CN113345677A - Magnetic device and magnetic device installation method - Google Patents
Magnetic device and magnetic device installation method Download PDFInfo
- Publication number
- CN113345677A CN113345677A CN202110577442.2A CN202110577442A CN113345677A CN 113345677 A CN113345677 A CN 113345677A CN 202110577442 A CN202110577442 A CN 202110577442A CN 113345677 A CN113345677 A CN 113345677A
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- 238000000034 method Methods 0.000 title claims abstract description 22
- 238000009434 installation Methods 0.000 title abstract description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 52
- 229910052802 copper Inorganic materials 0.000 claims abstract description 52
- 239000010949 copper Substances 0.000 claims abstract description 52
- 239000000758 substrate Substances 0.000 claims abstract description 47
- 239000002184 metal Substances 0.000 claims abstract description 14
- 229910052751 metal Inorganic materials 0.000 claims abstract description 14
- 239000011257 shell material Substances 0.000 claims description 57
- 238000003466 welding Methods 0.000 claims description 9
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 230000001965 increasing effect Effects 0.000 abstract description 18
- 229910045601 alloy Inorganic materials 0.000 abstract description 12
- 239000000956 alloy Substances 0.000 abstract description 12
- 230000017525 heat dissipation Effects 0.000 abstract description 7
- 238000011900 installation process Methods 0.000 abstract 1
- 239000000047 product Substances 0.000 description 18
- 238000005476 soldering Methods 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 5
- 239000010409 thin film Substances 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000010923 batch production Methods 0.000 description 1
- 230000004069 differentiation Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/02—Casings
- H01F27/025—Constructional details relating to cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/02—Casings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/06—Mounting, supporting or suspending transformers, reactors or choke coils not being of the signal type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/08—Cooling; Ventilating
- H01F27/22—Cooling by heat conduction through solid or powdered fillings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2871—Pancake coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/06—Mounting, supporting or suspending transformers, reactors or choke coils not being of the signal type
- H01F2027/065—Mounting on printed circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
The invention provides a magnetic device and a magnetic device installation method, wherein the magnetic device comprises a magnetic core, a coil and a heat conduction shell, the coil is wound on the magnetic core, and the heat conduction shell is sleeved outside the magnetic core; wherein: the heat conducting shell is an alloy copper metal sheet, so that the heat radiating area is increased, the damage to the magnetic device is reduced, and meanwhile, the flat copper coil is adopted as the coil, so that the electrical connection of the magnetic device can be enhanced; in the installation process of the magnetic device, the length of the connection surface of the magnetic device and the substrate is utilized to determine the placement mode of the bonding pad on the substrate, so that the fixation of the magnetic device on the substrate is enhanced, and the heat dissipation performance is further improved.
Description
Technical Field
The invention belongs to the technical field of power device installation, and relates to a magnetic device and a magnetic device installation method.
Background
In recent years, with the increasing demand of the market for power density of high power supplies, new demands are being made on the installation of power magnetic devices by high power density power supplies and large current input or large current output power supplies.
In the prior art, for the installation of magnetic devices with different sizes and weights, the size market of a pad correspondingly placed on a substrate does not form a unified parameter value specification, the experience of engineers is relied on, the values designed by different engineers are different, the optimal design cannot be achieved, products are not uniform, the difference between the surface temperature of the magnetic device and the surface temperature of the substrate is large, and the heat dissipation performance is low.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: the invention provides a magnetic device and a magnetic device mounting method, aiming at improving the heat dissipation performance of the magnetic device, determining the specification and the mode of a bonding pad arranged on a substrate according to the length of a connecting surface of the magnetic device and enhancing the connection stability of the magnetic device.
In order to solve the technical problems, the invention adopts the technical scheme that:
the invention provides a magnetic device, which comprises a magnetic core, a coil and a heat-conducting shell, wherein the coil is wound on the magnetic core, and the heat-conducting shell is sleeved outside the magnetic core; wherein:
the heat conduction shell comprises an upper shell and a lower shell, the upper shell and the lower shell are matched and connected to form a shell connecting surface, and the shell connecting surface is positioned on the side surface of the magnetic core; the bottom surface of the lower shell is arranged to be the magnetic device connecting surface, and the coil is a flat copper coil.
Preferably, the shell material of the heat-conducting shell is an alloy copper sheet, and the thickness of the heat-conducting shell is 0.5 mm.
Preferably, the connecting surface of the shell is a welding surface, and the soldering tin height of the welding surface is 1mm-1.5mm and is distributed at 45 degrees.
Preferably, the length of the cross section of the flat copper coil is less than or equal to 7mm and the thickness is less than or equal to 3 mm.
A method of mounting a magnetic device, the magnetic device having a weight of 2Kg or less, the method comprising:
acquiring a magnetic device, and determining the length of a connecting surface of the magnetic device;
determining the number and the placement mode of pads placed on the substrate based on the length of the magnetic device connection surface;
and completing the welding between the magnetic device and the substrate through the bonding pad.
Preferably, the determining the number of pads to be placed on the substrate and the placement manner based on the length of the magnetic device connection surface includes:
if the length of the magnetic device connecting surface is less than or equal to 60mm, placing two bonding pads on the substrate, wherein the two bonding pads are arranged corresponding to two sides of the magnetic device connecting surface;
if the length of the magnetic device connecting surface is larger than 60mm and smaller than or equal to 120mm, three bonding pads are placed on the substrate, and the three bonding pads are arranged at equal intervals corresponding to the magnetic device connecting surface.
Preferably, after determining the number of pads to be placed on the substrate and the placement manner based on the length of the magnetic device connection surface, the method further includes:
determining the length and the width of the bonding pad, wherein the bonding pad is rectangular;
if the number of the bonding pads is two, the ratio of the width of the bonding pads to the length of the magnetic device connecting surface is 1:3, and the length of the bonding pads is not more than 2mm of the width of the magnetic device connecting surface;
if the number of the bonding pads is three, the ratio of the width of the bonding pads to the length of the magnetic device connecting surface is 1:5, and the length of the bonding pads is not more than 2mm of the width of the magnetic device connecting surface.
Preferably, the substrate is a copper substrate, and the thickness of the copper substrate is 2 mm.
The invention has the beneficial effects that:
(1) the alloy copper metal sheet is used for the shell of the magnetic device, so that the heat dissipation area of the magnetic device can be increased, the temperature of the magnetic device can be quickly reduced, and meanwhile, the hardness of the alloy copper metal sheet is increased by the area of the alloy copper metal sheet, so that the damage to the magnetic device is far lower than that of the conventional copper metal sheet in the market;
(2) the coil in the magnetic device adopts a flat copper coil, so that the window utilization rate of the magnetic device can be improved, the size of the required magnetic device can be reduced, and meanwhile, the electrical connection between the pins of the copper flat coil and the reflow soldering pad on the copper substrate can be enhanced;
(3) the ratio design that the pad provided according to this technical scheme on the base plate can make the surface temperature difference of magnetic device surface temperature and base plate reduce, improves heat dispersion, strengthens connecting the steadiness simultaneously.
Drawings
The detailed structure of the invention is described in detail below with reference to the accompanying drawings
FIG. 1 is an exploded view of a magnetic device according to the present invention;
FIG. 2 is a schematic view of the magnetic device assembly of the present invention;
FIG. 3 is a schematic view of the mounting structure of a first embodiment of the magnetic device of the present invention;
FIG. 4 is a schematic view of a mounting structure of a second embodiment of the magnetic device of the present invention;
wherein: 1-an upper shell; 2-a magnetic core; 3-a coil; 4-a lower shell; 5-fixing the back-off; 6-a first housing connection face; 7-magnetic device connection face; 8-a second housing connection face; 9-coil pins; 10-a substrate; 11-pad.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the invention and are not to be construed as limiting the invention.
The invention provides a magnetic device, wherein a general conventional copper sheet shell is not used for fixing a magnetic core device in the production of the magnetic device in the industry, the optimal temperature required by a copper substrate flowing through a reflow furnace is not well regulated, the temperature of the reflow furnace needs to be debugged again after a supplier of the magnetic device is replaced, and meanwhile, the thickness of the general conventional copper sheet is increased to meet the requirement of the magnetic device on the tolerance in the whole product, so that the thickness of the general conventional copper sheet is more than 1.2mm, and the magnetic device is obviously damaged or semi-damaged due to the excessive hardness of the general conventional copper sheet in the batch production of the magnetic device, so that the sectional type copper shell is basically adopted for fixing the magnetic device in the industry, the heat radiation performance is reduced, and the size of the whole product is increased.
Referring to the schematic structural diagrams of the magnetic device shown in fig. 1 and fig. 2, the present invention provides a magnetic device, which includes a magnetic core 2, a coil 3 and a heat-conducting shell, wherein the coil 3 is wound around the magnetic core 2, and the heat-conducting shell is sleeved outside the magnetic core 2; wherein: the heat conduction shell comprises an upper shell 1 and a lower shell 4, the upper shell 1 and the lower shell 4 are matched and connected to form a shell connecting surface, and the shell connecting surface is positioned on the side surface of the magnetic core 2; the bottom surface of the lower shell 4 is provided with the magnetic device connecting surface 7, and the coil 3 is a flat copper coil.
Specifically, in the present embodiment, the alloy copper is used as the heat conductive housing and the substrate of the magnetic device because copper has high thermal conductivity and solderability. Corresponding magnetic device copper shells are configured for different magnetic devices, and a special processing jig is configured in the preparation process to ensure that the magnetic devices can be closely overlapped when the magnetic device copper shells are connected, so that the qualification rate and the production efficiency are improved. The alloy copper metal sheet can increase the heat dissipation area of the magnetic device, quickly reduce the temperature of the magnetic device, and simultaneously, the hardness of the alloy copper metal sheet is increased, so that the damage to the magnetic device is far lower than that of the conventional copper metal sheet in the market.
The shell connecting surface is a welding surface formed by welding soldering tin, as shown in the figure, the left side and the right side of the upper shell and the lower shell are respectively the first shell connecting surface 6 and the second shell connecting surface 8, so that the soldering tin is uniform, the soldering tin at the welding position is smooth and flat, and the soldering tin height of the welding surface of the magnetic device is 1mm-1.5mm and is distributed at 45 degrees, so that the situation that the heat conducting shell of the magnetic device is loosened in the whole machine product and the function of the whole machine product is failed is avoided. The magnetic device shell connecting surface is arranged on the side surface of the magnetic device, the length and width of the size of the magnetic device heat conducting shell are equal to those of the magnetic device, and the thickness of the magnetic device heat conducting shell is 0.5 mm; in some embodiments, the height and width of the copper shell of the magnetic device are slightly larger than the size of the magnetic device, and the copper shell is bent by 2mm-3mm to form a fixed back buckle 5.
The coil 3 is a flat copper coil, and multiple strands of thin film wires are basically used as the coil in the industry, so that the pins are not convenient to be electrically connected with the bonding pads 11 of the substrate 10, the same current flows, the size of the bonding pads 11 of the multiple strands of thin film wires is larger than that of the flat copper coil, the bonding pads 11 of the multiple strands of thin film wires can meet the requirement of reliable electrical connection, and when the substrate 10 needs to be provided with a magnetic device wound by multiple strands of thin film wires, the size of the substrate 10 is increased. Therefore, in this embodiment, the coil 3 is a flat copper coil, which can improve the window utilization rate of the magnetic device, reduce the size of the required magnetic device, and enhance the electrical connection between the coil pin 9 and the pad 11 on the substrate 10, and preferably, the length of the cross section of the flat copper coil is less than or equal to 7mm and the thickness of the cross section of the flat copper coil is less than or equal to 3 mm.
Another aspect of the present invention provides a method of mounting a magnetic device, the magnetic device having a weight of 2Kg or less, the method comprising:
and acquiring a magnetic device, and determining the length of the connection surface of the magnetic device.
Determining the number and the placement mode of pads placed on the substrate based on the length of the magnetic device connection surface;
and completing the welding between the magnetic device and the substrate through the bonding pad.
Referring to the schematic view of the mounting structure of the first embodiment shown in fig. 3, the length of the magnetic device connection surface 7 is 60mm or less and the weight of the magnetic device is 2Kg or less, and the pads 11 may be placed as follows:
placing a bonding pad 11 on each of two sides of the substrate 10 corresponding to the magnetic device connecting surface 7, wherein the ratio of the width of the bonding pad 11 to the length of the magnetic device connecting surface 7 is 1:3, so that the difference between the surface temperature of the magnetic device and the surface temperature of the substrate 10 can be reduced by 5-7 ℃; the length of the bonding pad 11 is not more than the width of the magnetic device connecting surface 7 is 2mm, so that the magnetic device connecting surface 7 can overflow normally from two sides, backflow soldering paste is prevented from permeating from the two sides of the bonding pad 11, and direct short circuit of the bonding pad 11 is avoided. At this time, if the proportion of the bonding pads 11 is smaller than 1:3, the temperature of the reflow soldering equipment is set too high, so that other components on the substrate 10 are damaged due to over-temperature, the proportion of the bonding pads 11 is larger than 1:3, the heat conducting shell of the magnetic device can fall off or loosen in the vibration and impact process of the product, the magnetic device needs to be supported by a pressing part outside the product, so that the number of internal structural components of the product is increased, the quality failure evaluation of the product is increased, the production process and working procedures of the product are increased, and the production cost of the product is increased.
Referring to the mounting structure diagram of the second embodiment shown in fig. 4, the length of the magnetic device connection face 7 is greater than 60mm and equal to or less than 120mm and the magnetic device weight is equal to or less than 2Kg, and the reflow pads 11 can be placed in the following way:
the ratio of the width of the bonding pad 11 to the length of the magnetic device connecting surface 7 is 1:5, three bonding pads 11 are arranged on the substrate 10 corresponding to the magnetic device connecting surface 7, the three bonding pads 11 are arranged at equal intervals corresponding to the magnetic device connecting surface 7, namely two reflow soldering pads 11 are arranged on two sides, and one reflow soldering pad 11 is arranged in the middle, so that the difference between the surface temperature of the magnetic device and the surface temperature of the copper substrate 10 can be reduced by 5-7 ℃; the length of pad 11 is not more than 7 width 2mm are connected to the magnetic device, guarantee to connect the face solder paste and can normally overflow from both sides, ensure that backward flow solder paste does not permeate from between 11 both sides of pad, avoid the direct short circuit of pad 11. At this time, if the proportion of the bonding pads 11 is less than 1:5, the temperature of the reflow soldering equipment is set too high, so that other components on the substrate 10 are damaged due to over-temperature, the proportion of the bonding pads 11 is greater than 1:5, the copper shell of the magnetic device can fall off or loosen in the vibration and impact process of the product, the magnetic device needs to be supported by a pressing part outside the product, so that the number of internal structural components of the product is increased, the quality failure evaluation of the product is increased, the production process and working procedures of the product are increased, and the production cost of the product is increased.
The above-mentioned mounting method proposed for the magnetic device with the length of the connection surface 7 being less than or equal to 60mm or the length of the connection surface being greater than 60mm and less than or equal to 120mm and the weight of the magnetic device being less than or equal to 2kg, it should be noted that the substrates 10 are all copper substrates 10, the thickness of the copper substrates 10 is 2mm, the copper substrates 10 are used together with the alloy copper heat-conducting shell of the magnetic device, and when the shell of the whole machine product is made of metal, the size is reduced by 1/4 compared with the PR-4 size of the substrate 10.
In summary, the magnetic device and the installation method of the magnetic device provided by the invention have the following beneficial effects:
(1) the bonding pad on the substrate is designed according to the ratio provided by the technical scheme, so that the difference between the surface temperature of the magnetic device and the surface temperature of the substrate can be reduced, the heat dissipation performance is improved, and the connection stability is enhanced;
(2) the alloy copper metal sheet is used for the shell of the magnetic device, so that the heat dissipation area of the magnetic device can be increased, the temperature of the magnetic device can be quickly reduced, and meanwhile, the hardness of the alloy copper metal sheet is increased by the area of the alloy copper metal sheet, so that the damage to the magnetic device is far lower than that of the conventional copper metal sheet in the market;
(3) the flat copper coil is adopted as the coil in the magnetic device, so that the window utilization rate of the magnetic device can be improved, the size of the required magnetic device is reduced, and meanwhile, the electrical connection between the pin of the flat copper coil and the reflow soldering pad on the copper substrate can be enhanced.
The first … … and the second … … are only used for name differentiation and do not represent how different the importance and position of the two are.
Here, the upper, lower, left, right, front, and rear represent only relative positions thereof and do not represent absolute positions thereof.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes performed by the present specification and drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (8)
1. A magnetic device is characterized by comprising a magnetic core, a coil and a heat-conducting shell, wherein the coil is wound on the magnetic core, and the heat-conducting shell is sleeved outside the magnetic core; wherein:
the heat conduction shell comprises an upper shell and a lower shell, the upper shell and the lower shell are matched and connected to form a shell connecting surface, and the shell connecting surface is positioned on the side surface of the magnetic core; the bottom surface of the lower shell is arranged to be the magnetic device connecting surface, and the coil is a flat copper coil.
2. The magnetic device according to claim 1, wherein the thermally conductive housing shell material is a sheet of alloyed copper metal, the thermally conductive housing shell having a thickness of 0.5 mm.
3. The magnetic device of claim 2, wherein the case attachment surface is a solder surface, and the solder height of the solder surface is 1mm to 1.5mm and is distributed at 45 °.
4. The magnetic device according to claim 3, wherein the flat copper coil cross-section has a length of 7mm or less and a thickness of 3mm or less.
5. A method of mounting a magnetic device, the magnetic device having a weight of 2Kg or less, the method comprising:
acquiring a magnetic device, and determining the length of a connecting surface of the magnetic device;
determining the number and the placement mode of pads placed on the substrate based on the length of the magnetic device connection surface;
and completing the welding between the magnetic device and the substrate through the bonding pad.
6. The mounting method according to claim 5, wherein the determining the number and the placement manner of the pads placed on the substrate based on the length of the magnetic device connection surface comprises:
if the length of the magnetic device connecting surface is less than or equal to 60mm, placing two bonding pads on the substrate, wherein the two bonding pads are arranged corresponding to two sides of the magnetic device connecting surface;
if the length of the magnetic device connecting surface is larger than 60mm and smaller than or equal to 120mm, three bonding pads are placed on the substrate, and the three bonding pads are arranged at equal intervals corresponding to the magnetic device connecting surface.
7. The mounting method according to claim 2, wherein the determining the number of the pads to be placed on the substrate and the placement manner based on the length of the magnetic device connection surface further comprises:
determining the length and the width of the bonding pad, wherein the bonding pad is rectangular;
if the number of the bonding pads is two, the ratio of the width of the bonding pads to the length of the magnetic device connecting surface is 1:3, and the length of the bonding pads is not more than 2mm of the width of the magnetic device connecting surface;
if the number of the bonding pads is three, the ratio of the width of the bonding pads to the length of the magnetic device connecting surface is 1:5, and the length of the bonding pads is not more than 2mm of the width of the magnetic device connecting surface.
8. The mounting method according to claim 1, wherein the substrate is a copper substrate having a thickness of 2 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110577442.2A CN113345677A (en) | 2021-05-26 | 2021-05-26 | Magnetic device and magnetic device installation method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110577442.2A CN113345677A (en) | 2021-05-26 | 2021-05-26 | Magnetic device and magnetic device installation method |
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| CN113345677A true CN113345677A (en) | 2021-09-03 |
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| CN202110577442.2A Pending CN113345677A (en) | 2021-05-26 | 2021-05-26 | Magnetic device and magnetic device installation method |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001168443A (en) * | 1999-12-06 | 2001-06-22 | Kyocera Corp | Package for housing optical semiconductor element |
| US20140022733A1 (en) * | 2012-07-19 | 2014-01-23 | Samsung Electronics Co., Ltd. | Storage Device |
| WO2015087129A1 (en) * | 2013-12-11 | 2015-06-18 | Toyota Jidosha Kabushiki Kaisha | Power converter |
| CN206516469U (en) * | 2017-01-20 | 2017-09-22 | 珠海华铖电子科技有限公司 | A kind of Flat wire high-current inductor |
| CN210805459U (en) * | 2019-10-24 | 2020-06-19 | 深圳市首航新能源有限公司 | Converter |
-
2021
- 2021-05-26 CN CN202110577442.2A patent/CN113345677A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001168443A (en) * | 1999-12-06 | 2001-06-22 | Kyocera Corp | Package for housing optical semiconductor element |
| US20140022733A1 (en) * | 2012-07-19 | 2014-01-23 | Samsung Electronics Co., Ltd. | Storage Device |
| WO2015087129A1 (en) * | 2013-12-11 | 2015-06-18 | Toyota Jidosha Kabushiki Kaisha | Power converter |
| CN206516469U (en) * | 2017-01-20 | 2017-09-22 | 珠海华铖电子科技有限公司 | A kind of Flat wire high-current inductor |
| CN210805459U (en) * | 2019-10-24 | 2020-06-19 | 深圳市首航新能源有限公司 | Converter |
Non-Patent Citations (4)
| Title |
|---|
| 吴建辉: "《印刷电路板的电磁兼容性设计》", 28 February 2005, 国防工业出版社 * |
| 姜培安: "《印刷电路板的可制造性设计》", 30 September 2007, 中国电力出版社 * |
| 樊会灵: "《电子产品工艺（第2版）》", 30 June 2010, 机械工业出版社 * |
| 袁祖强: "《电子实训手册》", 31 August 2017 * |
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