CN113346031A

CN113346031A - Display device

Info

Publication number: CN113346031A
Application number: CN202110594988.9A
Authority: CN
Inventors: 陈腾; 孟维欣; 王文涛; 杨璐; 张伟
Original assignee: BOE Technology Group Co Ltd; Chongqing BOE Display Technology Co Ltd
Current assignee: BOE Technology Group Co Ltd; Chongqing BOE Display Technology Co Ltd
Priority date: 2021-05-28
Filing date: 2021-05-28
Publication date: 2021-09-03
Anticipated expiration: 2041-05-28
Also published as: CN113346031B

Abstract

The embodiment of the application provides a display device, which comprises a display panel, a connecting layer and a touch panel, wherein one side of the display panel is provided with a film packaging layer and an organic coating layer, and the film packaging layer comprises an organic packaging layer and an inorganic packaging layer wrapped on the outer side of the organic packaging layer; the touch panel comprises a barrier layer and a touch structure layer arranged on the barrier layer, and the inorganic packaging layer and the barrier layer are both made of silicon-containing inorganic materials; one side of the connecting layer is connected with the inorganic packaging layer and the organic coating layer, and the other side of the connecting layer is connected with the barrier layer; the connection layer is formed of amorphous silicon by plasma enhanced chemical vapor deposition. In the display device provided by the above embodiment, the connection layer may form a covalent bond with the barrier layer, the inorganic encapsulation layer, and the organic coating layer, so as to generate a relatively strong adhesion force and form a firm bonding interface, thereby preventing Peeling from occurring between the touch panel and the display panel, and improving the yield of products and the bending and folding performance of the display device.

Description

Display device

Technical Field

The embodiment of the application relates to the technical field of display equipment, in particular to a display device.

Background

The touch structure is arranged On the packaging Layer of the Flexible Display panel (Flexible Display), a Flexible Multi-Layer cover surface type (FMLOC for short) structure form is formed, the Display structure and the touch structure are integrated by the FMLOC structure, the touch Display panel has the advantages of being light, thin, foldable and the like, and can meet product requirements of Flexible folding, narrow frames and the like.

The FMLOC structure comprises a Barrier layer (Barrier) and a touch control structure layer arranged on the touch control layer, wherein the Barrier layer is arranged close to the packaging layer relative to the touch control structure layer and is made of silicon oxide SiO₂Or inorganic materials such as silicon nitride SiNx. However, the flexible display panel has an organic clad Layer in direct contact with a barrier Layer, such as a Planarization Layer (PLN), a Pixel Definition Layer (PDL), and a Spacer (PS). The adhesion of the organic coating layer to the barrier layer is weakened after water absorption, and Peeling (Peeling) of the FMLOC structure is likely to occur.

Disclosure of Invention

In view of the above, an object of the embodiments of the present application is to provide a display device.

In a first aspect, an embodiment of the present application provides a display device, including a display panel, a connection layer, and a touch panel, where one side of the display panel is provided with a film encapsulation layer and an organic coating layer, and the film encapsulation layer includes an organic encapsulation layer and an inorganic encapsulation layer wrapped outside the organic encapsulation layer; the touch panel comprises a barrier layer and a touch structure layer arranged on the barrier layer, and the inorganic packaging layer and the barrier layer are both made of silicon-containing inorganic materials;

one side of the connecting layer is connected with the inorganic packaging layer and the organic coating layer, and the other side of the connecting layer is connected with the barrier layer; the connection layer is formed by amorphous silicon through plasma enhanced chemical vapor deposition.

In the display device provided by the embodiment, the connecting layer can form a covalent bond with the barrier layer, the inorganic packaging layer and the organic coating layer to generate a relatively strong adhesive force and form a firm bonding interface, so that the Peeling between the touch panel and the display panel can be prevented, and the yield of products is improved; meanwhile, the increase of the adhesive force can also improve the bending and folding performance of the display device.

In one possible embodiment, the display device includes a display region and a non-display region, the thin film encapsulation layer covers the display region, and the organic clad layer is located in the non-display region.

In a possible implementation manner, the touch structure layer includes a first touch metal layer, a touch insulating layer, and a second touch metal layer stacked on the barrier layer, and the touch panel further includes a touch protection layer disposed on a side of the second touch metal layer away from the barrier layer.

In one possible implementation, the display panel includes a substrate and sub-pixels located in the display area, the sub-pixels being disposed between the thin film encapsulation layer and the substrate;

along display panel's light-emitting direction, the articulamentum with the barrier layer to the projection coincidence of base plate, and all with the subpixel to the projection of base plate is not overlapped.

In one possible embodiment, the display panel includes a substrate, and an insulating layer is disposed on the substrate at a side close to the thin film encapsulation layer in the non-display region;

the display device is provided with a plurality of metal pins in the non-display area, and the metal pins are arranged on one side of the insulating layer, which is far away from the substrate; the organic coating layer comprises an organic protective layer which coats the contact position of the metal pin and the first insulating layer; the barrier layer is in contact with the organic protective layer.

In a possible embodiment, the metal pins include a plurality of test pins arranged side by side, and/or a plurality of bonding pins arranged side by side.

In one possible embodiment, the connection layer and the barrier layer are disconnected between adjacent metal pins.

In one possible embodiment, the organic clad layer includes at least one of a planarization layer, a pixel defining layer, and a spacer.

In one possible embodiment, the organic coating layer includes at least one of polyimide, polyethylene terephthalate, acrylate, epoxy resin, and polymethyl methacrylate.

In one possible embodiment, the thickness of the connecting layer is

In one possible embodiment, the thin film encapsulation layer comprises a first inorganic encapsulation layer, an organic encapsulation layer and a second inorganic encapsulation layer, wherein the first inorganic encapsulation layer and the second inorganic encapsulation layer are arranged on two sides of the organic encapsulation layer and seal-wrap the organic encapsulation layer; the connecting layer is in contact connection with the second inorganic packaging layer.

In one possible embodiment, the silicon-containing inorganic material includes at least one of silicon nitride, silicon oxide, and silicon oxynitride.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments or related technologies of the present application, the drawings needed to be used in the description of the embodiments or related technologies are briefly introduced below, it is obvious that the drawings in the following description are only one or more embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a display device according to an embodiment of the present disclosure;

fig. 2 is a schematic structural diagram of a display panel in an AA region in a display device according to an embodiment of the present application;

fig. 3 is a schematic structural diagram of a touch panel and a connection layer in a display device according to an embodiment of the present disclosure;

fig. 4 is a schematic diagram of a touch panel and a display panel in an AA area according to an embodiment of the present disclosure;

fig. 5 is a schematic structural diagram of a display device provided in an embodiment of the present application at a bonding pin.

Description of reference numerals:

1-display device, 2-display area, 3-peripheral area, 4-test area, 5-binding area, 6-flexible substrate, 7-buffer layer, 8-thin film transistor layer, 9-flat layer, 10-pixel defining layer, 11-thin film packaging layer, 12-first inorganic packaging layer, 13-organic packaging layer, 14-second inorganic packaging layer, 15-spacer, 16-OLED sub-pixel, 17-barrier layer, 18-first touch metal layer, 19-touch insulating layer, 20-second touch metal layer, 21-touch structural layer, 22-touch protective layer, 23-connecting layer, 24-insulating layer, 25-organic protective layer, 26-binding pin, 27-first metal layer, 28-second metal layer, 29-third metal layer, 30-metal routing layer.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The embodiment of the application provides a display device, the display device includes a display panel, a touch panel and a connection layer, fig. 1 is a schematic structural diagram of the display device 1 provided in the embodiment of the application, as shown in fig. 1, the display device 1 includes a display Area (AA Area for short) 2 and a non-display Area, wherein the non-display Area includes a peripheral Area 3, a binding Area 5 and a test Area 4, the binding Area 5 is located on one side of the display Area 2, the test Area 4 is located on one side of the binding Area 5 away from the display Area 2, and the peripheral Area 3 is located on other peripheries of the display Area 2 except for the side corresponding to the binding Area 5.

Fig. 2 is a schematic structural diagram of a display panel in an AA area in a display device according to an embodiment of the present disclosure, where as shown in fig. 2, the display panel includes a substrate and a pixel unit. In this embodiment, the display panel is a flexible display panel that can be bent, the substrate is a flexible substrate 6 that can be bent, and the flexible substrate 6 may be made of a polymer material such as Polyimide (PI), Polycarbonate (PC), Polyethersulfone (PES), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), Polyarylate (PAR), or glass Fiber Reinforced Plastic (FRP).

The flexible substrate 6 includes opposing first and second surfaces. Taking the orientation shown in fig. 2 as an example, the flexible substrate 6 is horizontally and laterally placed, and the first surface is located above the second surface, that is, the direction between the first surface and the second surface is the up-down direction, which is also the thickness direction of the flexible substrate 6, which is also the direction perpendicular to the flexible substrate 6. In addition, the direction between the first surface and the second surface is parallel to the light-emitting direction of the display panel.

The flexible substrate 6 is provided with a plurality of pixel units on a first surface, the plurality of pixel units are arranged on the flexible substrate 6 in an array manner to form a pixel array, and a region corresponding to the pixel array is a display region 2 (fig. 1) of the display device 1. Each pixel unit includes a plurality of sub-pixels which are light emitting devices capable of emitting a single color, for example, the pixel unit includes a first sub-pixel which is a G sub-pixel capable of emitting Green (Green) light, a second sub-pixel which is an R sub-pixel capable of emitting Red (Red) light, and a third sub-pixel which is a B sub-pixel capable of emitting Blue (Blue) light. When the display panel displays, color display is realized by controlling the light emission of various sub-pixels in each pixel unit.

The pixel unit may be an OLED (Organic Light-Emitting Diode), a Mini LED (sub-millimeter Light-Emitting Diode) or a Micro LED (Micro Light-Emitting Diode), and the pixel unit is described herein as an OLED pixel unit, which includes a plurality of OLED sub-pixels 16.

The pixel unit is an OLED pixel unitIn the embodiment, the flexible substrate 6 is provided with a Buffer Layer (Buffer)7, a thin film transistor Layer 8, a Planarization Layer (PLN) 9, a Pixel Definition Layer (PDL) 10, an OLED subpixel 16, and a thin film encapsulation Layer 11 on one side of the first surface. The buffer layer 7 is an inorganic insulating film layer, can be made of a silicon-containing inorganic material, and can be of a multilayer or single-layer structure, and the silicon-containing inorganic material can be silicon oxide SiO₂Silicon nitride SiN_xAnd silicon oxynitride SiON. So designed, with the material properties of the inorganic material, the flexible substrate 6 and the structures on the flexible substrate 6 are isolated, penetration of foreign substances, moisture, or external air from below the flexible substrate 6 is reduced or blocked, and a flat surface can be provided.

The Thin Film Transistor layer 8 is disposed above the buffer layer 7, and includes a Thin Film Transistor (TFT) and a pixel circuit, and the pixel circuit includes a data line and a scan line that are disposed in a crossing manner. The TFT may be made of Amorphous silicon (abbreviated as α -Si, also known as Amorphous silicon), Polycrystalline silicon (abbreviated as Poly-Si), Low-temperature Polycrystalline silicon (LTPS), or a metal oxide (such as indium gallium zinc oxide, abbreviated as IGZO). The TFT structure type may be a top gate type, a bottom gate type, or a double gate type, and the material and structure type of the TFT are not limited in the embodiments of the present application.

The thin-film transistor layer 8 is provided with a flat layer 9 on one side far away from the flexible substrate 6, the flat layer 9 covers the thin-film transistor layer 8, and one side far away from the thin-film transistor layer 8 is provided with a flat surface which facilitates the manufacturing and forming of the structure above the flat surface. Planar layer 9 has a first opening that is through thin-film-transistor layer 8. The pixel defining layer 10 is disposed on a side of the flat layer 9 away from the flexible substrate 6, and the pixel defining layer 10 has a second opening.

The OLED sub-pixel 16 comprises a first electrode, an intermediate layer and a second electrode, the intermediate layer being located between the first electrode and the second electrode. The first electrode is disposed between the planarization layer 9 and the pixel defining layer 10, opposite the second opening, and is connected to the pixel circuit in the thin-film transistor layer 8 through the first opening. The intermediate layer is positioned in the second opening, and the second electrode is positioned on the other side of the intermediate layer opposite to the first electrode. The intermediate layer includes an organic light emitting layer, and may further include a common layer common to the sub-pixels in the pixel unit, and the common layer may be at least one of a Hole Transport Layer (HTL), a Hole Injection Layer (HIL), an Electron Transport Layer (ETL), and/or an Electron Injection Layer (EIL).

A Spacer 15 (abbreviated as PS) is disposed on the pixel defining layer 10 outside the second opening, the Spacer 15 is a columnar structure extending upward along the thickness direction of the flexible substrate 6, and the top end of the columnar structure far away from the pixel defining layer 10 is used for supporting a mask plate for evaporating an organic light emitting layer.

The thin film packaging layer 11 of the display panel covers one side, far away from the flexible substrate 6, of the OLED pixel unit, and the OLED pixel unit is packaged in a sealing mode. The film encapsulation layer 11 includes an organic encapsulation layer and an inorganic encapsulation layer which are stacked, and the inorganic encapsulation layer is at least hermetically wrapped on one side of the organic encapsulation layer far away from the flexible substrate 6, namely the outer side of the organic encapsulation layer.

The inorganic packaging layer is made of silicon-containing inorganic material, such as SiO₂Silicon nitride SiN_xAnd silicon oxynitride SiON. The material of the organic encapsulation layer can be polymers such as acrylic-based polymers and silicon-based polymers. The inorganic packaging layer has good water and oxygen blocking performance, and the influence of external water and oxygen on organic materials in the OLED pixel units is prevented. The organic packaging layer can well absorb and disperse the stress between layers, and the reduction of the barrier property to water and oxygen caused by the crack of the compact inorganic packaging layer is avoided.

As shown in fig. 2, in the present embodiment, the thin film encapsulation layer 11 includes a first inorganic encapsulation layer 12, an organic encapsulation layer 13 and a second inorganic encapsulation layer 14, which are stacked in a direction away from the flexible substrate 6, and the first inorganic encapsulation layer 12 and the second inorganic encapsulation layer 14 are disposed on two sides of the organic encapsulation layer 13, and seal-wrap the organic encapsulation layer 13, so as to fully exert the water blocking performance of the inorganic encapsulation layer.

The touch panel in the display device 1 adopts a capacitive touch technology, and the capacitive touch technology includes Self Capacitance (Self Capacitance) and Mutual Capacitance (Mutual Capacitance). The self-capacitance touch panel is formed by a touch electrode and a human body, and position detection is carried out by utilizing the change of the self-capacitance. The mutual capacitance structure is formed by a first touch electrode and a second touch electrode to form mutual capacitance, and position detection is carried out by using the change of the mutual capacitance. The mutual capacitance type touch panel can be divided into a single-layer electrode structure and a double-layer electrode structure, wherein the single-layer electrode structure is characterized in that the first touch electrode and the second touch electrode are arranged on the same layer, and the double-layer electrode structure is characterized in that the first touch electrode and the second touch electrode are arranged in different layers. The self-contained touch panel is of a single-layer structure and has the characteristics of low power consumption, simple structure and the like.

Fig. 3 is a schematic structural diagram of a touch panel and a connection layer in a display device according to an embodiment of the present disclosure, and as shown in fig. 3, the touch panel includes a Barrier layer (Barrier)17, a first touch metal layer 18, a touch insulating layer 19, a second touch metal layer 20, and a touch protection layer 22, which are sequentially stacked. The barrier layer 17 is made of silicon-containing inorganic material, which may be SiO₂Silicon nitride SiN_xAnd silicon oxynitride SiON. The first touch metal layer 18 includes a plurality of connection bridges, and the second touch metal layer 20 may include a plurality of first touch electrodes arranged along a first direction and a plurality of second touch electrodes arranged at intervals along a second direction perpendicular to the first direction. Two adjacent first touch electrodes are integrally connected, and two adjacent second touch electrodes are connected with a connecting bridge through via holes formed in the touch insulating layer 19, that is, the connecting bridge connects the two adjacent second touch electrodes. The first touch metal layer 18, the touch insulating layer 19 and the second touch metal layer 20 are collectively referred to as a touch structure layer 21. It can be seen that the touch panel shown in fig. 3 adopts a mutual capacitance type touch panel with a double-layer electrode structure, but the embodiment of the present invention is not limited thereto, and for example, the touch panel may also be a mutual capacitance type touch panel with a single-layer electrode structure, and may also be a self-capacitance type touch panel.

The connection layer 23 in the display device 1 is disposed between the touch panel and the display panel. In the display area 2 of the display device 1, the touch panel is disposed On the film encapsulation Layer 11 of the display panel through the connection Layer 23, so as to form a Flexible Multi-Layer cover surface (FMLOC) structure, and the touch panel and the display panel are integrated together, so that the display device has the advantages of being light, thin, foldable, and capable of meeting the product requirements of Flexible folding, narrow frame, and the like.

The connection layer 23 is formed by Deposition of Amorphous silicon (Amorphous silicon, abbreviated α -Si, also known as Amorphous silicon) by Plasma Enhanced Chemical Vapor Deposition (PECVD).

In the above-described embodiment, the second inorganic encapsulation layer 14 is located outside the thin film encapsulation layer 11, and in the display region 2 of the display device 1, the connection layer 23 is in contact with the second inorganic encapsulation layer 14 on one side and the barrier layer 17 on the other side. Since the barrier layer 17 and the second inorganic encapsulation layer 14 are both made of silicon-containing inorganic materials, while amorphous silicon generates Si plasma in the process of making the connection layer 23 by PECVD, the Si plasma causes the connection layer 23 to form Si-Si covalent bonds with the second inorganic encapsulation layer 14 and the barrier layer 17, respectively, thereby forming a relatively strong adhesive force.

In order to reduce the influence of amorphous silicon on the optical performance of the display panel, the thickness of the connection layer 23 needs to be controlled

For example, in the present embodiment, the thickness of the connection layer 23 is smaller than

Fig. 4 is a schematic view of the touch panel and the display panel provided in the embodiment of the present application in the AA region, and as shown in fig. 4, along the light exit direction of the display panel, the projections of the connection layer 23 and the barrier layer 17 to the flexible substrate 6 are overlapped and are not overlapped with the projection of the OLED subpixel 16 to the flexible substrate 6; that is, in the display area 2 of the display device 1, the touch panel barrier layer 17 and the connection layer 23 located between the sub-pixels are removed by etching. Since the amorphous silicon absorbs blue light to a certain extent, etching away the barrier layer 17 and the connection layer 23 between the sub-pixels can improve the influence of the amorphous silicon on the optical effect of the display panel. In addition, since the first touch metal layer 18 and the second touch metal layer 20 have lower transmittance, the amorphous silicon remaining under the metal lines in the first touch metal layer 18 and the second touch metal layer 20 does not have a great influence on the optical effect of the display panel.

The display panel comprises display signal lines connected with pixel circuits in the thin film transistor layer 8, the touch panel comprises touch signal lines connected with the first touch electrodes and the second touch electrodes, and the display signal lines and the touch signal lines are arranged in the peripheral area 3 of the display device 1 and extend to the binding area 5.

The display device 1 is provided with a plurality of parallel binding pins in the binding region 5, and the display signal line and the touch signal line are connected with the binding pins in the binding region 5. The binding pins are also used for being bound and connected with an external Integrated Circuit (IC) and/or a Flexible Printed Circuit (FPC), and the display driving and touch control functions are realized through the bound IC and/or FPC.

Fig. 5 is a schematic structural diagram of a display device provided in an embodiment of the present application at a bonding pin, and as shown in fig. 5, a buffer layer 7, an insulating layer 24, a bonding pin 26, and a metal routing layer 30 are stacked on one side of a flexible substrate 6 near an OLED pixel unit. The insulating layer 24 is disposed on a side of the buffer layer 7 away from the flexible substrate 6, and may be formed by compounding multiple layers of insulating materials. In the present embodiment, the insulating Layer 24 is formed in the same Layer as an Inter Layer Dielectric (ILD) Layer of the tft. Here, "a and B are fabricated at the same layer" means that a and B are simultaneously formed through the same patterning process, and the "patterning process" includes processes of depositing a film layer, coating a photoresist, mask exposure, developing, etching, and stripping the photoresist. The deposition may employ any one or more selected from sputtering, evaporation and chemical vapor deposition, the coating may employ any one or more selected from spray coating and spin coating, and the etching may employ any one or more selected from dry etching and wet etching.

The bonding pins 26 comprise a plurality of metal layers arranged in a stack, where the plurality of metal layers may be fabricated in the same layer as the metal layers in the TFT. For example, in the present embodiment, the bonding pin 26 includes a first metal layer 27, a second metal layer 28, and a third metal layer 29 stacked in a direction away from the flexible substrate 6, where the first metal layer 27 is located in the insulating layer 24 and is fabricated in the same layer as a Gate (Gate) in the TFT, and the second metal layer 28 and the third metal layer 29 are located above the insulating layer 24 and are fabricated in the same layer as two source-drain metal layers (SD1 and SD2) in the TFT, respectively.

The display device 1 is further provided with an organic protective layer 25, and the organic protective layer 25 covers the contact position of the binding pins 26 and the insulating layer 24 to prevent corrosion of acidic liquid. The organic protective layer 25 can be formed in the same layer as the planarization layer 9, and the connection layer 23 will contact the organic protective layer 25 at the binding region 5.

The metal wiring layer 30 is disposed on the top end of the bonding pin 26 away from the insulating layer 24, and may be a display signal line or a touch signal line. In the embodiment shown in fig. 5, the metal wiring layer 30 is a touch signal line.

As can be seen from fig. 5, the connection layer 23 and the barrier layer 17 are disconnected between the adjacent bonding pins 26, and since the amorphous silicon is a semiconductor and has a certain conductivity, the disconnection of the connection layer 23 and the barrier layer 17 between the adjacent bonding pins 26 can prevent signal interference between the bonding pins 26.

A plurality of test pins are arranged side by side in the test area 4 of the display device 1, the display signal line, the touch signal line and/or the test metal line are directly connected with the test pins, or are connected with the test pins through the binding pins 26, and the detection of the display device 1 can be realized through the test pins. The test pins and the bonding pins 26 are metal pins disposed in the non-display region, and the design of the test pins may refer to the description of the bonding pins 26, which is not described herein again.

The non-display region further includes an organic cladding layer exposed to the outside and contacting the connection layer 23, the organic cladding layer includes at least one of a planarization layer, a pixel defining layer and a spacer, and it should be noted that the planarization layer, the pixel defining layer and the spacer may also be an organic structure fabricated on the same layer as the planarization layer, for example, the organic protection layer 25 is fabricated on the same layer as the planarization layer, and the organic cladding layer includes the organic protection layer 2. The organic clad layer may include at least one of Polyimide (PI), polyethylene terephthalate (PET), acrylate, epoxy, and Polymethylmethacrylate (PMMA).

The amorphous silicon generates Si plasma in the process of fabricating the connection layer 23 by PECVD, so that the amorphous silicon and the organic coating layer form H-H covalent bonds, thereby generating relatively strong adhesive force to form a firm bonding interface.

As can be seen from the above description, by providing the connection layer 23, a covalent bond can be formed with the barrier layer 17, the thin film encapsulation layer 11 and the organic coating layer, so as to generate a relatively strong adhesion force and form a firm bonding interface, thereby preventing Peeling from occurring between the touch panel and the display panel and improving the yield of products; and meanwhile, the bending and folding performance is improved, and the flexible display device is suitable for the flexible display device 1. In addition, the deposition of the connecting layer 23 and the deposition of the barrier layer 17 can be completed by the same equipment, and the connecting layer 23 is thin, so that the influence on the productivity and the cost is small.

The above embodiments are described by taking the display panel as a flexible display panel, and obviously, the embodiments can also be used for a display panel which cannot be deformed.

In the description of the embodiments of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referred device or element must have a specific orientation, be configured in a specific orientation, and operate, and thus, should not be construed as limiting the present application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the embodiments of the present application, it should be noted that the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected unless explicitly stated or limited otherwise; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. Specific meanings of the above terms in the embodiments of the present application can be understood in specific cases by those of ordinary skill in the art.

In addition, the technical features mentioned in the different embodiments of the present application can be combined with each other as long as they do not conflict with each other.

So far, the technical solutions of the present application have been described in connection with the preferred embodiments shown in the drawings, but it is easily understood by those skilled in the art that the scope of the present application is obviously not limited to these specific embodiments. Equivalent changes or substitutions of related technical features can be made by those skilled in the art without departing from the principle of the present application, and the technical scheme after the changes or substitutions will fall into the protection scope of the present application.

Claims

1. A display device, characterized in that: the display panel comprises a display panel, a connecting layer and a touch panel, wherein a film packaging layer and an organic coating layer are arranged on one side of the display panel, and the film packaging layer comprises an organic packaging layer and an inorganic packaging layer wrapped on the outer side of the organic packaging layer; the touch panel comprises a barrier layer and a touch structure layer arranged on the barrier layer, and the inorganic packaging layer and the barrier layer are both made of silicon-containing inorganic materials;

2. The display device according to claim 1, wherein: the display device comprises a display area and a non-display area, the thin film packaging layer covers the display area, and the organic coating layer is located in the non-display area.

3. The display device according to claim 2, wherein: the touch control structure layer comprises a first touch control metal layer, a touch control insulating layer and a second touch control metal layer which are arranged on the barrier layer in a stacked mode, and the touch control panel further comprises a touch control protective layer arranged on one side, far away from the barrier layer, of the second touch control metal layer.

4. The display device according to claim 3, wherein: the display panel comprises a substrate and sub-pixels positioned in the display area, and the sub-pixels are arranged between the thin film packaging layer and the substrate;

5. The display device according to claim 2, wherein: the display panel comprises a substrate, wherein an insulating layer is arranged on one side, close to the thin film packaging layer, of the substrate in the non-display area;

6. The display device according to claim 5, wherein: the metal pins comprise a plurality of test pins arranged side by side and/or a plurality of binding pins arranged side by side.

7. The display device according to claim 5 or 6, wherein: the connection layer and the barrier layer are disconnected between adjacent metal pins.

8. The display device according to claim 1, wherein: the organic coating layer comprises at least one of a flat layer, a pixel defining layer and a spacer.

9. The display device according to claim 8, wherein: the organic coating layer comprises at least one of polyimide, polyethylene terephthalate, acrylate, epoxy resin and polymethyl methacrylate.

10. The display device according to claim 1, wherein: the thickness of the connecting layer is

11. The display device according to claim 1, wherein: the thin film packaging layer comprises a first inorganic packaging layer, an organic packaging layer and a second inorganic packaging layer, wherein the first inorganic packaging layer and the second inorganic packaging layer are arranged on two sides of the organic packaging layer and seal and coat the organic packaging layer; the connecting layer is in contact connection with the second inorganic packaging layer.

12. The display device according to claim 1, wherein: the silicon-containing inorganic material includes at least one of silicon nitride, silicon oxide, and silicon oxynitride.