CN113327869A - Shunting and pressurizing device and method for semiconductor equipment - Google Patents
Shunting and pressurizing device and method for semiconductor equipment Download PDFInfo
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- CN113327869A CN113327869A CN202011497107.3A CN202011497107A CN113327869A CN 113327869 A CN113327869 A CN 113327869A CN 202011497107 A CN202011497107 A CN 202011497107A CN 113327869 A CN113327869 A CN 113327869A
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- reposition
- air
- redundant personnel
- shunting
- shunt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to the semiconductor field, in particular to a shunting and pressurizing device and a method for semiconductor equipment, which comprises a first air supply system, a shunting system, an air speed controller and a power supply module, wherein airflow is shunted and pressurized by the first air supply system and a second air supply system, the uniformity of the air flow of an operation area is ensured by arranging a shunting area and a detention area in shunting, the reprocessing time is saved to a great extent, the equipment adjusting period is shortened, the first air supply system and the second air supply system are conveniently controlled by the air speed controller, the operation convenience and the uniformity of the air flow distribution of the operation area are effectively improved, the angles of a vertical shunting rod and a horizontal shunting rod on a shunting air outlet and an air outlet are adjusted by a first rotating motor and a second rotating motor, and the air flow and the uniformity of the air supply system are systematically distributed, the process precision requirement of the equipment on the air flow is improved, and the actual production efficiency is improved.
Description
Technical Field
The invention relates to the field of semiconductors, in particular to a shunting and pressurizing device and method for semiconductor equipment.
Background
In the production process of a semiconductor front-end process wafer, the cost is high due to the complex process, the requirements on the wafer productivity and the qualified rate are very strict, in the actual production of semiconductor equipment, the productivity is reduced and the product qualified rate cannot be met due to the fact that the temperature, the humidity and the air flow inside the equipment are not uniform, in the prior art, an air supply system directly exhausts air to a working area, the distribution and the non-uniformity of the air supply system cannot guarantee the wafer process requirements, multiple times of adjustment are needed, the operation time is seriously influenced, and the qualified rate is reduced.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides the flow dividing and pressurizing device and method for the semiconductor equipment, which have uniform airflow and improve the processing precision.
(II) technical scheme
In order to achieve the purpose, the invention provides the following technical scheme: the invention relates to a shunting supercharging device for semiconductor equipment, which comprises a first air supply system, a shunting system, an air speed controller and a power supply module, wherein the first air supply system is connected with the shunting system, the shunting system comprises a shunting pipe and a second air supply system, a shunting air outlet is arranged on the shunting system, a baffle is arranged between the shunting air outlets for separation, at least two shunting pipes are arranged, the shunting pipe is connected with the shunting air outlet of the shunting system, an air outlet is arranged at the end part of the shunting pipe, the second air supply system is positioned in an air flow pipe, a vertical shunting rod and a horizontal shunting rod are arranged on the shunting air outlet and the air outlet, the horizontal shunting rod is positioned at the outer side of the vertical shunting rod, a plurality of vertical shunting rods and a plurality of horizontal shunting rods are arranged, and connecting rods are arranged at the two ends of the vertical shunting rods and the two ends of the plurality of horizontal shunting rods for connection, the one end of horizontal reposition of redundant personnel pole is equipped with first rotation motor, the one end of vertical reposition of redundant personnel pole is equipped with the second and rotates the motor, and connects on vertical reposition of redundant personnel pole and the horizontal separation pole in the middle of many vertical reposition of redundant personnel poles and horizontal reposition of redundant personnel poles, first air feed system and second air feed system all are equipped with the wire between the wind speed controller and are connected, be equipped with the wire between wind speed controller and the power module and be connected.
In order to improve the sealing effect, the invention has the improvement that a sealing gasket is arranged at the joint of the first air supply system and the flow dividing system, and a sealing gasket is arranged at the joint of the flow dividing air outlet and the flow dividing pipe.
In order to increase the supercharging effect, the invention improves that a shunting area and a straight flow area are arranged in the shunting pipe, the shunting area is arranged around the inner side of the shunting pipe, the straight flow area is positioned in the shunting area, and the second air supply system is arranged in the straight flow area.
In order to improve the use effect of the first air supply system and the second air supply system, the invention is improved in that the first air supply system and the second air supply system comprise air boxes, fixing rods, mounting plates, motors and fan blades, the fixing rods are connected to the inner sides of the air boxes, the mounting plates are connected with the fixing rods, the motors are mounted on the mounting plates, the fan blades are mounted on the motors, and at least three fan blades are arranged.
In order to prolong the service life of the fan blade, the invention improves that the outer side of the fan blade is provided with an anticorrosive coating which is an electroplated layer or sprayed with anticorrosive paint.
In order to improve the controllability, the wind speed controller comprises a shell, a display screen, a control key and a main control system, wherein the main control system is installed inside the shell, the display screen and the control key are installed on the outer side of the shell and are connected with the shell in an embedded mode, and wires are arranged between the display screen and the main control system and between the control key and the main control system for connection.
A shunting pressurization method for semiconductor equipment comprises the following steps;
the method comprises the following steps: starting a power supply module;
step two: inputting a set rotating speed through a control key in the wind speed controller;
step three: the display screen displays the wind speed information and performs proofreading;
step four: the first air supply system guides the airflow into the flow dividing system;
step five: the second air supply system sucks and discharges the airflow;
(III) advantageous effects
Compared with the prior art, the invention provides a shunting and supercharging device and method for semiconductor equipment, which have the following beneficial effects:
the shunting supercharging device and the method for the semiconductor equipment have the advantages that the shunting supercharging device and the method are used for adjusting the shunting supercharging of airflow through the first air supply system and the second air supply system, the shunting area and the detention area are arranged in the shunting to ensure the uniformity of the air flow of an operation area, the reprocessing time is saved to a great extent, the adjustment period of the equipment is shortened, the first air supply system and the second air supply system are conveniently controlled through the air speed controller, the operation convenience and the uniformity of the air flow distribution of the operation area are effectively improved, the angles of the vertical shunting rods and the horizontal shunting rods on the shunting air outlet and the air outlet are adjusted through the first rotating motor and the second rotating motor, the air flow and the uniformity of the air supply systems are systematically distributed, the process precision requirement of the equipment on the air flow is improved, the actual production efficiency is improved, and the device is simple in structure, convenient implementation, low price and the like.
Drawings
FIG. 1 is a schematic diagram of the system of the present invention;
FIG. 2 is a schematic view of a shunt tube configuration of the present invention;
FIG. 3 is a schematic view of the split-flow air outlet structure of the present invention;
FIG. 4 is a schematic view of the structure of an air outlet according to the present invention;
FIG. 5 is a schematic view of the air supply system of the present invention;
in the figure: 1. a first air supply system; 2. a shunt system; 3. a shunt tube; 4. a wind speed controller; 5. a power supply module; 6. a vertical shunt rod; 7. a transverse shunt rod; 8. a connecting rod; 9. a first rotating electric machine; 10. A second rotating electric machine; 11. a shunting region; 12. a direct current region; 13. fixing the rod; 14. an air box; 15. mounting a plate; 16. a motor; 17. a fan blade; 18. a second air supply system;
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-3, the split-flow supercharging device for semiconductor equipment of the present invention includes a first air supply system 1, a split-flow system 2, an air speed controller 4 and a power supply module 5, wherein the first air supply system 1 is connected to the split-flow system 2, the split-flow system 2 includes a split-flow pipe 3 and a second air supply system 18, the split-flow system 2 is provided with split-flow air outlets, baffles are disposed between the split-flow air outlets, at least two split-flow pipes 3 are disposed, the split-flow pipe 3 is connected to the split-flow air outlets of the split-flow system 2, an air outlet is disposed at an end of the split-flow pipe 3, the second air supply system 18 is located inside the air flow pipe, vertical split-flow rods 6 and horizontal split-flow rods 7 are disposed on the split-flow air outlets and the air outlet, the horizontal split-flow rods 7 are disposed on outer sides of the vertical split-flow rods 6, the vertical split-flow rods 6 and the horizontal split-flow rods 7 are both provided with a plurality of them, and the both ends of many vertical reposition of redundant personnel poles 6 and the both ends of many horizontal reposition of redundant personnel poles 7 all are equipped with connecting rod 8 and connect, the one end of horizontal reposition of redundant personnel pole 7 is equipped with first rotation motor 9, the one end of vertical reposition of redundant personnel pole 6 is equipped with second rotation motor 10, and connects on vertical reposition of redundant personnel pole 6 and the horizontal reposition of redundant personnel pole in the middle of many vertical reposition of redundant personnel poles 6 and horizontal reposition of redundant personnel poles 7, first air feed system 1 and second air feed system 18 all are equipped with the wire between with wind speed controller 4 and are connected, be equipped with the wire between wind speed controller 4 and the power module 5 and be connected.
When the shunting and pressurizing device and the method for the semiconductor equipment are used, the air flow is shunted and pressurized by the first air supply system 1 and the second air supply system 18, the shunting area 11 and the detention area are arranged in the shunting to ensure the uniformity of the air flow of the operation area, the reprocessing time is saved to a great extent, the equipment adjusting period is reduced, the first air supply system 1 and the second air supply system 18 are conveniently controlled by the air speed controller 4, the operation convenience and the uniformity of the air flow distribution of the operation area are effectively improved, the angles of the vertical shunting rod 6 and the transverse shunting rod 7 on the shunting air outlet and the air outlet are adjusted by the first rotating motor 9 and the second rotating motor 10, the air flow and the uniformity of the air supply system 1 are systematically distributed, the process precision requirement of the equipment on the air flow is improved, and the actual production efficiency is improved, the wind speed control is started by supplying electric energy through the power supply module 5.
In order to improve the sealing effect, the invention has the improvement that a sealing gasket is arranged at the joint of the first air supply system 1 and the shunt system 2, and a sealing gasket is arranged at the joint of the shunt air outlet and the shunt pipe 3, so that gaps are prevented from being generated and air flow leakage is prevented.
In order to increase the supercharging effect, the invention improves that a flow splitting area 11 and a straight flow area 12 are arranged inside the flow splitting pipe 3, the flow splitting area 11 is arranged around the inner side of the flow splitting pipe 3, the straight flow area 12 is positioned inside the flow splitting area 11, the second air supply system 18 is arranged inside the straight flow area 12, a part of air flow is transmitted through the flow splitting area 11, and a part of air flow is sucked through the second air supply system 18 and then discharged to achieve the amplifying effect and mixed with the air flow in the flow splitting area 11, thereby achieving the supercharging effect.
In order to improve the use effect of the first air supply system 1 and the second air supply system 18, the invention has the improvement that the first air supply system 1 and the second air supply system 18 comprise an air box 14, a fixed rod 13, a mounting plate 15, a motor 16 and fan blades 17, the fixed rod 13 is connected to the inner side of the air box 14, the mounting plate 15 is connected with the fixed rod 13, the motor 16 is mounted on the mounting plate 15, the fan blades 17 are mounted on the motor 16, and the number of the fan blades 17 is at least three, so that the characteristics of simple structure, convenience in implementation, low price and the like are realized.
In order to prolong the service life of the fan blade 17, the invention improves that the outer side of the fan blade 17 is provided with an anticorrosive coating which is an electroplated coating or sprayed with anticorrosive paint.
In order to improve the controllability, the wind speed controller 4 includes a housing, a display screen, a control key, and a main control system, the main control system is installed inside the housing, the display screen and the control key are installed outside the housing and are embedded in the housing, and wires are provided between the display screen and the main control system and between the control key and the main control system.
A shunting pressurization method for semiconductor equipment comprises the following steps;
the method comprises the following steps: starting the power supply module 5;
step two: inputting a set rotating speed through a control key in the wind speed controller 4;
step three: the display screen displays the wind speed information and performs proofreading;
step four: the first air supply system 1 guides air flow into the flow dividing system 2;
step five: the second air supply system 18 draws in the air flow and discharges the air flow.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The utility model provides a semiconductor equipment is with reposition of redundant personnel supercharging device, its characterized in that, includes first air feed system (1), reposition of redundant personnel system (2), wind speed controller (4) and power module (5), first air feed system (1) is connected with reposition of redundant personnel system (2), reposition of redundant personnel system (2) include shunt tubes (3) and second air feed system (18), be equipped with the reposition of redundant personnel air outlet on reposition of redundant personnel system (2), just be equipped with the baffle between the reposition of redundant personnel air outlet and separate, shunt tubes (3) are equipped with two at least, shunt tubes (3) are connected with the reposition of redundant personnel air outlet of reposition of redundant personnel system (2), the tip of shunt tubes (3) is equipped with the air exit, second air feed system (18) are located the inside of tuber pipe, be equipped with vertical reposition of redundant personnel pole (6) and horizontal reposition of redundant personnel pole (7) on reposition of redundant personnel air, just horizontal reposition of redundant personnel pole (7) are located the outside of vertical reposition of redundant personnel pole (6), vertical reposition of redundant personnel pole (6) and horizontal reposition of redundant personnel pole (7) all are equipped with many, and the both ends of many vertical reposition of redundant personnel pole (6) and the both ends of many horizontal reposition of redundant personnel pole (7) all are equipped with connecting rod (8) and connect, the one end of horizontal reposition of redundant personnel pole (7) is equipped with first rotation motor (9), the one end of vertical reposition of redundant personnel pole (6) is equipped with second rotation motor (10), and connects on vertical reposition of redundant personnel pole (6) and the horizontal separation pole in the middle of many vertical reposition of redundant personnel pole (6) and horizontal reposition of redundant personnel pole (7), first air feed system (1) and second air feed system (18) all are equipped with the wire between wind speed controller (4) and are connected, be equipped with the wire between wind speed controller (4) and power module (5) and be connected.
2. The semiconductor device shunt and pressure boosting device according to claim 1, wherein a sealing gasket is disposed at a connection between the first air supply system (1) and the shunt system (2), and a sealing gasket is disposed at a connection between the shunt air outlet and the shunt tube (3).
3. The shunt voltage boosting device for semiconductor equipment according to claim 1, wherein a shunt area (11) and a straight flow area (12) are provided inside the shunt tube (3), the shunt area (11) is disposed around the inside of the shunt tube (3), the straight flow area (12) is located inside the shunt area (11), and the second air supply system (18) is installed inside the straight flow area (12).
4. The semiconductor device shunt supercharging apparatus according to claim 1, wherein the first air supply system (1) and the second air supply system (18) include an air box (14), a fixing rod (13), a mounting plate (15), a motor (16), and at least three fan blades (17), the fixing rod (13) is connected to an inner side of the air box (14), the mounting plate (15) is connected to the fixing rod (13), the motor (16) is mounted on the mounting plate (15), the fan blades (17) are mounted on the motor (16), and the number of the fan blades (17) is at least three.
5. The semiconductor device shunting and supercharging device according to claim 1, wherein the wind speed controller (4) comprises a housing, a display screen, a control key and a main control system, the main control system is installed inside the housing, the display screen and the control key are installed outside the housing and connected with the housing in an embedded manner, and a wire is connected between the display screen and the control key and the main control system.
6. The shunt supercharging device for the semiconductor equipment according to claim 4, wherein an anti-corrosion layer is provided on the outer side of the fan blade (17), and the anti-corrosion layer is an electroplated layer or a sprayed anti-corrosion paint.
7. A shunting pressurization method for semiconductor equipment is characterized by comprising the following steps;
the method comprises the following steps: starting a power supply module (5);
step two: inputting a set rotating speed through a control key in the wind speed controller (4);
step three: the display screen displays the wind speed information and performs proofreading;
step four: the first air supply system (1) guides airflow into the flow dividing system (2);
step five: the second air supply system (18) sucks the air flow into the air flow and discharges the air flow.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011497107.3A CN113327869A (en) | 2020-12-17 | 2020-12-17 | Shunting and pressurizing device and method for semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011497107.3A CN113327869A (en) | 2020-12-17 | 2020-12-17 | Shunting and pressurizing device and method for semiconductor equipment |
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| Publication Number | Publication Date |
|---|---|
| CN113327869A true CN113327869A (en) | 2021-08-31 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011497107.3A Pending CN113327869A (en) | 2020-12-17 | 2020-12-17 | Shunting and pressurizing device and method for semiconductor equipment |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003161512A (en) * | 2001-11-28 | 2003-06-06 | Nippon Plast Co Ltd | Wind direction adjusting device |
| JP2013147152A (en) * | 2012-01-19 | 2013-08-01 | Nippon Soken Inc | Cooling device for vehicle |
| CN105489526A (en) * | 2014-09-17 | 2016-04-13 | 沈阳芯源微电子设备有限公司 | Shunt supercharging device for semiconductor equipment and control method for shunt supercharging device |
| CN207487037U (en) * | 2017-11-17 | 2018-06-12 | 叶恒威 | A kind of hanging cabinet type air conditioner used in kitchen |
-
2020
- 2020-12-17 CN CN202011497107.3A patent/CN113327869A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003161512A (en) * | 2001-11-28 | 2003-06-06 | Nippon Plast Co Ltd | Wind direction adjusting device |
| JP2013147152A (en) * | 2012-01-19 | 2013-08-01 | Nippon Soken Inc | Cooling device for vehicle |
| CN105489526A (en) * | 2014-09-17 | 2016-04-13 | 沈阳芯源微电子设备有限公司 | Shunt supercharging device for semiconductor equipment and control method for shunt supercharging device |
| CN207487037U (en) * | 2017-11-17 | 2018-06-12 | 叶恒威 | A kind of hanging cabinet type air conditioner used in kitchen |
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Application publication date: 20210831 |