CN1133507C - Coating method and device for flate-plate coated material - Google Patents
Coating method and device for flate-plate coated material Download PDFInfo
- Publication number
- CN1133507C CN1133507C CNB001217275A CN00121727A CN1133507C CN 1133507 C CN1133507 C CN 1133507C CN B001217275 A CNB001217275 A CN B001217275A CN 00121727 A CN00121727 A CN 00121727A CN 1133507 C CN1133507 C CN 1133507C
- Authority
- CN
- China
- Prior art keywords
- coated
- tabular
- coating
- mentioned
- electric conductivity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
- B05D5/12—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
- B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
- B05B13/04—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work the spray heads being moved during spraying operation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B5/00—Electrostatic spraying apparatus; Spraying apparatus with means for charging the spray electrically; Apparatus for spraying liquids or other fluent materials by other electric means
- B05B5/025—Discharge apparatus, e.g. electrostatic spray guns
- B05B5/03—Discharge apparatus, e.g. electrostatic spray guns characterised by the use of gas, e.g. electrostatically assisted pneumatic spraying
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/02—Processes for applying liquids or other fluent materials performed by spraying
- B05D1/04—Processes for applying liquids or other fluent materials performed by spraying involving the use of an electrostatic field
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/36—Successively applying liquids or other fluent materials, e.g. without intermediate treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
- B05D7/02—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to macromolecular substances, e.g. rubber
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Electrostatic Spraying Apparatus (AREA)
- Spray Control Apparatus (AREA)
Abstract
The present invention provides a coating method for flat-plate coated material and a coating apparatus thereof. The object is to provide a coating method of printed circuit board by which the manufactured products have excellent performance. The method comprises spraying and coating a conductivity imparting agent onto the surface and/or the rear surface, or the both sides of a plate-shaped material to be coated of the printed circuit board which is hung longitudinally and drooping to form an non-dried conductivity imparting film having a volume resistivity of 5x10<6> [Omega]*[cm] or below; and then electrostatically coating a liquid photoresist onto the coated surface or non-coated surface of the flat-plate coated material.
Description
Technical field
The present invention relates to the coating method of coating such as on coated of tabulars such as printed circuit board (PCB) coating resist.
Background technology
In the past, method as electrostatic coating coating is used on the non-conductive materials such as plastics, apply the electric conductivity primer of electric conductivity inserts such as containing conductive metal powder, graphite, conductive processing is carried out on the non-conductive material surface after, carried out the pre-treatment of electrostatic coating.Because raw material physical property difference and process badly etc. because of sagging makes the method have the high shortcoming of cost.
In addition, well-known, also have on non-conductive material, not to be coated with the electric conductivity primer, and use coating itself to have the method for electric conductivity.The method is because coating thickness is inhomogeneous, can form short circuit even average applied thickness in the thin place that also can occur more than the 30 μ m below the coating thickness 1 μ m, therefore is used on the resist of printed circuit board (PCB), so this method is inapplicable.
In addition, the requirement to pattern of wants precision (fine) circuit board in recent years increases, and if can guarantee thickness that approach, uniform, just can critically make the circuit board of thin thickness certainly, adopts the method for deposition and dependence precise treatment to help realizing thin plateization.
Applicant is opened the electrostatic coating apparatus that has proposed coating on coated of tabular in the flat 4-78459 communique the spy, the shortcoming of the coating method before having overcome.The shortcoming of coating method in the past is, method as coating such as the anti-weldering of coating erosion grade on coated of tabulars such as printed circuit board (PCB), method with serigraphy, air or vacuum (air-less) coating machine is moved back and forth, to transfer coated with conveyer on the one hand, apply (Fig. 9) simultaneously.
; on this applying device; when being coated with the such thin printed circuit board (PCB) of thickness of slab 0.2mm; normally used printed circuit board (PCB) is that the circuitous pattern that forms conduction such as copper at last branch such as the insulated substrate of glass epoxide etc. constitutes; therefore insulated part and current-carrying part mix on same substrate; during the electrostatic coating resist, Partial charge is accumulated on the substrate on such substrate.Therefore electrostatic coating must be provided with earth plate at substrate back, be coated with the substrate of hanging on the application suspension apparatus and will lean against on the earth plate, because of substrate tilts, cause the coated film uneven thickness sometimes, or coated substrate contacts with earth plate, poor quality's problems such as product occur.
In order to address these problems, consider to adopt the fixedly method that substrate is fixing such as suspension apparatus and lower fixture of top, but have these fixtures dirty the time to remove dirt, necessary cleaning device must be set, existence will especially increase the problem of optional equipment, wants automatic coating substrate that the direction size is different in length and breadth and problems such as cost height, maximization in addition in addition.
Summary of the invention
Therefore, the inventor etc. are in order to develop the electrostatic coating method of the liquid scolding tin resist of coating on coated of tabulars such as printed circuit board (PCB), carried out wholwe-hearted research, the solution method of all problems in the past consequently can be provided, Here it is coats specific electric conductivity imparting agent on coated, method with electrostatic coating applies liquid scolding tin resist then, and uses specific applying device.Finally finished the present invention.
Like this, the invention provides the coating method of coated of a kind of tabular, it is characterized by: at coated the surface of tabulars such as printed circuit board (PCB) or the back side of vertically suspention, perhaps the electric conductivity imparting agent is gone up in the two sides spraying, forms one deck specific insulation 5 * 10
6The following undried electric conductivity of Ω cm is given film, then the liquid resist of electrostatic coating on the applicator surface of coated of this tabular or uncoated face.
Above-mentioned electric conductivity imparting agent is preferably the volatility conductive solvent, or the resin dissolves that resist is used or be distributed in this solvent.
The best average out to 0.05～0.2mm of the slab-thickness that above-mentioned tabular is coated.
The air atomizing pressure of above-mentioned spraying is 0.03～0.3Mpa, and the figure atomizing pressure is to carry out low-pressure air atomizing coating under 0.05～0.3MPa condition.
It is 0.1～0.6Mpa that above-mentioned spraying is preferably in air atomizing pressure, and the figure atomizing pressure is under the condition of 0.2～0.6Mpa, carries out the air atomizing coating.
The invention provides a kind of applying device that uses when implementing above-mentioned coating method, it is characterized by, it comprises: the conveying device that the conveyance tabular is coated, this conveying device has the straight line portion that two segment length are L, the conveyance direction of these two sections straight line portioies is opposite, and parallel, the interval of 2R is arranged, and the pass of above-mentioned L and R is L 〉=2R; Inversion set, its accepts coated of the tabular sent here from one section straight line portion, coated counter-rotating of above-mentioned tabular, gives another section straight line portion again; Atomising device, its pivot center is positioned at the centre of the straight line portion of above-mentioned conveying device, and has the rotary atomization head that can stretch in vertical direction; Make above-mentioned rotary atomization head along the reciprocating supporting arrangement of above-mentioned pivot center; The electrostatic coating apparatus of the liquid resist of coating on coated of tabular; As the preceding step operation of above-mentioned electrostatic coating, the spraying of spraying electric conductivity imparting agent is applied and is put.
In addition, applying device provided by the invention constitutes with following form: in above-mentioned applying device, above-mentioned conveying device vertically suspention coated of tabular in opposite directions cloth become two row, and equidirectional conveyance; Above-mentioned spray equipment is configured at the surface or the back side of coated of above-mentioned tabular, perhaps two sides spraying electric conductivity imparting agent; Above-mentioned rotary atomization head makes liquid resist atomizing by rotation, on one side rotary atomization head is pumped, Yi Bian go up the liquid resist of electrostatic coating at coated relative face of this tabular (surface).
Adopt the present invention can be at the uniform resist of coating on coated of the very thin tabular of thickness of slab.
Description of drawings
Below in conjunction with accompanying drawing illustrated embodiment explanation the present invention, can find out feature of the present invention and effect, in the accompanying drawing:
Fig. 1 is the plane sketch of the used applying device of coated coating method of the tabular of the preferred embodiment of the present invention.
Fig. 2 is the partial sectional view of Fig. 1 device.
Fig. 3 is the plane sketch of the used applying device of coated coating method of the tabular of the preferred embodiment of the present invention.
Fig. 4 is the partial sectional view of Fig. 3 device.
Fig. 5 is the plane sketch of the used applying device of coated coating method of the tabular of the preferred embodiment of the present invention.
Fig. 6 is the partial sectional view of Fig. 5 device.
Fig. 7 is the plane sketch of the used applying device of coated coating method of the tabular of the preferred embodiment of the present invention.
Fig. 8 is the partial sectional view of Fig. 7 device.
Fig. 9 is the plane sketch of former applying device.
Figure 10 is the partial sectional view of Fig. 9 device.
The specific embodiment
The following describes the coating method of coated of tabular of the present invention and an embodiment of applying device thereof.
As coated of tabulars such as suitable printed circuit board (PCB) of the present invention, known printed circuit board (PCB) before using for example has through hole or/and the flat panel substrate of non-through hole, or does not have the substrate in these holes.Printed circuit board (PCB) wishes to use the substrate of thickness of slab 0.05mm～0.2mm before well-known.Have again, wish to use through hole or/and the flat panel substrate of non-through hole as this substrate.
Can enumerate a variety of as printed circuit board (PCB), for example on the substrate material surface of the plastic tab of glass-epoxy resin board with electrical insulating property etc., adhere to metal formings such as copper, aluminium, the method of perhaps utilizing vacuum evaporation is plated in substrate material surface with metals such as copper or electroconductive oxide of being representative with indium oxide-Xi (ITC) etc., form the compound conducting film at substrate material surface, have on the surface on the matrix material of electric conductivity, be provided with the position of through hole, for example with the substrate of copper coating at the inner formation of through hole conducting film; The substrate of the electroconductive circuit figure that on this substrate, forms with the method for taking a picture; On the substrate that forms conductive pattern such as metal, insulating resin layer is arranged, open non-through hole, comprising the substrate that forms conducting film on the insulating resin laminar surface of non-through hole inner face with copper coating etc. then with the method for Laser Processing or photograph; Use the substrate of the formation electroconductive circuit figures such as method of taking a picture on this substrate; Carry out the liquid resist of negative film photoresist, positive photoresist and the video picture of dry plate resist on this substrate and handle, form the printed circuit board (PCB) of electroconductive circuit pattern etc.
Use coating method of the present invention, by at the surface or the back side of printed circuit board (PCB), perhaps coating electrically conductive imparting agent in two sides can be removed the electric charge of accumulating on the printed circuit board (PCB), can use the liquid resist of electrostatic coating method coating then, on printed circuit board (PCB), form uniform resist layer.Apply the conducting film that this electric conductivity imparting agent forms, under the not drying regime before electrostatic coating, the specific insulation value of resist is 5 * 10
6Below the Ω cm, preferably 1 * 10
3Ω cm～2 * 10
3In the Ω cm scope.The value of specific insulation surpasses 5 * 10
6Ω cm then can not remove the electric charge of accumulating on the printed circuit board (PCB), can not form uniform resist with the coated liquid resist of electrostatic coating on printed circuit board (PCB) subsequently.The electric charge that is accumulated in addition in addition on the substrate can discharge, and makes the impaired shortcoming of circuitous pattern of copper.
In order to form above-mentioned not desciccator diaphragm state lower volume resistivity 5 * 10
6The conducting film that Ω cm is following as the electric conductivity imparting agent, for example can use the electric conductivity solvent separately, or previously used scolder with dissolving such as the resin of usefulness against corrosion or be dispersed in the electric conductivity solvent.
Such electric conductivity solvent dielectric constant will be more than 10, and preferably 12～35.In addition, wish it is volatile as this solvent, for example flat evaporator speed is below 0.2, preferably 0.003～0.2 organic solvent.Specifically can enumerate: for example, N-N-methyl-2-2-pyrrolidone N-, butyldiglycol, isophorone (3,5,5-trimethyl-2-cyclic ethylene-1-ketone), phenmethylol, D-sorbite, diacetone alcohol, diisobutyl ketone, dimethyl formamide etc.
Dielectric constant less than 10 and flat evaporator speed also can be used as required above other solvent of 0.2, specifically can enumerate, hydrocarbon solvent as water, dimethylbenzene, toluene etc., the ketone series solvent of MEK, methyl iso-butyl ketone (MIBK) etc., the ester series solvent of ethyl acetate, butyl acetate etc., the ether series solvents of ethylene glycol monomethyl ether, ethylene glycol monobutyl ether etc. etc. can one or more also be used.
The solid-state part of electric conductivity imparting agent should be 0～45%, is preferably 0～30%.Solid state component is bad above 45% words air atomizing.
It is that resin, acrylic resin, polyester based resin, alkyd are that resin, silicon are that resin, fluorine resin, vinylite, phenol resin, urethane are resin that above-mentioned resist can use epoxy with resin, and their two or more chemical combination or composite denatured resin.
Will be to printed circuit board (PCB) above-mentioned electric conductivity imparting agent spraying and applying, can be at air atomizing pressure 0.03～0.3MPa, and low-pressure air atomizing coating under the condition of figure atomizing pressure 0.05～0.3MPa.When so-called air atomizing pressure is meant spraying and applying for the required air pressure that atomizes.Carrying out under the situation of spraying and applying under the low pressure like this, atomised coating fully is coated onto on coated, wish that the flow of atomised coating wants big.The atomised coating flow of wishing is more than 200 liters/minute, and is best more than 250 liters/minute below 500 liters/minute, below 400 liters/minute.Spraying and applying air atomizing insufficient pressure 0.03MPa with this understanding, it is uneven that coating can take place, and existence can not be when electrostatic coating evenly be coated in shortcoming on the printed circuit board (PCB) to liquid resist.On the contrary, surpass 0.3MPa,, also have the problem that can not evenly spray because printed circuit board (PCB) rocks.
In addition, the not enough 0.05MPa of figure atomizing pressure, the part that can occur not being coated with on the contrary, surpasses 0.3MPa, and the shape instability of injection can produce the problem that can not evenly apply.When so-called figure atomizing pressure is meant spraying and applying, the necessary air pressure of figure that from nozzle, sprays when spraying in order to adjust.
Except with the method for above-mentioned electric conductivity imparting agent spraying and applying to the printed circuit board (PCB), can also be at air atomizing pressure 0.1～0.6MPa, and air atomizing coating under the condition of figure atomizing pressure 0.2～0.6MPa.Spraying and applying under such medium-pressure or high pressure, the flow of atomised coating lacks in the time of can applying than low-pressure fuel injection.In this case, the atomised coating flow of hope is more than 50 liters/minute, and is best more than 50 liters/minute below 200 liters/minute, below 100 liters/minute.Under such coating condition, air atomizing insufficient pressure 0.1MPa is because it is uneven coating to occur, existence can not evenly be coated to problem on the printed circuit board (PCB) to liquid resist, on the contrary, surpasses the words of 0.6MPa, because printed circuit board (PCB) rocks, also there is the shortcoming that can not evenly apply.
This spraying and applying for example, can use air spraying and applying machine and airless injection coating machine etc.
About the thickness of electric conductivity imparting agent, wet thickness is generally 2～20 μ m, is preferably 5～10 μ m.
The electric conductivity imparting agent is coated to coated the surface or the back side, perhaps after the two sides, carries out the electrostatic coating of liquid resist.This liquid resist is applied to coated surface that has been coated with the electric conductivity imparting agent or coated the back side that has been coated with the electric conductivity imparting agent, perhaps has been coated with coated the surface and the back side of electric conductivity imparting agent.The surface and the back side that electric conductivity during electrostatic coating is given film all are in undried state, and the specific insulation value of this liquid resist is 1 * 10
6Below the Ω cm.
The liquid resist that well-known electrostatic coating was used before liquid resist can use.The resin that uses as this liquid resist can use the resist resin of being put down in writing in the electric conductivity imparting agent and identical with it in essence resin.Use identical in essence resin, have good two-layer intermiscibility, mutual binding ability, anti-weldering erosion performance, video picture performance etc., wish the combination of these resins.
The electrostatic coating method can be used known electrostatic coating machine, for example, and electrostatic coating machines such as air atomizing coating machine, vacuum atomizing coating machine, electric atomizing coating machine.
The thickness of this liquid state resist, dry film thickness be 1～100 μ m normally, preferably 2～50 μ m.
The preferred implementing form of the applying device of the present invention that will implement above-mentioned coating method use is described below with reference to Fig. 1～Fig. 4.
This applying device is opened the electrostatic coating apparatus of recording and narrating in the flat 4-78459 communique that is used for coated of tabular the spy, have in the preceding step operation of this electrostatic coating above-mentioned electric conductivity imparting agent is sprayed on the surface or the back side of printed circuit board (PCB), the perhaps device on two sides.
That is to say that this applying device comprises: supporting arrangement 6, spray equipment 7 and the coating chamber shell 8 of the circulating conveying device 2 that the conveyance tabular is coated 1, inversion set 3, the atomising device 5 that has rotary atomization head 4 (Fig. 2 and Fig. 4), supporting atomising device 5.
Circulating conveying device 2 has two sections straight line portioies, and their conveyance direction is opposite, and parallel, is spaced apart 2R, and length is L, and above-mentioned L and R press the relation design of L 〉=2R.
Atomising device 5 is arranged on the downstream of spray equipment 7.The rotary atomization head 4 of atomising device 5, its rotation is positioned at the central authorities of the above-mentioned straight line portion of conveying device 2, and can stretch in vertical direction, the liquid resist of electrostatic coating on coated 1 of tabular.
Supporting arrangement 6 makes rotary atomization head 4 move back and forth along its rotation.
Except above-mentioned electric conductivity imparting agent being sprayed on the surface or the back side of printed circuit board (PCB), perhaps beyond the device on two sides, can use the identical device of recording and narrating with above-mentioned communique in this applying device, so omitted explanation to detailed device and action.
Above-mentioned applying device is owing to the device of the above-mentioned electric conductivity imparting agent of spraying in the operation that is equipped with before electrostatic coating, so even the thickness that applies on the thin printed circuit board (PCB) below the thickness of slab 0.2mm also is uniform.Do not have coated substrate to contact in addition yet and the problem of poor quality's product occurs with earth plate.
Other preferred implementation of apparatus of the present invention is described below with reference to Fig. 5～Fig. 8.
The apparatus and method of spraying electric conductivity imparting agent in this applying device, and the electrostatic coating apparatus of liquid resist and method can use device same as described above, and under same coating condition, apply.This applying device is to open in the filamentary material coating method of flat 6-339662 communique record the spy, equipped in the operation before the electrostatic coating of this rotary-atomizing device, at the printed circuit board surface or the back side, perhaps spray the device of above-mentioned electric conductivity imparting agent on the two sides.
This applying device comprises: conveying device 12, and with two row conveyance printed circuit board (PCB)s 11, substrate is relatively put and to equidirectional conveyance; Atomising device 14 with rotary atomization head 13 (Fig. 6 and Fig. 8); The supporting arrangement 15 of supporting atomising device 14; Spray equipment 16; Coating chamber shell 17.
In this coating method, except above-mentioned electric conductivity imparting agent is sprayed on the printed circuit board surface or the back side, perhaps beyond the device on two sides, can use the same device of recording and narrating with above-mentioned communique, so omitted explanation to detailed device and action.
This spray equipment 16 can spray electric conductivity imparting agent (Fig. 5) in printed circuit board surface, perhaps in printed circuit board (PCB) back side spraying (Fig. 7).
Behind printed circuit board (PCB) 11 surface spraying electric conductivity imparting agents, give on the film surface with atomising device 14 coating liquid resists (Fig. 5) in this electric conductivity.Behind printed circuit board (PCB) back side spraying electric conductivity imparting agent, go up with atomising device 14 coating liquid resists (Fig. 7) at the uncoated face (surface) (it is the back side that electric conductivity is given film) of printed circuit board (PCB).This spray equipment 16 is as Fig. 6 and shown in Figure 8 moving up and down.
The foregoing description is not to limit content of the present invention, and in the invention scope that the claim scope is recorded and narrated, the present invention has the possibility of various variations.
Reference numeral illustrates coated 12 conveying devices of coated 2 conveying devices of 1 tabular 3 inversion sets 4 rotary atomization heads 5 atomising devices, 6 supporting arrangements, 7 spray equipments, 8 coating chamber shells, 11 tabulars 13 rotary atomization heads 14 atomising devices 15 supporting arrangements 16 spray equipments 17 coating chamber shells
Claims (9)
1. the coating method of coated of tabular is characterized by, at the surface or the back side of coated of the tabular of vertically suspention, and perhaps two sides spraying electric conductivity imparting agent, forming specific insulation is 5 * 10
6The following undried electric conductivity of Ω cm is given film, then the liquid resist of electrostatic coating on the applicator surface of coated of this tabular or uncoated face.
2. coating method as claimed in claim 1 is characterized by, and the electric conductivity imparting agent is volatile conductive solvent, or the resin dissolves that resist is used or be dispersed in this solvent.
3. coating method as claimed in claim 1 is characterized by, slab-thickness average out to 0.05～0.2mm that tabular is coated.
4. coating method as claimed in claim 2 is characterized by, slab-thickness average out to 0.05～0.2mm that tabular is coated.
5. as the described coating method of one of claim 1～4, it is characterized by, is 0.03～0.3MPa at air atomizing pressure during spraying, and the figure atomizing pressure is to carry out low-pressure air atomizing coating under the condition of 0.05～0.3MPa.
6. as the described coating method of one of claim 1～4, it is characterized by, is 0.1～0.6MPa at air atomizing pressure during spraying, and the figure atomizing pressure is to carry out the air atomizing coating under the condition of 0.2～0.6MPa.
7. the applying device of implementing one of claim 1～6 described coating method and using is characterized by, and this device comprises:
The conveying device that the conveyance tabular is coated, this conveying device have two sections straight line portioies, and their conveyance directions are opposite, and parallel, are spaced apart 2R, and length is L, and the pass of L and R is L 〉=2R;
Inversion set, this inversion set are accepted coated of the tabular sent here from a straight line portion, with coated counter-rotating of above-mentioned tabular, deliver to another straight line portion again;
Spray equipment, spraying electric conductivity imparting agent on coated of the tabular that above-mentioned conveying device is sent here;
Atomising device, this atomising device is configured in the downstream of above-mentioned spray equipment, its rotation is positioned at the central authorities of the straight line portion of above-mentioned conveying device, and extends in vertical direction, and has and be used for the rotary atomization head of on coated of the above-mentioned tabular liquid resist of electrostatic coating;
Make above-mentioned rotary atomization head along the reciprocating supporting arrangement of above-mentioned rotation.
8. applying device as claimed in claim 7 is characterized by,
Above-mentioned conveying device is divided into two row to coated of the tabular of vertically suspention, and coated of this tabular is put relatively, and equidirectional conveyance;
Above-mentioned spray equipment is configured at coated the surface of above-mentioned tabular or the back side, perhaps two sides spraying electric conductivity imparting agent;
Above-mentioned rotary atomization head makes liquid resist atomizing by rotation, and rotary-atomizing is pumped in front, and the limit is at the liquid resist of coated relative face of this tabular (surface) difference electrostatic coating.
9. as claim 7 or 8 described applying devices, it is characterized by, above-mentioned spray equipment is designed to and can moves up at upper and lower.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1999/205593 | 1999-07-21 | ||
| JP11205593A JP2001029869A (en) | 1999-07-21 | 1999-07-21 | Method for coating plate-shaped material to be coated |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1281754A CN1281754A (en) | 2001-01-31 |
| CN1133507C true CN1133507C (en) | 2004-01-07 |
Family
ID=16509460
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB001217275A Expired - Fee Related CN1133507C (en) | 1999-07-21 | 2000-07-21 | Coating method and device for flate-plate coated material |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2001029869A (en) |
| KR (1) | KR100487116B1 (en) |
| CN (1) | CN1133507C (en) |
| TW (1) | TW503679B (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100733843B1 (en) * | 2006-04-03 | 2007-07-03 | 현대페인트공업 주식회사 | Powder coating method of mdf substrate |
| KR20070116704A (en) * | 2006-06-06 | 2007-12-11 | 아스리트 에프에이 가부시키가이샤 | System for coating resin |
| JP4832963B2 (en) * | 2006-06-06 | 2011-12-07 | アスリートＦａ株式会社 | Resin coating system |
| CN102294319A (en) * | 2011-07-28 | 2011-12-28 | 蔡国华 | Method for coating polyether-ether-ketone powder at surface of metal workpiece by adopting air fog method |
| CN104438000B (en) * | 2013-09-23 | 2017-11-07 | 深圳崇达多层线路板有限公司 | The spraying method and its device of electrostatic spraying wiring board |
| WO2019202701A1 (en) * | 2018-04-19 | 2019-10-24 | 本田技研工業株式会社 | Electrostatic coating device for resin molded articles and electrostatic coating method for resin molded articles |
| TWI696412B (en) * | 2019-02-27 | 2020-06-11 | 群翊工業股份有限公司 | Equipment for spraying substrate and method of spraying substrate |
| CN116056805B (en) * | 2020-08-21 | 2024-05-10 | Ａｇｃ株式会社 | Substrate with coating film, method for forming coating film, and method for producing substrate with coating film |
| CN112888191B (en) * | 2021-01-11 | 2022-02-11 | 深圳市卡迪森机器人有限公司 | Multi-section strong-static circuit board ink coating method, device and product |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5091285A (en) * | 1989-04-28 | 1992-02-25 | Fujitsu Limited | Method of forming pattern by using an electroconductive composition |
| JPH04225353A (en) * | 1990-12-27 | 1992-08-14 | Dainippon Printing Co Ltd | Production of photomask with phase shift layer |
| JP3003657B2 (en) * | 1997-12-24 | 2000-01-31 | 日本電気株式会社 | Method for manufacturing semiconductor device |
| JPH11312860A (en) * | 1998-04-27 | 1999-11-09 | Jsr Corp | Manufacture of electrode and transfer film |
-
1999
- 1999-07-21 JP JP11205593A patent/JP2001029869A/en active Pending
-
2000
- 2000-07-20 TW TW089114545A patent/TW503679B/en not_active IP Right Cessation
- 2000-07-21 CN CNB001217275A patent/CN1133507C/en not_active Expired - Fee Related
- 2000-07-21 KR KR10-2000-0042027A patent/KR100487116B1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| CN1281754A (en) | 2001-01-31 |
| TW503679B (en) | 2002-09-21 |
| KR20010049840A (en) | 2001-06-15 |
| JP2001029869A (en) | 2001-02-06 |
| KR100487116B1 (en) | 2005-05-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1133507C (en) | Coating method and device for flate-plate coated material | |
| US6912113B2 (en) | Thin film capacitor using conductive polymers | |
| US20090285976A1 (en) | Method for producing electrically conductive surfaces on a support | |
| EP2139007B1 (en) | Conductive ink for letterpress reverse printing | |
| CN106230306A (en) | A kind of flexible generating thin film and preparation method thereof | |
| CN104520113B (en) | Intaglio offset method, intaglio offset device and intaglio plate | |
| US20090321123A1 (en) | Method for producing structured electrically conductive surfaces | |
| CN1208782C (en) | Aqueous carbon composition and method for coating a non conductive substrate | |
| CN1805653A (en) | Printed circuit board and manufacturing method thereof | |
| TWI707928B (en) | Laminates, printed wiring boards, flexible printed wiring boards and molded products using them | |
| CN1032447A (en) | The plastic static coating is with conductive agent and have the plastic molded product of electrostatic coating | |
| JP4208203B2 (en) | Display device substrate manufacturing method and display device substrate | |
| CN1383705A (en) | Carrier-field copper foil circuit, printed circuit board mfg. method using circuit, and printed circuit board | |
| CN1183625C (en) | Tubular circuit connector | |
| US20040175503A1 (en) | Method for producing thin homogenenous layers with the help of screen printing technology, device for carrying out said method and the use thereof | |
| TWI726222B (en) | Laminates, printed wiring boards using them, flexible printed wiring boards and molded products | |
| CN1717154A (en) | Shield wire | |
| NO315279B1 (en) | Method of Metallization of Nonconductive Substrates | |
| CN1093892C (en) | Unconducting surface electroplating | |
| CN1838863A (en) | Method of manufacturing substrate for display device and substrate for display device | |
| JP7204195B2 (en) | Plating primer and laminate using the same | |
| US20060022174A1 (en) | Electroactive chemical composition and method of coating | |
| JP7044203B2 (en) | Laminates, molded products, printed wiring boards and electromagnetic wave shields | |
| EP4234758A1 (en) | Method for manufacturing conductive pattern-provided structure | |
| KR100282113B1 (en) | Printed Circuit Board Manufacturing Method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |