CN113343825A - Display module - Google Patents

Display module Download PDF

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Publication number
CN113343825A
CN113343825A CN202110604187.6A CN202110604187A CN113343825A CN 113343825 A CN113343825 A CN 113343825A CN 202110604187 A CN202110604187 A CN 202110604187A CN 113343825 A CN113343825 A CN 113343825A
Authority
CN
China
Prior art keywords
display panel
display module
infrared light
circuit board
infrared
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202110604187.6A
Other languages
Chinese (zh)
Inventor
郑财
丁立薇
马一鸿
解红军
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kunshan Govisionox Optoelectronics Co Ltd
Original Assignee
Kunshan Govisionox Optoelectronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kunshan Govisionox Optoelectronics Co Ltd filed Critical Kunshan Govisionox Optoelectronics Co Ltd
Priority to CN202110604187.6A priority Critical patent/CN113343825A/en
Publication of CN113343825A publication Critical patent/CN113343825A/en
Pending legal-status Critical Current

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    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements

Abstract

The embodiment of the invention relates to the technical field of display, and discloses a display module, which comprises a cover plate and a display panel arranged below the cover plate; the infrared light generating circuit is arranged below the cover plate and surrounds the display panel, and is used for emitting infrared light so that the infrared light covers the whole display panel; and a signal receiving circuit is arranged below the display panel and used for receiving the infrared light emitted by the infrared light generating circuit and generating a fingerprint signal. The display module can realize large-area infrared fingerprint identification, is convenient to use, and can greatly improve user experience.

Description

Display module
Technical Field
The embodiment of the invention relates to the technical field of display, in particular to a display module.
Background
At present, the conventional optical scheme under the screen is infrared fingerprint identification, the infrared lamp and the signal receiver are designed in an integrated mode, the infrared lamp emits infrared light, and the signal receiver receives the infrared light returned by the finger of a user to generate a fingerprint signal.
The position of infrared fingerprint identification is comparatively fixed and the identification area is limited among this kind of design, and the user can only carry out fingerprint identification in specific area, and when the finger can't accurately press at appointed fingerprint identification zone time because of various reasons, then can't successfully unblank, influence and use experience.
Disclosure of Invention
The embodiment of the invention aims to provide a display module which can realize large-area infrared fingerprint identification, is convenient to use and can greatly improve user experience.
In order to solve the above technical problems, an embodiment of the present invention provides a display module, including a cover plate, and a display panel disposed below the cover plate; the infrared light generating circuit is arranged below the cover plate and surrounds the display panel, and is used for emitting infrared light so that the infrared light covers the whole display panel; and a signal receiving circuit is arranged below the display panel and used for receiving the infrared light emitted by the infrared light generating circuit and generating a fingerprint signal.
In addition, the infrared light generation circuit includes: the display panel comprises a first flexible circuit board arranged around the display panel and an infrared LED arranged on one side, close to the cover plate, of the first flexible circuit board; the first flexible circuit board is used for providing electric signals for the infrared LED, and the infrared LED is used for emitting infrared light so that the infrared light covers the whole display panel.
In addition, the infrared LED is annular; or the infrared LEDs are arranged in a plurality and are uniformly distributed on the first flexible circuit board. Two structural styles of the infrared LED are given in the scheme.
In addition, the display module assembly still includes: and the sealant is used for adhering the first flexible circuit board to the lower part of the cover plate. The sealant in this arrangement only serves to secure the first flexible circuit.
In addition, the sealant surrounds the display panel, is located on one side of the infrared LED close to the outer side of the display panel, and is light-proof. The sealant in the scheme not only plays a role in fixing the first flexible circuit board, but also is used for blocking light rays emitted by the infrared LED in the display module and preventing the light rays from emitting outwards.
In addition, the display module assembly still includes: and the brightness enhancement film is arranged between the display panel and the signal receiving circuit. The bright enhancement film in the scheme can gather infrared light rays returned by fingers towards the signal receiving circuit so as to improve the brightness.
In addition, the display module assembly still includes: a composite assembly disposed below the display panel; the brightness enhancement film is positioned between the display panel and the composite component. In the scheme, the brightness enhancement film is arranged below the display panel for avoiding the influence of the brightness enhancement film on the luminous display effect of the display panel.
In addition, the brightness enhancement film includes: the prism structure comprises an upper base material, a lower base material and two prism structure layers positioned between the upper base material and the lower base material; every prism structural layer is arranged into the array by a plurality of prism cell structure according to same direction, two prism structural layer sets up relatively, and two prism cell structure on the prism structural layer sets up in the crisscross.
In addition, the display module assembly still includes: a composite assembly disposed between the display panel and the signal receiving circuit; the composite component is provided with a plurality of hollow holes, the signal receiving circuit comprises a plurality of signal receivers, and each signal receiver corresponds to one hollow hole. According to the scheme, the signal receiving circuit comprises a plurality of signal receivers, and each signal receiver corresponds to one hollow hole. So, can guarantee to the utmost that signal receiving circuit receives the infrared light that the finger returned, and generate the fingerprint signal to can realize the infrared fingerprint identification of large tracts of land.
In addition, the display panel includes: the flat part and the bent part are positioned on one side of the flat part, and the bent part is bent to one side of the flat part, which is far away from the cover plate; the display module assembly still includes: the second flexible circuit board is positioned below the flat part and connected with the bent part; the first flexible circuit board extends from one side close to the bending part, bends to one side of the flat part far away from the cover plate, and is electrically connected with the second flexible circuit board.
Compared with the design of integrating an infrared lamp and a signal receiver in the prior art, the display module provided by the embodiment of the invention has the advantages that the infrared lamp and the signal receiver are split, the infrared light generating circuit is separately arranged, the infrared light generating circuit is arranged below the cover plate of the display module and surrounds the display panel below the cover plate, and the infrared light generating circuit is used for emitting infrared light to enable the infrared light to cover the whole display panel.
Drawings
One or more embodiments are illustrated by way of example in the accompanying drawings, which correspond to the figures in which like reference numerals refer to similar elements and which are not to scale unless otherwise specified.
FIG. 1 is a schematic structural diagram of a display module according to a first embodiment of the present invention;
FIG. 2 is a schematic view of another structure of a display module according to a first embodiment of the invention;
FIG. 3 is a schematic view of a display module according to a first embodiment of the present invention;
fig. 4 is a schematic structural diagram of an infrared light generating circuit according to a first embodiment of the present invention;
fig. 5 is another schematic structural diagram of an infrared light generating circuit according to the first embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the embodiments of the present invention will be described in detail below with reference to the accompanying drawings. However, it will be appreciated by those of ordinary skill in the art that numerous technical details are set forth in order to provide a better understanding of the present application in various embodiments of the present invention. However, the technical solution claimed in the present application can be implemented without these technical details and various changes and modifications based on the following embodiments.
A first embodiment of the present invention relates to a display module, as shown in fig. 1 to 5, the display module of the present embodiment includes a cover plate 1, a display panel 42 disposed below the cover plate 1; and an infrared light generating circuit 7 disposed below the cover plate 1 and surrounding the display panel 4, the infrared light generating circuit 7 being configured to emit infrared light so that the infrared light covers the entire display panel 4; a signal receiving circuit 200 is arranged below the display panel 4, and the signal receiving circuit 200 is used for receiving the infrared light emitted by the infrared light generating circuit 7 and generating a fingerprint signal.
Compare in the design of infrared lamp and signal receiver integral type among the prior art, infrared lamp and signal receiver carry out the split in this embodiment, and infrared light generating circuit 7 has been set up alone, infrared light generating circuit 7 sets up in 1 below of the apron of display module assembly, and encircle display panel 4 of 1 below of apron, infrared light generating circuit 7 is used for transmitting infrared light so that infrared light covers whole display panel 4, thus, when the finger is located display panel 4's optional position department, signal receiving circuit 200 of infrared light to display panel 4 below can both reflect, the infrared light that the finger returned is received to signal receiving circuit 200, and generate the fingerprint signal, thereby can realize large tracts of land infrared fingerprint identification, high durability and convenient use, user experience can be promoted greatly.
The following description specifically describes implementation details of the display module according to the present embodiment, and the following description is only provided for facilitating understanding of the implementation details and is not necessary for implementing the present embodiment.
As shown in fig. 1 to 3, in some examples, the display module further includes: and a polarizer 3 disposed between the cover plate 1 and the display panel 4, the polarizer 3 being for reducing reflection of light incident from the cover plate 1 side to the display panel 4 side. The polarizer 3 and the cover plate 1 are bonded to each other with an Adhesive (OCA), which will be hereinafter referred to as an OCA Adhesive 2. Because OCA glue 2 cementation intensity is good, and have colorless transparent, the light transmissivity is at the characteristics above 90%, consequently, can avoid influencing light incidence to display panel 4.
As shown in fig. 1 to 3, for the flexible display panel 4, the display module further includes a support layer 5 located between the display panel 4 and the composite assembly 6, and the support layer 5 is used for supporting the flexible display panel 4.
In some embodiments, the display module further comprises: and a composite member 6 disposed between the display panel 4 and the signal receiving circuit 200. The composite member 6 functions as a buffer and a heat sink, and may include an adhesive layer, a foam layer, a polyimide layer, a metal layer (e.g., copper), and the like. The composite component 6 is also referred to as a composite foam layer.
Because the composite component 6 is opaque, the infrared light returned by the finger can be prevented from entering the signal receiving circuit 200, therefore, the composite component 6 is provided with a hollow hole, and the signal receiving circuit 200 is arranged corresponding to the hollow hole, so that the composite component 6 is prevented from blocking the infrared light. Since the infrared light covers the entire display panel 4, it is possible to reflect the infrared light to the lower side of the display panel 4 when the finger is located at any position of the display panel 4.
As shown in fig. 3, in order to ensure that the signal receiving circuit 200 can receive the infrared light returned by the finger when the finger is located at any position of the display panel 4, in this embodiment, a plurality of hollow holes are formed in the composite component 6, and the signal receiving circuit 200 includes a plurality of signal receivers, and each signal receiver corresponds to one hollow hole. So, can guarantee to the utmost that signal receiving circuit 200 receives the infrared light that the finger returned, and generate the fingerprint signal to can realize the infrared fingerprint identification of large tracts of land, convenient to use can promote user experience greatly.
In practical application, as shown in fig. 1 and fig. 2, the surface area of the signal receiver can be increased instead of increasing the number of the signal receivers, and accordingly, the area of the hollow hole on the composite component 6 is increased, so that the large-area infrared fingerprint identification can be realized.
As shown in fig. 4 and 5, in some embodiments, the infrared light generation circuit 7 includes: a first flexible circuit board 71 arranged around the display panel 4, and an infrared LED72 arranged on one side of the first flexible circuit board 71 close to the cover plate 1; the first flexible circuit board 71 is used to supply an electric signal to the infrared LED72, and the infrared LED72 is used to emit infrared light so that the infrared light covers the entire display panel 4.
Specifically, the infrared light generation circuit 7 includes: the first flexible circuit board 71 is disposed around the display panel 4, the first flexible circuit board 71 is in a hollow ring shape, and the hollow area exposes the display panel 4 so as to prevent the first flexible circuit board 71 from shielding the display panel 4. The infrared light generation circuit 7 further includes: the infrared LED72 and the infrared LED72 are arranged on one side of the first flexible circuit board 71 close to the cover plate 1. The first flexible circuit board 71 is electrically connected with the infrared LED72, the first flexible circuit board 71 provides an electric signal for the infrared LED72, and the infrared LED72 is used for emitting infrared light so that the infrared light covers the whole display panel 4, thereby realizing large-area infrared fingerprint identification.
In one implementation, the infrared LED72 is in the shape of a ring, as shown in fig. 4. The infrared LED72 is only one in number and has a ring-like configuration and is disposed around the display panel 4. One infrared LED72 can achieve coverage of infrared light over the entire display panel 4.
As another implementation, as shown in fig. 5, a plurality of infrared LEDs 72 are provided, and a plurality of infrared LEDs 72 are uniformly distributed on the first flexible circuit board 71. The number of the infrared LEDs 72 is plural, and the plurality of infrared LEDs 72 collectively emit infrared light so that the infrared light covers the entire display panel 4, thereby realizing large-area infrared fingerprint recognition.
In one embodiment, the plurality of infrared LEDs 72 can be arranged closely to form a ring shape without a gap between two adjacent infrared LEDs 72, so as to ensure the coverage of infrared light to the maximum extent.
In another embodiment, as shown in fig. 5, the display panel 4 has a square shape, and the first flexible circuit board 71 has substantially the same shape as the display panel 4. The first flexible circuit board 71 includes four corners corresponding to the four corners of the square display panel 4, respectively, and the first flexible circuit board 71 further includes four sides connecting the four corners. The infrared LEDs 72 are disposed at four corners of the first flexible circuit board 71, so as to ensure that the positions of the four corners of the display panel 4 can be covered by infrared light. The remaining other infrared LEDs 72 may be evenly distributed on four sides of the first flexible circuit board 71. Optionally, 2 or more infrared LEDs 72 may be disposed on the long side of the first flexible circuit board 71, and only one infrared LED72 may be disposed on the short side of the first flexible circuit board 71, so as to ensure the coverage of infrared light, reduce the number of infrared LEDs 72, and reduce the manufacturing cost. In this embodiment, the infrared LED72 with a large light emitting angle and surface light emission can be used to ensure the coverage of the single infrared LED72, so that the number of the infrared LEDs 72 can be reduced as much as possible to reduce the manufacturing cost.
In some embodiments, as shown in fig. 1 to 5, the display module further includes: and the sealant 8 is used for adhering the first flexible circuit board 71 to the lower part of the cover plate 1. In the present embodiment, the first flexible circuit board 71 is bonded and fixed below the cover plate 1 by the sealant 8.
Optionally, the sealant 8 is disposed around the display panel 4 and on a side of the infrared LED72 near the outer side of the display panel 4, and the sealant 8 is opaque. The sealant 8 in this embodiment is disposed around the display panel 4 to form an annular sealant 8, so as to firmly adhere and fix the first flexible circuit board 71 below the cover plate 1. The sealant 8 is located at one side of the infrared LED72 close to the outer side of the display panel 4, and the sealant 8 is light-proof, so that light emitted from the surface of the infrared LED72 can be blocked, and the side wall of the display module is exposed. The sealant 8 not only plays a role in fixing the first flexible circuit board 71, but also is used for blocking light emitted by the infrared LED72 in the display module without emitting outside.
In some embodiments, the display module further includes: and a brightness enhancement film 9 provided between the display panel 4 and the signal receiving circuit 200. The brightness enhancement film 9 can concentrate infrared light returned by a finger toward the signal receiving circuit 200 to improve the brightness. It should be noted that the brightness enhancement film 9 is disposed below the display panel 4 far from the cover plate 1, because if the brightness enhancement film 9 is disposed above the display panel 4, when the display panel 4 emits light for displaying, the brightness enhancement film 9 will converge the light emitted from the display panel 4, thereby reducing the light emitting angle of the display panel 4 and affecting the light emitting display effect of the display panel 4. Therefore, in order to prevent the brightness enhancement film 9 from affecting the light emitting display effect of the display panel 4, the brightness enhancement film 9 is provided below the display panel 4.
In some embodiments, the display module further comprises: a composite member 6 disposed below the display panel 4; the brightness enhancement film 9 is located between the display panel 4 and the composite member 6. The composite member 6 serves as a buffer and a heat sink, and may include an adhesive layer, a foam layer, a polyimide layer, a metal layer (e.g., copper), and the like. The composite component 6 is also referred to as a composite foam layer. In this embodiment, the composite assembly 6 is opaque, and can block the infrared light returned by the finger, so that the bright enhancement film 9 is disposed between the display panel 4 and the composite assembly 6 to ensure the use effect of the bright enhancement film 9.
It should be noted that, for the flexible display panel 4, the display module further includes a support layer 5 located between the display panel 4 and the composite component 6, and the support layer 5 is used for supporting the flexible display panel 4. At this time, the brightness enhancement film 9 may be disposed between the support layer 5 and the composite member 6.
Alternatively, the brightness enhancement film 9 includes: an upper substrate 91, a lower substrate 92, and two prism structure layers 93 located between the upper substrate 91 and the lower substrate 92; each prism structure layer 93 is formed by arraying a plurality of prism unit structures in the same direction, two prism structure layers 93 are oppositely arranged, and the prism unit structures on the two prism structure layers 93 are arranged in a staggered manner. The edges and corners of each prism unit structure can be arranged in an arc shape, a trapezoid shape or a triangle shape. In the drawings of the present embodiment, the edges and corners of the prism unit structure are triangular, for example: the bright enhancement film 9 has better light-gathering effect when the angle can be 90 degrees.
The display panel 4 includes: the flat part 40 and the bending part 41 positioned on one side of the flat part, the bending part is bent to one side of the flat part far away from the cover plate 1; the display module assembly still includes: a second flexible circuit board 100 located below the flat portion and connected to the bent portion; the first flexible circuit board 71 extends from a side close to the bending portion, bends to a side of the flat portion away from the cover plate 1, and is electrically connected to the second flexible circuit board 100.
Specifically, in the present embodiment, the display panel 4 is a flexible display panel 4, the display panel 4 includes a flat portion and a bending portion located on one side of the flat portion, the bending portion can be bent to one side of the flat portion away from the cover plate 1, the bending portion is electrically connected to the second flexible circuit board 100 located below the flat portion, and the IC chip 101 is disposed on the bending portion. Such a Bending manner of the flexible display panel 4 is called as Pad bonding technology. The second flexible circuit board 100 is a main flexible circuit board, and is used for providing electrical signals for the IC chip and the circuits in the display panel 4. In this embodiment, the first flexible circuit board 71 extends from a side close to the bending portion, bends to a side of the flat portion away from the cover plate 1, and is electrically connected to the second flexible circuit board 100, and the second flexible circuit board 100 provides an electrical signal for the first flexible circuit board 71. The first flexible circuit board 71 is disposed on one side of the flexible display panel 4Pad bonding to avoid occupying too much space in the display module.
When the display panel 4 is the flexible display panel 4, another bonding technology exists, as shown in the figure, the display panel 4 is flat, the second flexible circuit board 100 is bonded on the display panel 4, the second flexible circuit board 100 can be bent to one side of the display panel 4 far away from the cover plate 1, and the IC chip is disposed on the portion of the second flexible circuit board 100 bent to the back of the display panel 4. The flexible display panel 4 is bent in a mode called COF bonding technology, COF is a Chip On Film, and is called Chip On Flex or Chip On Film in English. At this time, the first flexible circuit board 71 is disposed on one side of the flexible display panel 4COF bonding to avoid occupying too much space in the display module.
Specifically, because the second flexible circuit board 100 is disposed on one side of the display panel 4 away from the cover plate 1, and the second flexible circuit board 100 is opaque, in order to prevent the second flexible circuit board 100 from blocking infrared light from entering the signal receiving circuit 200, or the signal receiving circuit 200 is disposed on the second flexible circuit board 100, or a hollow hole is formed in the second flexible circuit board 100, and the hollow hole in the second flexible circuit board 100 needs to correspond to the hollow hole in the composite component 6 one-to-one, so that it can be ensured that the signal receiving circuit 200 receives the infrared light returned by the finger to the greatest extent.
Compared with the prior art, the embodiment of the invention provides a display module, which is formed by splitting an infrared lamp and a signal receiver, and an infrared light generating circuit 7 is separately provided, the infrared light generating circuit 7 is provided below the cover plate 1 of the display module and surrounds the display panel 4 below the cover plate 1, the infrared light generating circuit 7 is used for emitting infrared light so that the infrared light covers the whole display panel 4, thus, when the finger is located at any position of the display panel 4, the infrared light can be reflected to the signal receiving circuit 200 below the display panel 4, the signal receiving circuit 200 receives the infrared light returned by the finger and generates a fingerprint signal, therefore, large-area infrared fingerprint identification can be realized, the use is convenient, and the user experience can be greatly improved.
It will be understood by those of ordinary skill in the art that the foregoing embodiments are specific examples for carrying out the invention, and that various changes in form and details may be made therein without departing from the spirit and scope of the invention in practice.

Claims (10)

1. A display module is characterized by comprising a cover plate and a display panel arranged below the cover plate;
the infrared light generating circuit is arranged below the cover plate and surrounds the display panel, and is used for emitting infrared light so that the infrared light covers the whole display panel;
and a signal receiving circuit is arranged below the display panel and used for receiving the infrared light emitted by the infrared light generating circuit and generating a fingerprint signal.
2. The display module of claim 1, wherein the infrared light generating circuit comprises: the display panel comprises a first flexible circuit board arranged around the display panel and an infrared LED arranged on one side, close to the cover plate, of the first flexible circuit board;
the first flexible circuit board is used for providing electric signals for the infrared LED, and the infrared LED is used for emitting infrared light so that the infrared light covers the whole display panel.
3. The display module of claim 2, wherein the infrared LED is ring-shaped; or the infrared LEDs are arranged in a plurality and are uniformly distributed on the first flexible circuit board.
4. The display module assembly of claim 2, wherein the display module assembly further comprises: and the sealant is used for adhering the first flexible circuit board to the lower part of the cover plate.
5. The display module of claim 4, wherein the sealant is disposed around the display panel and on a side of the infrared LED adjacent to an outer side of the display panel, and the sealant is opaque to light.
6. The display module assembly of claim 1, wherein the display module assembly further comprises: and the brightness enhancement film is arranged between the display panel and the signal receiving circuit.
7. The display module assembly of claim 6, wherein the display module assembly further comprises: a composite assembly disposed below the display panel;
the brightness enhancement film is positioned between the display panel and the composite component.
8. The display module of claim 6, wherein the brightness enhancement film comprises: the prism structure comprises an upper base material, a lower base material and two prism structure layers positioned between the upper base material and the lower base material;
every prism structural layer is arranged into the array by a plurality of prism cell structure according to same direction, two prism structural layer sets up relatively, and two prism cell structure on the prism structural layer sets up in the crisscross.
9. The display module assembly of claim 1, wherein the display module assembly further comprises: a composite assembly disposed between the display panel and the signal receiving circuit;
the composite component is provided with a plurality of hollow holes, the signal receiving circuit comprises a plurality of signal receivers, and each signal receiver corresponds to one hollow hole.
10. The display module of claim 2, wherein the display panel comprises: the flat part and the bent part are positioned on one side of the flat part, and the bent part is bent to one side of the flat part, which is far away from the cover plate;
the display module assembly still includes: the second flexible circuit board is positioned below the flat part and connected with the bent part; the first flexible circuit board extends from one side close to the bending part, bends to one side of the flat part far away from the cover plate, and is electrically connected with the second flexible circuit board.
CN202110604187.6A 2021-05-31 2021-05-31 Display module Pending CN113343825A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110604187.6A CN113343825A (en) 2021-05-31 2021-05-31 Display module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110604187.6A CN113343825A (en) 2021-05-31 2021-05-31 Display module

Publications (1)

Publication Number Publication Date
CN113343825A true CN113343825A (en) 2021-09-03

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202110604187.6A Pending CN113343825A (en) 2021-05-31 2021-05-31 Display module

Country Status (1)

Country Link
CN (1) CN113343825A (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN208654763U (en) * 2018-07-31 2019-03-26 Oppo广东移动通信有限公司 Display screen component and electronic equipment
CN111414881A (en) * 2017-05-12 2020-07-14 Oppo广东移动通信有限公司 Display device and mobile terminal
CN111444842A (en) * 2020-03-26 2020-07-24 维沃移动通信有限公司 Display assembly and electronic equipment

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111414881A (en) * 2017-05-12 2020-07-14 Oppo广东移动通信有限公司 Display device and mobile terminal
CN208654763U (en) * 2018-07-31 2019-03-26 Oppo广东移动通信有限公司 Display screen component and electronic equipment
CN111444842A (en) * 2020-03-26 2020-07-24 维沃移动通信有限公司 Display assembly and electronic equipment

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Application publication date: 20210903