CN113363803A

CN113363803A - Heat dissipation device and method for packaging high-power semiconductor laser

Info

Publication number: CN113363803A
Application number: CN202110614471.1A
Authority: CN
Inventors: 张磊
Original assignee: Individual
Current assignee: Individual
Priority date: 2021-06-02
Filing date: 2021-06-02
Publication date: 2021-09-07

Abstract

The invention discloses a heat dissipation device and a heat dissipation method for packaging a high-power semiconductor laser. This a heat abstractor for high-power semiconductor laser encapsulation, through the bottom plate, the diaphragm, the fan, rotating device and mobile device's cooperation, the worm rotates, the worm drives the worm wheel and rotates, the worm wheel drives the down tube and rotates, the stock drives the sloping block, the sloping block drives the curved bar and reciprocates, the curved bar drives the shell and reciprocates, the shell drives the diaphragm and reciprocates, and then realize the regulation to the upper and lower height of fan, application scope is wide, the practicality is high, the inside slip riser, the riser drives splint rebound, and then make splint laminate mutually with the one end of short piece, and then make the outer wall of round bar and splint laminate mutually, and then realize fixing the fan, avoid when going up and down to the fan, lead to the fan to drop, and then cause the damage of fan.

Description

Heat dissipation device and method for packaging high-power semiconductor laser

Technical Field

The invention relates to the technical field of semiconductor lasers, in particular to a heat dissipation device for packaging a high-power semiconductor laser.

Background

Semiconductor lasers, also known as laser diodes, are lasers that use semiconductor materials as the working substance. Due to the difference in material structure, the specific process of generating laser light in different types is more specific. The common working substances include gallium arsenide (GaAs), cadmium sulfide (CdS), indium phosphide (InP), zinc sulfide (ZnS) and the like, and the excitation modes include three modes of electric injection, electron beam excitation and optical pumping. Semiconductor laser devices can be classified into homojunctions, single heterojunctions, double heterojunctions, and the like. The homojunction laser and the single heterojunction laser are mostly pulse devices at room temperature, and the double heterojunction laser can realize continuous work at room temperature.

A heat abstractor for high-power semiconductor laser encapsulation among the prior art, the staff of being not convenient for carries out the regulation of height from top to bottom to the fan, and then leads to its application scope little, and the practicality is not high, and the heat abstractor for high-power semiconductor laser encapsulation among the prior art, and the staff of being not convenient for fixes the fan, and then when going up and down to the fan, leads to the fan to drop easily, and then causes the damage of fan.

Disclosure of Invention

The invention aims to provide a heat dissipation device for packaging a high-power semiconductor laser, and aims to solve the problems that in the prior art, the heat dissipation device for packaging the high-power semiconductor laser is inconvenient for workers to adjust the vertical height of a fan, so that the application range of the heat dissipation device is small and the practicability is low.

In order to achieve the purpose, the invention provides the following technical scheme: a heat dissipation device for packaging a high-power semiconductor laser comprises a bottom plate, wherein a transverse plate is arranged above the bottom plate, a fan is arranged above the transverse plate, and a rotating device is arranged above the bottom plate;

the rotating device comprises a straight plate, a worm, a wide plate, a worm wheel and a vertical plate;

the bottom of riser respectively with the top left and right sides fixed connection of bottom plate, one side top rigid coupling of riser has the straight board, the inner wall of straight board passes through the bearing and rotates with the outer wall top of worm to be connected, one side meshing of worm is connected with the worm wheel, the rear end of worm wheel rotates through the round pin axle with the preceding terminal surface of wide slab to be connected, the rear end right side of wide slab and the preceding terminal surface top fixed connection of riser.

Preferably, a handle is fixedly connected above the outer wall of the worm.

Preferably, a moving device is arranged above the bottom plate;

the moving device comprises an inclined rod, a round block, a long rod, an inclined block, a curved rod, a first sliding rod, a square plate, a curved plate, a first spring and a shell;

the bottom of the first sliding rod is fixedly connected with the top of the bottom plate, an inclined block is arranged on the outer side of the first sliding rod, the inner wall below the inclined block is in sliding clamping connection with the outer wall of the first sliding rod, a long rod is arranged on one side of the inclined block, one end of the long rod is fixedly connected with one end of the inclined block, a round block is arranged in front of the long rod, the rear end of the round block is fixedly connected with one side of the front end face of the long rod, an inclined rod is arranged on the outer side of the round block, an inner side through groove of the inclined rod is in sliding clamping connection with the outer wall of the round block, the rear end of the inclined rod is fixedly connected with the front end face of the worm wheel, a curved rod is arranged above the inclined block, the bottom of the curved rod is attached to the top of the inclined block, one end of the curved rod is fixedly connected with one end of the inner wall of the shell, the top of the shell is fixedly connected with the bottom of the transverse plate, a curved plate is arranged behind the first sliding rod, the bottom of the curved plate is fixedly connected with the left side and the right side of the top of the bottom plate respectively, the outer wall one side of bent plate respectively with the left and right sides recess slip joint of square plate, the top of square plate and the bottom fixed connection of shell, the top rigid coupling of bent plate has first spring, the top of first spring respectively with the bottom left and right sides fixed connection of shell.

Preferably, the bent levers are axially symmetrically distributed by taking the bottom plate as an axis.

Preferably, the inclined block and the first sliding rod form a sliding structure.

Preferably, a fixing device is arranged above the transverse plate;

the fixing device comprises a vertical rod, a second spring, a round rod, a clamping plate, a short block, a second sliding rod, a round plate and a vertical block;

the bottom of the vertical rod is fixedly connected with the left side and the right side of the top of the transverse plate respectively, the front end face of the vertical rod is rotatably connected with the front end face of the round rod through a pin shaft, one end of the round rod is fixedly connected with the upper end and the lower end of the second spring respectively, one side of the round rod is provided with a clamping plate, one side of the outer wall of the clamping plate is attached to one end of the round rod respectively, a vertical block is arranged below the clamping plate, the top of the vertical block is fixedly connected with one side of the bottom of the clamping plate, a second sliding rod is arranged on the inner side of the vertical block, the outer wall of the second sliding rod is slidably clamped with the inner wall below the vertical block, the bottom of the second sliding rod is fixedly connected with the left side and the right side of the top of the transverse plate respectively, one side of the clamping plate is provided with a short block, one end of the short block is attached to one end of the clamping plate, the bottom of the short block is fixedly connected with the left side and the right side of the top of the transverse plate respectively, and the lower inner wall of the circular plate is in clearance fit with a convex block on the top of the transverse plate, the top of the circular plate is fixedly connected with a base preset below the fan.

A heat dissipation method specifically comprises the following steps:

s1, firstly, connecting the fan with an external power supply, sliding the vertical block inwards, driving the clamping plate to move inwards by the vertical block, enabling the clamping plate to be attached to one end of the short block, driving the round rod to rotate by the second spring, enabling the round rod to be attached to the outer wall of the clamping plate, and further fixing the fan;

s2, the worm is rotated to drive the worm wheel to rotate through the worm, the worm wheel drives the inclined rod to rotate, the inclined rod drives the round block to move left and right, the round block drives the long rod to move left and right, the long rod drives the inclined block, the inclined block drives the bent rod to move up and down, the bent rod drives the shell to move up and down, the shell drives the transverse plate to move up and down, and then the upper and lower height of the fan is adjusted, and after the fan is adjusted to a proper position, the fan starts to work, and.

Compared with the prior art, the invention has the beneficial effects that: the heat dissipation device for packaging the high-power semiconductor laser device has the advantages that the bottom plate, the transverse plate, the fan, the rotating device and the moving device are matched, so that when the device is used, the worm can drive the worm wheel to rotate through rotating the worm, the worm wheel drives the inclined rod to rotate, the inclined rod drives the round block to move left and right, the round block drives the long rod to move left and right, the long rod drives the inclined block, the inclined block drives the curved rod to move up and down, the curved rod drives the shell to move up and down, the shell drives the transverse plate to move up and down, and therefore the up-down height of the fan can be adjusted;

rotate the worm simultaneously, the worm drives the worm wheel and rotates, and the worm wheel drives the down tube and rotates, and the down tube drives the piece and removes about, and the piece drives the stock and removes about, and the stock drives the piece to one side, and the piece drives the curved bar and reciprocates, and the curved bar drives the shell and reciprocates, and the shell drives the diaphragm and reciprocates, and then realizes the regulation to the upper and lower height of fan, and the staff of being convenient for maintains and maintains the device, is convenient for maintain.

Through the matching of the bottom plate, the transverse plate, the fan and the fixing device, when the device is used, the vertical block can slide inwards, the vertical block drives the clamping plate to move inwards, so that the clamping plate is attached to one end of the short block, the second spring drives the round rod to rotate, so that the round rod is attached to the outer wall of the clamping plate, the fan is fixed, and the fan is prevented from falling off and being damaged when the fan is lifted;

the inside riser that slides simultaneously, riser drive splint inwardly move, and then make splint laminate mutually with the one end of short piece, and the second spring drives the round bar and rotates, and then makes the outer wall of round bar and splint laminate mutually, and then realize the fixed of fan, the staff's of being convenient for operation, the staff of being convenient for uses.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of the structure of the clamping plate, the second slide bar and the vertical block in FIG. 1;

FIG. 3 is a schematic structural view of the vertical rod, the second spring and the round rod in FIG. 1;

FIG. 4 is a schematic view of the construction of the down tube, round block and long tube of FIG. 1;

FIG. 5 is a schematic view of the square plate, curved plate and first spring of FIG. 1;

fig. 6 is a schematic structural view of the worm wheel, the worm and the wide plate in fig. 1.

In the figure: 1. the device comprises a base plate, 2, a rotating device, 201, a straight plate, 202, a worm, 203, a wide plate, 204, a worm wheel, 205, a vertical plate, 3, a moving device, 301, an inclined rod, 302, a round block, 303, a long rod, 304, an inclined block, 305, a curved rod, 306, a first sliding rod, 307, a square plate, 308, a curved plate, 309, a first spring, 310, a shell, 4, a fixing device, 401, a vertical rod, 402, a second spring, 403, a round rod, 404, a clamping plate, 405, a short block, 406, a second sliding rod, 407, a round plate, 408, a vertical block, 5, a transverse plate, 6 and a fan.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-6, the present invention provides a technical solution: a heat dissipation device for packaging a high-power semiconductor laser comprises a base plate 1, a transverse plate 5 is arranged above the base plate 1, a fan 6 is arranged above the transverse plate 5, the type of the fan 6 is determined according to the actual use condition, a rotating device 2 is arranged above the base plate 1, the rotating device 2 comprises a straight plate 201, a worm 202, a wide plate 203, a worm wheel 204 and a vertical plate 205, the bottom of the vertical plate 205 is fixedly connected with the left side and the right side of the top of the base plate 1 respectively, the straight plate 201 is fixedly connected above one side of the vertical plate 205, the inner wall of the straight plate 201 is rotatably connected with the upper part of the outer wall of the worm 202 through a bearing, the bearing enables the worm 202 to rotate on the inner wall of the straight plate 201 when being stressed, the worm wheel 204 is connected with one side of the worm 202 in a meshing manner, a handle is fixedly connected above the outer wall of the worm 202, the handle is convenient for workers to rotate the worm 202, the rear end of the worm wheel 204 is rotatably connected with the front end face of the wide plate 203 through a pin shaft, the pin shaft enables the worm wheel 204 to rotate on the front end face of the wide plate 203 when stressed, and the right side of the rear end of the wide plate 203 is fixedly connected with the upper portion of the front end face of the vertical plate 205.

The moving device 3 is arranged above the bottom plate 1, the moving device 3 comprises an inclined rod 301, a round block 302, a long rod 303, an inclined block 304, a curved rod 305, a first sliding rod 306, a square plate 307, a curved plate 308, a first spring 309 and a shell 310, the bottom of the first sliding rod 306 is fixedly connected with the top of the bottom plate 1, the outer side of the first sliding rod 306 is provided with the inclined block 304, the lower inner wall of the inclined block 304 is in sliding clamping connection with the outer wall of the first sliding rod 306, one side of the inclined block 304 is provided with the long rod 303, one end of the long rod 303 is fixedly connected with one end of the inclined block 304, the round block 302 is arranged in front of the long rod 303, the rear end of the round block 302 is fixedly connected with one side of the front end face of the long rod 303, the outer side of the round block 302 is provided with the inclined rod 301, the inner through groove of the inclined rod 301 is in sliding clamping connection with the outer wall of the round block 302, the rear end of the inclined rod 301 is fixedly connected with the front end face of the worm wheel 204, the curved rod 305 is arranged above the inclined block 304, the curved rod 305 is symmetrically distributed by taking the bottom plate 1 as an axis, the design can be more stable go up and down to fan 6 like this, the bottom of curved bar 305 is laminated with the top of sloping block 304 mutually, sloping block 304 constitutes sliding structure with first slide bar 306, can slide about the outer wall of first slide bar 306 when sloping block 304 atress, the one end of curved bar 305 and the inner wall one end fixed connection of shell 310, the top of shell 310 and the bottom fixed connection of diaphragm 5, the rear of first slide bar 306 is equipped with curved plate 308, the bottom of curved plate 308 respectively with the top left and right sides fixed connection of bottom plate 1, outer wall one side of curved plate 308 respectively with the left and right sides recess slip joint of square plate 307, the top of square plate 307 and the bottom fixed connection of shell 310, the top rigid coupling of curved plate 308 has first spring 309, first spring 309 gives the downward power to shell 310, the top of first spring 309 respectively with the bottom left and right sides fixed connection of shell 310.

The fixing device 4 is arranged above the transverse plate 5, the fixing device 4 comprises a vertical rod 401, a second spring 402, a round rod 403, a clamping plate 404, a short block 405, a second sliding rod 406, a round plate 407 and a vertical block 408, the bottom of the vertical rod 401 is fixedly connected with the left side and the right side of the top of the transverse plate 5 respectively, the front end face of the vertical rod 401 is rotatably connected with the front end face of the round rod 403 through a pin shaft, the pin shaft enables the round rod 403 to rotate on the front end face of the vertical rod 401 when stressed, one end of the round rod 403 is fixedly connected with the upper end and the lower end of the second spring 402 respectively, the second spring 402 gives an outward force to the round rod 403, one side of the round rod 403 is provided with the clamping plate 404, one end of the outer wall of the clamping plate 404 is provided with grinding grains, one side of the outer wall of the clamping plate 404 is respectively attached to one end of the round rod 403, the vertical block 408 is arranged below the clamping plate 404, the top of the vertical block 408 is fixedly connected with one side of the bottom of the clamping plate 404, the inner side of the vertical block 408 is provided with the second sliding rod 406, the outer wall of the second slide bar 406 is slidably clamped with the lower inner wall of the vertical block 408, the vertical block 408 can slide left and right on the outer wall of the second slide bar 406 under stress, the bottom of the second slide bar 406 is fixedly connected with the left side and the right side of the top of the transverse plate 5, one side of the clamping plate 404 is provided with a short block 405, one end of the short block 405 is attached to one end of the clamping plate 404, the bottom of the short block 405 is fixedly connected with the left side and the right side of the top of the circular plate 407, the lower inner wall of the circular plate 407 is in clearance fit with the top bump of the transverse plate 5, and the top of the circular plate 407 is fixedly connected with a base preset below the fan 6.

When the heat dissipation device for packaging the high-power semiconductor laser is used, firstly, a fan 6 is connected with an external power supply, a vertical block 408 slides inwards, the vertical block 408 drives a clamping plate 404 to move inwards, so that the clamping plate 404 is attached to one end of a short block 405, a second spring 402 drives a round rod 403 to rotate, so that the round rod 403 is attached to the outer wall of the clamping plate 404, and further the fan 6 is fixed, the fan 6 is prevented from falling when the fan 6 is lifted, a worm 202 is rotated, the worm 202 drives a worm wheel 204 to rotate, the worm wheel 204 drives an inclined rod 301 to rotate, the inclined rod 301 drives the round block 302 to move left and right, the round block 302 drives a long rod 303 to move left and right, the long rod 303 drives an inclined block 304, the inclined block 304 drives a curved rod 305 to move up and down, the curved rod 305 drives a shell 310 to move up and down, the shell 310 drives a transverse plate 5 to move up and down, so as to realize the adjustment of the up-down height of the fan 6, after the fan 6 is adjusted to a proper position, the fan 6 starts to work, and then the heat dissipation effect is achieved.

In the description of the present invention, it is to be understood that the terms "coaxial", "bottom", "one end", "top", "middle", "other end", "upper", "one side", "top", "inner", "front", "center", "both ends", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.

In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "disposed," "connected," "secured," "screwed" and the like are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; the terms may be directly connected or indirectly connected through an intermediate, and may be communication between two elements or interaction relationship between two elements, unless otherwise specifically limited, and the specific meaning of the terms in the present invention will be understood by those skilled in the art according to specific situations.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A heat dissipation device for packaging a high-power semiconductor laser comprises a bottom plate (1), and is characterized in that: a transverse plate (5) is arranged above the bottom plate (1), a fan (6) is arranged above the transverse plate (5), and a rotating device (2) is arranged above the bottom plate (1);

the rotating device (2) comprises a straight plate (201), a worm (202), a wide plate (203), a worm wheel (204) and a vertical plate (205);

the bottom of riser (205) respectively with the top left and right sides fixed connection of bottom plate (1), one side top rigid coupling of riser (205) has straight board (201), the inner wall of straight board (201) passes through the bearing and rotates with the outer wall top of worm (202) to be connected, one side meshing of worm (202) is connected with worm wheel (204), the rear end of worm wheel (204) is connected through the round pin axle and the preceding terminal surface rotation of wide plate (203), the rear end right side of wide plate (203) and the preceding terminal surface top fixed connection of riser (205).

2. A heat sink device according to claim 1 for a high power semiconductor laser package, wherein: a handle is fixedly connected above the outer wall of the worm (202).

3. A heat sink device according to claim 1 for a high power semiconductor laser package, wherein: a moving device (3) is arranged above the bottom plate (1);

the moving device (3) comprises an inclined rod (301), a round block (302), a long rod (303), an inclined block (304), a curved rod (305), a first sliding rod (306), a square plate (307), a curved plate (308), a first spring (309) and a shell (310);

the bottom of first slide bar (306) and the top fixed connection of bottom plate (1), the outside of first slide bar (306) is equipped with sloping block (304), the below inner wall of sloping block (304) and the outer wall slip joint of first slide bar (306), one side of sloping block (304) is equipped with stock (303), the one end of stock (303) and the one end fixed connection of sloping block (304), the place ahead of stock (303) is equipped with round block (302), the rear end of round block (302) and the preceding terminal surface one side fixed connection of stock (303), the outside of round block (302) is equipped with down tube (301), the inboard logical groove of down tube (301) and the outer wall slip joint of round block (302), the rear end of down tube (301) and the preceding terminal surface fixed connection of worm wheel (204), the top of sloping block (304) is equipped with curved bar (305), the bottom of curved bar (305) is laminated with the top of sloping block (304), the utility model discloses a bent lever, including the inner wall one end fixed connection of one end of curved bar (305) and shell (310), the top of shell (310) and the bottom fixed connection of diaphragm (5), the rear of first slide bar (306) is equipped with bent plate (308), the bottom of bent plate (308) respectively with the top left and right sides fixed connection of bottom plate (1), the outer wall one side of bent plate (308) respectively with the left and right sides recess slip joint of square plate (307), the top of square plate (307) and the bottom fixed connection of shell (310), the top rigid coupling of bent plate (308) has first spring (309), the top of first spring (309) respectively with the bottom left and right sides fixed connection of shell (310).

4. A heat sink device according to claim 3 for a high power semiconductor laser package, wherein: the bent levers (305) are distributed in an axial symmetry mode by taking the bottom plate (1) as an axis.

5. A heat sink device according to claim 3 for a high power semiconductor laser package, wherein: the sloping block (304) and the first sliding rod (306) form a sliding structure.

6. A heat sink device according to claim 1 for a high power semiconductor laser package, wherein: a fixing device (4) is arranged above the transverse plate (5);

the fixing device (4) comprises a vertical rod (401), a second spring (402), a round rod (403), a clamping plate (404), a short block (405), a second sliding rod (406), a round plate (407) and a vertical block (408);

the bottom of the vertical rod (401) is fixedly connected with the left side and the right side of the top of the transverse plate (5) respectively, the front end face of the vertical rod (401) is rotatably connected with the front end face of the round rod (403) through a pin shaft, one end of the round rod (403) is fixedly connected with the upper end and the lower end of the second spring (402) respectively, one side of the round rod (403) is provided with a clamping plate (404), one side of the outer wall of the clamping plate (404) is attached to one end of the round rod (403) respectively, a vertical block (408) is arranged below the clamping plate (404), the top of the vertical block (408) is fixedly connected with one side of the bottom of the clamping plate (404), the inner side of the vertical block (408) is provided with a second sliding rod (406), the outer wall of the second sliding rod (406) is slidably clamped with the inner wall below the vertical block (408), and the bottom of the second sliding rod (406) is fixedly connected with the left side and the right side of the top of the transverse plate (5) respectively, one side of splint (404) is equipped with short block (405), the one end of short block (405) is laminated with the one end of splint (404) mutually, the bottom of short block (405) respectively with the top left and right sides fixed connection of plectane (407), the below inner wall of plectane (407) and the top lug clearance fit of diaphragm (5), the base fixed connection that the below of plectane (407) and fan (6) was predetermine.

7. A method of dissipating heat from a heat sink for high power semiconductor laser packages as claimed in claims 1-6 wherein: the method specifically comprises the following steps:

s1, firstly, connecting the fan (6) with an external power supply, sliding the vertical block (408) inwards, driving the clamping plate (404) to move inwards by the vertical block (408), enabling the clamping plate (404) to be attached to one end of the short block (405), driving the round rod (403) to rotate by the second spring (402), enabling the round rod (403) to be attached to the outer wall of the clamping plate (404), and further fixing the fan (6);

s2, the worm (202) is rotated, the worm (202) drives the worm wheel (204) to rotate, the worm wheel (204) drives the diagonal rod (301) to rotate, the diagonal rod (301) drives the round block (302) to move left and right, the round block (302) drives the long rod (303) to move left and right, the long rod (303) drives the diagonal block (304), the diagonal block (304) drives the curved rod (305) to move up and down, the curved rod (305) drives the shell (310) to move up and down, the shell (310) drives the transverse plate (5) to move up and down, so that the up-down height of the fan (6) is adjusted, after the fan (6) is adjusted to a proper position, the fan (6) starts to work, and further the heat dissipation effect is achieved.