related thereto has been actively conducted.

In the case of a camera module mounted on a small electronic product such as a smartphone, the camera module may frequently be impacted during use, and the camera module may be slightly shaken according to a user's hand shake while shooting. In view of this point, the development of a camera module in which an anti-shake means is additionally installed in the camera module is recently required.

The OIS module is usually divided into a lens shift that moves the lens in the horizontal direction, sensor shift that moves the image sensor in the horizontal direction, and module tilt that moves the AF module in the horizontal direction, depending on the object to be moved along the X and Y axes.

(Patent Document 1) KR10-1200711 B1

An object of the present invention is to provide a camera module having an optical image stabilizer (OIS) function.

A camera module according to an embodiment of the present invention includes a printed circuit board on which an image sensor is mounted; a housing unit disposed above the printed circuit board; a holder module disposed to be spaced apart from an inner bottom surface of the housing unit by a predetermined distance, a first coil wound around an outer circumferential surface, and including at least one lens therein; a wiring unit disposed above the holder module and including an electronic circuit pattern layer; a plate member coupled to the bottom surface of the holder module; and a plurality of wire springs having one end connected to the wiring unit and the other end connected to the plate member.

The holder module includes: an outer blade on which a first coil is wound on an outer circumferential surface; a bobbin disposed in the center of the outer blade, the lens disposed therein, and a second coil fixed to an outer circumferential surface thereof.

The wiring unit may be formed of an electronic circuit pattern layer integrally formed on a surface of the housing unit.

The electronic circuit pattern layer may be formed on at least one of an exposed surface and an inner surface of the housing unit.

The electronic circuit pattern layer may further include a metal layer formed by any one of coating and plating with a conductive material.

The housing unit may include a first housing disposed above the printed circuit board; a second housing disposed above the first housing; first and second permanent magnets interposed between the first and second housings; and a yoke disposed between the first and second permanent magnets or located on the inner surface of the first and second housings to transmit magnetic force into the holder module; One side wall of the first and second housings may be covered by the electronic circuit pattern layer.

The yoke may be formed to protrude a central portion facing the holder module.

The electronic circuit pattern layer may be integrally formed on the surfaces of the first and second housings.

A shield can having a through hole at a position corresponding to the connection portion between the wiring unit and the wire spring and the lens module, and installed to surround the housing unit; may further include.

The holder module includes upper and lower elastic members respectively disposed on the upper and lower sides of the bobbin to elastically support the bobbin with respect to the outer blade, wherein the center of the first coil has a magnetic force toward the second coil. A space portion may be formed to be invested.

The electronic circuit pattern layer may be integrally formed with a terminal portion at a portion connected to the printed circuit board.

The wire spring may be made of a metal material, and may be electrically connected to the plate member.

At least six wire springs may be provided to supply power of two polarities for auto-focusing control and four polarities for driving OIS to the holder module through connection with a wiring unit.

The wire springs are of the same length and are arranged two by two at the corners of the holder module, so that a total of eight can be provided.

Since the wiring unit for supplying power to the wire spring can be configured by forming an electronic circuit pattern layer instead of the conventional FPCB, it is possible to provide a highly reliable camera module with little risk of disconnection due to external impact.

In addition, although it may be formed on the surface of a separate substrate, it is also possible to form integrally with the existing housing unit 20, thereby saving space for installing the FPCB, which is advantageous for miniaturization of the camera module.

1 is a schematic plan view of a camera module according to an embodiment of the present invention;
Figure 2 is a cross-sectional view AA of Figure 1,
3 and 4 are side views of a camera module according to an embodiment of the present invention;
5 is a view showing an example of a housing unit having an electronic circuit pattern layer according to an embodiment of the present invention;
6 is a schematic plan view of a camera module having an electronic circuit pattern layer according to another embodiment of the present invention, and,
7 is a view illustrating an example of a housing unit having an electronic circuit pattern layer according to an embodiment of the present invention.

Hereinafter, a preferred embodiment of the present invention will be described with reference to the drawings.

1 is a schematic plan view of a camera module according to an embodiment of the present invention, FIG. 2 is a cross-sectional view taken along line AA of FIG. 1 , FIGS. 3 and 4 are side views of a camera module according to an embodiment of the present invention, and FIG. 5 is a view showing an example of a housing unit having an electronic circuit pattern layer according to an embodiment of the present invention, Figure 6 is a schematic plan view of a camera module having an electronic circuit pattern layer according to another embodiment of the present invention, and , FIG. 7 is a view showing an example of a housing unit having an electronic circuit pattern layer according to an embodiment of the present invention.

As shown in Fig. 2 showing a schematic plan view of Fig. 1 and a schematic side view showing a cross section AA of Fig. 1, the camera module according to an embodiment of the present invention is a printed circuit board 10, a housing unit ( 20 ), the holder module 30 , the plate member 40 , the wiring unit 50 , the wire spring 60 , and the electronic circuit pattern layer 100 .

In the printed circuit board 10, the image sensor 11 is mounted in the vicinity of the center, and it is preferable that the printed circuit board 10 is provided as a PCB board. Components for operating the image sensor 11 may be disposed on the printed circuit board 10 , or a plurality of terminal units capable of supplying power and outputting information of the image sensor 11 may be provided.

The housing unit 20 is disposed on the upper side of the printed circuit board 10 and forms a skeleton of the camera module. According to a preferred embodiment of the present invention, the housing unit 20 includes a first housing 21 , a second housing 22 , first and second permanent magnets 23 , 24 and a yoke 25 . includes

The first housing 21 as a base is disposed on the upper side of the printed circuit board 10 and is provided to be spaced apart from the image sensor 11 by a predetermined distance. A filter member capable of filtering an image incident to the image sensor 11 may be further installed in the first housing 21 , if necessary.

The second housing 22 is disposed above the first housing 21 to cover the first housing 21 . An opening is formed at a position corresponding to the image to be transmitted to the image sensor 11 in the vicinity of the center of the second housing 22 . A wiring unit 50 , which will be described later, may be disposed on the upper surface of the second housing 22 .

The first and second permanent magnets 23 and 24 are interposed between the first and second housings 21 and 22 to invest magnetic force into the holder module 30 . The first and second permanent magnets 23 and 24 may have the same size. In addition, the first and second permanent magnets 23 and 24 and the yoke 25 may be disposed on the inner surfaces of the first and second housings if possible within the design tolerance range.

On the other hand, if the sizes of the first and second permanent magnets 23 and 24 are increased, the OIS operation is increased even with a small current, and if the sizes of the first and second permanent magnets 23 and 24 are constant, In this case, as the current flowing through the first and second coils 31a and 32a disposed at positions corresponding to the first and second permanent magnets 23 and 24 increases, the OIS driving increases. In conclusion, the larger the size of the first and second permanent magnets 23 and 24, the better the OIS drive, but the optimal size can be designed within other design tolerances.

The yoke 25 is interposed between the first and second permanent magnets 23 and 24 . In addition, the yoke 25 is provided in a protruding shape near the center so that the magnetic force of the first and second permanent magnets 23 and 24 can be invested into the inner space of the holder module 30 . Preferably, the width is provided the same as the first and second permanent magnets 23 and 24, and the center protrudes to a certain size so that the permanent magnet and the yoke are formed to have an approximately “T” shape. desirable.

The holder module 30 is spaced apart from the inner bottom surface of the housing unit 20 by a predetermined distance, and includes an outer blade 31 and a bobbin 32 . The holder module 30 may perform pendulum motion in forward/backward/left/right and diagonal directions while being suspended from the wire spring 60 .

Elastic members 35 and 36 are provided on upper and lower sides of the outer blade 31 , and the bobbin 32 can be elastically supported in vertical movement by the elastic members 35 .

As shown in FIG. 1 , the outer blade 31 has a total of four first coils 31a to 31d wound on the outer peripheral surface of the four sides, and the four side central portions on which the coils 31a to 31d are wound. It is drilled without a coil. The yoke 25 is disposed at a position corresponding to the open space, so that the yoke 25 may be partially inserted into the space.

A plate member 40 may be fixed to a lower surface of the outer blade 31 by a fixing member 33 such as a double-sided tape or an adhesive. The outer blade 31 is front, rear, left, right, or forward, as shown in the arrow of FIG. 2 according to the interaction between the magnetic force of the first and second permanent magnets 22 and 23 and the first coils 31a to 31d. It is suspended by a plurality of wire springs 60 so as to be able to move in a diagonal direction, and is spaced apart from the bottom surface of the first housing 21 by a predetermined distance.

In addition, a plurality of spring through-holes 37 may be provided in the outer blade 31 so that the wire spring 60 may pass through and be connected to the plate member 40 .

In the bobbin 32 , the outer blade 31 is vertically movable inside, and at least one lens 34 is installed therein. A second coil 32a is wound around the outer circumferential surface of the bobbin 32 , and the second coil 32a is connected to the first coils 31a to 31d of the outer blade 31 through the yoke 25 . An operation of raising and lowering the bobbin 32 is performed by interaction with the magnetic force invested through the empty space. As the size of the yoke 25 increases, the AF driving improves, but this may also vary depending on an optimal design value. It is possible to automatically adjust the focus of the image transmitted to the image sensor 11 by the lifting action of the bobbin 32 as described above.

The plate member 40 is preferably made of a conductive metal material, and is disposed on the bottom surface of the outer blade 31 as described above to supply power to the first and second coils 31a and 32a. The wire spring 60 is connected so that The connection method can be any method as long as it can be connected by soldering or other conductive material. That is, the connection portion w' of the plate member 40 is connected to the first and second coils 31a and 32a, respectively, as shown in FIG. 2 , and is connected to the wire spring 60 through the The supplied power is transmitted to the first and second coils 31a and 32a to form an electromagnetic force.

At this time, in the case of the second coil 32a, it may be directly connected to the plate member 40, and as shown in FIG. 2, first, it is connected to the lower spring 36, and then the lower spring 36 is connected to the lower spring 36. It is also possible to connect with the plate member 40 .

The wiring unit 50 may be disposed on the upper side of the second housing 22 , and the power transmitted through the terminal part 52 of the wiring unit 50 connected to the printed circuit board 10 is the plate member. It is transmitted to the plate member 40 through the wire spring 60 connected as shown in (40). The connection method can be any method as long as it can be connected by soldering or other conductive material.

As shown in FIGS. 2 to 4, the wiring unit 50 is provided to cover one side wall of the first and second housings 21 and 22. In this case, the first and second permanent A window 55 is formed on the surface facing the magnets 23 and 24 and the yoke 25 , and may be configured to avoid interference with them. This is a configuration for avoiding this, since the first and second permanent magnets 23 and 24 and the yoke 25 are generally directly attached to the shield can 70 to be described later with a fixing means such as epoxy.

According to an embodiment of the present invention, as shown in FIGS. 2 and 5 , the wiring unit 50 may form wiring by using a technique for forming the electronic circuit pattern layer 100 on the surface.

The technique can be divided into three major techniques.

First, the first method is a plating method through double molding, and the body portion constituting the wiring unit 50 and the portion constituting the externally exposed side wall surface on which the electronic circuit pattern layer 100 is provided are made of synthetic resins of different materials. Can be injection molded. In this case, the body portion of the base 20 is injected with an insulating material, and the sidewall portion where the electronic circuit pattern layer 100 is to be formed is injected using a conductive synthetic resin, or the portion where the electronic circuit pattern layer 100 is to be formed. After injection molding using a synthetic resin that is easy to metal plating, the wiring unit 50 is injection molded, and then, the electronic circuit pattern layer 100 is completed by a subsequent process such as an electroplating operation.

In the second method, when the wiring unit 50 is injected, injection molding is performed in a state including impurities that react to light and heat, and the injection-molded wiring unit 50 is subjected to a surface operation such as laser exposure, and an electronic circuit pattern layer By performing laser exposure on the exposed sidewall surface where 100 is to be formed, the electronic circuit pattern layer 100 may be formed on this portion.

The third method is a method of metallizing the entire surface of the wiring unit 50 to form the electronic circuit pattern layer 100 on the exposed surface by metallizing the entire surface.

On the other hand, on the surface of the electronic circuit pattern layer 100 formed by the first to third methods described above, it is also possible to further form a metal layer formed by any one of coating and plating with a conductive material.

According to another embodiment of the present invention, as shown in FIGS. 6 and 7 , the electronic circuit pattern layer 100 on the surfaces of the first and second housings 21 and 22 instead of the wiring unit 50 . ) can also be formed directly. In this case, the electronic circuit pattern layer 100 may replace the role of the wiring unit 50 . Then, the electronic circuit pattern layer 100 is formed directly on the surfaces of the first and second housings 21 and 22 to supply power to the wire spring 60, so that the wiring unit 50 is caused by an external shock or the like. It can prevent short circuit to occur.

As described above, when wiring is formed with the electronic circuit pattern layer 100 , the terminal part 52 shown in FIGS. 2 and 6 may also be formed integrally with the electronic circuit pattern layer 100 , or a separate It is also possible to be formed by attaching a terminal module made of a metal material.

According to such a configuration, it is possible to minimize the occurrence of problems such as disconnection due to external impact, and since there is no need for a space to separately arrange the wiring unit 50 using an FPCB or the like, it is advantageous for miniaturization of the camera module.

Both ends of the wire spring 60 are connected to the plate member 40 and the wiring unit 50 . At this time, one end of the wire spring 60 is connected to the wiring unit 50 as shown in FIG. 2 , and the wire spring 60 connected to the wiring unit 50 connects the terminal part 52 . By supplying power supplied through the plate member 40 to the side of the first and second coils 31a and 32a, the first and second permanent magnets 23 and 24 can interact with each other. .

In addition, as shown in FIG. 2 , the other end of the wire spring 60 passes through a spring through hole 37 formed in the outer blade 31 , and a plate member installed on the bottom surface of the outer blade 31 . (40) is connected. At this time, the other end of the wire spring 60, although not shown, is connected from a pad (not shown) formed on the plate member 40 like the wiring unit 50, and the center of the pad (not shown). A through hole (not shown) through which the wire spring 60 passes is formed. The connection method can be any method as long as it can be connected by soldering or other conductive material. According to this configuration, the outer blade 31 may be suspended from the wire spring 60 and spaced apart from the bottom surface of the first housing 21 by a predetermined distance or more. Then, according to the interaction between the first coil 31a and the first and second permanent magnets 23 and 24, the outer blade 31 performs pendulum motion, It is possible to correct the vibration of the 31 ) by the interaction of the first coil 31a with the first and second permanent magnets 23 and 24 . To this end, it is preferable that the wire spring 60 is made of a metal material that has elasticity and can conduct electricity so as to withstand an impact.

On the other hand, the thinner the wire spring 60, the better the hand shake correction movement even with a small current, but this may vary depending on the optimal design value. Preferably, the thickness of the wire spring 60 is several μm to several hundred μm, preferably 1 to 100 μm.

In addition, the wire spring 60 is preferably provided with at least six or more, at least two polarities for auto-focusing control and four polarities for hand-shake correction movement hand-shake correction are connected to the wiring unit 50 It is necessary to supply to the holder module 30 through

According to a preferred embodiment of the present invention, as shown in FIGS. 1 and 2 , two of the same length and two each are arranged at the corners of the holder module 30, it is good to provide a total of eight for balancing .

Meanwhile, as shown in FIG. 2 , when a separate third housing such as a shield can 70 is further included, as described above, the wiring unit 50 includes the first and second permanent magnets 23 ) 24 and the yoke 25 are fixedly coupled to the shield can 70 with epoxy or the like, in order to avoid this coupling part, a window 55 is formed to form the first and second housings 21 (22) cover the side wall surface.

The shield can 70 has a through hole at a position corresponding to the holder module 30 around the connection part w between the wiring unit 50 and the wire spring 60, and the housing units 21 and 22. It can be installed to surround the

Meanwhile, as shown in FIG. 2 , the hook unit 80 may be provided on four surfaces or at least one surface in order to fix the shield can 70 to the first housing 21 . The positions may be within a range allowed by the center or edge design, and the number may be one or plural.

The hook unit 80 may include a hook 81 protruding from the first housing 21 and a hook hole 82 formed through the shield can 70 facing the hook 81. , and vice versa, if necessary.

The embodiments of the present invention described above and shown in the drawings should not be construed as limiting the technical spirit of the present invention. The protection scope of the present invention is limited only by the matters described in the claims, and those skilled in the art can improve and change the technical idea of the present invention in various forms. Accordingly, such improvements and modifications will fall within the protection scope of the present invention as long as it is apparent to those of ordinary skill in the art.

10; printed circuit board 20; housing unit
21; first housing 22; second housing
23; a first permanent magnet 24; 2nd permanent magnet
25; yoke 30; holder module
31; outer blade 31a; first coil
32; bobbin 32a; 2nd coil
40; wiring unit 50; wiring unit
52; terminal 60; wire spring
70; shield can 80; hook unit
100; electronic circuit pattern layer

Claims (20)

Base;
a holder module including an outer blade spaced apart from the base, a bobbin disposed in the outer blade, and an elastic member connecting the outer blade and the bobbin;
a second coil disposed on the bobbin;
a permanent magnet for moving the bobbin through interaction with the second coil;
a first coil for moving the holder module through interaction with the permanent magnet;
a wire connected to the holder module; and
an electronic circuit pattern layer electrically connected to the second coil;
The electronic circuit pattern layer is an image stabilization device electrically connected to the elastic member. According to claim 1,
The electronic circuit pattern layer is an image stabilization device electrically connected to the wire. According to claim 1,
The wire includes first to fourth wires,
The base includes a first corner portion and a second corner portion disposed opposite to each other with respect to the optical axis, and a third corner portion and a fourth corner portion disposed opposite to each other with respect to the optical axis,
The first to fourth wires are respectively disposed at positions corresponding to the first to fourth corner portions of the base. According to claim 1,
The wire comprises four wires,
The four wires are symmetrically disposed with respect to the optical axis. According to claim 1,
The electronic circuit pattern layer includes two terminals for focusing,
The two terminals for the focusing are electrically connected to the second coil. 5. The method of claim 4,
The electronic circuit pattern layer includes four terminals for image stabilization,
The four terminals for the hand shake compensation are electrically connected to the first coil. According to claim 1,
The electronic circuit pattern layer is a hand shake correction device formed of a metal on the surface of the insulating material. According to claim 1,
The elastic member includes an upper spring and a lower spring disposed below the upper spring,
The electronic circuit pattern layer is electrically connected to the second coil through the lower spring. 9. The method of claim 8,
The holder module includes a plate member connected to the wire,
The second coil is connected to the plate member through the lower spring. According to claim 1,
The electronic circuit pattern layer includes a portion extending in the optical axis direction. According to claim 1,
The wire is formed of a metal material and has a thickness of 1 to 100㎛ hand-shake compensation device. According to claim 1,
The first coil includes four coils,
The second coil is an image stabilization device formed of a single coil. According to claim 1,
The electronic circuit pattern layer is an image stabilization device formed on the outer surface of the base. printed circuit board;
an image sensor disposed on the printed circuit board;
The hand shake correction device of claim 1 disposed on the printed circuit board; and
A camera module including a lens coupled to the bobbin of the image stabilization device. A smartphone comprising the camera module of claim 14 . Base;
a holder module including an outer blade spaced apart from the base, a bobbin disposed in the outer blade, and an elastic member connecting the outer blade and the bobbin;
a second coil disposed on the bobbin;
a permanent magnet disposed at a position corresponding to the second coil;
a first coil disposed at a position corresponding to the permanent magnet;
a wire connected to the holder module; and
and an electronic circuit pattern layer including two terminals electrically connected to the second coil,
The two terminals of the electronic circuit pattern layer are electrically connected to the elastic member. 17. The method of claim 16,
The wire includes first to fourth wires,
The base includes a first corner portion and a second corner portion disposed opposite to each other with respect to the optical axis, and a third corner portion and a fourth corner portion disposed opposite to each other with respect to the optical axis,
The first to fourth wires are respectively disposed at positions corresponding to the first to fourth corner portions of the base. 17. The method of claim 16,
The wire comprises four wires,
The four wires are symmetrically disposed with respect to the optical axis. 17. The method of claim 16,
wherein the electronic circuit pattern layer includes four terminals electrically connected to the first coil. Base;
a holder module including an outer blade spaced apart from the base, a bobbin disposed in the outer blade, and an elastic member connecting the outer blade and the bobbin;
a second coil disposed on the bobbin;
a permanent magnet for moving the bobbin through interaction with the second coil; and
and a first coil for moving the holder module through interaction with the permanent magnet.

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