CN113328026B - High-power LED chip packaging device - Google Patents
High-power LED chip packaging device Download PDFInfo
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- CN113328026B CN113328026B CN202110594129.XA CN202110594129A CN113328026B CN 113328026 B CN113328026 B CN 113328026B CN 202110594129 A CN202110594129 A CN 202110594129A CN 113328026 B CN113328026 B CN 113328026B
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 62
- 230000008093 supporting effect Effects 0.000 claims description 81
- 230000005540 biological transmission Effects 0.000 claims description 38
- 238000009434 installation Methods 0.000 abstract description 15
- 230000000694 effects Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 206010066054 Dysmorphism Diseases 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Packaging Frangible Articles (AREA)
Abstract
The invention provides a high-power LED chip packaging device, which belongs to the technical field of chip packaging and comprises a packaging part, an elastic jacking part, a first limiting part, a resetting part, a second limiting part, a limiting part and a driving part, wherein a chip mounting area is arranged on one side of the packaging part, the elastic jacking part is movably arranged in the chip mounting area, one end of the elastic jacking part extends into the packaging part and is connected with the driving part, the first limiting part is movably arranged in the packaging part and is connected with the driving part, the second limiting part is arranged on one side of the first limiting part, the limiting part is fixedly arranged in the packaging part and can be matched with the second limiting part to form a locking state, and one end of the resetting part is connected with the first limiting part. Compared with the prior art, the embodiment of the invention can realize the quick installation of the chip and has the advantage of quick and convenient chip installation.
Description
Technical Field
The invention belongs to the technical field of chip packaging, and particularly relates to a high-power LED chip packaging device.
Background
At present, after the production of the high-power LED chip is finished, the high-power LED chip needs to be installed in a corresponding equipment shell for bearing, fixing and protecting the LED chip.
In the prior art, when the LED chip is installed inside the equipment shell, the LED chip is connected with the shell mostly through modes such as buckles or screws, and although the connection of the mode is firm, the problems of complex operation and the like exist, so that the installation of the LED chip is not convenient enough, and the installation efficiency of the LED chip is influenced to a great extent.
Disclosure of Invention
In view of the above deficiencies of the prior art, an embodiment of the present invention provides a high power LED chip package device.
In order to solve the technical problems, the invention provides the following technical scheme:
a high-power LED chip packaging device comprises a packaging part, an elastic supporting part, a first limit part, a reset part, a second limit part, a limit part and a driving part,
one side of the packaging part is provided with a chip mounting area, the elastic jacking part is movably arranged in the chip mounting area, one end of the elastic jacking part extends into the packaging part and is connected with the driving part,
the first limit part is movably arranged in the packaging part and is connected with the driving part, the second limit part is arranged at one side of the first limit part,
the limiting piece is fixedly arranged in the packaging part and can be matched with the second limiting part to form a locking state, one end of the resetting part is connected with the first limiting part, the other end of the resetting part is connected with the inner wall of the packaging part and is used for providing elastic tension for the first limiting part,
the elastic supporting part can drive the driving part to move when moving, so as to drive the first limiting part to move towards the direction of the chip mounting area and press against one side of the chip, and at the moment, a locking state is formed between the second limiting part and the limiting part so as to prevent the first limiting part from moving reversely.
As a further improvement of the invention: the elastic supporting part comprises a supporting part, a supporting part and an elastic part,
the supporting part is fixedly arranged on one side of the supporting part, one end, far away from the supporting part, of the supporting part extends into the packaging part and is movably matched with the packaging part, one end of the elastic part is connected with the supporting part, and the other end of the elastic part is connected with the packaging part.
As a further improvement of the invention: the side wall of the supporting piece is fixedly provided with a sliding pin,
the driving part comprises a connecting piece and a transmission part, the driving rod is rotatably arranged in the packaging part, the connecting piece is connected with the first limiting part through the transmission part, a special-shaped groove is formed in the connecting piece, one end of the sliding pin, far away from the supporting piece, extends into the special-shaped groove and is in sliding fit with the special-shaped groove,
when the supporting piece moves, the sliding pin can be driven to slide along the inside of the special-shaped groove, so that the connecting piece is driven to move, and when the connecting piece moves, the first limiting part can be driven by the transmission part to move and abut against one side of the chip.
As a further improvement scheme of the invention: the special-shaped groove is of an inclined structure, the connecting piece is of a plate-shaped structure, the connecting piece is arranged inside the packaging portion in a sliding mode, the transmission portion is a connecting rod, one end of the connecting rod is connected with the connecting piece, and the other end of the connecting rod is connected with the first limiting portion.
As a still further improvement of the invention: the dysmorphism groove is helical structure, the connecting piece is shaft-like structure, and the connecting piece rotates and sets up inside encapsulation portion, transmission portion is including fixed the setting incomplete gear on the connecting piece and fixed the setting are in the transmission rack of first spacing portion one side, incomplete gear can with the meshing of transmission rack.
As a still further improvement scheme of the invention: the first limiting portion comprises a butt connection piece and a pulling connection piece, the butt connection piece is fixedly arranged at one end of the pulling connection piece, one end of the resetting portion is connected with the pulling connection piece, the other end of the resetting portion is connected with the inner wall of the packaging portion, and the transmission rack is fixedly arranged on one side of the pulling connection piece.
As a still further improvement of the invention: the second limiting part comprises an elastic sheet and a hook part, the elastic sheet is arranged at one end, away from the pulling and connecting piece, of the transmission rack, and the hook part is arranged at one end, away from the transmission rack, of the elastic sheet and used for forming a locking state with the limiting part to prevent the limiting part from moving reversely.
As a still further improvement scheme of the invention: the elastic sheet is positioned on one side of the end part of the supporting piece, and the supporting piece can act on the elastic sheet and drive the elastic sheet to deform when moving so as to drive the hook part to be separated from one side of the limiting piece.
As a still further improvement scheme of the invention: the pulling and connecting piece is connected with the inner wall of the packaging part in a sliding mode through a sliding part.
As a still further improvement scheme of the invention: the sliding part comprises a guide rail fixedly installed on the inner wall of the packaging part and a sliding block fixedly arranged at one end, far away from the abutting part, of the pulling and connecting part, and the sliding block is in sliding fit with the guide rail.
Compared with the prior art, the invention has the beneficial effects that:
when the chip is installed, the chip can be arranged on one side of the elastic supporting portion, then the chip is pressed, the chip drives the elastic supporting portion to move, the driving portion can be driven to move when the elastic supporting portion moves, the first limiting portion is further driven to move towards the direction of the chip installation area, after the chip moves to a certain position, the first limiting portion is pressed against one side of the chip, and therefore position limitation of the chip is achieved, at the moment, the first limiting portion can drive the second limiting portion to move to a position between the first limiting portion and the limiting portion to form a locking state, and therefore reverse movement of the first limiting portion is prevented, firmness of chip installation is guaranteed.
Drawings
FIG. 1 is a schematic structural diagram of a high power LED chip packaging device;
FIG. 2 is a schematic view of the installation of a limiting portion and a driving portion in a high power LED chip packaging device;
FIG. 3 is a schematic view of a flexible supporting portion of a high power LED chip package device;
in the figure: 1-packaging part, 11-chip mounting region, 12-limiting hole, 2-supporting part, 3-elastic supporting part, 31-sliding pin, 32-supporting part, 33-elastic part, 4-first limiting part, 41-abutting part, 42-pulling part, 43-resetting part, 44-transmission rack, 45-second limiting part, 5-sliding part, 51-sliding block, 52-guide rail, 6-limiting part, 7-driving part, 71-incomplete gear, 72-connecting part and 73-special-shaped groove.
Detailed Description
The technical solution of the present patent will be described in further detail with reference to the following embodiments.
Reference will now be made in detail to embodiments of the present patent, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present patent and are not to be construed as limiting the present patent.
In the description of this patent, it is to be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientations and positional relationships indicated in the drawings for the convenience of describing the patent and for the simplicity of description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the patent.
In the description of this patent, it is noted that unless otherwise specifically stated or limited, the terms "mounted," "connected," and "disposed" are to be construed broadly and can include, for example, fixedly connected, disposed, detachably connected, disposed, or integrally connected and disposed. The specific meaning of the above terms in this patent may be understood by those of ordinary skill in the art as appropriate.
Referring to the drawings, the embodiment provides a high-power LED chip packaging device, which includes a packaging portion 1, an elastic supporting portion 3, a first limiting portion 4, a reset portion 43, a second limiting portion 45, a limiting member 6 and a driving portion 7, wherein a chip mounting region 11 is provided at one side of the packaging portion 1, the elastic supporting portion 3 is movably disposed inside the chip mounting region 11, one end of the elastic supporting portion 3 extends into the packaging portion 1 and is connected to the driving portion 7, the first limiting portion 4 is movably disposed inside the packaging portion 1 and is connected to the driving portion 7, the second limiting portion 5 is disposed at one side of the first limiting portion 4, the limiting member 6 is fixedly disposed inside the packaging portion 1 and can be matched with the second limiting portion 5 to form a locking state, one end of the reset portion 43 is connected to the first limiting portion 4, the other end of the elastic supporting portion is connected with the inner wall of the packaging portion 1 and used for providing elastic tension for the first limiting portion 4, the elastic supporting portion 3 can drive the driving portion 7 to move when moving, the first limiting portion 4 is further driven to move towards the chip mounting area 11 and is abutted against one side of the chip, and at the moment, a locking state is formed between the second limiting portion 5 and the limiting piece 6 so as to prevent the first limiting portion 4 from moving reversely.
When installing the chip, can arrange the chip in 3 one sides of elasticity top supporting part, then press the chip, the chip drives elasticity top supporting part 3 and removes, can drive 7 movements of drive portion when elasticity top supporting part 3 removes, and then drive first spacing portion 4 and remove to 11 directions in chip installing zone, remove to a locating position after the chip, first spacing portion 4 supports and presses to chip one side, thereby realize that the position of chip is injectd, and at this moment, first spacing portion 4 can drive the spacing portion 5 of second and remove to and form the lock-out state between locating part 6, thereby prevent the reverse movement of first spacing portion 4, guarantee the fastness of chip installation.
Referring to fig. 1 and 3, in an embodiment, the elastic supporting portion 3 includes a supporting portion 2, a supporting portion 32, and an elastic member 33, the supporting portion 32 is fixedly disposed at one side of the supporting portion 2, one end of the supporting portion 32 away from the supporting portion 2 extends into the encapsulating portion 1 and is movably engaged with the encapsulating portion 1, and one end of the elastic member 33 is connected to the supporting portion 2, and the other end is connected to the encapsulating portion 1.
When installing the chip, can arrange the chip in supporting part 2 one side, press the chip, the chip drives supporting part 2 and support piece 32 and removes, make support piece 32 to the inside removal of encapsulation portion 1, elastic component 33 pressurized this moment, after first spacing portion 4 removed certain distance to chip mounting region 11 direction, first spacing portion 4 can act on the marginal position that supporting part 2 one side was kept away from to the chip, then stop pressing of chip, this moment under the supporting role of elastic component 33, the installation of chip is realized to the cooperation of first spacing portion 4.
In another embodiment, the elastic supporting portion 3 may further include a guide sleeve, a guide rod, and an elastic portion, one end of the guide sleeve is fixedly connected to the packaging portion 1, one end of the guide rod extends into the guide sleeve and is in telescopic fit with the guide sleeve, and the elastic portion is disposed in the guide sleeve and abuts against one end of the guide rod.
When installing the chip, can arrange the chip in guide bar one side in, press the chip, the chip drives the guide bar and moves to the guide sleeve is inside, and the elastic part pressurized this moment, after first spacing portion 4 removes the certain distance to 11 directions in chip installation area, first spacing portion 4 can act on the marginal position that supporting part 2 one side was kept away from to the chip, then stops pressing of chip, and under the supporting role of elastic part this moment, the installation of chip is realized to first spacing portion 4 of cooperation.
In the above embodiments, the elastic member 33 and the elastic portion are both springs or metal elastic pieces, which are not limited herein; the support member 32 is a support post or a support sleeve.
Referring to fig. 1, in an embodiment, a sliding pin 31 is fixedly disposed on a side wall of the supporting member 32, the driving portion 7 includes a connecting member 72 and a transmission portion, the driving rod 72 is rotatably disposed inside the packaging portion 1, the connecting member 72 is connected to the first position-limiting portion 4 through the transmission portion, a special-shaped groove 73 is disposed on the connecting member 72, one end of the sliding pin 31, which is away from the supporting member 32, extends into the special-shaped groove 73 and is in sliding fit with the special-shaped groove 73, when the supporting member 32 moves, the sliding pin 31 can be driven to slide along the inside of the special-shaped groove 73, so as to drive the connecting member 72 to move, and when the connecting member 72 moves, the transmission portion can drive the first position-limiting portion 4 to move and press against one side of the chip, so as to achieve position limitation of the chip.
In the above embodiment, the special-shaped groove 73 has an inclined structure or a spiral structure, when the special-shaped groove 73 has an inclined structure, the connecting member 72 has a plate-shaped structure, the connecting member 72 is slidably disposed inside the enclosure portion 1, the transmission portion is a connecting rod, one end of the connecting rod is connected to the connecting member 72, and the other end of the connecting rod is connected to the first limiting portion 4.
When the supporting element 32 moves, the sliding pin 31 can be driven to slide along the inside of the inclined irregular groove 73, and the connecting element 72 is slidably disposed inside the packaging portion 1, so as to drive the connecting element 72 to slide, so as to drive the first limiting portion 4 to move toward the chip mounting region 11.
When the special-shaped groove 73 is a spiral structure, please refer to fig. 2, the connecting member 72 is a rod-shaped structure, and the connecting member 72 is rotatably disposed inside the packaging part 1, the transmission part includes an incomplete gear 71 fixedly disposed on the connecting member 72 and a transmission rack 44 fixedly disposed on one side of the first limiting part 4, and the incomplete gear 71 can be engaged with the transmission rack 44.
When the supporting member 32 moves, the sliding pin 31 can be driven to slide along the inside of the spiral-structured special-shaped groove 73, and since the connecting member 72 is rotatably disposed inside the packaging portion 1, the sliding pin 31 drives the connecting member 72 to rotate, and further drives the incomplete gear 71 to rotate, and the first limiting portion 4 is driven to move toward the chip mounting region 11 by the meshing action between the incomplete gear 71 and the transmission rack 44.
Referring to fig. 1, in an embodiment, the first position-limiting portion 4 includes an abutting member 41 and a pulling member 42, the abutting member 41 is fixedly disposed at one end of the pulling member 42, one end of the resetting portion 43 is connected to the pulling member 42, the other end is connected to the inner wall of the packaging portion 1, and the transmission rack 44 is fixedly disposed at one side of the pulling member 42.
When the incomplete gear 71 rotates, the pulling member 42 is driven to move through the meshing action between the incomplete gear 71 and the transmission rack 44, and then the abutting member 41 is driven to move, so that the abutting member 41 moves into the chip mounting region 11 and acts on the edge position of the chip, and the 2-position limitation of the chip is realized by matching the supporting action of the elastic member 33.
In another embodiment, the first position-limiting portion 4 may further include a hook plate having an arc structure or an L-shaped structure, one end of the reset portion 43 is connected to the hook plate, the other end of the reset portion is connected to the inner wall of the packaging portion 1, and the transmission rack 44 is fixedly disposed on one side of the hook plate.
When the incomplete gear 71 rotates, the hook plate is driven to move through the meshing action between the incomplete gear and the transmission rack 44, so that the hook plate moves into the chip mounting area 11 and hooks the edge position of the chip, and the 2-position limitation of the chip is realized by matching with the supporting action of the elastic piece 33.
In the above embodiment, the pulling member 42 has a rod-like or plate-like structure, and the abutting member 41 has a plate-like or sheet-like structure.
Referring to fig. 1 and 2, in an embodiment, the limiting member 6 is a rod-shaped or plate-shaped structure, the second limiting portion 45 includes a spring piece and a hook portion, the spring piece is disposed at one end of the transmission rack 44 away from the pull-connecting member 42, and the hook portion is disposed at one end of the spring piece away from the transmission rack 44, and is configured to form a locking state with the limiting member 6 to prevent the limiting member 4 from moving reversely.
When the transmission rack 44 drives the pulling piece 42 to move, the elastic piece and the hook portion can be driven to move, when the elastic piece drives the hook portion to move to one side of the limiting piece 6, the hook portion can act on the limiting piece 6 and bypass from one side of the limiting piece 6, the elastic piece is bent at the moment, and the hook portion gets to the other side of the limiting piece 6 after passing through the limiting piece 6, so that the position of the first limiting portion 4 is limited, the limiting state of the first limiting portion 4 on a chip is guaranteed, and the chip is locked.
In one embodiment, the elastic sheet is located at one side of the end of the supporting member 32, and the supporting member 32 can act on the elastic sheet and drive the elastic sheet to deform when moving, so as to drive the hook portion to disengage from one side of the limiting member 6.
When the chip needs to be taken out, the chip can be continuously pressed, the chip drives the elastic supporting part 3 to continuously move, the supporting part 32 can act on the elastic sheet and drive the elastic sheet to deform when moving, and then the hook part is driven to move, so that the hook part is separated from one side of the limiting part 6, the incomplete gear 71 is just in a separation state with the transmission rack 44, after the hook part is separated from one side of the limiting part 6, under the pulling action of the resetting part 43, the pulling part 42 and the abutting part 41 can be driven to reversely move, so that the abutting part 41 is removed from the inside of the chip mounting area 11, and the chip can be taken at the moment.
In another embodiment, the second position-limiting portion 45 may further include a supporting rod fixedly disposed at an end of the conventional rack 44 away from the pull-connecting member 42 and a first magnet disposed at an end of the supporting rod away from the conventional rack 44, the position-limiting member 6 is a second magnet, the second magnet and the first magnet are attracted to each other, and the supporting rod is provided with an inclined hole for the supporting member 32 to enter.
When the transmission rack 44 drives the supporting plate to move to a certain position, attraction is generated between the first magnet and the second magnet, the attraction can overcome the pulling force of the reset part 43, so that the abutting part 41 is limited on one side of the chip, the position limitation of the chip is realized, at the moment, the transmission rack 44 and the incomplete gear 71 are separated from engagement, when the chip needs to be taken out, the chip is continuously pressed, the chip drives the supporting part 32 to move, the supporting part 32 can enter the inclined hole and drive the supporting rod to move reversely, the first magnet and the second magnet are gradually far away until the attraction between the first magnet and the second magnet is not enough to overcome the pulling force of the reset part 43, at the moment, the reset part 43 can pull the pull-connecting part 42 to move reversely, so that the abutting part 41 is pulled away from the chip mounting area 11.
In one embodiment, the reset portion 43 is a spring or an elastic rubber strip.
Referring to fig. 1, in an embodiment, the pulling-connecting member 42 is slidably connected to the inner wall of the packaging portion 1 through a sliding portion 5, and the sliding portion 5 is arranged to enhance a guiding effect on the movement of the pulling-connecting member 42, so as to ensure that the pulling-connecting member 42 moves smoothly.
Referring to fig. 1, in an embodiment, the sliding portion 5 includes a guide rail 52 fixedly installed on an inner wall of the enclosure portion 1, and a slider 51 fixedly disposed at an end of the pull-connecting member 42 away from the abutting member 41, and the slider 51 is slidably engaged with the guide rail 52.
In another embodiment, the sliding portion 5 may further include a sliding rod fixedly disposed on the inner wall of the packaging portion 1, and a sleeve fixedly disposed at an end of the pulling-connecting member 42 far away from the abutting member 41, and the sleeve is sleeved outside the sliding rod and slidably engaged with the sliding rod.
Referring to fig. 1, in an embodiment, the structure of the package portion 1 is not limited, the package portion 1 is provided to provide a support for mounting a chip, and a person skilled in the art can reasonably design the package portion as needed by only ensuring that a cavity for accommodating the driving portion 7, the limiting portion 4 and the sliding portion 5 is formed inside the package portion 1, the chip mounting region 11 is a recess formed on one side of the package portion 1, the sidewall of the recess is provided with a limiting hole 12 through which the abutting member 41 can enter the recess, and the recess is configured to prevent the chip from protruding outside the package portion 1 during mounting, thereby providing a certain protection effect on the chip.
When the chip is installed in the embodiment of the invention, the chip can be arranged on one side of the elastic supporting part 3, then the chip is pressed, the chip drives the elastic supporting part 3 to move, the driving part 7 can be driven to move when the elastic supporting part 3 moves, and the first limiting part 4 is further driven to move towards the chip installation area 11, after the chip moves to a certain position, the first limiting part 4 is pressed against one side of the chip, so that the position limitation of the chip is realized, at the moment, the first limiting part 4 can drive the second limiting part 5 to move to form a locking state with the limiting part 6, so that the reverse movement of the first limiting part 4 is prevented, the firmness of the chip installation is ensured, and compared with the prior art, the quick installation of the chip can be realized, and the chip installation has the advantages of quickness and convenience.
Although the preferred embodiments of the present patent have been described in detail, the present patent is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present patent within the knowledge of those skilled in the art.
Claims (9)
1. A high-power LED chip packaging device is characterized by comprising a packaging part, an elastic jacking part, a first limiting part, a resetting part, a second limiting part, a limiting part and a driving part,
one side of the packaging part is provided with a chip mounting area, the elastic top supporting part is movably arranged in the chip mounting area, one end of the elastic top supporting part extends into the packaging part and is connected with the driving part,
the first limit part is movably arranged in the packaging part and is connected with the driving part, the second limit part is arranged at one side of the first limit part,
the limiting piece is fixedly arranged in the packaging part and can be matched with the second limiting part to form a locking state, one end of the resetting part is connected with the first limiting part, the other end of the resetting part is connected with the inner wall of the packaging part and is used for providing elastic tension for the first limiting part,
when the elastic supporting part moves, the driving part can be driven to move, so that the first limiting part is driven to move towards the direction of the chip mounting area and is pressed against one side of the chip, and at the moment, a locking state is formed between the second limiting part and the limiting part so as to prevent the first limiting part from moving reversely;
the elastic jacking portion comprises a supporting piece, a sliding pin is fixedly arranged on the side wall of the supporting piece,
the driving part comprises a connecting piece and a transmission part, the connecting piece is rotatably arranged in the packaging part, the connecting piece is connected with the first limiting part through the transmission part, a special-shaped groove is formed in the connecting piece, one end of the sliding pin, far away from the supporting piece, extends into the special-shaped groove and is in sliding fit with the special-shaped groove,
when the supporting piece moves, the sliding pin can be driven to slide along the inner part of the special-shaped groove, so that the connecting piece is driven to move, and when the connecting piece moves, the first limiting part can be driven by the transmission part to move and abut against one side of the chip.
2. The packaging device of claim 1, wherein the resilient supporting portion further comprises a supporting portion and a resilient member,
the supporting part is fixedly arranged on one side of the supporting part, one end, far away from the supporting part, of the supporting part extends into the packaging part and is movably matched with the packaging part, one end of the elastic part is connected with the supporting part, and the other end of the elastic part is connected with the packaging part.
3. The high power LED chip package apparatus according to claim 1, wherein the shaped groove has an inclined structure, the connecting member has a plate-like structure, and is slidably disposed inside the package portion, the transmission portion is a connecting rod, one end of the connecting rod is connected to the connecting member, and the other end of the connecting rod is connected to the first position-limiting portion.
4. The high power LED chip package device according to claim 1, wherein the special-shaped groove is a spiral structure, the connecting member is a rod-shaped structure, and the connecting member is rotatably disposed inside the package portion, the transmission portion includes an incomplete gear fixedly disposed on the connecting member and a transmission rack fixedly disposed on one side of the first position-limiting portion, and the incomplete gear can be engaged with the transmission rack.
5. The high-power LED chip packaging device according to claim 4, wherein the first limiting portion comprises an abutting member and a pulling member, the abutting member is fixedly disposed at one end of the pulling member, one end of the resetting portion is connected to the pulling member, the other end of the resetting portion is connected to the inner wall of the packaging portion, and the transmission rack is fixedly disposed at one side of the pulling member.
6. The high-power LED chip packaging device according to claim 5, wherein the second position-limiting portion comprises a spring piece and a hook portion, the spring piece is disposed at one end of the transmission rack away from the pull-connecting piece, and the hook portion is disposed at one end of the spring piece away from the transmission rack and is used for forming a locking state with the position-limiting piece to prevent the position-limiting portion from moving reversely.
7. The device of claim 6, wherein the spring is disposed at one side of the end of the supporting member, and the supporting member is movable to act on the spring and deform the spring to separate the hook from the side of the limiting member.
8. The packaging device of claim 5, wherein the pull member is slidably connected to the inner wall of the packaging portion through a sliding portion.
9. The high power LED chip package assembly according to claim 8, wherein said sliding portion comprises a guide rail fixedly mounted on an inner wall of said package portion and a sliding block fixedly disposed at an end of said pulling member away from said abutting member, said sliding block being slidably engaged with said guide rail.
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| CN202110594129.XA CN113328026B (en) | 2021-05-28 | 2021-05-28 | High-power LED chip packaging device |
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| CN202110594129.XA CN113328026B (en) | 2021-05-28 | 2021-05-28 | High-power LED chip packaging device |
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| CN114035022A (en) * | 2021-10-21 | 2022-02-11 | 武汉光谷信息光电子创新中心有限公司 | Test tool and test system of chip |
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