CN113351985A

CN113351985A - Laser processing control method, device and system

Info

Publication number: CN113351985A
Application number: CN202110551674.0A
Authority: CN
Inventors: 潘庆龙; 白天翔; 刘文杰; 游德勇; 李文彦
Original assignee: Suzhou Deqing Optical Technology Co ltd
Current assignee: Suzhou Deqing Optical Technology Co ltd
Priority date: 2021-05-20
Filing date: 2021-05-20
Publication date: 2021-09-07
Anticipated expiration: 2041-05-20
Also published as: CN113351985B

Abstract

The embodiment of the application discloses laser processing control method, device and system, when detecting the optical radiation signal of laser processing point, acquire the laser processing depth information of at least one processing point through coherent light imaging device, revise the initial judgement condition of laser processing spare processing point quality according to laser processing depth information, confirm laser processing spare processing point quality statistics, and then carry out supplementary correction to laser processing spare processing point quality according to the laser processing depth information that coherent light imaging device obtained, it is many to reduce optical coherent light imaging device precision requirement, production high speed detection demand when satisfying current industrial production, coherent light imaging device's complexity requirement has been reduced.

Description

Laser processing control method, device and system

Technical Field

The present disclosure relates to the field of laser processing, and in particular, to a method, an apparatus, and a system for controlling processing parameters during laser processing.

Background

The laser processing process is a process of interaction between light and a material, and mainly utilizes laser beams emitted by a laser to be focused on the surface of the material after being transmitted through an optical fiber and a lens, and the material absorbs laser energy to cause melting and even gasification, thereby achieving the purpose of material processing. Due to the thermal influence of the laser, a molten pool is formed in a processing area of the material to be processed, and multiple signals such as plasma, metal vapor, a radiation optical signal, a radiation acoustic signal and the like are radiated. A number of studies have shown that the above signals are closely related to the quality of laser processing. If defects such as hump, incomplete penetration, splash, pollution and the like occur in the laser processing process, the radiation signals can show different signal representations.

In the laser processing production process, the control parameters of laser light emission, parameters of optical related equipment, and process parameters such as the material and shape of a workpiece all affect the production efficiency of the laser workpiece and the quality of a final product. In order to improve the precision of laser processing detection and improve the production quality of products, in the prior art, an optical sensor is used for acquiring a light intensity signal of radiation light of a laser processing point, and different laser processing defects are represented by the light intensity of the radiation light of different frequency bands.

Disclosure of Invention

The application provides a laser processing control method, a laser processing control device and a laser processing control system, which meet the requirement of high-speed detection in production in the existing industrial production and reduce the complexity requirement of a coherent light imaging device.

The application adopts the following technical scheme:

in a first aspect, an embodiment of the present application provides a laser processing control method, including the following steps:

receiving an optical radiation signal from at least one processing point in a laser processing path, the optical radiation signal comprising: one or more of an infrared radiation signal, a visible radiation signal, a machining laser reflection signal; photoelectrically converting the received optical radiation signal into an electric signal by a single-point photoelectric sensor;

acquiring laser processing depth information of the at least one processing point through a coherent light imaging device, wherein the coherent light imaging device comprises an optical interferometer, and the laser processing depth information is obtained through the optical interferometer, and the relative processing depth of the at least one processing point relative to an optical reference surface is acquired through the optical interferometer;

determining an initial judgment condition of the quality of a processing point of the laser processing piece according to an electric signal obtained by the single-point photoelectric sensor and a pre-stored normal electric signal corresponding to the processing point of the laser processing standard piece; the normal electric signal is a value range of the electric signal which changes correspondingly in the qualified processing process of the processing point of the laser processing piece under a technological parameter;

and correcting the initial judgment condition of the quality of the processing point of the laser processing piece according to the laser processing depth information, and determining the quality statistics of the processing point of the laser processing piece.

According to the laser processing process control method, the quality of the processing point of the laser processing piece is supplemented and corrected according to the laser processing depth information acquired by the coherent light imaging device, the precision requirement of the optical coherent light imaging device is greatly reduced, the high-speed production detection requirement in the existing industrial production is met, and the complexity of the coherent light imaging device is reduced.

With reference to the first aspect, in some embodiments, an initial determination condition of the quality of the processing point of the laser processing piece is determined according to an electric signal obtained by the single-point photoelectric sensor and a pre-stored normal electric signal corresponding to the processing point of the laser processing standard piece; further comprising the steps of:

according to the electric signal that single-point photoelectric sensor obtained and the normal electric signal that the laser processing standard component processing point that prestores corresponds, confirm the initial defect data kind that laser processing detected data corresponds, wherein the defect kind includes: one or more of a laser welding cold joint defect, a laser welding pinhole defect and a laser welding explosion point defect.

With reference to the first aspect, in some embodiments, the initial determination condition of the quality of the processing point of the laser processing member is modified according to the laser processing depth information, and a quality statistic of the processing point of the laser processing member is determined; further comprising the steps of: and judging the initial defect data type again according to the laser processing depth information, and determining the quality statistics of the processing points of the laser processing piece.

With reference to the first aspect, in some embodiments, the initial determination condition of the quality of the processing point of the laser processing member is modified according to the laser processing depth information, and a quality statistic of the processing point of the laser processing member is determined; further comprising the steps of:

determining a feedback control grade table according to the initial defect data type; the feedback control grade table is used for indicating laser processing parameter setting corresponding to a laser processing depth range under a certain defect type;

and setting feedback according to the laser processing parameters to adjust the laser processing process.

According to the laser processing process control method, the feedback control grade table is preset in the system, and the laser processing process is subjected to real-time feedback control by inquiring the feedback control grade table during actual laser processing, so that the requirements of self-adaptive intelligent high-efficiency control in laser industrial processing are met.

In a second aspect, an embodiment of the present application provides a laser processing apparatus, including a single-point optical sensor, a coherent light imaging device, and a processor; a single-point optical sensor for receiving an optical radiation signal from at least one processing point in a laser processing path, the optical radiation signal comprising: one or more of an infrared radiation signal, a visible radiation signal, a machining laser reflection signal; photoelectrically converting the received optical radiation signal into an electric signal by a single-point photoelectric sensor; the coherent light imaging device is used for acquiring laser processing depth information of the at least one processing point, and comprises an optical interferometer, wherein the laser processing depth information is the relative processing depth of the at least one processing point relative to an optical reference surface acquired by the optical interferometer; the processor is used for determining the initial judgment condition of the quality of the processing point of the laser processing piece according to the electric signal obtained by the single-point photoelectric sensor and the pre-stored normal electric signal corresponding to the processing point of the laser processing standard piece; the normal electric signal is a value range of the electric signal which changes correspondingly in the qualified processing process of the processing point of the laser processing piece under a technological parameter; and correcting the initial judgment condition of the quality of the processing point of the laser processing piece according to the laser processing depth information obtained by the coherent light imaging device, and determining the quality statistics of the processing point of the laser processing piece.

According to the laser processing device, the quality of the processing point of the laser processing piece is supplemented and corrected according to the laser processing depth information acquired by the coherent light imaging device, the precision requirement of the optical coherent light imaging device is greatly reduced, the high-speed production detection requirement during the existing industrial production is met, and the complexity of the coherent light imaging device is reduced.

With reference to the second aspect, in some embodiments, the laser processing apparatus further includes a memory, and the processor is further configured to determine an initial defect data type corresponding to the laser processing detection data according to the electric signal obtained by the single-point photoelectric sensor and a normal electric signal corresponding to a processing point of the laser processing standard stored in the memory, where the defect type includes: one or more of a laser welding cold joint defect, a laser welding pinhole defect and a laser welding explosion point defect.

With reference to the second aspect, in some embodiments, the processor is further configured to perform a re-judgment on the initial defect data type according to the laser processing depth information, and determine a processing point quality statistic of the laser processing member.

In combination with the second aspect, in some embodiments, the laser machining apparatus includes a memory, the processor determining a table of feedback control levels based on an initial defect data type; the feedback control grade table is stored in a memory and used for indicating laser processing parameter setting corresponding to a laser processing depth range under a certain defect type; and the processor sets feedback according to the laser processing parameters to adjust the laser processing process.

The application provides a laser beam machining device through predetermineeing the feedback control grade table to the system, adds man-hour at actual laser, goes real-time feedback control laser beam machining process through inquiry feedback control grade table, has satisfied the demand of self-adaptation intelligence high efficiency control in the laser industrialization processing.

In a third aspect, an embodiment of the present application provides a laser processing system, including: the device comprises a laser processing head, a single-point optical sensor, a coherent light imaging device and a processor; the laser processing head is used for carrying out laser processing on the laser processing piece according to the laser processing parameters on the laser processing path; a single-point optical sensor for receiving an optical radiation signal from at least one processing point in a laser processing path, the optical radiation signal comprising: one or more of an infrared radiation signal, a visible radiation signal, a machining laser reflection signal; photoelectrically converting the received optical radiation signal into an electric signal by a single-point photoelectric sensor; the coherent light imaging device is used for acquiring laser processing depth information of the at least one processing point, and comprises an optical interferometer, wherein the laser processing depth information is the relative processing depth of the at least one processing point relative to an optical reference surface acquired by the optical interferometer; the processor is used for determining the initial judgment condition of the quality of the processing point of the laser processing piece according to the electric signal obtained by the single-point photoelectric sensor and the pre-stored normal electric signal corresponding to the processing point of the laser processing standard piece; the normal electric signal is a value range of the electric signal which changes correspondingly in the qualified processing process of the processing point of the laser processing piece under a technological parameter; and correcting the initial judgment condition of the quality of the processing point of the laser processing piece according to the laser processing depth information obtained by the coherent light imaging device, and determining the quality statistics of the processing point of the laser processing piece.

With reference to the third aspect, in some embodiments, the laser processing system further includes a memory, and the processor is further configured to determine an initial defect data type corresponding to the laser processing detection data according to the electric signal obtained by the single-point photoelectric sensor and a normal electric signal corresponding to a processing point of the laser processing standard stored in the memory, where the defect type includes: one or more of a laser welding insufficient welding defect, a laser welding pinhole defect and a laser welding explosion point defect; judging the type of initial defect data again according to the laser processing depth information, and determining the quality statistics of the processing points of the laser processing piece; the processor determines a feedback control grade table according to the initial defect data type; the feedback control grade table is stored in a memory and used for indicating laser processing parameter setting corresponding to a laser processing depth range under a certain defect type; and the processor sets feedback according to the laser processing parameters to adjust the laser processing process.

According to the laser processing control method, the laser processing control device and the laser processing control system, the quality of a processing point of a laser processing piece is supplemented and corrected according to the laser processing depth information acquired by the coherent light imaging device, the precision requirement of the optical coherent light imaging device is greatly reduced, the high-speed production detection requirement during the existing industrial production is met, and the complexity of the coherent light imaging device is reduced.

Drawings

FIG. 1 is a schematic diagram illustrating an application of a workpiece processing monitoring system to online detection of laser welding quality according to an embodiment of the present application;

fig. 2 is a flowchart of a laser processing control method according to an embodiment of the present application;

FIG. 3 is a schematic diagram of a laser processing control apparatus according to an embodiment of the present disclosure; and

fig. 4 is a schematic diagram of a laser processing control system according to an embodiment of the present disclosure.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

For better understanding of the technical solutions of the present invention, the following detailed descriptions of the embodiments of the present application are provided with reference to the accompanying drawings.

The terminology used in the embodiments of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in the examples of this application and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

It should be understood that the term "and/or" as used herein is merely one type of association that describes an associated object, meaning that three relationships may exist, e.g., a and/or B may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship.

It should be understood that although the terms first, second, etc. may be used to describe the set thresholds in the embodiments of the present application, the set thresholds should not be limited to these terms. These terms are used only to distinguish the set thresholds from each other. For example, the first set threshold value may also be referred to as a second set threshold value, and similarly, the second set threshold value may also be referred to as a first set threshold value, without departing from the scope of the embodiments of the present application.

The "user interface" related to the embodiment of the application refers to an interface displayed on a display screen of the electronic device. The user interface may include any application interface. The user interface also includes status bars and the like.

The "display element" referred to in the embodiments of the present application refers to content displayed by the application interface, including content displayed by each application interface for a user to view and content for the user to perform an operation.

Embodiments of the present application relate to "a plurality" or "a plurality" of two or more.

At present, in a machining process monitoring system, such as a laser welding process detection device, in a welding process along a laser beam axis of a laser machining beam, various laser welding defects, such as a cold joint, a laser machining point surface pollution, incomplete penetration, a welding beading, collapse, splashing, welding seam deviation and the like, can be generated due to shielding gas abnormality, power attenuation, defocusing amount change, protective lens pollution, gap change and the like in the industrial machining process of a machining workpiece existing in the market. The problem of related defects in the laser welding process belongs to welding defects which are difficult to find, so that hidden troubles are always brought to the product quality. Particularly, in some industries with higher quality requirements, such as mass production in the fields of batteries and precision consumer electronics, the method is a technical problem which is urgently needed to be solved by manufacturers. The process requires that the explosion-proof valve and the cover plate are completely sealed and welded, and the conditions of leakage welding, insufficient welding and poor sealing caused by partial welding cannot be caused. The tab welding part needs to weld the copper sheet and the aluminum material together, and due to the characteristics of different material welding processes, deformation during sheet welding and the like, a cold joint condition is easy to occur, and a poor welding structure is easy to occur. The sealing welding of the battery shell is an important process of the power battery, and the welding quality of the battery shell directly influences the sealing performance and the compressive strength of the whole battery, so that the service life and the safety performance are influenced. The series-parallel connection welding of the battery pack is also an important process for the output efficiency of the battery pack, and the difficulty is that the welding depth and the welding strength of the welding need to be ensured.

First, a system for monitoring a machining process of a workpiece according to an embodiment of the present application will be described. Referring to fig. 1, a workpiece processing monitoring system according to an embodiment of the present application is provided. The monitoring system can be applied to various application environments, for example, cutting quality monitoring of a machined part during laser cutting, welding quality monitoring of the machined part during laser welding, welding quality monitoring during 3D printing, real-time process monitoring of a manufacturing process during industrial manufacturing, real-time monitoring of certain environmental test point processes, and the like, and the embodiment of the application is not limited.

As shown in fig. 1, the machining monitoring system for the machined part is applied to online detection of laser welding quality, and comprises a laser machining head 1, a beam combining mirror 4, a light splitting element 5 and a light radiation signal detection module 8, wherein the beam combining mirror 4 and a main light path of the laser machining head 1 form an included angle of 45 degrees, the beam combining mirror 4 and the light splitting element 5 are arranged in parallel, reflected light of the laser machining head 1 is reflected to the light splitting element 5 through the beam combining mirror 4, and then is reflected to the light radiation signal detection module 8 through the light splitting element 5; and a light intensity regulator 9 is arranged on a light path between the beam combining mirror 4 and the optical radiation signal detection module 8, and the light intensity regulator 9 regulates and controls the overall light intensity. The light intensity regulator 9 is internally provided with a light attenuation sheet for carrying out attenuation control on the light radiation intensity, the light attenuation sheet can select attenuation values with different proportions according to process requirements, and the purpose of controlling the light intensity is achieved by replacing the light attenuation sheets with different attenuation proportions. The light splitting element 5 is a beam splitter, which is a mirror that partially reflects and partially transmits the light signal. The detection apparatus further comprises an imaging module 20.

The optical radiation signal detection module 8 has a photosensor for receiving the optical radiation signal and a focusing mirror 7 for focusing the radiation optical signal to the effective range of the photosensor. The signal processing circuit 11 is configured to perform amplification analysis processing on the signal received by the photosensor. The photoelectric sensor can be a photoelectric sensor used for receiving light radiation signals of different wave bands such as a visible light wave band, a laser reflection wave band, an infrared light wave band and the like, converts different light radiation signals into electric signals, outputs the electric signals to the signal processing circuit to process the signals, and is used for analyzing and judging the laser processing quality subsequently.

In this embodiment, the optical radiation signal 3 generated by the laser beam and the material processing area 2 is guided into the device through the beam combiner 4 in the laser processing head 1, the first beam splitter 5 forming an angle of 45 ° with the signal beam divides the signal beam into two optical radiation signals, one path of the optical radiation signals is vertically turned to the imaging module 20 through reflection, the other portion of the optical radiation signals is transmitted to the second beam splitter 5 through transmission, and then is converged to the photosensitive working area of the photoelectric sensor through the focusing mirror 7, and in order to enable the photoelectric sensor to obtain a specified optical radiation signal, a band-pass filter (not shown) is arranged in front of the photoelectric sensor and used for filtering out the specified optical radiation signal. The optical radiation signal is converted into an electrical signal by the photoelectric sensor, and is output to the signal processing circuit 11 for modulation and amplification, and then is output to the laser processing quality analysis system 12. It can be seen that various signals related to the welding quality are obtained by guiding and decomposing the optical radiation signals generated by the laser beam processing, and the results highly related to the laser processing quality are obtained through the signal processing circuit 11 and the laser processing quality analysis system 12.

Specifically, the optical radiation signal detection module 8 is configured to receive the radiation light and convert the radiation light into a corresponding optical intensity electrical signal, and may include a single-point photoelectric sensor such as a photodiode. The method can comprise the following steps: infrared radiation signal sensor, visible light radiation signal sensor, laser processing reflection signal sensor. Generally, the infrared radiation signal sensor can correspondingly receive infrared radiation signals with the wavelength ranging from 1250nm to 1700 nm. The visible light radiation signal sensor can correspondingly receive visible light radiation signals in the range of 400nm to 700 nm. The laser processing reflected signal sensor can correspondingly receive processing laser reflected signals in actual laser processing, for example, the processing laser wavelength is 915nm, 1064nm, 1080nm and the like. The wavelength of the machining laser is related to the actual laser wavelength used. Those skilled in the art will appreciate that the optical radiation signal received by the optical radiation signal detection module 8 at least one processing point in the laser processing path of the present application is related to the spectrum detectable by the single-point photosensor itself. In some use environments, a suitable interval for the infrared radiation signal may extend outside the 1250nm to 1700nm interval. In some use environments, the visible radiation signal may extend outside the 400nm to 700nm interval. Or the relevant optical radiation signal may be a certain segment of the relevant interval or a certain specific spectrum. Such as a particular blue light, a particular green light, etc. According to the embodiment of the application, the laser processing quality can be contrastively represented through three sections of values of the infrared radiation signal, the visible radiation signal and the processing laser reflection signal, and then the quality of the processing point of the laser processing piece can be more accurately detected.

Specifically, the optical radiation signal detection module 8 further includes a signal processing circuit 11, and then the optical radiation signal detection module 8 can directly perform photoelectric conversion on the received radiation signal into a digital electrical signal and output the digital electrical signal to the laser processing quality analysis system 12. As shown in fig. 2, in the schematic view of the display effect of the workpiece processing monitoring interface provided in the embodiment of the present application, the optical radiation signal detection module 8 obtains a corresponding voltage value V1 through the visible light radiation signal sensor, obtains a corresponding voltage value V2 through the laser processing reflection signal sensor, obtains a corresponding voltage value V3 through the infrared radiation signal sensor, and outputs the adjustment electrical signals after respectively performing gain adjustment on the corresponding voltage values V1, V2, and V3. The gain adjustment here can be understood as: in order to more intuitively and conveniently represent the quality value of the processing point corresponding to the laser processing point through the voltage value, the voltage values of V1, V2 and V3 are properly and correspondingly adjusted within a certain range respectively, so that the change of the voltage value can intuitively reflect the quality change of the processing point of the laser processing point. In the embodiment of the present application, a single-point photoelectric sensor photoelectrically converts a received radiation signal into an electrical signal, and the obtained electrical signal may be V ═ m × V1+ n × V2+ k × V3, where m, n, and k are constants, and m + n + k is 1.

According to the actual processing point quality value of the laser processing point, the corresponding relation between the processing point quality value of the laser processing point and the electric signal is established, and the method comprises the following steps: respectively establishing a corresponding relation between voltage values of V1, V2 and V3 corresponding to each processing point of the laser processing standard component and the quality value of the processing point of the laser processing point; the corresponding relation is used for reflecting the quality value of the processing point of the laser processing point according to the size of the electric signal which is adjusted correspondingly to the laser processing point on the laser processing path; it is understood that the processing point quality values described in the embodiments of the present application include: whether the processing points have insufficient solder joints, splashing, welding beading, surface pollution and the like. The change in the adjustment electrical signal may reflect the change in the quality of the machining point alone or may reflect a weighted change in the quality of the machining point.

Further, generating characterization data for quality detection of the laser processing point according to the corresponding relation, further comprising: and determining whether the characterization data of the real-time machining point quality detection of the laser machining points meet the normal standard in the laser machining process according to the pre-stored normal adjustment electric signals corresponding to each machining point of the laser machining standard component. In the embodiment of the application, when some workpieces are welded in batch in the laser processing process, whether the quality of the welding point processing point of the workpieces meets the qualified requirement of products needs to be detected in real time. According to the scheme, the optical radiation signals of the processing points at the same or similar parts of the batch of laser processing parts need to be detected in real time, and then the corresponding relation between the processing point quality value of the real-time laser processing points and the electric signals is established. The corresponding relation obtained in real time needs a standard reference table for comparison and judgment, for example, the corresponding relation between the quality value of the pre-stored standard machining point and the voltage needs to be determined, and then whether the quality value of the real-time machining point is abnormal or not is judged according to the voltage value obtained in real time. It is understood that the corresponding relationship between the machining point quality value of the pre-stored machining point and the voltage can be an envelope surface, that is, in the same laser machining path, the corresponding curve of the machining point quality value of the pre-stored machining point and the voltage formed by fitting a plurality of laser machining points can have an upper limit and a lower limit. And when the corresponding relation between the real-time laser processing point quality value and the processing path fitted by the electric signal meets the upper limit and the lower limit of the corresponding relation between the standard processing point quality value and the voltage, judging that the real-time laser processing point quality value meets the laser processing standard.

It is to be understood that the illustrated structure of the embodiment of the present invention does not constitute a specific limitation to the workpiece processing monitoring system. In other embodiments of the present application, the optical radiation signal detection module 8 may include more or fewer components than shown, or combine certain components, or split certain components, or a different arrangement of components. The illustrated components may be implemented in hardware, software, or a combination of software and hardware.

Laser process quality analysis system 12 may be a display device with a processor for displaying images, video, etc. The display device includes a display panel. The display panel may employ a Liquid Crystal Display (LCD), an organic light-emitting diode (OLED), or the like. In some embodiments, laser processing quality analysis system 12 may include 1 or N display screens, with N being a positive integer greater than 1.

The imaging module 20 may implement a shooting function through an ISP, a camera, a video codec, a GPU, a display screen, an application processor, and the like. The ISP is used for processing data fed back by the camera. For example, when a photo is taken, the shutter is opened, light is transmitted to the camera photosensitive element through the lens, the optical signal is converted into an electrical signal, and the camera photosensitive element transmits the electrical signal to the ISP for processing and converting into an image visible to naked eyes. The ISP can also carry out algorithm optimization on the noise, brightness and skin color of the image. The ISP can also optimize parameters such as exposure, color temperature and the like of a shooting scene.

The imaging module 20 is used to capture still images or video. The object generates an optical image through the lens and projects the optical image to the photosensitive element. The photosensitive element may be a Charge Coupled Device (CCD) or a complementary metal-oxide-semiconductor (CMOS) phototransistor. The light sensing element converts the optical signal into an electrical signal, which is then passed to the ISP where it is converted into a digital image signal. And the ISP outputs the digital image signal to the DSP for processing. The DSP converts the digital image signal into image signal in standard RGB, YUV and other formats.

The workpiece processing monitoring system can also comprise an external memory interface which is used for connecting an external storage card, such as a Micro SD card, and the storage capacity of the expansion equipment is realized. The external memory card communicates with the processor through the external memory interface to realize the data storage function. For example, files such as pictures, videos, and the like are saved in an external memory card.

The workpiece processing monitoring system may also include an internal memory for storing computer executable program code, the executable program code including instructions. The processor executes various functional applications of the device and data processing by executing instructions stored in the internal memory. The internal memory may include a program storage area and a data storage area. Wherein the storage program area may store an operating system, an application program required for at least one function, and the like. The storage data area may store data created during use of the device, and the like. In addition, the internal memory may include a high-speed random access memory, and may further include a nonvolatile memory, such as at least one of a magnetic disk storage device, a flash memory device, a universal flash memory (UFS), and the like.

The workpiece processing monitoring system can also comprise a detection alarm indicator, wherein the indicator can be an indicator lamp, can be used for indicating an abnormal state, and can also be used for indicating messages, notices and the like.

In the workpiece processing monitoring system, the laser processing quality analysis system 12 further includes application software. Through the content provider for storing and retrieving data and making it accessible to applications. The data may include video, images, audio, and the like. The view system includes visual controls such as controls to display text, controls to display pictures, and the like. The view system may be used to build applications. The display interface may be composed of one or more views. For example, a display interface including a notification icon may include a view displaying text and a view displaying a picture. The notification manager enables the application to display notification information in the status bar, can be used to convey notification-type messages, can disappear automatically after a short dwell, and does not require user interaction. Such as a notification manager used to inform download completion, message alerts, etc. The notification manager may also be a notification that appears in the form of a chart or scroll bar text at the top status bar of the system, such as a notification of a background running application, or a notification that appears on the screen in the form of a dialog window. For example, prompting text information in the status bar, sounding a prompt tone, vibrating the electronic device, flashing an indicator light, etc.

In order to enable the monitoring interface displayed by the laser processing quality analysis system 12 to reflect the processing quality in the laser processing process more accurately. Before the laser processing piece is produced, relevant parameters need to be continuously adjusted according to different production targets, so that the optimal process parameters of the production targets can be achieved.

In the laser processing process data analysis, after a large batch of laser processing pieces are repeatedly processed, corresponding multiple pieces of laser processing process detection data are left. For example, 1000 laser welding seams are provided, and generally 1000 welding seam welding process detection data are obtained correspondingly. When the data of the batch is analyzed to screen products with poor welding, characteristic clustering needs to be carried out according to the data of the batch, and qualified product data or non-qualified product data are marked out by clustering under the same characteristic by a reference threshold value.

For this purpose, the laser processing quality analysis system 12 determines the process defect type and the detection signal parameter characteristics of the process defect type related to the laser processing quality by pre-storing or importing the preset laser processing defect model. And further performing clustering/classification/point group and other mathematical analyses on the finished batch processing data according to the defect characteristics to obtain a data distinguishing characteristic value as a reference value of parameter characteristics for judging the quality of the detection signal in the processing process.

When the received radiation signals are photoelectrically converted into electric signals through the single-point photoelectric sensor, defects of a few different types may exist in actual laser processing, but because optical radiation intensity signals of processing points are similar, the single-point photoelectric sensor is low in identification precision of the laser processing defects of the different types, for example, when a cold joint defect occurs in the traditional laser processing, the radiation light intensity of a cold joint is similar to the light intensity of a qualified welding point, and the detection system cannot effectively identify the defect. To this end, referring to fig. 2, an embodiment of the present application provides a laser processing control method 200, including the following steps:

step 210: receiving an optical radiation signal from at least one processing point in a laser processing path, the optical radiation signal comprising: one or more of an infrared radiation signal, a visible radiation signal, a machining laser reflection signal; photoelectrically converting the received optical radiation signal into an electric signal by a single-point photoelectric sensor;

step 220: acquiring laser processing depth information of the at least one processing point through a coherent light imaging device, wherein the coherent light imaging device comprises an optical interferometer, and the laser processing depth information is obtained through the optical interferometer, and the relative processing depth of the at least one processing point relative to an optical reference surface is acquired through the optical interferometer;

step 230: determining an initial judgment condition of the quality of a processing point of the laser processing piece according to an electric signal obtained by the single-point photoelectric sensor and a pre-stored normal electric signal corresponding to the processing point of the laser processing standard piece; the normal electric signal is a value range of the electric signal which changes correspondingly in the qualified processing process of the processing point of the laser processing piece under a technological parameter;

step 240: and correcting the initial judgment condition of the quality of the processing point of the laser processing piece according to the laser processing depth information, and determining the quality statistics of the processing point of the laser processing piece.

It can be understood that, in step 230, the determining of the initial condition for determining the quality of the processing point of the laser processing member according to the electrical signal obtained by the single-point photoelectric sensor and the pre-stored normal electrical signal corresponding to the processing point of the laser processing standard member may be that, in the foregoing solution of the present application, the corresponding relationship between the quality value of the processing point of the standard processing point and the voltage is pre-stored, for example, an envelope, that is, in the same laser processing path, a corresponding curve between the quality value of the processing point of the standard processing point and the voltage formed by fitting a plurality of laser processing points may have an upper limit and a lower limit. And when the corresponding relation between the real-time laser processing point quality value and the processing path fitted by the electric signal meets the upper limit and the lower limit of the corresponding relation between the standard processing point quality value and the voltage, judging that the real-time laser processing point quality value meets the laser processing standard.

In the embodiment of the present application, when the quality initial determination condition satisfies the laser processing standard, the quality initial determination condition of the processing point of the laser processing member is modified according to the laser processing depth information, and the quality statistics of the processing point of the laser processing member is determined in step 240. The processing depth information is a quantitative value, and can be the depth information of the lowest point of the keyhole with higher precision, the depth information of the edge of the keyhole with lower precision or the depth information of the keyhole with high/low precision. And then this application embodiment can comparatively accurately reflect certain type laser beam machining defect. When the low-precision key hole depth information is corrected, the precision requirement of the optical coherent light imaging device is greatly reduced, and the requirement of high-speed detection in production during the existing industrial production is met. When the coherent light imaging device acquires the laser processing depth information of the at least one processing point, various detection auxiliary equipment and/or algorithms are needed for determining the bottom of the key hole, so that the complexity of the coherent light imaging device is directly influenced by the accuracy of the depth information of the bottom of the key hole effectively. In the embodiment of the application, the initial judgment condition of the quality of the processing point of the laser processing piece can be corrected by the keyhole depth information mixed with the keyhole lowest point depth information and the keyhole edge depth information, so that the complexity of a coherent light imaging device is reduced.

It can be understood that the initial determination condition of the quality of the machining point of the laser machining member is modified according to the laser machining depth information, the statistics of the quality of the machining point of the laser machining member is determined, and further data screening for determining that the quality value of the machining point of the real-time laser machining member in step 230 meets the laser machining standard can be performed. For example, a keyhole depth information reference range is further established, and whether laser processing defects and/or corresponding defect types occur or not is further determined by judging whether the keyhole depth information obtained by the coherent light imaging device meets the keyhole depth information reference range or not.

Further, in this embodiment of the application, in step 230, an initial condition for determining the quality of the processing point of the laser processing piece is determined according to the electrical signal obtained by the single-point photoelectric sensor and a pre-stored normal electrical signal corresponding to the processing point of the laser processing standard component; further comprising the steps of: according to the electric signal that single-point photoelectric sensor obtained and the normal electric signal that the laser processing standard component processing point that prestores corresponds, confirm the initial defect data kind that laser processing detected data corresponds, wherein the defect kind includes: one or more of a laser welding cold joint defect, a laser welding pinhole defect and a laser welding explosion point defect.

In the embodiment of the present application, in step 240, the initial determination condition of the quality of the processing point of the laser processing member is corrected according to the laser processing depth information, and the quality statistics of the processing point of the laser processing member is determined; further comprising the steps of: and judging the initial defect data type again according to the laser processing depth information, and determining the quality statistics of the processing points of the laser processing piece. It can be understood that the laser welding cold joint defect can scan the key hole in the machining process in real time through the coherent light imaging device, and then real-time key hole depth information is obtained. For the laser welding pinhole defect, the laser welding explosion point defect, etc., because the defect occurs after the keyhole is closed, the coherent light imaging device needs to be set with scanning delay or the measured value of the penetration within a period of time after real-time welding is taken to obtain the depth information. Further step 240: correcting the initial judgment condition of the quality of the processing point of the laser processing piece according to the laser processing depth information, determining the quality statistics of the processing point of the laser processing piece, and further comprising the following steps: and correcting the acquisition time of the depth information of the keyhole according to the preset defect type.

In one embodiment, in a double-layer lap welding setting of a laser welding combination of 0.2mmCu and 2.0mmCu, the chip penetration under a qualified process is 700 mu m, and qualified keyhole depth information is continuous penetration value feedback; when the cold joint defect occurs in the laser processing process, the depth information of the defect keyhole is in a discontinuous state, namely the feedback of the jump fusion depth value.

In one embodiment, in a double-layer lap welding setting of a laser welding combination of 0.2mmCu and 2.0mmCu, the chip penetration under a qualified process is 700 mu m, and qualified keyhole depth information is continuous penetration value feedback; when the welding surface explosion point or pinhole defect occurs in the laser processing process, a molten pool after the molten pool is closed generally forms a pit, and then the depth information of the defect fusion depth and the depth information of the qualified workpiece form a more obvious difference. Furthermore, the coherent light imaging device can obtain an obvious characteristic penetration value within a period of time after scanning delay setting or real-time welding.

Further, in this embodiment of the present application, in step 240, the initial determination condition of the quality of the processing point of the laser processing member is modified according to the laser processing depth information, so as to determine the quality statistics of the processing point of the laser processing member; further comprising the steps of:

step 241: determining a feedback control grade table according to the initial defect data type; the feedback control grade table is used for indicating laser processing parameter setting corresponding to a laser processing depth range under a certain defect type; it can be understood that when the melting depth range of the sliced piece is between 680 μm and 730 μm under the qualified process, the feedback control grade table is set at an interval of 50 μm according to the laser processing depth information, for example, one or more mixed parameter settings of parameters such as laser light output power, defocusing amount of a laser processing point, laser processing speed, processing laser type and the like at corresponding levels are respectively set at 630-680 μm,730-780 μm and the like.

Step 242: and setting feedback according to the laser processing parameters to adjust the laser processing process. The one or more mixed parameter settings corresponding to the grade table may be queried according to the laser processing depth information of the at least one processing point obtained by the coherent light imaging device, and the laser processing process may be feedback-adjusted according to the parameter settings.

The preset laser processing depth information and the corresponding feedback control grade table in the embodiment of the application can be preset in a system according to an empirical value, and can also be obtained on site according to the current scene of laser processing. The feedback control grade table is preset in the system, and when actual laser processing is carried out, the feedback control grade table is inquired to carry out real-time feedback control on the laser processing process, so that the requirement of self-adaptive intelligent high-efficiency control in laser industrial processing is met.

Referring to fig. 3, the present embodiment further provides a laser processing apparatus 300, which includes a single-point optical sensor 310, a coherent light imaging apparatus 320, and a processor 330. Wherein the single-point optical sensor 310 is configured to receive an optical radiation signal from at least one processing point in the laser processing path, the optical radiation signal including: one or more of an infrared radiation signal, a visible radiation signal, a machining laser reflection signal; and photoelectrically converting the received optical radiation signal into an electric signal by a single-point photoelectric sensor. The coherent light imaging device 320 is used for acquiring laser processing depth information of the at least one processing point, and the coherent light imaging device comprises an optical interferometer, and the laser processing depth information is used for acquiring the relative processing depth of the at least one processing point relative to the optical reference surface through the optical interferometer. The processor 330 is configured to determine an initial condition for determining the quality of the processing point of the laser processing piece according to the electrical signal obtained by the single-point photoelectric sensor and a pre-stored normal electrical signal corresponding to the processing point of the laser processing standard component; the normal electric signal is a value range of the electric signal which changes correspondingly in the qualified processing process of the processing point of the laser processing piece under a technological parameter; and correcting the initial judgment condition of the quality of the processing point of the laser processing piece according to the laser processing depth information obtained by the coherent light imaging device, and determining the quality statistics of the processing point of the laser processing piece.

In the embodiment of the present application, when the accuracy meeting the laser processing standard is not sufficient in the quality initial determination condition, the processor 330 corrects the quality initial determination condition of the processing point of the laser processing member according to the laser processing depth information, and determines the quality statistics of the processing point of the laser processing member. The processing depth information is a quantitative value, and can be the depth information of the lowest point of the keyhole with higher precision, the depth information of the edge of the keyhole with lower precision or the depth information of the keyhole with high/low precision. And then this application embodiment can comparatively accurately reflect certain type laser beam machining defect. When the low-precision key hole depth information is corrected, the precision requirement of the optical coherent light imaging device is greatly reduced, and the requirement of high-speed detection in production during the existing industrial production is met. When the coherent light imaging device acquires the laser processing depth information of the at least one processing point, various detection auxiliary equipment and/or algorithms are needed for determining the bottom of the key hole, so that the complexity of the coherent light imaging device is directly influenced by the accuracy of the depth information of the bottom of the key hole effectively. In the embodiment of the application, the initial judgment condition of the quality of the processing point of the laser processing piece can be corrected by the keyhole depth information mixed with the keyhole lowest point depth information and the keyhole edge depth information, so that the complexity of a coherent light imaging device is reduced.

Further, the embodiment of the present application provides a laser processing apparatus 300 further including a memory 340, and the processor 330 is further configured to determine an initial defect data type corresponding to laser processing detection data according to an electric signal obtained by the single-point photoelectric sensor and a normal electric signal corresponding to a laser processing standard component processing point prestored in the memory 340, where the defect type includes: one or more of a laser welding cold joint defect, a laser welding pinhole defect and a laser welding explosion point defect.

In an embodiment, the determining of the initial condition for determining the quality of the processing point of the laser processing piece according to the electric signal obtained by the single-point photoelectric sensor and the pre-stored normal electric signal corresponding to the processing point of the laser processing standard component may be: the corresponding relation between the quality value of the standard processing point and the voltage is prestored. For example, the curve of the quality value of the standard processing point and the voltage formed by fitting a plurality of laser processing points in the same laser processing path can have an upper limit and a lower limit. And when the corresponding relation between the real-time laser processing point quality value and the processing path fitted by the electric signal meets the upper limit and the lower limit of the corresponding relation between the standard processing point quality value and the voltage, judging that the real-time laser processing point quality value meets the laser processing standard.

In one embodiment, the processor 330 is further configured to re-determine the initial defect data type according to the laser processing depth information, and determine the processing point quality statistics of the laser processing member. Specifically, the laser welding cold joint defect can be used for scanning the key hole in the machining process in real time through the coherent light imaging device, and then real-time key hole depth information is obtained. For the laser welding pinhole defect, the laser welding explosion point defect, etc., because the defect occurs after the keyhole is closed, the coherent light imaging device needs to be set with scanning delay or the measured value of the penetration within a period of time after real-time welding is taken to obtain the depth information. Further step 240: correcting the initial judgment condition of the quality of the machining point of the laser machining piece according to the laser machining depth information, determining the quality statistics of the machining point of the laser machining piece, and further correcting the acquisition time of the depth information of the keyhole according to the preset defect type.

In one embodiment, the processor 330 determines the feedback control level table according to the initial defect data type; the feedback control grade table is stored in the memory 340 and used for indicating the laser processing parameter setting corresponding to the laser processing depth range under a certain defect type; the processor 330 adjusts the laser machining process based on the laser machining parameter settings feedback.

By combining the scheme of the present application, the preset laser processing depth information and the corresponding feedback control level table in the embodiment of the present application may be preset in the system according to an empirical value, or may be obtained on site according to a current scene of laser processing. The feedback control grade table is preset in the system, and when actual laser processing is carried out, the feedback control grade table is inquired to carry out real-time feedback control on the laser processing process, so that the requirement of self-adaptive intelligent high-efficiency control in laser industrial processing is met.

Referring to fig. 4, an embodiment of the present application further provides a laser processing system 400, including: the laser processing head 450, the single point optical sensor 410, the coherent light imaging device 420, and the processor 430. Wherein the laser machining head 450 is used for laser machining the laser machined part on the laser machining path according to the laser machining parameters. The single point optical sensor 410 is configured to receive an optical radiation signal from at least one processing point in the laser processing path, the optical radiation signal including: one or more of an infrared radiation signal, a visible radiation signal, a machining laser reflection signal; the received optical radiation signal is photoelectrically converted to an electrical signal by a single point photosensor 410. The coherent light imaging device 420 is used for acquiring laser processing depth information of at least one processing point, and the coherent light imaging device 420 comprises an optical interferometer, and the laser processing depth information is obtained by the optical interferometer through relative processing depth of the at least one processing point relative to an optical reference surface. The processor 430 is configured to determine an initial determination condition of the quality of the processing point of the laser processing piece according to the electrical signal obtained by the single-point photoelectric sensor 410 and a pre-stored normal electrical signal corresponding to the processing point of the laser processing standard component; the normal electric signal is a value range of the electric signal which changes correspondingly in the qualified processing process of the processing point of the laser processing piece under a technological parameter; and correcting the initial judgment condition of the quality of the processing point of the laser processing piece according to the laser processing depth information obtained by the coherent light imaging device 420, and determining the quality statistics of the processing point of the laser processing piece.

Optionally, the laser processing system 400 provided in this embodiment of the application further includes a memory 440, and the processor 430 determines an initial defect data type corresponding to the laser processing detection data according to the electric signal obtained by the single-point photoelectric sensor 410 and a normal electric signal corresponding to a processing point of a laser processing standard component prestored in the memory 440, where the defect type includes: one or more of a laser welding insufficient welding defect, a laser welding pinhole defect and a laser welding explosion point defect; and judging the initial defect data type again according to the laser processing depth information, and determining the quality statistics of the processing points of the laser processing piece. The processor 430 determines a feedback control level table according to the initial defect data type; the feedback control level table is stored in the memory 440 and is used to indicate the laser processing parameter settings corresponding to the laser processing depth range under a certain defect type. And the processor 430 adjusts the laser machining process according to the laser machining parameter setting feedback.

It can be understood that, in the laser processing system 400 provided in the present application, when the accuracy meeting the laser processing standard is not sufficient in the quality initial determination condition, the processor 430 corrects the laser processing member processing point quality initial determination condition according to the laser processing depth information, and determines the laser processing member processing point quality statistics. The processing depth information is a quantitative value, and can be the depth information of the lowest point of the keyhole with higher precision, the depth information of the edge of the keyhole with lower precision or the depth information of the keyhole with high/low precision. And then this application embodiment can comparatively accurately reflect certain type laser beam machining defect. When the low-precision key hole depth information is corrected, the precision requirement of the optical coherent light imaging device is greatly reduced, and the requirement of high-speed detection in production during the existing industrial production is met. When the coherent light imaging device acquires the laser processing depth information of the at least one processing point, various detection auxiliary equipment and/or algorithms are needed for determining the bottom of the key hole, so that the complexity of the coherent light imaging device is directly influenced by the accuracy of the depth information of the bottom of the key hole effectively. In the embodiment of the application, the initial judgment condition of the quality of the processing point of the laser processing piece can be corrected by the keyhole depth information mixed with the keyhole lowest point depth information and the keyhole edge depth information, so that the complexity of a coherent light imaging device is reduced. Further, the preset laser processing depth information and the corresponding feedback control grade table in the embodiment of the present application may be preset in the system according to an empirical value, or may be obtained on site according to a current scene of laser processing. The feedback control grade table is preset in the system, and when actual laser processing is carried out, the feedback control grade table is inquired to carry out real-time feedback control on the laser processing process, so that the requirement of self-adaptive intelligent high-efficiency control in laser industrial processing is met.

Those of ordinary skill in the art will appreciate that the various elements and algorithm steps described in connection with the embodiments disclosed herein can be implemented as electronic hardware, computer software, or combinations of electronic hardware. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the implementation. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present application.

It is clear to those skilled in the art that, for convenience and brevity of description, the specific working processes of the above-described systems, apparatuses and units may refer to the corresponding processes in the foregoing method embodiments, and are not described herein again.

In the several embodiments provided in the present application, any one of the functions, if implemented in the form of software functional units and sold or used as a stand-alone product, may be stored in a computer readable storage medium. Based on such understanding, the technical solution of the present application or portions thereof that substantially contribute to the prior art may be embodied in the form of a software product stored in a storage medium and including instructions for causing a computer device (which may be a personal computer, a server, or a network device) to execute all or part of the steps of the method according to the embodiments of the present application. And the aforementioned storage medium includes: a U disk, a removable hard disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk or an optical disk, and other various media capable of storing program codes.

The above description is only for the specific embodiments of the present application, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present disclosure, and all the changes or substitutions should be covered by the protection scope of the present application. The protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A laser processing control method is characterized by comprising the following steps:

2. The method according to claim 1, characterized in that the initial judgment condition of the quality of the processing point of the laser processing piece is determined according to the electric signal obtained by the single-point photoelectric sensor and the pre-stored normal electric signal corresponding to the processing point of the laser processing standard piece; further comprising the steps of:

3. The method according to claim 2, characterized in that the initial judgment condition of the quality of the processing point of the laser processing piece is corrected according to the information of the laser processing depth, and the quality statistics of the processing point of the laser processing piece is determined; further comprising the steps of: and judging the initial defect data type again according to the laser processing depth information, and determining the quality statistics of the processing points of the laser processing piece.

4. The method according to claim 2, characterized in that the initial judgment condition of the quality of the processing point of the laser processing piece is corrected according to the information of the laser processing depth, and the quality statistics of the processing point of the laser processing piece is determined; further comprising the steps of:

5. A laser processing device comprises a single-point optical sensor, a coherent light imaging device and a processor, and is characterized in that:

a single-point optical sensor for receiving an optical radiation signal from at least one processing point in a laser processing path, the optical radiation signal comprising: one or more of an infrared radiation signal, a visible radiation signal, a machining laser reflection signal; photoelectrically converting the received optical radiation signal into an electric signal by a single-point photoelectric sensor;

the coherent light imaging device is used for acquiring laser processing depth information of the at least one processing point, and comprises an optical interferometer, wherein the laser processing depth information is the relative processing depth of the at least one processing point relative to an optical reference surface acquired by the optical interferometer;

the processor is used for determining the initial judgment condition of the quality of the processing point of the laser processing piece according to the electric signal obtained by the single-point photoelectric sensor and the pre-stored normal electric signal corresponding to the processing point of the laser processing standard piece; the normal electric signal is a value range of the electric signal which changes correspondingly in the qualified processing process of the processing point of the laser processing piece under a technological parameter; and correcting the initial judgment condition of the quality of the processing point of the laser processing piece according to the laser processing depth information obtained by the coherent light imaging device, and determining the quality statistics of the processing point of the laser processing piece.

6. The apparatus of claim 5, further comprising a memory, wherein the processor is further configured to determine an initial defect data type corresponding to the laser processing inspection data according to the electrical signal obtained by the single-point photosensor and a normal electrical signal corresponding to the processing point of the laser processing standard stored in the memory, wherein the defect type includes: one or more of a laser welding cold joint defect, a laser welding pinhole defect and a laser welding explosion point defect.

7. The apparatus of claim 5, wherein the processor is further configured to re-determine the initial defect data type based on the laser processing depth information to determine the laser processing point quality statistics.

8. The apparatus of claim 5, further comprising a memory, the processor determining the table of feedback control levels based on an initial defect data type; the feedback control grade table is stored in a memory and used for indicating laser processing parameter setting corresponding to a laser processing depth range under a certain defect type; and the processor sets feedback according to the laser processing parameters to adjust the laser processing process.

9. A laser machining system, comprising: a laser processing head, a single-point optical sensor, a coherent light imaging device and a processor, which are characterized in that,

the laser processing head is used for carrying out laser processing on the laser processing piece according to the laser processing parameters on the laser processing path;

10. The system of claim 9, further comprising a memory, wherein the processor is further configured to determine an initial defect data type corresponding to the laser processing inspection data according to the electrical signal obtained by the single-point photosensor and a normal electrical signal corresponding to the processing point of the laser processing standard stored in the memory, wherein the defect type includes: one or more of a laser welding insufficient welding defect, a laser welding pinhole defect and a laser welding explosion point defect; judging the type of initial defect data again according to the laser processing depth information, and determining the quality statistics of the processing points of the laser processing piece; the processor determines a feedback control grade table according to the initial defect data type; the feedback control grade table is stored in a memory and used for indicating laser processing parameter setting corresponding to a laser processing depth range under a certain defect type; and the processor sets feedback according to the laser processing parameters to adjust the laser processing process.