CN113352020A - Research and development of preformed soldering tin sheet containing soldering flux and production and preparation process thereof - Google Patents
Research and development of preformed soldering tin sheet containing soldering flux and production and preparation process thereof Download PDFInfo
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- CN113352020A CN113352020A CN202110722618.9A CN202110722618A CN113352020A CN 113352020 A CN113352020 A CN 113352020A CN 202110722618 A CN202110722618 A CN 202110722618A CN 113352020 A CN113352020 A CN 113352020A
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- fixedly connected
- plate
- rod
- tin
- soldering flux
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- 238000005476 soldering Methods 0.000 title claims abstract description 74
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 60
- 230000004907 flux Effects 0.000 title claims abstract description 38
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- 238000002360 preparation method Methods 0.000 title claims abstract description 7
- 238000012827 research and development Methods 0.000 title abstract description 5
- 229910052718 tin Inorganic materials 0.000 claims abstract description 59
- 238000007789 sealing Methods 0.000 claims abstract description 37
- 230000007246 mechanism Effects 0.000 claims abstract description 32
- 238000005266 casting Methods 0.000 claims abstract description 29
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 21
- 229910052802 copper Inorganic materials 0.000 claims abstract description 21
- 239000010949 copper Substances 0.000 claims abstract description 21
- 229910052787 antimony Inorganic materials 0.000 claims abstract description 20
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims abstract description 20
- 230000002265 prevention Effects 0.000 claims abstract description 15
- KDYFGRWQOYBRFD-UHFFFAOYSA-N succinic acid Chemical compound OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 claims abstract description 12
- 230000008569 process Effects 0.000 claims abstract description 10
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 claims abstract description 8
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims abstract description 8
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims abstract description 8
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims abstract description 8
- 238000010438 heat treatment Methods 0.000 claims abstract description 7
- 238000003756 stirring Methods 0.000 claims abstract description 7
- 238000005303 weighing Methods 0.000 claims abstract description 7
- 239000001384 succinic acid Substances 0.000 claims abstract description 5
- 238000002844 melting Methods 0.000 claims abstract description 4
- 230000008018 melting Effects 0.000 claims abstract description 4
- 239000002893 slag Substances 0.000 claims abstract description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 33
- 238000001816 cooling Methods 0.000 claims description 32
- 239000000243 solution Substances 0.000 claims description 31
- 229910000679 solder Inorganic materials 0.000 claims description 25
- 238000002347 injection Methods 0.000 claims description 18
- 239000007924 injection Substances 0.000 claims description 18
- 238000003825 pressing Methods 0.000 claims description 14
- 239000000203 mixture Substances 0.000 claims description 12
- 238000005086 pumping Methods 0.000 claims description 10
- 238000010992 reflux Methods 0.000 claims description 8
- 230000000694 effects Effects 0.000 claims description 7
- 238000012545 processing Methods 0.000 claims description 5
- 239000007787 solid Substances 0.000 claims description 4
- 238000012546 transfer Methods 0.000 claims description 4
- 230000001680 brushing effect Effects 0.000 claims description 3
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 3
- 235000017166 Bambusa arundinacea Nutrition 0.000 claims 1
- 235000017491 Bambusa tulda Nutrition 0.000 claims 1
- 241001330002 Bambuseae Species 0.000 claims 1
- 235000015334 Phyllostachys viridis Nutrition 0.000 claims 1
- 239000011425 bamboo Substances 0.000 claims 1
- 238000003466 welding Methods 0.000 abstract description 14
- 239000012535 impurity Substances 0.000 abstract description 2
- 239000002184 metal Substances 0.000 abstract description 2
- 229910052751 metal Inorganic materials 0.000 abstract description 2
- 239000000498 cooling water Substances 0.000 description 7
- 239000002699 waste material Substances 0.000 description 3
- 230000001174 ascending effect Effects 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22C—FOUNDRY MOULDING
- B22C9/00—Moulds or cores; Moulding processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22C—FOUNDRY MOULDING
- B22C9/00—Moulds or cores; Moulding processes
- B22C9/08—Features with respect to supply of molten metal, e.g. ingates, circular gates, skim gates
- B22C9/082—Sprues, pouring cups
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D27/00—Treating the metal in the mould while it is molten or ductile ; Pressure or vacuum casting
- B22D27/04—Influencing the temperature of the metal, e.g. by heating or cooling the mould
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0233—Sheets, foils
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
- C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a research and development and production preparation process of a preformed soldering tin sheet containing soldering flux, S1, weighing and matching tin, copper and antimony, putting the tin, copper and antimony into a melting furnace, heating the tin, copper and antimony at the temperature of 360 ℃, and stirring and fishing slag to completely melt the tin, copper and antimony; s2, casting the molten solution into the lower die 3 at the top end of the base 1 through the matching of the sealing backflow prevention mechanism 7 and the casting bubble prevention mechanism 6, and reducing bubbles generated during casting; the welding flux has a scientific and reasonable structure, is safe and convenient to use, utilizes tin, copper and antimony as main metal components of the welding flux, is convenient to form a welding spot, can effectively increase the toughness of the welding flux and the welding spot, increases the brightness of the welding spot and improves the strength of the welding spot, and can effectively remove oxides and impurities on the surfaces of a welding piece and a welding pad in the welding process by using rosin, diethylene glycol monomethyl ether and succinic acid as the welding flux.
Description
Technical Field
The invention relates to the technical field of solder sheet research and development, in particular to a process for researching, developing and producing a preformed solder sheet containing soldering flux.
Background
Preformed solder pieces are used for various stations requiring precise amounts of solder, and the formed solder pieces have various standard shapes, such as square, rectangular, washer-shaped, and disc-shaped, ring-shaped, tube-shaped, and the like;
however, in the existing preformed soldering tin sheet, in some special soldering joints or sheet welding, the tin solder is not completely wet, and in the casting process of the soldering tin sheet, air bubbles are easily generated in the mold, so that the forming quality of the soldering tin sheet is affected, and the subsequent processing effect is reduced.
Disclosure of Invention
The invention provides a pre-formed soldering tin sheet containing soldering flux, research and development and a production preparation process thereof, which can effectively solve the problems that in some special soldering seams or sheet welding, the tin solder is not completely wetted, and bubbles are easily generated in a mould in the casting process of the soldering tin sheet, so that the forming quality of the soldering tin sheet is influenced, and the subsequent processing effect is reduced.
In order to achieve the purpose, the invention provides the following technical scheme: a production and preparation process of a preformed soldering tin sheet containing soldering flux comprises the following steps:
s1, weighing and matching tin, copper and antimony, putting the tin, copper and antimony into a melting furnace, heating the tin, copper and antimony at the temperature of 360 ℃, and stirring and fishing slag to completely melt the tin, copper and antimony;
s2, casting the molten solution into the lower die 3 at the top end of the base 1 through the matching of the sealing backflow prevention mechanism 7 and the casting bubble prevention mechanism 6, and reducing bubbles generated during casting;
s3, circularly cooling the melted solution in the lower die 3 through the cooling circulation mechanism 8 to rapidly cool and mold the soldering tin sheet;
s4, weighing and mixing rosin, diethylene glycol monomethyl ether and succinic acid, putting the mixture into an electromagnetic heating pot, processing the mixture at the temperature of 70 ℃, continuously stirring the mixture to completely melt the mixture, preparing the soldering flux for the preformed soldering tin sheet, and cooling the soldering flux for later use;
and S5, uniformly brushing the prepared soldering flux on the front and back surfaces of the mixed soldering tin sheet by using a fine brush, and then putting the mixed soldering tin sheet into a hot air reflux furnace to bake for 3 minutes at the temperature of 40 ℃ to prepare the preformed soldering tin sheet containing the soldering flux.
According to the technical scheme, the formula of the preformed soldering tin sheet containing the soldering flux comprises the following components in percentage by mass: 86.4 to 91.4 percent of tin with the purity of 99.95 percent, 0.9 to 1.8 percent of copper, 5.3 to 6.5 percent of antimony, 1.1 to 2.0 percent of rosin, 1.2 to 2.8 percent of diethylene glycol monomethyl ether and 0.1 to 0.5 percent of succinic acid.
Compared with the prior art, the invention has the beneficial effects that: the invention has scientific and reasonable structure and safe and convenient use:
1. the solder joint is conveniently formed by using tin, copper and antimony as main metal components of the solder, meanwhile, the toughness of the solder and the solder joint can be effectively increased, the brightness of the solder joint is increased, the strength of the solder joint is improved, and by using rosin, diethylene glycol monomethyl ether and succinic acid as soldering flux, oxides and impurities on the surfaces of a soldering part and a solder joint can be effectively removed in the welding process, so that a wetting effect is provided for liquid solder.
2. The casting bubble-preventing mechanism is arranged, through the matching of the limiting frame and the vertical rod, when an upper die and a lower die are closed, the movable frame and the pressing plate are pushed to descend, gas in the lower die is extruded, the gas in the lower die is conveniently discharged, the solution is conveniently injected, then the top plate is pulled through the electric telescopic rod, through the matching of the push rod, the push plate is pushed to move, the molten solution in the cavity is extruded, the molten solution is injected into the lower die through the vertical cylinder and the sleeve, the molten solution in the lower die is gradually increased, when the pressure in the lower die is greater than the thrust of the buffer spring, the pressing plate and the movable frame are pushed to ascend, the injection of the solution is completed, the solution is tightly attached to the top end of the pressing plate, the residual of bubbles is avoided, and the forming quality of the soldering tin sheet is ensured;
in addition, through rotating the screw rod, make the screw rod pass through the connecting plate and drive the movable frame and rise, adjust spacing and the distance between the movable frame to adjust the ascending distance of clamp plate as required, conveniently cast the soldering tin piece of different thickness, improved the adaptability of device.
3. The sealing backflow prevention mechanism is arranged, and the lantern ring is pushed by the telescopic characteristic of the supporting spring to enable the lantern ring to pull the connecting rod and the sealing plate to rise, so that the sealing plate is embedded into the embedded groove to seal the sleeve, molten solution is prevented from spilling out when the mould is opened, waste is reduced, and meanwhile, solution is prevented from scalding operators;
in addition, through the cooperation of the baffle, at the in-process that the push pedal descends, make the inside pressure of cavity, promote the baffle and rise, seal the injection pipe to avoid the inside molten solution backward flow of cavity to get into the injection pipe, guaranteed the extrusion effect to the cavity, avoid molten solution to spill simultaneously, it is extravagant to reduce, and through the effect of balancing weight, promote movable rod and baffle and reset simultaneously, the convenience is poured into the cavity with solution again inside.
4. The cooling circulation mechanism is arranged, cooperation through a water pump and a water suction pipe, the cooling water in the water tank is sent into the heat exchange cavity, heat exchange is carried out on the molten solution in the lower die, the cooling speed of the solution is improved, the production efficiency is improved, then the cooling water after heat exchange is discharged through the cooling pipe, cooling is carried out, storage is carried out in a backflow cavity, the water in the backflow cavity is gradually increased, the tensioning spring is pushed to shrink, cooperation through a fixing plate and a transverse rod is realized, the sealing ball is pushed to move, the cooling water is discharged out of the water tank, circulation is formed, continuous reduction is carried out on the lower die, the forming efficiency of soldering tin pieces is improved, in addition, the characteristic of stretching through the tensioning spring is realized, the fixing plate is driven, the transverse rod and the sealing ball reset phenomenon of avoiding backflow.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
FIG. 1 is a process diagram for preparing a solder sheet according to the present invention;
FIG. 2 is a schematic view of the mounting structure of the lower mold of the present invention;
FIG. 3 is a schematic view of the mounting structure of the movable frame of the present invention;
FIG. 4 is a schematic view of the mounting structure of the vertical tube of the present invention;
FIG. 5 is a schematic structural view of the casting bubble prevention mechanism of the present invention;
FIG. 6 is a schematic view of the mounting structure of the weight member of the present invention;
FIG. 7 is a schematic structural view of the sealing and backflow prevention mechanism of the present invention;
fig. 8 is a schematic structural view of the cooling circulation mechanism of the present invention.
Reference numbers in the figures: 1. a base; 2. fixing the rod; 3. a lower die; 4. a turntable; 5. an upper die;
6. casting an anti-bubble mechanism; 601. a groove; 602. a movable frame; 603. pressing a plate; 604. a buffer spring; 605. a vertical rod; 606. a limiting frame; 607. a connecting plate; 608. a screw; 609. a vertical cylinder; 610. a sleeve; 611. a chamber; 612. pushing the plate; 613. a push rod; 614. a top plate; 615. an electric telescopic rod;
7. a sealing anti-backflow mechanism; 701. an injection pipe; 702. a transverse plate; 703. a movable rod; 704. a balancing weight; 705. a baffle plate; 706. a collar; 707. a connecting rod; 708. a sealing plate; 709. a groove is embedded; 710. a support spring;
8. a cooling circulation mechanism; 801. a water tank; 802. a water pumping pipe; 803. a water pump; 804. a heat exchange chamber; 805. a reflux cavity; 806. a cooling tube; 807. a return pipe; 808. a fixing ring; 809. tensioning the spring; 810. a fixing plate; 811. a cross bar; 812. and (4) sealing the ball.
Detailed Description
The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are described herein for the purpose of illustration and explanation and not limitation.
Example (b): as shown in fig. 1-2, a process for developing and manufacturing a preformed solder sheet containing soldering flux comprises the following steps:
s1, weighing and matching tin, copper and antimony, putting the tin, copper and antimony into a melting furnace, heating the tin, copper and antimony at the temperature of 360 ℃, and stirring and fishing slag to completely melt the tin, copper and antimony;
s2, casting the molten solution into the lower die 3 at the top end of the base 1 through the matching of the sealing backflow prevention mechanism 7 and the casting bubble prevention mechanism 6, and reducing bubbles generated during casting;
s3, circularly cooling the melted solution in the lower die 3 through the cooling circulation mechanism 8 to rapidly cool and mold the soldering tin sheet;
s4, weighing and mixing rosin, diethylene glycol monomethyl ether and succinic acid, putting the mixture into an electromagnetic heating pot, processing the mixture at the temperature of 70 ℃, continuously stirring the mixture to completely melt the mixture, preparing the soldering flux for the preformed soldering tin sheet, and cooling the soldering flux for later use;
and S5, uniformly brushing the prepared soldering flux on the front and back surfaces of the mixed soldering tin sheet by using a fine brush, and then putting the mixed soldering tin sheet into a hot air reflux furnace to bake for 3 minutes at the temperature of 40 ℃ to prepare the preformed soldering tin sheet containing the soldering flux.
According to the technical scheme, the formula of the preformed soldering tin sheet containing the soldering flux comprises the following components in percentage by mass: 88.6 percent of tin with the purity of 99.95 percent, 1.2 percent of copper, 5.7 percent of stibium, 1.8 percent of rosin, 2.3 percent of diethylene glycol monomethyl ether and 0.4 percent of succinic acid.
As shown in fig. 2-8, the top end of the base 1 is symmetrically and fixedly connected with the fixing rods 2, a lower mold 3 is arranged at a position between the two fixing rods 2 corresponding to the top end of the base 1, the top end of the base 1 is movably connected with an upper mold 5 through the fixing rods 2, a turntable 4 is rotatably connected at a position corresponding to the outer side of the fixing rods 2 at the top end of the upper mold 5, the inner wall of the turntable 4 is in threaded connection with the outer side of the fixing rods 2, a casting anti-bubble mechanism 6 is arranged at the bottom end inside the upper mold 5, and the casting anti-bubble mechanism 6 comprises a groove 601, a movable frame 602, a pressure plate 603, a buffer spring 604, a vertical rod 605, a limiting frame 606, a connecting plate 607, a screw 608, a vertical cylinder 609, a sleeve 610, a cavity 611, a push plate 612, a push rod 613, a top plate 614 and an electric telescopic rod 615;
the bottom end of the upper die 5 is provided with a groove 601, the inside of the groove 601 is movably connected with a movable frame 602, the bottom end of the movable frame 602 is fixedly connected with a pressing plate 603 corresponding to the inside position of the lower die 3, the top end of the pressing plate 603 is fixedly connected with buffer springs 604 at equal intervals, the top end of the movable frame 602 is movably connected with a vertical rod 605 at equal intervals, the top end of the vertical rod 605 is fixedly connected with the top end of the groove 601, the inside of the groove 601 is movably connected with a limiting frame 606 through the vertical rod 605, two ends of the limiting frame 606 are symmetrically and fixedly connected with connecting plates 607, the bottom end of the upper die 5 is rotatably connected with a screw 608 corresponding to the top position of the connecting plates 607, the bottom end of the screw 608 penetrates through the bottom end of the connecting plates 607, the top end of the groove 601 is fixedly connected with a vertical cylinder 609 corresponding to the position between the two buffer springs 604, the outer side of the vertical cylinder 609 is movably connected with a sleeve 610, in order to reduce air bubbles, the top end of the lower die 3 is provided with a casting groove, the outer side of the pressing plate 603 is attached to the inner wall of the casting groove, the top end of the buffer spring 604 is fixedly connected with the top end of the groove 601, the inner wall of the connecting plate 607 is in threaded connection with the outer side of the screw 608, the bottom end of the sleeve 610 is fixedly connected with the top end of the pressure plate 603, and a sealing ring is sleeved at the joint of the sleeve 610 and the vertical cylinder 609;
a cavity 611 is formed in the upper die 5 corresponding to the top of the groove 601, a push plate 612 is movably connected in the cavity 611, push rods 613 are fixedly connected to corners of the top end of the push plate 612, a top plate 614 is fixedly connected to the top end of the push rod 613 corresponding to the top of the upper die 5, an electric telescopic rod 615 is fixedly connected to the top end of the upper die 5 corresponding to the bottom of the top plate 614 through bolts, for casting, the top end of a vertical cylinder 609 is communicated with the interior of the cavity 611, the outer side of the push plate 612 is attached to the inner wall of the cavity 611, the top end of the electric telescopic rod 615 is fixedly connected to the top end of the top plate 614, and the electric telescopic rod 615 supplies power through an external power supply;
a sealing backflow prevention mechanism 7 is arranged inside the upper die 5, and the sealing backflow prevention mechanism 7 comprises an injection pipe 701, a transverse plate 702, a movable rod 703, a balancing weight 704, a baffle 705, a lantern ring 706, a connecting rod 707, a sealing plate 708, an embedded groove 709 and a supporting spring 710;
an injection pipe 701 is fixedly connected to the middle position of the top end of the push plate 612, a transverse plate 702 is fixedly connected to the bottom position of the inner wall of the injection pipe 701, a movable rod 703 is movably connected to the top end of the transverse plate 702, a balancing weight 704 is fixedly connected to the top end of the movable rod 703, and a baffle 705 is fixedly connected to the bottom end of the movable rod 703;
a lantern ring 706 is movably sleeved at the bottom of the outer side of the sleeve 610, connecting rods 707 are fixedly connected to the bottom end of the lantern ring 706 at equal intervals, the bottom end of the connecting rod 707 penetrates the bottom end of the pressing plate 603, a sealing plate 708 is cast at the position of the bottom end of the connecting rod 707 corresponding to the bottom of the pressing plate 603, an embedded groove 709 is arranged at the position of the bottom end of the pressing plate 603 corresponding to the top of the sealing plate 708, a supporting spring 710 is fixedly connected at the position of the outer side of the lantern ring 706 corresponding to one side of the connecting rod 707, in order to prevent the molten solution from flowing back, the bottom end of the injection pipe 701 penetrates the bottom end of the push plate 612, the bottom end of the baffle 705 has a lower level than the bottom end of the push plate 612, the outer diameter of the baffle 705 is larger than the inner diameter of the injection pipe 701, a sleeve seal sleeve is filled at the joint of the connecting rod 707 and the pressure plate 603, the thickness of the sealing plate 708 is equidistant with the depth of the embedded groove 709, the top ends of the sealing plate 708 and the embedded groove 709 are both provided with inclined surfaces, the inclined angle of the inclined plane of the sealing plate 708 is equal to that of the inclined plane of the embedded groove 709;
a cooling circulation mechanism 8 is arranged at a position, corresponding to one side of the lower die 3, of the top end of the base 1, and the cooling circulation mechanism 8 comprises a water tank 801, a water pumping pipe 802, a water pump 803, a heat exchange chamber 804, a backflow cavity 805, a cooling pipe 806, a backflow pipe 807, a fixing ring 808, a tensioning spring 809, a fixing plate 810, a cross rod 811 and a sealing ball 812;
a water tank 801 is arranged at a position, corresponding to one side of a lower die 3, of the top end of a base 1, a water pumping pipe 802 is fixedly connected to the top of the water tank 801, a water pump 803 is fixedly connected to the outer side of the water pumping pipe 802, the other end of the water pumping pipe 802 is fixedly connected with one end of the lower die 3, a heat exchange cavity 804 is formed in the lower die 3, reflux cavities 805 are symmetrically formed in the lower die 3, corresponding to two sides of the heat exchange cavity 804, and a cooling pipe 806 is fixedly connected to the top of the lower die 3, corresponding to the reflux cavities 805;
3 one end of bed die corresponds backward flow chamber 805 one side position department fixedly connected with back flow 807, the solid fixed ring 808 of back flow 807 inner wall fixedly connected with, gu fixed ring 808 one end fixedly connected with tensioning spring 809, tensioning spring 809 other end fixedly connected with fixed plate 810, fixed plate 810 corresponds solid fixed ring 808 middle part position department fixedly connected with horizontal pole 811, horizontal pole 811 one end fixedly connected with ball sealer 812, in order to improve the cooling efficiency of soldering tin piece, the inside equidistance fixedly connected with gusset plate of heat transfer cavity 804, the cooling tube 806 other end and 3 one end fixed connection of bed die, and the cooling tube 806 other end and the inside intercommunication of heat transfer cavity 804, the outside of ball sealer 812 laminates with the inner wall of back flow 807 mutually, water pump 803 supplies power through external power source.
The working principle and the using process of the invention are as follows: firstly, the turntable 4 is rotated to enable the turntable 4 to push the upper die 5 to descend along the fixed rod 2, so that the upper die 5 and the lower die 3 are closed, casting is facilitated, meanwhile, in the descending process of the upper die 5, the movable frame 602 pushes the pressing plate 603 to descend through the matching of the limiting frame 606 and the vertical rod 605, so that gas in the lower die 3 is pushed to extrude, the gas in the lower die 3 is forced to be discharged, then the screw 608 is rotated to enable the screw 608 to drive the movable frame 602 to ascend through the connecting plate 607, the ascending distance of the pressing plate 603 is conveniently adjusted as required, and the adaptability of the device is improved;
then, injecting a molten solution into the cavity 611 through the injection pipe 701, starting the electric telescopic rod 615, enabling the electric telescopic rod 615 to pull the top plate 614 to move, pushing the push plate 612 to move through the cooperation of the push rod 613, extruding the molten solution in the cavity 611, enabling the molten solution to enter the lower die 3 through the vertical cylinder 609 and the sleeve 610, and meanwhile gradually increasing the pressure and gradually increasing the molten solution in the lower die 3 along with the continuous descending of the push plate 612, when the pressure in the lower die 3 is greater than the thrust of the buffer spring 604, pushing the press plate 603 and the movable frame 602 to ascend until the top end of the movable frame 602 is attached to the bottom end of the limiting frame 606, limiting the press plate 603, and stopping casting;
then, in the process of descending the push plate 612, the baffle 705 is pushed to ascend due to the pressure in the cavity 611, so that the top end of the upper baffle 705 is attached to the bottom end of the push plate 612, and the injection pipe 701 is prevented, so that the molten solution in the cavity 611 is prevented from flowing back to enter the injection pipe 701, the extrusion effect on the cavity 611 is ensured, the molten solution is prevented from spilling, and the waste is reduced;
in addition, during casting, the sealing plate 708 is pushed to descend along with the increase of pressure, the supporting spring 710 is contracted, the molten solution can conveniently enter the lower die 3, and during die opening, the lantern ring 706 is pushed through the telescopic characteristic of the supporting spring 710, the lantern ring 706 pulls the connecting rod 707 and the sealing plate 708 to ascend, so that the sealing plate 708 is embedded into the embedded groove 709 to seal the sleeve 610, the molten solution is prevented from spilling, waste is reduced, and meanwhile, the solution is prevented from scalding operators;
finally, through the cooperation of the water pump 803 and the water pumping pipe 802, the cooling water in the water tank 801 is sent into the heat exchange chamber 804, the heat exchange is carried out on the melted solution in the lower die 3, the cooling speed of the solution is improved, the production efficiency is increased, in addition, along with the injection of the cooling water, the liquid level rises continuously, the cooling water after heat exchange is conveniently discharged out of the cooling pipe 806, and is discharged into the backflow cavity 805 after being cooled by the cooling pipe 806, and the tensioning spring 809 is pushed to contract along with the gradual increase of water in the backflow cavity 805, and through the cooperation of the fixing plate 810 and the cross bar 811, the sealing ball 812 is pushed to move, the cooling water is discharged out of the interior of the water tank 801, circulation is formed, the lower die 3 is continuously lowered, the molding efficiency of the soldering tin sheet is improved, in addition, the fixed plate 810, the cross rod 811 and the sealing ball 812 are driven to reset by the telescopic characteristic of the tension spring 809 so as to avoid the backflow phenomenon.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A production and preparation process of a preformed soldering tin sheet containing soldering flux is characterized in that: the method comprises the following steps:
s1, weighing and matching tin, copper and antimony, putting the tin, copper and antimony into a melting furnace, heating the tin, copper and antimony at the temperature of 360 ℃, and stirring and fishing slag to completely melt the tin, copper and antimony;
s2, casting the molten solution into the lower die (3) at the top end of the base (1) through the matching of the sealing backflow prevention mechanism (7) and the casting bubble prevention mechanism (6), and reducing bubbles generated during casting;
s3, circularly cooling the melted solution in the lower die (3) through the cooling circulation mechanism (8) to rapidly cool and mold the soldering tin sheet;
s4, weighing and mixing rosin, diethylene glycol monomethyl ether and succinic acid, putting the mixture into an electromagnetic heating pot, processing the mixture at the temperature of 70 ℃, continuously stirring the mixture to completely melt the mixture, preparing the soldering flux for the preformed soldering tin sheet, and cooling the soldering flux for later use;
and S5, uniformly brushing the prepared soldering flux on the front and back surfaces of the mixed soldering tin sheet by using a fine brush, and then putting the mixed soldering tin sheet into a hot air reflux furnace to bake for 3 minutes at the temperature of 40 ℃ to prepare the preformed soldering tin sheet containing the soldering flux.
2. The process for producing preformed solder flakes containing soldering flux as claimed in claim 1, wherein:
the formula of the preformed soldering tin sheet containing the soldering flux comprises the following components in percentage by mass: 86.4 to 91.4 percent of tin with the purity of 99.95 percent, 0.9 to 1.8 percent of copper, 5.3 to 6.5 percent of antimony, 1.1 to 2.0 percent of rosin, 1.2 to 2.8 percent of diethylene glycol monomethyl ether and 0.1 to 0.5 percent of succinic acid.
3. The process for producing preformed solder flakes containing soldering flux as claimed in claim 1, wherein: base (1) top symmetry fixedly connected with dead lever (2), and position department is provided with bed die (3) between base (1) top corresponds two dead levers (2), there is mould (5) on base (1) top through dead lever (2) swing joint, it rotates to be connected with carousel (4) to go up mould (5) top and correspond dead lever (2) outside position department, and passes through threaded connection in carousel (4) inner wall and dead lever (2) outside, the inside bottom of going up mould (5) is provided with casting anti-bubble mechanism (6), casting anti-bubble mechanism (6) include recess (601), movable frame (602), clamp plate (603), buffer spring (604), montant (605), spacing (606), connecting plate (607), screw rod (608), riser (609), sleeve (610), cavity (611), push pedal (612), The push rod (613), the top plate (614) and the electric telescopic rod (615);
the bottom end of the upper die (5) is provided with a groove (601), the inside of the groove (601) is movably connected with a movable frame (602), the bottom end of the movable frame (602) is fixedly connected with a pressing plate (603) corresponding to the inside of the lower die (3), the top end of the pressing plate (603) is fixedly connected with buffer springs (604) at equal intervals, the top end of the movable frame (602) is movably connected with a vertical rod (605) at equal intervals, the top end of the vertical rod (605) is fixedly connected with the top end of the groove (601), the inside of the groove (601) is movably connected with a limiting frame (606) through the vertical rod (605), two ends of the limiting frame (606) are symmetrically and fixedly connected with connecting plates (607), the bottom end of the upper die (5) corresponding to the top of the connecting plates (607) is rotatably connected with a screw rod (608), the bottom end of the screw rod (608) penetrates through the bottom end of the connecting plates (607), the top end of the groove (601) corresponding to a vertical tube (609) between the two buffer springs (604), a sleeve (610) is movably connected to the outer side of the vertical cylinder (609);
go up inside recess (601) top position department of corresponding of mould (5) and seted up cavity (611), the inside swing joint of cavity (611) has push pedal (612), equal fixedly connected with push rod (613) of each corner position department in push pedal (612) top, push rod (613) top corresponds mould (5) top position department fixedly connected with roof (614), and goes up mould (5) top and correspond roof (614) bottom position department through bolt fixedly connected with electric telescopic handle (615).
4. The process for preparing preformed solder sheet containing soldering flux as claimed in claim 3, wherein: the casting groove has been seted up on bed die (3) top, the outside of clamp plate (603) is laminated with the inner wall of casting groove mutually, the top of buffer spring (604) and the top fixed connection of recess (601), threaded connection is passed through with the outside of screw rod (608) in connecting plate (607) inner wall, the bottom of sleeve (610) and the top fixed connection of clamp plate (603), and sleeve (610) and the junction of erecting section of thick bamboo (609) have cup jointed the sealing ring.
5. The process for preparing preformed solder sheet containing soldering flux as claimed in claim 3, wherein: the top end of the vertical cylinder (609) is communicated with the interior of the cavity (611), the outer side of the push plate (612) is attached to the inner wall of the cavity (611), the top end of the electric telescopic rod (615) is fixedly connected with the top end of the top plate (614), and the electric telescopic rod (615) supplies power through an external power supply.
6. The process for preparing preformed solder sheet containing soldering flux as claimed in claim 3, wherein: a sealing backflow prevention mechanism (7) is arranged inside the upper die (5), and the sealing backflow prevention mechanism (7) comprises an injection pipe (701), a transverse plate (702), a movable rod (703), a balancing weight (704), a baffle plate (705), a lantern ring (706), a connecting rod (707), a sealing plate (708), an embedded groove (709) and a supporting spring (710);
an injection pipe (701) is fixedly connected to the middle position of the top end of the push plate (612), a transverse plate (702) is fixedly connected to the bottom position of the inner wall of the injection pipe (701), a movable rod (703) is movably connected to the top end of the transverse plate (702), a balancing weight (704) is fixedly connected to the top end of the movable rod (703), and a baffle (705) is fixedly connected to the bottom end of the movable rod (703);
the utility model discloses a clamp plate, including sleeve (610), cover ring (706), the activity of sleeve (610) outside bottom position department cup joints lantern ring (706), lantern ring (706) bottom equidistance fixedly connected with connecting rod (707), and the bottom of connecting rod (707) runs through the bottom of clamp plate (603), the bottom of connecting rod (707) corresponds the bottom position department founding of clamp plate (603) and has sealed plate (708), embedded groove (709) have been seted up to clamp plate (603) bottom correspondence sealed plate (708) top position department, the lantern ring (706) outside corresponds connecting rod (707) one side position department fixedly connected with supporting spring (710).
7. The process for preparing preformed solder sheet containing soldering flux as claimed in claim 6, wherein: the bottom that push pedal (612) was run through to injection pipe (701) bottom, the level of baffle (705) bottom is less than the level of push pedal (612) bottom, and the external diameter of baffle (705) is greater than the internal diameter of injection pipe (701), the junction of connecting rod (707) and clamp plate (603) is filled and has been cup jointed the seal cover, the degree of depth of the thickness equidistance embedded groove (709) of sealing plate (708), inclined plane has all been seted up on sealing plate (708) top and embedded groove (709) top, and the inclination on sealing plate (708) inclined plane equals with the inclination on embedded groove (709) inclined plane.
8. The process for preparing preformed solder sheet containing soldering flux as claimed in claim 3, wherein: a cooling circulation mechanism (8) is arranged at a position, corresponding to one side of the lower die (3), of the top end of the base (1), and the cooling circulation mechanism (8) comprises a water tank (801), a water pumping pipe (802), a water pump (803), a heat exchange chamber (804), a backflow cavity (805), a cooling pipe (806), a backflow pipe (807), a fixing ring (808), a tensioning spring (809), a fixing plate (810), a cross rod (811) and a sealing ball (812);
a water tank (801) is arranged at a position, corresponding to one side of the lower die (3), of the top end of the base (1), a water pumping pipe (802) is fixedly connected to the top of the water tank (801), a water pump (803) is fixedly connected to the outer side of the water pumping pipe (802), the other end of the water pumping pipe (802) is fixedly connected with one end of the lower die (3), a heat exchange cavity (804) is formed in the lower die (3), reflux cavities (805) are symmetrically formed in positions, corresponding to two sides of the heat exchange cavity (804), in the lower die (3), and a cooling pipe (806) is fixedly connected to a position, corresponding to the top of the reflux cavity (805), of the top end of the lower die (3);
lower mould (3) one end corresponds backward flow chamber (805) one side position department fixedly connected with back flow (807), back flow (807) inner wall fixedly connected with solid fixed ring (808), gu fixed ring (808) one end fixedly connected with tensioning spring (809), tensioning spring (809) other end fixedly connected with fixed plate (810), fixed plate (810) correspond solid fixed ring (808) middle part position department fixedly connected with horizontal pole (811), horizontal pole (811) one end fixedly connected with sealing ball (812).
9. The process for preparing preformed solder sheet containing soldering flux as claimed in claim 8, wherein: the inside equidistance fixedly connected with gusset plate of heat transfer cavity (804), cooling tube (806) other end and bed die (3) one end fixed connection, and the inside intercommunication of cooling tube (806) other end and heat transfer cavity (804), the outside of ball sealer (812) is laminated with the inner wall of back flow (807) mutually, water pump (803) are supplied power through external power source.
10. A preformed soldering tin sheet containing soldering flux is characterized in that: the soldering tin sheet is prepared according to any step of the production and preparation process of the preformed soldering tin sheet containing the soldering flux.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110722618.9A CN113352020A (en) | 2021-06-28 | 2021-06-28 | Research and development of preformed soldering tin sheet containing soldering flux and production and preparation process thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110722618.9A CN113352020A (en) | 2021-06-28 | 2021-06-28 | Research and development of preformed soldering tin sheet containing soldering flux and production and preparation process thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113352020A true CN113352020A (en) | 2021-09-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110722618.9A Withdrawn CN113352020A (en) | 2021-06-28 | 2021-06-28 | Research and development of preformed soldering tin sheet containing soldering flux and production and preparation process thereof |
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| Country | Link |
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| CN (1) | CN113352020A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116786803A (en) * | 2023-08-28 | 2023-09-22 | 河北蒙电电气科技有限公司 | Manufacturing tool for iron component |
-
2021
- 2021-06-28 CN CN202110722618.9A patent/CN113352020A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116786803A (en) * | 2023-08-28 | 2023-09-22 | 河北蒙电电气科技有限公司 | Manufacturing tool for iron component |
| CN116786803B (en) * | 2023-08-28 | 2023-10-24 | 河北蒙电电气科技有限公司 | Manufacturing tool for iron component |
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