CN113355703B - Manufacturing device and method for double-scale efficient localized electrodeposition printing pure copper structural part - Google Patents
Manufacturing device and method for double-scale efficient localized electrodeposition printing pure copper structural part Download PDFInfo
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- CN113355703B CN113355703B CN202110667205.5A CN202110667205A CN113355703B CN 113355703 B CN113355703 B CN 113355703B CN 202110667205 A CN202110667205 A CN 202110667205A CN 113355703 B CN113355703 B CN 113355703B
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Abstract
A manufacturing device and a manufacturing method for a double-scale efficient localized electro-deposition printing pure copper structural member belong to the technical field of localized electro-chemical deposition and comprise a vibration isolation platform, a EcP printing system, an EDM electro-discharge machining system, an LECD- μAM system, an electrolytic cell unit, an electrolytic cell moving unit, a EcP printing moving system and a central control system. The invention realizes the positive manufacture of localized electrochemical deposition of the pure copper metal microstructure through three independent steps, and effectively connects the two electrochemical deposition technologies by utilizing an electric spark forming technology (EDM electric spark processing); the method is characterized in that a millimeter-scale electrochemical deposition rapid material structure is used as a foundation, then a precise electric spark forming technology is utilized to polish the surface to be deposited, and finally a LECD-mu AM technology is utilized to realize forward manufacturing of a pure copper metal microstructure on the polished surface.
Description
Technical Field
The invention belongs to the technical field of localized electrochemical deposition, and particularly relates to a device and a method for manufacturing a double-scale efficient localized electro-deposition printing pure copper structural member.
Background
Localized electrodeposition fabrication techniques have their particular advantages, which in 1996, developed over 25 years, greatly enriched the fabrication of tiny metallic structures. The localized electrodeposition changes the manufacturing thought of precise electroplating and electroforming, discards a deposition mask, enhances the localized characteristic of directional transmission of electrolyte, and realizes the forward manufacturing of the three-dimensional cantilever structure of the micro structural member. The development of localized electrodeposition technology benefits from the development of microelectrode/probe fabrication technology. Localized electrodeposition in the nascent stage is based on solid inert metal electrodes as micro-anodes, and researchers gradually reduce the diameter of the inert metal electrodes to improve the localized nature of the deposition; one of the faster deposition techniques is electrochemical printing (EcP printing). With the development of technology, localized electrodeposition developed a meniscus-constrained localized electrochemical deposition technology based on micropipette technology, which is directed to gradually reducing the pore size of micropipettes to achieve high localization. Currently, a 100nm diameter wire can be fabricated by meniscus-confined localized electrochemical deposition. Currently, the development of the faster localized electrodeposition micro-additive manufacturing technology (LECD- μam) is based on hollow atomic force probes, which have two important roles: the first is that the atomic force probe cantilever can realize submicron precision matching deposition movement by a force servo device for successfully growing metal deposit, and the second hollow channel realizes localized liquid feeding by taking electrolyte pressurizing injection technology as a channel of a micro-fluid system.
However, the realization of high localization also brings about the problems of undersize of the manufactured structure, difficult fine assembly and limited application field of the structure. The smallest diameter of a cylindrical structure manufactured by the LECD-muam technique can reach 300nm (using a probe with a caliber of 50 nm). Cubes with side length of 850 μm can be realized at maximum, and cross-scale manufacturing of submicron to submillimeter scale is realized. For a typical printing speed of 10-20 μm 3 For the LECD- μAM technique of/s, manufacturing to achieve a 850 μm size has a high time cost for the LECD- μAM technique.
Therefore, a new technical scheme is needed in the prior art to solve the problem of forward manufacturing of the double-scale micro pure copper metal structural member, and the invention provides a technical scheme for solving the problem.
Disclosure of Invention
The technical problems to be solved by the invention are as follows: the manufacturing device and the method for manufacturing the double-scale high-efficiency localized electrodeposition printing pure copper structural part are provided, manufacturing of millimeter-level appearance and substrate is realized by using an electrochemical printing technology, and micron-level printing precision is improved by using an LECD-mu AM technology; the upper surface manufactured by the electrochemical printing technology needs to be subjected to surface modification by an electric spark machining technology to achieve a smooth surface state, and then a micro structure body is deposited by using an LECD-mu AM.
Double-scale high-efficient localized electrodeposition prints pure copper structure manufacturing installation, characterized by: comprises a vibration isolation platform, a EcP printing system, an EDM electric spark processing system, an LECD-muAM system, an electrolytic cell unit, an electrolytic cell moving unit, a EcP printing moving system and a central control system,
the table top of the vibration isolation platform is horizontal, and a stable supporting structure is arranged at the lower part of the table top of the vibration isolation platform;
the electrolytic cell moving unit is arranged on the table top of the vibration isolation platform, and a monitoring camera is arranged on the electrolytic cell moving unit;
the electrolytic cell unit is arranged on the electrolytic cell movement unit and comprises a graphite anode, a working electrode, a reference electrode and an insulating bracket arranged among the three motors;
the EcP printing motion system is arranged on the table top of the vibration isolation platform, and the EcP printing motion system comprises a EcP printing X-axis motion system, a EcP printing Y-axis motion system and a EcP printing Z-axis motion system; the EcP printing Y-axis motion system is vertically arranged on the EcP printing X-axis motion system through a sliding block, and the EcP printing Z-axis motion system is arranged on the EcP printing Y-axis motion system through a sliding block;
the EcP printing system is arranged on the EcP printing Y-axis motion system and comprises a EcP printing glass tube, a EcP printing glass tube clamping device and a EcP printing system switching mechanism, wherein the EcP printing system switching mechanism is connected with the EcP printing Y-axis motion system; the EcP printing glass tube clamping device is connected with the EcP printing system switching mechanism; the EcP printed glass tube is arranged on the EcP printed glass tube clamping device;
the EDM electric spark machining system is fixedly arranged on the electrolytic cell moving unit and comprises an EDM electric spark electrode, an EDM electric spark Y-axis moving system, an EDM electric spark Z-axis moving system and an EDM electric spark X-axis moving system, wherein the EDM electric spark X-axis moving system is arranged on the electrolytic cell moving unit, and the EDM electric spark Z-axis moving system is arranged on the EDM electric spark X-axis moving system; the EDM electric spark Y-axis moving system is arranged on the EDM electric spark Z-axis moving system, and the EDM electric spark electrode is arranged at the lower part of the EDM electric spark Y-axis moving system; the LECD- μAM system comprises an atomic force probe, an atomic force probe piezoelectric ceramic scanner, an atomic force probe system fixing device, an LECD- μAM system precise Z-axis moving system and an LECD- μAM system Z-axis fixing device, wherein the LECD- μAM system Z-axis fixing device is arranged on an electrolytic cell moving unit; the precise Z-axis moving system of the LECD-mu AM system is movably connected with the Z-axis fixing device of the LECD-mu AM system; the atomic force probe system fixing device is arranged on the LECD-mu AM system precise Z-axis moving system; the atomic force probe piezoelectric ceramic scanner is arranged on the atomic force probe system fixing device; the atomic force probe is arranged at the lower part of the atomic force probe piezoelectric ceramic scanner;
the central control system is in signal connection with a EcP printing system, an EDM electric spark machining system and an LECD-mu AM system, and is simultaneously connected with three electrodes of the electrolytic cell to form a three-electrode constant potential system.
The manufacturing method of the double-scale high-efficiency localized electro-deposition printing pure copper structural part is characterized by comprising the following steps of: the manufacturing device for printing the pure copper structural member by using the double-scale high-efficiency localized electro-deposition comprises the following steps which are sequentially carried out,
step one, preparing a solution by adopting CuSO 4 The solution is used as electrolyte solution, sulfuric acid solution is used as supporting solution, and deionized water is used as auxiliary solution;
step two, connecting a graphite anode in the electrolytic cell unit with a power supply anode in the central control system, and applying positive voltage; the working electrode is connected with a negative electrode of a power supply in the central control system, and negative voltage is applied; the reference electrode is connected with a central control system and forms a three-electrode constant potential system with the graphite anode and the working electrode;
filling the electrolyte solution in the step one into a EcP printing glass tube, filling the sulfuric acid solution in the step one into a graphite anode of an electrolytic cell unit, and completely immersing the lowest end of a reference electrode by the liquid level;
step four, adjusting an electrolytic cell unit and a EcP printing motion system to enable a EcP printing glass tube to be positioned right above the center of the electrolytic cell unit;
step five, adjusting a EcP printing X-axis motion system in a EcP printing motion system, a EcP printing Y-axis motion system and a EcP printing Z-axis motion system, and adjusting the lowest end of the EcP printing glass tube to be 5 mu m away from the upper surface of the working electrode;
step six, utilizing a EcP printing system to deposit on the upper surface of the working electrode, and after the deposition of the bulk metal according to a preset program is finished, returning the EcP printing motion system to an initial position;
step seven, adjusting the electrolytic cell unit to be right below the EDM electric spark machining system through the electrolytic cell moving unit; the EDM electric spark Y-axis moving system, the EDM electric spark Z-axis moving system and the EDM electric spark X-axis moving system are used for leveling and polishing the upper surface of the block-shaped metal structure by using the EDM electric spark electrode; after the completion, the electrolytic cell unit is adjusted to an initial position by the electrolytic cell moving unit;
step eight, precisely adjusting the distance between the atomic force probe and the working electrode by using a precise Z-axis moving system of an LECD-mu AM system in the LECD-mu AM system; adopting an atomic force probe piezoelectric ceramic scanner and an atomic force probe to print a pure copper metal microstructure according to a program;
step nine, after printing is finished, all the systems carry out zeroing operation;
thus, the manufacturing of the double-scale high-efficiency localized electrodeposition printing pure copper structural member is completed.
Through the design scheme, the invention has the following beneficial effects: the manufacturing device and the method of the double-scale high-efficiency localized electro-deposition printing pure copper structural part realize the forward manufacturing of localized electro-chemical deposition of the pure copper metal microstructure through three independent steps, and effectively connect the two electro-chemical deposition technologies by utilizing an electric spark forming technology (EDM electro-discharge machining); the method is characterized in that a millimeter-scale electrochemical deposition rapid material structure is used as a foundation, then a precise electric spark forming technology is utilized to polish the surface to be deposited, and finally a LECD-mu AM technology is utilized to realize forward manufacturing of a pure copper metal microstructure on the polished surface.
Specifically, the application range of the existing localized electrochemical deposition manufacturing process is obviously expanded through a dual-scale localized electrodeposition process;
the electric spark micro-machining process is skillfully integrated into the surface finishing process of the electrochemical deposition surface;
and the pure copper metal microstructure is manufactured positively, so that one-step metallization is realized, and subsequent steps are not needed for processing.
Drawings
The invention is further described with reference to the drawings and detailed description which follow:
FIG. 1 is an isometric view of a device for manufacturing a dual-scale high-efficiency localized electrodeposition printed pure copper structure.
FIG. 2 is a schematic diagram of a full section of a device for manufacturing a dual-scale high-efficiency localized electro-deposition printed pure copper structural member.
FIG. 3 is a schematic diagram of the electrolytic cell unit of the manufacturing device of the double-scale high-efficiency localized electro-deposition printing pure copper structural member.
In the drawing, a vibration isolation platform, a 2-EcP printing system, a 3-EDM electric spark machining system, a 4-LECD-muAM system, a 5-electrolytic cell unit, a 6-electrolytic cell moving unit, a 7-EcP printing moving system, an 8-central control system, a 201-EcP printing glass tube, a 202-EcP printing glass tube clamping device, a 203-EcP printing system switching mechanism, a 301-EDM electric spark electrode, a 302-EDM electric spark Y-axis moving system, a 303-EDM electric spark Z-axis moving system, a 304-EDM electric spark X-axis moving system, a 401-atomic force probe, a 402-atomic force probe piezoelectric ceramic scanner, a 403-atomic force probe system fixing device, a 404-LECD-muAM system precision Z-axis moving system, a 405-LECD-muAM system Z-axis fixing device, a 501-graphite anode, a 502-working electrode, a 503-reference electrode, a 504-insulating bracket, a 601-monitoring camera 701, a 702-EcP printing X-axis moving system, a 702-EcP printing Y-axis moving system and a 703-EcP printing Z-axis moving system are arranged.
Detailed Description
The manufacturing device of the double-scale high-efficiency localized electro-deposition printing pure copper structural part comprises a vibration isolation platform 1, a EcP printing system 2, an EDM electro-discharge machining system 3, an LECD- μAM system 4, an electrolytic cell unit 5, electrolytic cell moving units 6 and EcP printing moving system 7 and a central control system 8 as shown in figures 1 to 3,
the vibration isolation platform 1 is used as a foundation of a double-scale efficient localized electrodeposition printing pure copper metal structural member manufacturing device, the table top of the vibration isolation platform is horizontal, and the lower part of the vibration isolation platform is provided with a stable supporting structure;
the electrolytic cell moving unit 6 is arranged on the table top of the vibration isolation platform 1, and the electrolytic cell moving unit 6 is provided with a monitoring camera 601;
the electrolytic cell unit 5 is arranged on the electrolytic cell moving unit 6 and can move along a guide rail of the electrolytic cell moving unit 6, and comprises a graphite anode 501, a working electrode 502, a reference electrode 503 and an insulating bracket 504 arranged among three motors, wherein the graphite anode 501, the working electrode 502 and the reference electrode 503 form a three-electrode potentiostatic system, and the insulating bracket 504 plays a role in isolating each electrode;
the EcP printing motion system 7 is arranged on the table top of the vibration isolation platform 1 and provides support and power source for the whole EcP printing system 2, and the EcP printing motion system 7 comprises EcP printing X-axis motion systems 701, ecP printing Y-axis motion systems 702 and EcP printing Z-axis motion systems 703; the EcP printing Y-axis motion system 702 is vertically arranged on the EcP printing X-axis motion system 701 through a sliding block, and the EcP printing Z-axis motion system 703 is arranged on the EcP printing Y-axis motion system 702 through a sliding block; the three axial movement parts are matched with each other to finish the precise movement of the EcP printing system 2;
the EcP printing system 2 is arranged on the EcP printing Y-axis motion system 702 and comprises a EcP printing glass tube 201, an ecP printing glass tube clamping device 202 and an ecP printing system switching mechanism 203, wherein the EcP printing system switching mechanism 203 is connected with the EcP printing Y-axis motion system 702; the EcP printing glass tube clamping device 202 is connected with the EcP printing system switching mechanism 203; the EcP printed glass tube 201 is arranged on the EcP printed glass tube clamping device 202;
the EDM electric spark machining system 3 comprises an EDM electric spark electrode 301, an EDM electric spark Y-axis moving system 302, an EDM electric spark Z-axis moving system 303 and an EDM electric spark X-axis moving system 304; the EDM electric spark X-axis moving system 302 is arranged on the electrolytic cell moving unit 6, and the EDM electric spark electrode 301 is driven by three moving systems, namely an EDM electric spark Y-axis moving system 302, an EDM electric spark Z-axis moving system 303 and an EDM electric spark X-axis moving system 304, to level and polish the microdeposition massive metal;
the LECD- μAM system 4 comprises an atomic force probe 401, an atomic force probe piezoelectric ceramic scanner 402, an atomic force probe system fixing device 403, an LECD- μAM system precise Z-axis moving system 404 and an LECD- μAM system Z-axis fixing device 405, wherein the LECD- μAM system Z-axis fixing device 405 is arranged on a moving element of the electrolytic cell moving unit 6; the LECD- μAM system precise Z-axis moving system 404 is movably connected with the LECD- μAM system Z-axis fixing device 405, and the LECD- μAM system precise Z-axis moving system 404 can move up and down precisely along the LECD- μAM system Z-axis fixing device 405; the atomic force probe system fixing device 403 is arranged on the LECD- μAM system precise Z-axis moving system 404; the atomic force probe piezoelectric ceramic scanner 402 is arranged on the atomic force probe system fixing device 403; the atomic force probe 401 is arranged at the lower part of the atomic force probe piezoelectric ceramic scanner 402; the atomic force probe piezoelectric ceramic scanner 402 drives the atomic force probe 401 to perform microscopic movement, so that precise printing is realized;
the central control system 8 is connected with the EcP printing system 2, the EDM electric spark machining system 3 and the LECD-mu AM system 4 in a signal mode, and is connected with three electrodes of the electrolytic cell 5 to form a three-electrode constant potential system.
The manufacturing method of the double-scale high-efficiency localized electro-deposition printing pure copper structural part adopts the manufacturing device of the double-scale high-efficiency localized electro-deposition printing pure copper structural part, comprises the following steps which are sequentially carried out,
step one: preparing a solution, wherein the electrolyte solution adopts 0.5M CuSO 4 The supporting solution was 54mM sulfuric acid solution and the auxiliary solution was deionized water.
Step two: connecting a graphite anode 501 in the electrolytic cell unit 5 with a positive electrode of a power supply in the central control system 8, and applying a voltage of 5V; the working electrode 502 is connected with the negative electrode of the power supply in the central control system 8 and is applied with-1V voltage; the reference electrode 503 also needs to be connected to the central control system 8 to form a three-electrode potentiostatic system with the graphite anode 501 and the working electrode 502;
step three: the EcP print glass tube 201 was filled with a 0.5M solution of CuSO 4. The graphite anode 501 of the cell unit 5 is filled with a sulfuric acid solution of 54mM supporting solution, the liquid surface is required to completely submerge the lowermost end of the reference electrode 503.
Step four: the electrolytic cell units 5 and EcP print motion system 7 was adjusted so that EcP print glass tube 201 was located directly above the center of electrolytic cell unit 5.
Step five: adjusting EcP printing X-axis motion system 701, ecP printing Y-axis motion system 702 and ecP printing Z-axis motion system 703 in EcP printing motion system 7; the lowermost end of the EcP printed glass tube 201 was adjusted to be 5 μm from the upper surface of the working electrode 502.
Step six: after depositing bulk metal on the upper surface of working electrode 502 using printing system 2 EcP, the printing motion system 7 is retracted EcP to the initial position.
Step seven: the electrolytic cell unit 5 is adjusted to be directly below the EDM electrical discharge machining system 3.
Step eight: the EDM electric spark machining system 3 respectively moves an EDM electric spark Y-axis moving system 302, an EDM electric spark Z-axis moving system 303 and an EDM electric spark X-axis moving system 304, and the EDM electric spark electrode 301 is utilized to level and polish the upper surface of the block-shaped metal structure.
Step nine: the cell unit 5 is adjusted to the initial position.
Step ten: the distance of the atomic force probe 401 from the working electrode 502 is precisely adjusted using the LECD- μam system precision Z-axis movement system 404 in the LECD- μam system 4.
Step eleven: the atomic force probe piezo ceramic scanner 402 and atomic force probe 401 were used to program pure copper metal microstructure printing.
Step twelve: and after printing is finished, all the systems perform zeroing operation.
The three printing processes of the method of the invention all set printing programs and parameters through the central control system 8, and provide control and guarantee for printing the micro structure.
Claims (2)
1. Double-scale high-efficient localized electrodeposition prints pure copper structure manufacturing installation, characterized by: comprises a vibration isolation platform (1), a EcP printing system (2), an EDM electric spark processing system (3), an LECD-muAM system (4), an electrolytic cell unit (5), an electrolytic cell moving unit (6), a EcP printing moving system (7) and a central control system (8),
the table top of the vibration isolation platform (1) is horizontal, and a stable supporting structure is arranged at the lower part of the vibration isolation platform;
the electrolytic cell moving unit (6) is arranged on the table top of the vibration isolation platform (1), and the monitoring camera (601) is arranged on the electrolytic cell moving unit (6);
the electrolytic cell unit (5) is arranged on the electrolytic cell moving unit (6) and comprises a graphite anode (501), a working electrode (502), a reference electrode (503) and an insulating bracket (504) arranged among three motors;
the EcP printing motion system (7) is arranged on the table top of the vibration isolation platform (1), and the EcP printing motion system (7) comprises a EcP printing X-axis motion system (701), a EcP printing Y-axis motion system (702) and a EcP printing Z-axis motion system (703); the EcP printing Y-axis motion system (702) is vertically arranged on the EcP printing X-axis motion system (701) through a sliding block, and the EcP printing Z-axis motion system (703) is arranged on the EcP printing Y-axis motion system (702) through a sliding block;
the EcP printing system (2) is arranged on the EcP printing Y-axis motion system (702) and comprises a EcP printing glass tube (201), a EcP printing glass tube clamping device (202) and a EcP printing system switching mechanism (203), and the EcP printing system switching mechanism (203) is connected with the EcP printing Y-axis motion system (702); the EcP printing glass tube clamping device (202) is connected with the EcP printing system switching mechanism (203); the EcP printing glass tube (201) is arranged on the EcP printing glass tube clamping device (202);
the EDM electric spark machining system (3) is fixedly arranged on the electrolytic cell moving unit (6) and comprises an EDM electric spark electrode (301), an EDM electric spark Y-axis moving system (302), an EDM electric spark Z-axis moving system (303) and an EDM electric spark X-axis moving system (304), wherein the EDM electric spark X-axis moving system (304) is arranged on the electrolytic cell moving unit (6), and the EDM electric spark Z-axis moving system (303) is arranged on the EDM electric spark X-axis moving system (304); the EDM electric spark Y-axis moving system (302) is arranged on the EDM electric spark Z-axis moving system (303), and the EDM electric spark electrode (301) is arranged at the lower part of the EDM electric spark Y-axis moving system (302);
the LECD- μAM system (4) comprises an atomic force probe (401), an atomic force probe piezoelectric ceramic scanner (402), an atomic force probe system fixing device (403), an LECD- μAM system precise Z-axis moving system (404) and an LECD- μAM system Z-axis fixing device (405), wherein the LECD- μAM system Z-axis fixing device (405) is arranged on the electrolytic cell moving unit (6); the LECD- μAM system precise Z-axis moving system (404) is movably connected with the LECD- μAM system Z-axis fixing device (405); the atomic force probe system fixing device (403) is arranged on the LECD-mu AM system precise Z-axis moving system (404); the atomic force probe piezoelectric ceramic scanner (402) is arranged on an atomic force probe system fixing device (403); the atomic force probe (401) is arranged at the lower part of the atomic force probe piezoelectric ceramic scanner (402);
the central control system (8) is connected with the EcP printing system (2), the EDM electric spark machining system (3) and the LECD-mu AM system (4) in a signal mode, and is connected with three electrodes of the electrolytic cell (5) to form a three-electrode constant potential system.
2. The manufacturing method of the double-scale high-efficiency localized electro-deposition printing pure copper structural part is characterized by comprising the following steps of: the manufacturing device for printing pure copper structural parts by using the double-scale high-efficiency localized electrodeposition according to claim 1 comprises the following steps in sequence,
step one, preparing a solution by adopting CuSO 4 The solution is used as electrolyte solution, sulfuric acid solution is used as supporting solution, and deionized water is used as auxiliary solution;
step two, connecting a graphite anode (501) in the electrolytic cell unit (5) with a positive electrode of a power supply in the central control system (8), and applying positive voltage; the working electrode (502) is connected with the negative electrode of a power supply in the central control system (8) and is applied with negative voltage; the reference electrode (503) is connected with the central control system (8) and forms a three-electrode potentiostatic system with the graphite anode (501) and the working electrode (502);
step three, filling the electrolyte solution in the step one into a EcP printing glass tube (201), filling the sulfuric acid solution in the step one into a graphite anode (501) of an electrolytic cell unit (5), and completely immersing the lowest end of a reference electrode (503) by the liquid level;
step four, adjusting the electrolytic cell units (5) and EcP to print the motion system (7) so that the EcP printed glass tube (201) is positioned right above the center of the electrolytic cell unit (5);
step five, adjusting a EcP printing X-axis motion system (701) in a EcP printing motion system (7), a EcP printing Y-axis motion system (702), a EcP printing Z-axis motion system (703), and adjusting the lowest end of a EcP printing glass tube (201) to be 5 mu m away from the upper surface of a working electrode (502);
step six, utilizing a EcP printing system (2) to deposit on the upper surface of the working electrode (502), and after the deposition of the bulk metal according to a preset program is finished, returning the EcP printing motion system (7) to an initial position;
step seven, adjusting the electrolytic cell unit (5) to be right below the EDM electric spark machining system (3) through the electrolytic cell moving unit (6); the EDM electric spark Y-axis moving system (302), the EDM electric spark Z-axis moving system (303), the EDM electric spark X-axis moving system (304) and the EDM electric spark electrode (301) are utilized to level and polish the upper surface of the block-shaped metal structure; after the completion, the electrolytic cell unit (5) is adjusted to an initial position by the electrolytic cell moving unit (6);
a step eight of precisely adjusting the distance between the atomic force probe (401) and the working electrode (502) by using an LECD- μAM system precise Z-axis moving system (404) in an LECD- μAM system (4); an atomic force probe piezoelectric ceramic scanner (402) and an atomic force probe (401) are adopted to print a pure copper metal microstructure according to a program;
step nine, after printing is finished, all the systems carry out zeroing operation;
thus, the manufacturing of the double-scale high-efficiency localized electrodeposition printing pure copper structural member is completed.
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