CN113347803A

CN113347803A - PCB anti-oxidation treatment method

Info

Publication number: CN113347803A
Application number: CN202110622640.6A
Authority: CN
Inventors: 彭坤
Original assignee: Wuhan Boweijia Electromechanical Engineering Co ltd
Current assignee: Wuhan Boweijia Electromechanical Engineering Co ltd
Priority date: 2021-06-04
Filing date: 2021-06-04
Publication date: 2021-09-03

Abstract

The invention relates to an anti-oxidation treatment method of a PCB (printed circuit board), in particular to a hot air leveling treatment device of the PCB, which comprises a conveying table for conveying the PCB, a plurality of hot air leveling devices which are arranged on the conveying table and are uniformly distributed along the conveying direction, and an air direction adjusting mechanism which is assembled among the hot air leveling devices; the device provided by the invention solves the problems of obtaining hot air flow with stable temperature and a hot air source with uniform distribution in the hot air leveling processing process of the anti-oxidation treatment of the PCB to a certain extent, and ensures the quality of the hot air leveling of the PCB.

Description

PCB anti-oxidation treatment method

Technical Field

The invention relates to the technical field of PCB production and manufacturing, and particularly provides an anti-oxidation treatment method for a PCB.

Background

In the processing and manufacturing process of the PCB, carrying out anti-oxidation treatment is an indispensable processing process link; the tin spraying process is a common and effective treatment process in the anti-oxidation processing process of the PCB, and the tin spraying refers to spraying a layer of soldering tin on the exposed copper surface which is not covered with solder resist oil so as to protect the copper surface from corrosion and oxidation and ensure good welding performance.

In the tin spraying process, the PCB material plate which is coated with the soldering tin needs to be subjected to hot air leveling treatment to remove redundant soldering tin materials on the surface and in the hole, so that a layer of uniformly attached soldering tin is obtained. In the existing hot air leveling process, vertical conveying is generally adopted for the double-sided material plates to carry out hot air leveling, a horizontal conveying mode can be adopted for the single-sided material plates to carry out hot air leveling, the process of hot air leveling is simple, but in the prior art, if a good and qualified PCB is leveled out by hot air, a lot of process conditions need to be mastered, for example, hot air flow with stable temperature and hot air sources with uniform distribution need to be provided, and poor control of the process conditions will finally influence the hot air leveling quality of the PCB.

Based on the problems, the invention provides an anti-oxidation treatment method for a PCB, and particularly relates to a hot air leveling treatment device for the PCB.

Disclosure of Invention

In order to solve the above problems, the present invention provides an antioxidant treatment method for a PCB, which is used to solve the above problems in the background art.

In order to achieve the purpose, the invention adopts the following technical scheme to realize the purpose: an anti-oxidation treatment method for a PCB comprises the following steps:

s1, carrying out microetching pretreatment processing on the exposed copper surface of the PCB plate which is not covered with the solder resist oil, and carrying out air drying after the microetching;

s2, preheating the PCB plate subjected to the microetching and air drying in the step S1;

s3, after preheating in the step S2, rosin coating and soldering tin coating are sequentially completed on the exposed copper surface which is not covered with the solder resist oil on the PCB plate;

s4, hot air leveling treatment is carried out on the soldering tin layer obtained in the step S3 through a PCB hot air leveling treatment device;

s5, after the hot air leveling treatment in the step S4 is completed, the tin material layer is solidified and shaped through air cooling, and the PCB material plate is washed and air-dried after air cooling;

the PCB anti-oxidation treatment method adopting the steps S1-S5 is adopted to carry out anti-oxidation treatment on the PCB, and the PCB hot air leveling treatment device further specifically comprises a conveying table for conveying the PCB, a plurality of hot air leveling devices which are arranged on the conveying table and uniformly distributed along the conveying direction, and an air direction adjusting mechanism which is assembled among the hot air leveling devices; wherein:

the hot air leveling device comprises two rotary support frames fixedly arranged on the conveying table, an outer wind barrel assembly horizontally and rotatably arranged between the two rotary support frames and an inner wind barrel assembly horizontally and rotatably arranged on the outer wind barrel assembly;

the outer air duct assembly comprises an outer drum body, four windows are uniformly formed in the circumference of the drum wall of the outer drum body, and an electric heating plate is correspondingly and hermetically mounted at each window position on the drum wall of the outer drum body; an air outlet nozzle for discharging hot air from the outer cylinder body is arranged between two adjacent electric heating plates on the outer cylinder body;

the inner air duct assembly comprises an inner tube body coaxially arranged in the outer tube body, a plurality of air ports are uniformly distributed on the inner tube body around the circumference of the central shaft, and a control assembly for controlling the opening and closing of the air ports is assembled at each air port position on the inner tube body; the inner wind barrel assembly further comprises a plurality of fins which are uniformly distributed in the circumferential direction and surround the periphery of the inner barrel body.

Preferably, the control assembly comprises two tuyere bars and a plurality of groups of springs; the two tuyere bars are hinged in the tuyere, the axial direction of a hinged shaft of the tuyere bars is parallel to the central shaft of the inner barrel, and a plurality of groups of springs are uniformly distributed at the tuyere along the axial direction of the inner barrel; each group of the springs comprises two springs which are connected between the two air inlet laths and the air inlet side wall in a one-to-one correspondence mode, and the two air inlet laths are in a contact closed state.

Preferably, the outer wind barrel assembly further comprises rotary ends fixed at two ends of the outer barrel body, the rotary ends are cylindrical, and the outer wind barrel assembly is horizontally rotatably installed between the two rotary support frames through the two rotary ends.

Preferably, the wind direction adjusting mechanism comprises an adjusting motor fixedly mounted on the conveying table, an adjusting driving shaft fixedly connected to the output end of the adjusting motor and a plurality of worm gear rings equal to the hot air leveling devices in number; the adjusting driving shaft is horizontally and rotatably arranged on all the rotating supporting frames which are positioned on the same side in the hot air leveling devices, the plurality of worm wheel rims are fixedly arranged on the plurality of rotating ends which are positioned on the same side of the adjusting driving shaft in the hot air leveling devices in a one-to-one correspondence mode, and the adjusting driving shaft is provided with a plurality of worms which are meshed with the plurality of worm wheel rims in a one-to-one correspondence mode.

Preferably, the rotating end heads positioned at the two ends of the outer cylinder body are internally provided with a rotating supporting disc; the inner wind barrel assembly also comprises a first rotating shaft end and a second rotating shaft end which are coaxially arranged and fixedly connected with the two ends of the inner barrel body; the first rotating shaft end and the second rotating shaft end are rotatably arranged on the two rotary supporting discs in a one-to-one correspondence manner; the first rotating shaft end and the connecting end of the inner barrel body and the second rotating shaft end and the connecting end of the inner barrel body are discs, the diameters of the discs are larger than the outer diameter of the inner barrel body, and the fins are fixedly connected between the two discs.

Preferably, the rotating shaft part of the first rotating shaft end is of a circular tube structure communicated with one end of the inner barrel, and the rotating shaft part of the second rotating shaft end is of a solid cylindrical structure for plugging the other end of the inner barrel.

Preferably, the air outlet nozzle extends to the position between the two rotary ends along the two axial sides of the outer cylinder, and a section air duct perpendicular to the axial direction of the outer cylinder on the air outlet nozzle is of a closing structure.

Preferably, the outer surface of the tuyere strip is coated with a rubber layer.

The technical scheme has the following advantages or beneficial effects:

1. the invention provides an anti-oxidation treatment method for a PCB (printed circuit board), and particularly relates to a hot air leveling treatment device for the PCB.

2. The invention provides an anti-oxidation treatment method for a PCB (printed circuit board), in particular to a hot air leveling treatment device for the PCB, which mainly comprises an outer air barrel assembly and an inner air barrel assembly, wherein a plurality of control assemblies are uniformly distributed in the inner air barrel assembly in the circumferential direction, so that introduced pressurized air flow can be distributed and uniformly discharged in the whole horizontal shaft, and a hot air source uniformly distributed in the horizontal direction can be finally obtained, so that the uniformity of the thickness of a soldering tin layer after hot air leveling is ensured, four electric heating plates are distributed in the outer air barrel assembly in the circumferential direction, the electric heating plates can realize intelligent temperature control on one hand, and can form a heating space concentrated from the circumference to the center on the other hand, the discharged pressurized air flow can be separated by fins, so that the pressurized air flow can be rapidly heated to form hot air by increasing the contact area on the one hand, and on the other hand, the separation of the fins and the rotary conveying of the whole inner air barrel assembly are realized, therefore, stable air flow can be continuously conveyed to the air outlet nozzle, the heating channel of the whole hot air flow is short, and the hot air flow with stable temperature is easy to control and form.

3. The invention provides an anti-oxidation treatment method for a PCB (printed circuit board), and particularly relates to a hot air leveling treatment device for the PCB.

Drawings

The invention and its features, aspects and advantages will become more apparent from reading the following detailed description of non-limiting embodiments with reference to the accompanying drawings. The drawings, in which like numerals refer to like parts throughout the several views and which are not necessarily drawn to scale, emphasis instead being placed upon illustrating the principles of the invention.

FIG. 1 is a flow chart of a PCB board antioxidant treatment method provided by the invention;

FIG. 2 is a schematic perspective view of a hot air leveling device for PCB boards according to the present invention at a first viewing angle;

FIG. 3 is a schematic perspective view of a hot air leveling device for PCB boards according to the present invention at a second viewing angle;

FIG. 4 is a schematic perspective view of a hot air leveling device in partial cross-sectional configuration;

FIG. 5 is an enlarged partial schematic view at A of FIG. 4;

FIG. 6 is a top view of the hot air flattening apparatus;

FIG. 7 is a cross-sectional view B-B of FIG. 6;

fig. 8 is a cross-sectional view of C-C in fig. 6.

In the figure: 1. a conveying table; 2. a hot air leveling device; 21. rotating the support frame; 22. an outer barrel assembly; 221. an outer cylinder; 2211. a window; 2212. an air outlet nozzle; 222. rotating the end head; 223. a rotating support disc; 224. an electric hot plate; 23. an inner barrel assembly; 231. an inner cylinder; 2311. a tuyere; 232. a control component; 2321. a tuyere stock; 2322. a spring; 233. a first rotating shaft end; 234. a second rotating shaft end; 235. and a fin. 3. A wind direction adjusting mechanism; 31. adjusting the motor; 32. adjusting the drive shaft; 321. a worm; 33. a worm wheel ring.

Detailed Description

The following detailed description of the embodiments of the present invention will be given with reference to the accompanying drawings for the purpose of providing those skilled in the art with a more complete, accurate and thorough understanding of the concept and technical solution of the present invention, and to facilitate the implementation thereof, but not to limit the present invention.

Referring to the attached drawings 1-8, the anti-oxidation treatment method of the PCB specifically comprises the following steps:

the PCB anti-oxidation treatment method adopting the steps S1-S5 is adopted to carry out anti-oxidation treatment on the PCB, and the PCB hot air leveling treatment device further specifically comprises a conveying table 1 for conveying the PCB, a plurality of hot air leveling devices 2 which are arranged on the conveying table 1 and are uniformly distributed along the conveying direction, and an air direction adjusting mechanism 3 which is assembled among the hot air leveling devices 2;

as can be seen from fig. 2 and 3, in the present embodiment, a row of conveying rollers for conveying the PCB board is provided on the conveying table 1.

The wind direction adjusting mechanism 3 comprises an adjusting motor 31 fixedly arranged on the conveying platform 1 through bolts, an adjusting driving shaft 32 fixedly connected to the output end of the adjusting motor 31 and four worm wheel rims 33; the adjusting driving shaft 32 is horizontally and rotatably arranged on all the rotating support frames 21 which are positioned on the same side in the four hot air leveling devices 2, the four worm wheel rims 33 are fixedly arranged on four rotating end heads 222 which are positioned on the same side of the adjusting driving shaft 32 in the four hot air leveling devices 2 in a one-to-one correspondence manner, and the adjusting driving shaft 32 is provided with four worms 321 which are correspondingly meshed with the four worm wheel rims 33 in a one-to-one correspondence manner.

The integral structure formed by the outer wind barrel assembly 22 and the inner wind barrel assembly 23 is rotatably installed between the two rotary supporting frames 21, and it should be noted that the directions of the four air outlets 2212 in the four hot air leveling devices 2 arranged in the conveying direction of the conveying table 1 are kept consistent; before hot air leveling processing, the four hot air leveling devices 2 can be synchronously adjusted through the wind direction adjusting mechanism 3 according to actual needs, so that the wind directions of the four air outlets 2212 are synchronously adjusted, and the thickness of the leveled soldering tin coating is controlled through the obtained different wind directions; specifically, the adjusting motor 31 is started to drive the adjusting driving shaft 32 to rotate, the four worms 321 synchronously drive the four worm wheel rims 33 in a one-to-one correspondence manner, and the four overall structures are synchronously driven to rotate, so that the wind directions of the four air outlets 2212 can be synchronously adjusted through rotation (the wind directions are certainly deviated downwards from a large direction), and the whole adjusting process can be completed in advance according to actual processing requirements; in addition, the adjusting motor 31 is a power-off self-locking motor, so after the adjustment is completed, the wind directions of the air outlets 2212 in the four hot air leveling devices 2 are all kept unchanged.

The hot air leveling device 2 comprises two rotary support frames 21 fixedly arranged on the conveying table 1 through bolts, an outer air barrel assembly 22 horizontally and rotatably arranged between the two rotary support frames 21, and an inner air barrel assembly 23 horizontally and rotatably arranged on the outer air barrel assembly 22;

the outer wind barrel assembly 22 comprises an outer barrel 221, four windows 2211 are uniformly arranged on the circumference of the barrel wall of the outer barrel 221, an electric heating plate 224 is correspondingly and hermetically installed at each window 2211 on the barrel wall of the outer barrel 221, the heat dissipation end of the electric heating plate 224 dissipates heat into the outer barrel 221 through the window 2211, and the electric heating plate 224 can be electrically connected with the existing intelligent temperature control system, so that the electric heating plate 224 can be well controlled to obtain stable temperature parameters in the actual hot air leveling process; an air outlet 2212 for discharging hot air from the outer cylinder 221 is arranged between two adjacent electric heating plates 224 on the outer cylinder 221, the air outlet 2212 extends to a position between two rotating end heads 222 along two axial sides of the outer cylinder 221, a section air duct perpendicular to the axial direction of the outer cylinder 221 on the air outlet 2212 is of a closing structure, hot air can be obtained through the closing structure, then the air outlet 2311 on the air outlet 2212 is of a flat opening structure in a horizontal state, and hot air flow discharged horizontally can be obtained; the outer wind barrel assembly 22 further comprises rotary end heads 222 welded at two ends of the outer barrel 221, the rotary end heads 222 are cylindrical, and the outer wind barrel assembly 22 is horizontally and rotatably installed between the two rotary support frames 21 through the two rotary end heads 222; rotary supporting discs 223 are arranged in the rotary end heads 222 positioned at the two ends of the outer cylinder body 221; by installing four electric heating plates 224 in the circumferential direction of the outer cylinder 221, a heating cavity with a central axis concentrated in the circumferential direction can be formed in the inner cavity of the outer cylinder 221, and the heat source is uniformly distributed.

The inner wind barrel assembly 23 comprises an inner barrel 231 coaxially arranged in the outer barrel 221, three wind ports 2311 are uniformly distributed on the inner barrel 231 around the circumference of a central shaft, and a control assembly 232 for controlling the opening and closing of the wind ports 2311 is assembled at the position of each wind port 2311 on the inner barrel 231; the inner barrel assembly 23 further comprises a plurality of circumferentially evenly distributed fins 235 disposed around the periphery of the inner barrel 231; the control assembly 232 comprises two tuyere bars 2321 and a plurality of groups of springs 2322; the two tuyere bars 2321 are hinged in the tuyere 2311, the axial direction of the hinged shaft of the tuyere bars 2321 is parallel to the central axis of the inner cylinder 231, and a plurality of groups of springs 2322 are uniformly distributed along the axial direction of the inner cylinder 231 at the position of the tuyere 2311; each group of springs 2322 comprises two springs 2322, the two springs 2322 are connected between the two tuyere laths 2321 and the side wall of the tuyere 2311 in a one-to-one correspondence manner, the two tuyere laths 2321 are in a contact closed state, and the outer surfaces of the tuyere laths are coated with rubber layers (when the tuyere laths are in the contact closed state, effective closure can be ensured through direct contact of the rubber layers, it needs to be noted that a gap between the hinged position of the tuyere laths 2321 in the tuyere 2311 and the tuyere 2311 is very small, and the airflow circulation at the gap position is negligible); the inner wind barrel assembly 23 further comprises a first rotating shaft end 233 and a second rotating shaft end 234 which are coaxially arranged and welded at two ends of the inner barrel 231; the first rotating shaft end 233 and the second rotating shaft end 234 are rotatably mounted on the two rotary supporting discs 223 in a one-to-one correspondence manner; the rotating shaft part of the first rotating shaft end 233 is of a circular tube structure communicated with one end of the inner cylinder 231, and the rotating shaft part of the second rotating shaft end 234 is of a solid cylindrical structure for plugging the other end of the inner cylinder 231; the connecting end of the first rotating shaft end 233 and the inner cylinder 231 and the connecting end of the second rotating shaft end 234 and the inner cylinder 231 are disks with diameters larger than the outer diameter of the inner cylinder 231, and the plurality of fins 235 are fixedly connected between the two disks. The first rotating shaft end 233 and the second rotating shaft end 234 connected to both ends of the inner cylinder 231 make one end of the inner cylinder 231 open and the other end closed; wherein, the first rotary end 233 is connected to a pipeline for introducing pressurized air through a rotary joint, and the second rotary end 222 is fixedly connected to an output shaft of a motor for rotary output, and in the drawings, the pipeline and the motor for rotary output are not shown; during the actual hot air leveling, the pressurized air flow is continuously introduced at the first rotating shaft end 233, and the rotating output motor drives the entire inner wind barrel assembly 23 to horizontally rotate between the two rotating support discs 223 while introducing the air flow.

When the PCB panel after the soldering tin coating is performed with the hot air leveling, the electric heating plates 224 in the four hot air leveling devices 2 are firstly turned on to make the electric heating plates 224 reach a predetermined temperature, and the outer cylinder 221 is synchronously preheated to make the fins 235 finally reach the same temperature, and after the preheating is completed, the motors in the four hot air leveling devices 2 for driving the inner wind cylinder assembly 23 to rotate are synchronously turned on to make the four inner wind cylinder assemblies 23 in a synchronous rotation state; in addition, pressurized air flow is introduced into the ends 233 of the four first rotating shaft ends, the air flow is filled in the inner cavity of the whole inner cylinder 231 along with the introduction of the pressurized air flow, the pressurized air flow is pushed open the three control assemblies 232 synchronously along with the continuous introduction of the pressurized air flow, so that the two tuyere bars 2321 in each control assembly 232 are in an open state, the pressurized air flow can be axially distributed in the whole inner cylinder 231 through the arrangement of the three control assemblies 232, the pressurized air flow can be uniformly discharged in the gap between the two tuyere bars 2321 in the axial direction of the whole inner cylinder 231, and the final effect is that the uniform distribution of hot air in the horizontal direction can be ensured; the pressurized air flow discharged from the gap opened by the control assembly 232 enters an annular space formed by the outer cylinder 221 and the inner cylinder 231, the fins 235 can separate the pressurized air flow, on one hand, the heated contact area of the pressurized air flow can be increased, so that the pressurized air flow can be rapidly heated to form hot air, on the other hand, the effects of stabilizing the air flow and guiding the air flow are achieved, the hot air can be continuously conveyed to the air outlet nozzle 2212 through the rotation of the inner air cylinder assembly 23, a stable hot air source can be obtained, and the hot air leveling is facilitated, so that a flat soldering tin layer is obtained;

after preheating of the four hot air leveling devices 2 is completed and stable hot air is obtained by pre-starting, the PCB plate after soldering tin coating is completed is horizontally placed on the conveying rollers of the conveying table 1, the conveying rollers drive the PCB plate to move forwards at a constant speed, and in the process of forward conveying, flat air flow discharged by the four air outlet nozzles 2212 relays to complete hot air leveling, and finally a uniformly attached soldering tin layer is obtained.

Those skilled in the art will appreciate that variations may be implemented by those skilled in the art in combination with the prior art and the above-described embodiments, and will not be described in detail herein. Such variations do not affect the essence of the present invention and are not described herein.

The above description is of the preferred embodiment of the invention. It is to be understood that the invention is not limited to the particular embodiments described above, in that devices and structures not described in detail are understood to be implemented in a manner common in the art; it will be understood by those skilled in the art that various changes and modifications may be made, or equivalents may be modified, without departing from the spirit of the invention. Therefore, any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present invention are still within the scope of the protection of the technical solution of the present invention, unless the contents of the technical solution of the present invention are departed.

Claims

1. An anti-oxidation treatment method for a PCB is characterized by comprising the following steps: the processing method specifically comprises the following steps:

the PCB anti-oxidation treatment method adopting the steps S1-S5 is adopted to carry out anti-oxidation treatment on the PCB, and the PCB hot air leveling treatment device further specifically comprises a conveying table (1) for conveying the PCB, a plurality of hot air leveling devices (2) which are arranged on the conveying table (1) and are uniformly distributed along the conveying direction, and an air direction adjusting mechanism (3) which is assembled among the hot air leveling devices (2); wherein:

the hot air leveling device (2) comprises two rotary supporting frames (21) fixedly arranged on the conveying table (1), an outer wind barrel assembly (22) horizontally and rotatably arranged between the two rotary supporting frames (21) and an inner wind barrel assembly (23) horizontally and rotatably arranged on the outer wind barrel assembly (22);

the outer wind barrel assembly (22) comprises an outer barrel body (221), four windows (2211) are uniformly formed in the circumference of the barrel wall of the outer barrel body (221), and an electric heating plate (224) is correspondingly and hermetically mounted at each window (2211) position on the barrel wall of the outer barrel body (221); an air outlet nozzle (2212) used for discharging hot air from the inner part of the outer cylinder body (221) is arranged between two adjacent electric heating plates (224) on the outer cylinder body (221);

the inner wind barrel assembly (23) comprises an inner barrel (231) coaxially arranged in the outer barrel (221), a plurality of wind ports (2311) are uniformly distributed on the inner barrel (231) around the circumference of a central shaft, and a control assembly (232) for controlling the opening and closing of the wind ports (2311) is assembled at the position of each wind port (2311) on the inner barrel (231); the inner barrel assembly (23) further comprises a plurality of circumferentially evenly distributed fins (235) disposed about the outer periphery of the inner barrel (231).

2. The PCB board anti-oxidation treatment method according to claim 1, wherein the PCB board anti-oxidation treatment method comprises the following steps: the control assembly (232) comprises two tuyere bars (2321) and a plurality of groups of springs (2322); the two tuyere strips (2321) are hinged in the tuyere (2311), the axial direction of a hinged shaft of the tuyere strips (2321) is parallel to the central axis of the inner cylinder (231), and a plurality of groups of springs (2322) are uniformly distributed along the axial direction of the inner cylinder (231) at the position of the tuyere (2311); each group of the springs (2322) comprises two springs, the two springs (2322) are connected between the two air opening slats (2321) and the side wall of the air opening (2311) in a one-to-one correspondence mode, and the two air opening slats (2321) are in a contact closed state.

3. The PCB board anti-oxidation treatment method according to claim 1, wherein the PCB board anti-oxidation treatment method comprises the following steps: the outer wind barrel assembly (22) further comprises rotary end heads (222) fixed at two ends of the outer barrel body (221), the rotary end heads (222) are cylindrical, and the outer wind barrel assembly (22) is horizontally and rotatably installed between the two rotary supporting frames (21) through the two rotary end heads (222).

4. The PCB board anti-oxidation treatment method according to claim 3, wherein the PCB board anti-oxidation treatment method comprises the following steps: the wind direction adjusting mechanism (3) comprises an adjusting motor (31) fixedly arranged on the conveying table (1), an adjusting driving shaft (32) fixedly connected to the output end of the adjusting motor (31) and a plurality of worm gear rings (33) with the number equal to that of the hot air leveling devices (2); the adjusting driving shaft (32) is horizontally and rotatably arranged on all the rotating supporting frames (21) which are positioned on the same side in the hot air leveling devices (2), the worm wheel rims (33) are fixedly arranged on the rotating end heads (222) which are positioned on the same side of the adjusting driving shaft (32) in the hot air leveling devices (2) in a one-to-one correspondence mode, and the adjusting driving shaft (32) is provided with a plurality of worms (321) which are correspondingly meshed with the worm wheel rims (33) in a one-to-one correspondence mode.

5. The PCB board anti-oxidation treatment method according to claim 3, wherein the PCB board anti-oxidation treatment method comprises the following steps: rotary supporting disks (223) are arranged in the rotary end heads (222) positioned at the two ends of the outer cylinder body (221); the inner wind barrel assembly (23) further comprises a first rotating shaft end (233) and a second rotating shaft end (234) which are coaxially arranged and fixedly connected to two ends of the inner barrel body (23); the first rotating shaft end heads (233) and the second rotating shaft end heads (234) are rotatably arranged on the two rotary supporting discs (223) in a one-to-one correspondence manner; the connecting end of the first rotating shaft end (233) and the inner cylinder (231) and the connecting end of the second rotating shaft end (234) and the inner cylinder (231) are discs, the diameters of the discs are larger than the outer diameter of the inner cylinder (231), and the fins (235) are fixedly connected between the two discs.

6. The PCB board anti-oxidation treatment method according to claim 5, wherein the PCB board anti-oxidation treatment method comprises the following steps: the rotating shaft part of the first rotating shaft end (233) is of a circular tube structure communicated with one end of the inner cylinder (231), and the rotating shaft part of the second rotating shaft end (234) is of a solid cylindrical structure for plugging the other end of the inner cylinder (231).

7. The PCB board anti-oxidation treatment method according to claim 3, wherein the PCB board anti-oxidation treatment method comprises the following steps: the air outlet nozzle (2212) extends to the position between the two rotating end heads (222) along the two axial sides of the outer cylinder body (221), and a section air duct perpendicular to the axial direction of the outer cylinder body (221) on the air outlet nozzle (2212) is of a closing structure.

8. The PCB board anti-oxidation treatment method according to claim 2, wherein the PCB board anti-oxidation treatment method comprises the following steps: the outer surface of the tuyere strip (2321) is coated with a rubber layer.