CN113346031B

CN113346031B - Display device

Info

Publication number: CN113346031B
Application number: CN202110594988.9A
Authority: CN
Inventors: 陈腾; 孟维欣; 王文涛; 杨璐; 张伟
Original assignee: BOE Technology Group Co Ltd; Chongqing BOE Display Technology Co Ltd
Current assignee: BOE Technology Group Co Ltd; Chongqing BOE Display Technology Co Ltd
Priority date: 2021-05-28
Filing date: 2021-05-28
Publication date: 2023-05-23
Anticipated expiration: 2041-05-28
Also published as: CN113346031A

Abstract

The embodiment of the application provides a display device, which comprises a display panel, a connecting layer and a touch panel, wherein a thin film packaging layer and an organic coating layer are arranged on one side of the display panel, and the thin film packaging layer comprises an organic packaging layer and an inorganic packaging layer wrapping the outer side of the organic packaging layer; the touch panel comprises a barrier layer and a touch structure layer arranged on the barrier layer, and the inorganic packaging layer and the barrier layer are both made of silicon-containing inorganic materials; one side of the connecting layer is connected with the inorganic packaging layer and the organic coating layer, and the other side of the connecting layer is connected with the barrier layer; the connecting layer is formed by Plasma Enhanced Chemical Vapor Deposition (PECVD) of amorphous silicon. In the display device provided in the above embodiment, the connection layer may form a covalent bond with the barrier layer, the inorganic encapsulation layer and the organic encapsulation layer, so as to generate a relatively strong adhesion force and form a firm bonding interface, thereby preventing Peeling of the touch panel and the display panel, and improving the product yield and the bending and folding properties of the display device.

Description

Display device

Technical Field

The embodiment of the application relates to the technical field of display equipment, in particular to a display device.

Background

The touch structure is arranged on the packaging layer of the Flexible Display panel (Flexible Display), a Flexible multilayer coverage surface (Flexible Multi Layer On Cell, FMLOC) structure is formed, the Display structure and the touch structure are integrated together by the FMLOC structure, and the Display panel has the advantages of being light, thin, foldable and the like, and can meet the product requirements of Flexible folding, narrow frames and the like.

The FMLOC structure comprises a Barrier layer (Barrier) and a touch control structure layer arranged on the touch control layer, wherein the Barrier layer is arranged close to the packaging layer relative to the touch control structure layer, and silicon oxide SiO is adopted ₂ Or inorganic materials such as silicon nitride SiNx. However, flexible display panels exist and areAn organic coating layer in direct contact with the barrier layer, such as a Planarization layer (abbreviated PLN), a pixel defining layer (PixelDefinition Layer, abbreviated PDL), and a Spacer (abbreviated PS), etc. The adhesion of the organic coating layer to the barrier layer after water absorption is reduced, and Peeling (Peeling) of the FMLOC structure is liable to occur.

Disclosure of Invention

In view of this, an object of an embodiment of the present application is to provide a display device.

In a first aspect, an embodiment of the present application provides a display device, including a display panel, a connection layer, and a touch panel, where one side of the display panel is provided with a thin film encapsulation layer and an organic encapsulation layer, and the thin film encapsulation layer includes an organic encapsulation layer and an inorganic encapsulation layer wrapped outside the organic encapsulation layer; the touch panel comprises a barrier layer and a touch structure layer arranged on the barrier layer, wherein the inorganic packaging layer and the barrier layer are both made of silicon-containing inorganic materials;

one side of the connecting layer is connected with the inorganic packaging layer and the organic coating layer, and the other side of the connecting layer is connected with the barrier layer; the connecting layer is formed by amorphous silicon through plasma enhanced chemical vapor deposition.

In the display device provided by the embodiment, the connecting layer can form a covalent bond with the barrier layer, the inorganic packaging layer and the organic coating layer to generate stronger adhesive force and form a firm bonding interface, so that Peeling between the touch panel and the display panel can be prevented, and the product yield is improved; meanwhile, the bending and folding performances of the display device can be improved due to the increase of the adhesive force.

In one possible embodiment, the display device includes a display region and a non-display region, the thin film encapsulation layer covers the display region, and the organic encapsulation layer is located in the non-display region.

In one possible implementation manner, the touch structure layer includes a first touch metal layer, a touch insulation layer and a second touch metal layer, which are stacked on the barrier layer, and the touch panel further includes a touch protection layer disposed on a side, far away from the barrier layer, of the second touch metal layer.

In one possible embodiment, the display panel includes a substrate and a subpixel in the display area, the subpixel being disposed between the thin film encapsulation layer and the substrate;

along the light emitting direction of the display panel, the projection of the connection layer and the blocking layer to the substrate is overlapped, and the projection of the connection layer and the blocking layer to the substrate is not overlapped with the projection of the sub-pixels to the substrate.

In one possible embodiment, the display panel includes a substrate provided with an insulating layer at a side close to the thin film encapsulation layer in the non-display region;

the display device is provided with a plurality of metal pins in the non-display area, and the metal pins are arranged on one side of the insulating layer far away from the substrate; the organic coating layer comprises an organic protection layer which coats the contact position of the metal pin and the insulating layer; the barrier layer is in contact with the organic protective layer.

In one possible embodiment, the metal pins include a plurality of test pins arranged side by side, and/or a plurality of bonding pins arranged side by side.

In one possible embodiment, the connection layer and the barrier layer are disconnected between adjacent ones of the metal pins.

In one possible embodiment, the organic cladding layer includes at least one of a planarization layer, a pixel defining layer, and a spacer.

In one possible embodiment, the organic coating layer includes at least one of polyimide, polyethylene terephthalate, acrylate, epoxy, and polymethyl methacrylate.

In one possible embodiment, the connection layer has a thickness of 10-30 a.

In one possible implementation manner, the thin film encapsulation layer comprises a first inorganic encapsulation layer, the organic encapsulation layer and a second inorganic encapsulation layer, and the first inorganic encapsulation layer and the second inorganic encapsulation layer are arranged at two sides of the organic encapsulation layer and seal-wrap the organic encapsulation layer; the connecting layer is in contact connection with the second inorganic packaging layer.

In one possible embodiment, the silicon-containing inorganic material comprises at least one of silicon nitride, silicon oxide, and silicon oxynitride.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the related art, the drawings that are required to be used in the embodiments or the related technical descriptions will be briefly described, and it is apparent that the drawings in the following description are only one or more embodiments of the present application, and other drawings may be obtained according to the drawings without inventive effort for those skilled in the art.

Fig. 1 is a schematic structural diagram of a display device according to an embodiment of the present application;

fig. 2 is a schematic structural diagram of a display panel in an AA area in the display device according to the embodiment of the present application;

fig. 3 is a schematic structural diagram of a touch panel and a connection layer in a display device according to an embodiment of the present disclosure;

fig. 4 is a schematic diagram of the cooperation between the touch panel and the display panel in the AA area according to the embodiment of the present application;

fig. 5 is a schematic structural diagram of a display device provided in an embodiment of the present application at a binding pin.

Reference numerals illustrate:

1-display device, 2-display region, 3-peripheral region, 4-test region, 5-bonding region, 6-flexible substrate, 7-buffer layer, 8-thin film transistor layer, 9-flat layer, 10-pixel defining layer, 11-thin film encapsulation layer, 12-first inorganic encapsulation layer, 13-organic encapsulation layer, 14-second inorganic encapsulation layer, 15-spacer, 16-OLED subpixel, 17-barrier layer, 18-first touch metal layer, 19-touch insulation layer, 20-second touch metal layer, 21-touch structure layer, 22-touch protection layer, 23-connection layer, 24-insulation layer, 25-organic protection layer, 26-bonding pin, 27-first metal layer, 28-second metal layer, 29-third metal layer, 30-metal routing layer.

Detailed Description

For the purposes of making the objects, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.

The embodiment of the application provides a display device, the display device includes a display panel, a touch panel and a connection layer, fig. 1 is a schematic structural diagram of a display device 1 provided in the embodiment of the application, as shown in fig. 1, the display device 1 includes a display Area (Active Area, abbreviated as AA Area) 2 and a non-display Area, wherein the non-display Area includes a peripheral Area 3, a binding Area 5 and a test Area 4, the binding Area 5 is located at one side of the display Area 2, the test Area 4 is located at one side of the binding Area 5 far away from the display Area 2, and the peripheral Area 3 is located at other peripheries of the display Area 2 except for a side corresponding to the binding Area 5.

Fig. 2 is a schematic structural diagram of a display panel in an AA area in a display device according to an embodiment of the present application, where, as shown in fig. 2, the display panel includes a substrate and a pixel unit. In this embodiment, the display panel is a flexible display panel capable of bending, the substrate is a flexible substrate 6 capable of bending, and the flexible substrate 6 can be made of polymer materials such as Polyimide (PI), polycarbonate (PC), polyethersulfone (PES), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyarylate (PAR), or glass Fiber Reinforced Plastic (FRP).

The flexible substrate 6 includes opposing first and second surfaces. Taking the orientation shown in fig. 2 as an example, the flexible substrate 6 is horizontally and transversely placed, and the first surface is located above the second surface, that is, the direction between the first surface and the second surface is the up-down direction, which is also the thickness direction of the flexible substrate 6, and is also the direction perpendicular to the flexible substrate 6. In addition, the direction between the first surface and the second surface is parallel to the light emitting direction of the display panel.

The flexible substrate 6 is provided with a plurality of pixel units on the first surface, the plurality of pixel units are arranged on the flexible substrate 6 in an array manner to form a pixel array, and a region corresponding to the pixel array is a display region 2 (fig. 1) of the display device 1. Each pixel unit includes a plurality of sub-pixels, which are light emitting devices capable of emitting a single color, for example, the pixel unit includes a first sub-pixel, which is a G sub-pixel capable of emitting Green (Green) light, a second sub-pixel, which is an R sub-pixel capable of emitting Red (Red) light, and a third sub-pixel, which is a B sub-pixel capable of emitting Blue (Blue) light. When the display panel performs display, color display is realized by controlling the light emission of various sub-pixels in each pixel unit.

The pixel units may be OLEDs (organic light-Emitting diodes), mini LEDs (sub-millimeter light-Emitting diodes) or Micro-LEDs (Micro light-Emitting diodes), and are described herein as OLED pixel units, which include various OLED sub-pixels 16.

In an embodiment in which the pixel cell is an OLED pixel cell, the flexible substrate 6 is provided with a Buffer layer (Buffer) 7, a thin film transistor layer 8, a Planarization Layer (PLN) 9, a pixel defining layer (Pixel Definition Layer, PDL) 10, OLED sub-pixels 16, and a thin film encapsulation layer 11 on one side of the first surface. Wherein the buffer layer 7 is an inorganic insulating film layer, can be made of silicon-containing inorganic material, and can be of a multi-layer or single-layer structure, and the silicon-containing inorganic material can be silicon oxide SiO ₂ SiN of silicon nitride _x And at least one of silicon oxynitride SiON. So designed, the flexible substrate 6 is isolated from the structures on the flexible substrate 6 by the material characteristics of the inorganic material, penetration of foreign substances, moisture, or outside air from below the flexible substrate 6 is reduced or blocked, and a flat surface can be provided.

The thin film transistor layer 8 is disposed above the buffer layer 7, and includes a thin film transistor (Thin Film Transistor, abbreviated TFT) and a pixel circuit including data lines and scan lines disposed to intersect. The TFT may be made of amorphous silicon (Amorphous silicon, abbreviated as α -Si, also known as amorphous silicon), polycrystalline silicon (Polycrystalline silicon, abbreviated as Poly-Si), low temperature polycrystalline silicon (Low-temperature polycrystalline silicon, LTPS), or metal oxide (e.g., indium gallium zinc oxide indium gallium zinc oxide, abbreviated as IGZO). The TFT structure type may be a top gate type, a bottom gate type, or a double gate type, and the embodiments of the present application are not limited to the material and structure type of the TFT.

The thin film transistor layer 8 is provided with a flat layer 9 on a side far from the flexible substrate 6, the flat layer 9 covers the thin film transistor layer 8, and a flat surface is arranged on a side far from the thin film transistor layer 8, and the flat surface facilitates the manufacturing and forming of a structure above the flat surface. The planarization layer 9 has a first opening penetrating the thin film transistor layer 8. The pixel defining layer 10 is disposed on a side of the flat layer 9 away from the flexible substrate 6, and the pixel defining layer 10 has a second opening.

The OLED subpixel 16 includes a first electrode, an intermediate layer, and a second electrode, the intermediate layer being located between the first electrode and the second electrode. The first electrode is disposed between the planarization layer 9 and the pixel defining layer 10, opposite to the second opening, and is connected to the pixel circuit in the thin film transistor layer 8 through the first opening. The intermediate layer is positioned in the second opening, and the second electrode is positioned on the other side of the intermediate layer opposite to the first electrode. The intermediate layer includes an organic light emitting layer, and may further include a common layer common to each sub-pixel in the pixel unit, and the common layer may be at least one of a Hole Transport Layer (HTL), a Hole Injection Layer (HIL), an Electron Transport Layer (ETL), and/or an Electron Injection Layer (EIL).

A Spacer 15 (abbreviated as PS) is disposed on the pixel defining layer 10 outside the second opening, and the Spacer 15 is a columnar structure extending upward along the thickness direction of the flexible substrate 6, and the columnar structure is far away from the top end of the pixel defining layer 10 and is used for supporting a mask plate used for evaporating an organic light emitting layer.

The thin film packaging layer 11 of the display panel covers one side, far away from the flexible substrate 6, of the OLED pixel unit, so that the OLED pixel unit is sealed and wrapped. The film encapsulation layer 11 includes an organic encapsulation layer and an inorganic encapsulation layer which are stacked, and the inorganic encapsulation layer is at least sealed and wrapped on one side of the organic encapsulation layer far away from the flexible substrate 6, that is, on the outer side of the organic encapsulation layer.

The inorganic packaging layer is made of silicon-containing inorganic material, which can be silicon oxide SiO ₂ SiN of silicon nitride _x And at least one of silicon oxynitride SiON. The material of the organic encapsulation layer may be an acrylic-based polymer, a silicon-based polymer, or the like. The inorganic packaging layer has good water-oxygen barrier property and prevents the influence of external water oxygen on organic materials in the OLED pixel unit. The organic packaging layer can well absorb and disperse the stress between the layers, so that cracks generated by the compact inorganic packaging layer are avoided, and the barrier property to water and oxygen is reduced.

As shown in fig. 2, in the present embodiment, the film encapsulation layer 11 includes a first inorganic encapsulation layer 12, an organic encapsulation layer 13 and a second inorganic encapsulation layer 14 stacked in a direction away from the flexible substrate 6, where the first inorganic encapsulation layer 12 and the second inorganic encapsulation layer 14 are disposed on two sides of the organic encapsulation layer 13, and seal-wrap the organic encapsulation layer 13 to fully exert the water blocking performance of the inorganic encapsulation layer.

The touch panel in the display device 1 adopts a capacitive touch technology, which includes Self Capacitance (Self Capacitance) and mutual Capacitance (Mutual Capacitance). The self-capacitance type touch panel is characterized in that a self-capacitance is formed by a touch electrode and a human body, and position detection is performed by utilizing the change of the self-capacitance. The mutual capacitance structure is formed by a first touch electrode and a second touch electrode, and position detection is performed by utilizing the change of the mutual capacitance. The mutual capacitance type touch panel can be divided into a single-layer electrode structure and a double-layer electrode structure, and the single-layer electrode structure is characterized in that a first touch electrode and a second touch electrode are arranged on the same layer, and the double-layer electrode structure is characterized in that the first touch electrode and the second touch electrode are arranged in different layers. The self-contained touch panel is of a single-layer structure and has the characteristics of low power consumption, simple structure and the like.

Fig. 3 is a schematic structural diagram of a touch panel and a connection layer in a display device according to an embodiment of the present application, where, as shown in fig. 3, the touch panel includes a barrier layer laminated in sequenceBarrer) 17, a first touch metal layer 18, a touch insulation layer 19, and a second touch metal layer 20, and a touch protection layer 22. The barrier layer 17 is made of a silicon-containing inorganic material, which may be silicon oxide SiO ₂ SiN of silicon nitride _x And at least one of silicon oxynitride SiON. The first touch metal layer 18 includes a plurality of connection bridges, and the second touch metal layer 20 may include a plurality of first touch electrodes arranged along a first direction and a plurality of second touch electrodes arranged at intervals along a second direction perpendicular to the first direction. The two adjacent first touch electrodes are integrally connected, and the two adjacent second touch electrodes are connected with the connecting bridge through the via holes arranged on the touch insulating layer 19, namely the connecting bridge connects the two adjacent second touch electrodes. The first touch metal layer 18, the touch insulating layer 19, and the second touch metal layer 20 are collectively referred to as a touch structure layer 21. As can be seen from this, the touch panel shown in fig. 3 adopts a mutual capacitive touch panel with a double-layer electrode structure, but the embodiment of the application is not limited thereto, and may be, for example, a mutual capacitive touch panel with a single-layer electrode structure or a self-capacitive touch panel.

The connection layer 23 in the display device 1 is provided between the touch panel and the display panel. In the display area 2 of the display device 1, the touch panel is arranged on the film packaging layer 11 of the display panel through the connecting layer 23, a flexible multilayer coverage surface (FlexibleMulti Layer On Cell, FMLOC for short) structure is formed, the touch panel and the display panel are integrated together, and the display device has the advantages of light weight, thinness, foldability and the like, and can meet the product requirements of flexible folding, narrow frames and the like.

The connection layer 23 is formed by deposition of amorphous silicon (abbreviated as α -Si, also called amorphous silicon) by a vapor deposition method (Plasma Enhanced Chemical Vapor Deposition, abbreviated as PECVD) of plasma enhanced chemistry.

In the above-described embodiment, the second inorganic encapsulation layer 14 is located outside the thin film encapsulation layer 11, and in the display area 2 of the display device 1, the connection layer 23 is in contact with the second inorganic encapsulation layer 14 on one side and the barrier layer 17 on the other side. Since the barrier layer 17 and the second inorganic encapsulation layer 14 are both made of a silicon-containing inorganic material, and the amorphous silicon generates Si plasma during the process of manufacturing the connection layer 23 by PECVD, the Si plasma forms Si-Si covalent bonds with the connection layer 23 and the second inorganic encapsulation layer 14 and the barrier layer 17, respectively, thereby forming a relatively strong adhesion.

In order to reduce the influence of amorphous silicon on the optical performance of the display panel, the thickness of the connection layer 23 needs to be controlled between 10-30 a, for example, in this embodiment, the thickness of the connection layer 23 is smaller than 20 a.

Fig. 4 is a schematic diagram of the touch panel and the display panel in the AA area, as shown in fig. 4, along the light emitting direction of the display panel, the projections of the connection layer 23 and the barrier layer 17 to the flexible substrate 6 are overlapped, and are not overlapped with the projections of the OLED sub-pixels 16 to the flexible substrate 6; that is, in the display region 2 of the display device 1, the touch panel barrier layer 17 and the connection layer 23 located between the sub-pixels are removed by etching. Since amorphous silicon absorbs blue light to some extent, etching away the barrier layer 17 and the connection layer 23 between the sub-pixels can improve the influence of amorphous silicon on the optical effect of the display panel. In addition, since the first touch metal layer 18 and the second touch metal layer 20 have lower transmittance, the amorphous silicon under the metal lines in the first touch metal layer 18 and the second touch metal layer 20 remains without greatly affecting the optical effect of the display panel.

The display panel comprises display signal lines connected with pixel circuits in the thin film transistor layer 8, the touch panel comprises touch signal lines connected with the first touch electrode and the second touch electrode, and the display signal lines and the touch signal lines are routed in the peripheral area 3 of the display device 1 and extend to the binding area 5.

The display device 1 is provided with a plurality of binding pins side by side in the binding area 5, and the display signal line and the touch signal line are connected with the binding pins in the binding area 5. The binding pins are also used for binding connection with an external integrated circuit (Integrated Circuit, IC) and/or a flexible circuit board (Flexible Printed Circuit, FPC), and drive display and touch control functions are realized through the bound IC and/or FPC.

Fig. 5 is a schematic structural diagram of a display device provided in the embodiment of the present application at a bonding pin, and as shown in fig. 5, a buffer layer 7, an insulating layer 24, a bonding pin 26 and a metal routing layer 30 are stacked on a side of the flexible substrate 6 close to an OLED pixel unit. The insulating layer 24 is disposed on a side of the buffer layer 7 away from the flexible substrate 6, and may be formed by compounding multiple layers of insulating materials. In this embodiment, the insulating layer 24 is formed on the same layer as an interlayer dielectric layer (InterLayer Dielectric, abbreviated as ILD) in the thin film transistor. Here, "a and B co-layer fabrication" means that a and B are formed simultaneously by the same patterning process, which includes processes of depositing a film layer, coating photoresist, mask exposure, development, etching, and stripping photoresist. The deposition may be any one or more selected from sputtering, evaporation and chemical vapor deposition, the coating may be any one or more selected from spray coating and spin coating, and the etching may be any one or more selected from dry etching and wet etching.

The bonding pin 26 includes a plurality of metal layers arranged in a stack, where the plurality of metal layers may be fabricated in the same layer as the metal layers in the TFT. For example, in the present embodiment, the bonding pin 26 includes a first metal layer 27, a second metal layer 28, and a third metal layer 29 stacked in a direction away from the flexible substrate 6, where the first metal layer 27 is located in the insulating layer 24 and is fabricated in the same layer as a Gate (Gate) in the TFT, and the second metal layer 28 and the third metal layer 29 are located above the insulating layer 24 and are fabricated in the same layer as two source drain metal layers (SD 1 and SD 2) in the TFT, respectively.

The display device 1 is further provided with an organic protective layer 25, and the organic protective layer 25 coats the contact position of the binding pins 26 and the insulating layer 24 to prevent corrosion of acidic liquid. The organic protective layer 25 may be made in the same layer as the planarization layer 9, and the connection layer 23 may be in contact with the organic protective layer 25 at the bonding region 5.

The metal wiring layer 30 is disposed on the top end of the bonding pin 26 away from the insulating layer 24, and may be a display signal line or a touch signal line. In the embodiment shown in fig. 5, the metal trace layer 30 is a touch signal line.

As can be seen from fig. 5, the connection layer 23 and the blocking layer 17 are disconnected between the adjacent bonding pins 26, and since amorphous silicon is a semiconductor, having a certain conductivity, the disconnection of the connection layer 23 and the blocking layer 17 between the adjacent bonding pins 26 can prevent signal interference between the bonding pins 26.

A plurality of test pins are arranged in the test area 4 of the display device 1, and the display signal lines, the touch signal lines and/or the test metal lines are directly connected with the test pins or connected with the test pins through the binding pins 26, so that the detection of the display device 1 can be realized through the test pins. The test pins and the bonding pins 26 are metal pins disposed in the non-display area, and the design of the test pins can be referred to the above description about the bonding pins 26, which is not repeated here.

The non-display area further includes an organic coating layer exposed to the outside and contacting the connection layer 23, wherein the organic coating layer includes at least one of a planarization layer, a pixel defining layer and a spacer, and it should be noted that, here, the planarization layer, the pixel defining layer and the spacer may also be organic structures fabricated with the same layers, for example, the organic protection layer 25 is fabricated with the planarization layer, and the organic coating layer includes the organic protection layer 2. The organic coating layer may include at least one of Polyimide (PI), polyethylene terephthalate (PET), acrylate, epoxy, and polymethyl methacrylate (PMMA).

The amorphous silicon generates Si plasma in the process of manufacturing the connection layer 23 by PECVD, so that the amorphous silicon forms an H-H covalent bond with the organic clad layer, thereby generating a relatively strong adhesive force, forming a firm bonding interface.

As can be seen from the above description, by providing the connection layer 23, a covalent bond can be formed with the barrier layer 17, the thin film encapsulation layer 11 and the organic encapsulation layer, so as to generate a relatively strong adhesion force and form a firm bonding interface, thereby preventing Peeling of the touch panel and the display panel and improving the product yield; and simultaneously improves bending and folding properties, and is suitable for the flexible display device 1. In addition, the deposition of the connection layer 23 and the deposition of the barrier layer 17 can be performed using the same apparatus, and the connection layer 23 is thin, which has less influence on productivity and cost.

The above embodiments are described taking the display panel as a flexible display panel as an example, and obviously, the present invention can also be applied to a display panel that cannot be deformed.

In the description of the embodiments of the present application, it should be noted that, directions or positional relationships indicated by terms such as "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., are based on directions or positional relationships shown in the drawings, are merely for convenience of description of the present application and simplification of the description, and do not indicate or imply that the apparatus or element referred to must have a specific direction, be configured and operated in the specific direction, and therefore should not be construed as limiting the present application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the embodiments of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the terms in the embodiments of the present application will be understood by those of ordinary skill in the art in a specific context.

In addition, the technical features described above in the different embodiments of the present application may be combined with each other as long as they do not collide with each other.

Thus far, the technical solution of the present application has been described in connection with the preferred embodiments shown in the drawings, but it is easily understood by those skilled in the art that the scope of protection of the present application is not limited to these specific embodiments. Equivalent modifications and substitutions for related technical features may be made by those skilled in the art without departing from the principles of the present application, and such modifications and substitutions will be within the scope of the present application.

Claims

1. A display device, characterized in that: the display device comprises a display panel, a connecting layer and a touch panel, wherein a thin film packaging layer and an organic coating layer are arranged on one side of the display panel, and the thin film packaging layer comprises an organic packaging layer and an inorganic packaging layer wrapping the outer side of the organic packaging layer; the touch panel comprises a barrier layer and a touch structure layer arranged on the barrier layer, wherein the inorganic packaging layer and the barrier layer are both made of silicon-containing inorganic materials;

one side of the connecting layer is connected with the inorganic packaging layer and the organic coating layer, and the other side of the connecting layer is connected with the barrier layer; the connecting layer is formed by amorphous silicon through plasma enhanced chemical vapor deposition;

the display device comprises a display area and a non-display area, wherein the display area is covered by the thin film packaging layer, and the organic coating layer is positioned in the non-display area;

the display panel comprises a substrate and sub-pixels positioned in the display area, and the sub-pixels are arranged between the thin film packaging layer and the substrate;

along the light emitting direction of the display panel, the projection of the connecting layer and the blocking layer to the substrate are overlapped, and the projection of the connecting layer and the blocking layer to the substrate are not overlapped with the projection of the sub-pixels to the substrate;

the display panel comprises a substrate, and an insulating layer is arranged on one side, close to the thin film packaging layer, of the substrate in the non-display area;

the display device is provided with a plurality of metal pins in the non-display area, and the metal pins are arranged on one side of the insulating layer far away from the substrate; the organic coating layer comprises an organic protection layer which coats the contact position of the metal pin and the insulating layer; the barrier layer is in contact with the organic protective layer;

the connection layer and the blocking layer are disconnected between adjacent metal pins so as to prevent signal interference between the adjacent metal pins.

2. The display device according to claim 1, wherein: the touch structure layer comprises a first touch metal layer, a touch insulating layer and a second touch metal layer which are arranged on the barrier layer in a stacked mode, and the touch panel further comprises a touch protection layer which is arranged on one side, far away from the barrier layer, of the second touch metal layer.

3. The display device according to claim 1, wherein: the metal pins comprise a plurality of test pins arranged side by side and/or a plurality of binding pins arranged side by side.

4. The display device according to claim 1, wherein: the organic coating layer comprises at least one of a flat layer, a pixel defining layer and a spacer.

5. The display device according to claim 4, wherein: the organic coating layer includes at least one of polyimide, polyethylene terephthalate, acrylate, epoxy resin, and polymethyl methacrylate.

6. The display device according to claim 1, wherein: the thickness of the connection layer is 10-30A.

7. The display device according to claim 1, wherein: the thin film packaging layer comprises a first inorganic packaging layer, an organic packaging layer and a second inorganic packaging layer, wherein the first inorganic packaging layer and the second inorganic packaging layer are arranged on two sides of the organic packaging layer and are used for sealing and coating the organic packaging layer; the connecting layer is in contact connection with the second inorganic packaging layer.

8. The display device according to claim 1, wherein: the silicon-containing inorganic material includes at least one of silicon nitride, silicon oxide, and silicon oxynitride.