CN113322504B - Electroplating device and process - Google Patents

Abstract

The invention relates to the technical field of electroplating, and discloses a physical coarsening electroplating device and a process for replacing coarsening of harmful hexavalent chromium, wherein the physical coarsening electroplating device comprises an electroplating box and anode pieces arranged at two ends of the inner side of the electroplating box, the anode pieces are electrically connected with an anode of an external power supply, and a cathode electroplating mechanism is arranged in the middle of a frame plate; the cathode electroplating mechanism comprises an air guide part and a cathode lead arranged outside the air guide part, wherein the cathode lead is electrically connected with a cathode of an external power supply, a plated part supporting part is arranged at the lower end of the air guide part, and the tail end of the cathode lead is fixedly connected with the plated part supporting part.

Description

Electroplating device and process

Technical Field

The invention relates to the technical field of electroplating, in particular to an electroplating device and an electroplating process.

Background

Electroplating is a process of plating a thin layer of other metals or alloys on the surface of some metals by using the principle of electrolysis, and is a process of attaching a layer of metal film on the surface of a metal or other material product by using the action of electrolysis so as to play roles of preventing metal oxidation, improving wear resistance, conductivity, light reflection, corrosion resistance, enhancing appearance and the like. The outer layer of a plurality of coins is also electroplated, the existing electroplating modes are various, physical coarsening electroplating is a common electroplating mode, and the existing electroplating mode replaces harmful hexavalent complex coarsening electroplating for the safety of electroplating operators.

However, the physical coarsening electroplating device has the defects that the workpiece to be plated is fixed during electroplating, the contact amount with the surrounding plating solution is limited, the defect cannot be changed only by directly inflating and stirring the bottom, the electroplating effect is poor, the speed is low, blind contact points exist in the stable mode of any one of hanging, clamping or supporting the perforated workpiece to be plated, and the contact points are covered, so that the plating cannot be performed, secondary plating is needed, the workload of the plating is increased, and the uniformity of the plating is not uniform.

To solve the above problems. Therefore, an electroplating device and a process are provided.

Disclosure of Invention

The invention aims to provide an electroplating device and an electroplating process, wherein an external air pump is opened, air flows to a spray head through a main air guide pipe, high-pressure air sprayed by the spray head has certain driving force on a pressure-bearing ball so as to drive the pressure-bearing ball to move downwards, the pressure-bearing ball drives a connecting pipe and an internal movable pipe to move downwards, and then under the action of matching of a sliding head and a sliding groove, the sliding head can drive the whole connecting pipe to rotate in a small amplitude when sliding in the sliding groove, the connecting pipe rotates in a small amplitude, and the whole process enables a support part of a plating part to slightly rotate while moving downwards, so that the problems in the background technology can be solved.

In order to achieve the purpose, the invention provides the following technical scheme: an electroplating device comprises an electroplating box and anode pieces arranged at two ends of the inner side of the electroplating box, wherein the anode pieces are electrically connected with an anode of an external power supply, heating pieces are arranged on the electroplating box between the anode pieces, the heating pieces are symmetrically arranged relative to the middle of the electroplating box, a frame plate is placed on the electroplating box between the heating pieces, the length of the frame plate is greater than the width of the electroplating box, and a cathode electroplating mechanism is arranged in the middle of the frame plate;

the cathode electroplating mechanism comprises an air guide part and a cathode wire arranged on the outer side of the air guide part, the cathode wire is electrically connected with the cathode of an external power supply, a plated part supporting part is arranged at the lower end of the air guide part, and the tail end of the cathode wire is fixedly connected with the plated part supporting part.

Furthermore, the air guide part comprises a main air pipe and an elastic pipe arranged at the lower end of the main air pipe, the lower end of the elastic pipe is provided with a connecting pipe, the lower end of the connecting pipe is provided with a pressure bearing ball, and the plated part supporting part is arranged on the outer side of the connecting pipe.

Furthermore, a movable pipe is fixedly arranged on the inner side of the connecting pipe, sliding heads are arranged on two sides of the upper end of the movable pipe, the sliding heads are matched with a sliding groove formed in the inner side of the lower end of the main air pipe, the sliding groove is C-shaped, and a spray head is arranged at the lower end of the movable pipe.

Furthermore, the nozzle is in a conical shape with an upper end opening larger than a lower end opening, the lower end of the nozzle is inserted into the middle of an inner cavity of the pressure bearing ball, and the pressure bearing ball is in a hollow state.

Further, plate a supporting component and include the gas-distributing pipe and set up the first check valve in the inlet end of gas-distributing pipe, the end of giving vent to anger of gas-distributing pipe is provided with the second check valve, and the outlet duct is installed to the upper end of second check valve, and the outlet duct upper end is installed and is waited to plate firm part.

Furthermore, the part to be plated comprises a regulating and stabilizing component and a supporting column arranged at the lower end of the regulating and stabilizing component, and the regulating and stabilizing component is sleeved with the part to be plated.

Furthermore, the adjusting and stabilizing component comprises a supporting rod and a lower stabilizing net disc arranged at the lower end of the supporting rod, one side of the supporting rod is provided with a conductive core, the conductive core is in contact connection with the part to be plated, and the upper end of the supporting rod is movably provided with an adjusting part.

Furthermore, the adjusting part comprises an upper stabilizing disc and an engagement column arranged at the lower end of the upper stabilizing disc, the lower end of the engagement column is provided with a screw rod, and the screw rod is in threaded connection with the upper end of the supporting rod.

Furthermore, the lower end of the screw rod is provided with an extrusion spring, and the reverse extrusion force of the extrusion spring enables the screw rod to be more stable after being connected with the support rod.

The invention provides another technical scheme that: an electroplating process of an electroplating device is provided, which comprises the following steps:

s1: sleeving the piece to be plated on the outer side of the support rod, and then connecting the adjusting part with the support rod through threads, wherein a distance of 0.6-1.2 cm is formed between the upper stabilizing disc and the upper end of the piece to be plated;

s2: inserting a cathode electroplating mechanism into an electroplating box filled with electroplating solution, electrifying an anode piece and a cathode lead, and optionally electrifying a heating piece;

s3: the external air pump is started, air flows to the spray head through the main air duct, high-pressure air sprayed by the spray head has certain driving force on the pressure-bearing ball, the pressure-bearing ball is driven to move downwards, the pressure-bearing ball drives the connecting pipe and the inner movable pipe to move downwards, and then the connecting pipe rotates in a small range under the action of the matching of the sliding head and the sliding groove;

s4: the gas entering the pressure-bearing ball is increased continuously, the pressure is increased continuously, and then the gas opens the first one-way valve and the second one-way valve in sequence to be sprayed out from the upper end of the gas outlet pipe, so that not only can the surrounding plating solution be driven to flow, and then the contact amount of the piece to be plated and the plating solution is increased, but also the piece to be plated can be pushed to move on the supporting rod;

s5: and stopping the external air pump, turning off the power supply and finishing electroplating.

Compared with the prior art, the invention has the beneficial effects that:

1. the invention provides an electroplating device and a process, wherein an external air pump is opened, air flows to a spray head through a main air duct, high-pressure air sprayed by the spray head has certain driving force on a pressure-bearing ball so as to drive the pressure-bearing ball to move downwards, the pressure-bearing ball drives a connecting pipe and an internal movable pipe to move downwards, then under the action of matching of a sliding head and a sliding groove, the sliding head can drive the connecting pipe to integrally rotate in a small amplitude when sliding in the sliding groove, the connecting pipe rotates in a small amplitude, a support part of a plating part slightly rotates while moving downwards in the whole process, the contact amount of the plating part and electroplating liquid is increased, and the electroplating effect is improved.

2. According to the electroplating device and the electroplating process, the gas quantity entering the pressure-bearing ball is increased continuously, the pressure is increased continuously, and then the gas opens the first one-way valve and the second one-way valve in sequence to be sprayed out from the upper end of the gas outlet pipe, so that not only can the surrounding plating solution be driven to flow, and the contact amount of the to-be-plated part and the plating solution be increased, but also the to-be-plated part can be pushed to move on the supporting rod, so that the to-be-plated part has no clamping or supporting connection dead angle, the to-be-plated part can be plated comprehensively, and the plating effect is further improved.

3. According to the electroplating device and the electroplating process, the screw rod is in threaded connection with the upper end of the support rod, parts to be plated with different lengths can be stabilized by adjusting the rotating depth of the screw rod on the support rod, the use flexibility of the electroplating device is improved, the lower end of the screw rod is provided with the extrusion spring, and the reverse extrusion force of the extrusion spring enables the screw rod to be more stabilized after being connected with the support rod and cannot be easily loosened, so that the parts to be plated cannot fall off during plating.

Drawings

FIG. 1 is a schematic perspective view of an electroplating apparatus according to the present invention;

FIG. 2 is a schematic top plan view of a cathode plating mechanism of the plating apparatus according to the present invention;

FIG. 3 is a schematic perspective view of an air guide of the electroplating apparatus according to the present invention;

FIG. 4 is a schematic view showing the internal plan structure of the air guide of the electroplating apparatus according to the present invention;

FIG. 5 is an enlarged schematic view of the electroplating apparatus of the present invention at the position A in FIG. 4;

FIG. 6 is a perspective view of a plating member supporting member of the electroplating apparatus according to the present invention;

FIG. 7 is a schematic perspective view of a to-be-plated securing member of the electroplating apparatus according to the present invention;

FIG. 8 is a schematic perspective view of an adjustment securing assembly of the electroplating apparatus according to the present invention;

FIG. 9 is a perspective view of an adjusting member of the electroplating apparatus according to the present invention.

In the figure: 1. electroplating box; 2. an anode member; 3. a heating member; 4. a cathode electroplating mechanism; 41. an air guide member; 411. leading the air pipe; 412. an elastic tube; 413. a connecting pipe; 414. a pressure bearing ball; 415. a movable tube; 416. a spray head; 417. a sliding head; 418. a chute; 42. a cathode lead; 43. a plated part support member; 431. a gas distributing pipe; 432. a first check valve; 433. a second one-way valve; 434. an air outlet pipe; 435. a stable part to be plated; 436. a support column; 437. adjusting the stabilizing assembly; 438. a part to be plated; 439. a support rod; 4310. a lower stabilizing net disc; 4311. a conductive core; 4312. an adjustment member; 4313. an upper stabilizing disc; 4314. connecting the column; 4315. a screw rod; 4316. a compression spring; 5. a frame plate.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1, an electroplating device, including electroplating tank 1 and anode spare 2 of setting at electroplating tank 1 inboard both ends, it has the plating solution to pour into in the electroplating tank 1, anode spare 2 and external power supply's positive pole electric connection, be provided with on the electroplating tank 1 between two corresponding anode spares 2 and add heat-insulating material 3, add heat-insulating material 3 and set up about the middle part symmetry of electroplating tank 1, it has placed frame plate 5 to be located electroplating tank 1 between two corresponding heat-insulating material 3, the length of frame plate 5 is greater than the width of electroplating tank 1, be convenient for put on electroplating tank 1, be convenient for change, the middle part of frame plate 5 is provided with cathodic plating mechanism 4.

Referring to fig. 2, in the electroplating apparatus, the cathode electroplating mechanism 4 includes an air guide 41 and a cathode wire 42 disposed outside the air guide 41, the cathode wire 42 is electrically connected to a cathode of an external power source, a plurality of plated part supporting members 43 are disposed at a lower end of the air guide 41, and a tail end of the cathode wire 42 is fixedly connected to the plated part supporting members 43.

Referring to fig. 3-5, in an electroplating apparatus, an air guide member 41 includes a main air guide pipe 411 and an elastic pipe 412 disposed at a lower end of the main air guide pipe 411, an upper end of the main air guide pipe 411 is connected to an output end of an external air pump, a connection pipe 413 is disposed at a lower end of the elastic pipe 412, a pressure-bearing ball 414 is disposed at a lower end of the connection pipe 413, the pressure-bearing ball 414 is hollow, and a plating member support member 43 is disposed at an outer side of the connection pipe 413.

The inner side of the connecting pipe 413 is fixedly provided with a movable pipe 415, two sides of the upper end of the movable pipe 415 are provided with sliding heads 417, the sliding heads 417 are matched with a sliding groove 418 arranged on the inner side of the lower end of a main air pipe 411, the sliding groove 418 is in a C shape, when the sliding heads 417 slide in the sliding groove 418, the connecting pipe 413 is driven to integrally rotate in a small amplitude, the lower end of the movable pipe 415 is provided with a spray head 416, the spray head 416 is in a conical shape with an upper end opening larger than a lower end opening, the lower end of the spray head 416 is inserted into the middle part of an inner cavity of a pressure-bearing ball 414, an external air pump is opened, air flows to the spray head 416 through the main air pipe 411, high-pressure air sprayed by the spray head 416 has a certain pushing force on the pressure-bearing ball 414, the pressure-bearing ball 414 is driven to move downwards, the connecting pipe 413 and the movable pipe 415 inside are driven to move downwards, then under the action of matching of the sliding heads 417 and the sliding groove 418, the connecting pipe 413 rotates in a small amplitude, and the whole process enables the plated part supporting part 43 to move downwards, the slight rotation is generated, so that the contact amount of the to-be-plated piece 438 and the electroplating solution is increased, and the electroplating effect is improved.

Referring to fig. 6, in the electroplating apparatus, the plated part supporting part 43 includes a gas distributing pipe 431 and a first one-way valve 432 disposed at a gas inlet end of the gas distributing pipe 431, a second one-way valve 433 is disposed at a gas outlet end of the gas distributing pipe 431, a gas outlet pipe 434 is disposed at an upper end of the second one-way valve 433, a to-be-plated stabilizing part 435 is disposed at an upper end of the gas outlet pipe 434, and the first one-way valve 432 and the second one-way valve 433 can prevent the plating solution from being refilled.

Referring to fig. 7-8, in an electroplating apparatus, a to-be-plated fixing member 435 includes an adjusting fixing assembly 437 and a support post 436 disposed at a lower end of the adjusting fixing assembly 437, a to-be-plated member 438 is sleeved on the adjusting fixing assembly 437, the adjusting fixing assembly 437 includes a support rod 439 and a lower fixing mesh 4310 disposed at a lower end of the support rod 439, a conductive core 4311 is disposed at one side of the support rod 439, the conductive core 4311 is in contact connection with the to-be-plated member 438, an adjusting member 4312 is movably disposed at an upper end of the support rod 439, the amount of gas entering the pressure-bearing ball 414 is increased, the pressure is increased, and then the gas sequentially opens the first check valve 432 and the second check valve 433 to be sprayed out from an upper end of the gas outlet pipe 434, which not only can drive the surrounding plating solution to flow, thereby increasing the contact amount between the to-be-plated member 438 and the plating solution, but also can push the plating member 438 to move on the support rod 439, so that the to make the to-be-plated member 438 have no dead angle of clamping or supporting connection, the piece 438 to be plated can be plated comprehensively, and the plating effect is further improved.

Referring to fig. 9, in an electroplating apparatus, an adjusting part 4312 includes an upper stabilizing disc 4313 and an engaging column 4314 disposed at a lower end of the upper stabilizing disc 4313, a screw rod 4315 is disposed at a lower end of the engaging column 4314, the screw rod 4315 is in threaded connection with an upper end of a supporting rod 439, and the workpiece 438 to be plated of different lengths can be stabilized by adjusting a rotation depth of the screw rod 4315 at the supporting rod 439, so as to improve flexibility of the electroplating apparatus, an extruding spring 4316 is disposed at a lower end of the screw rod 4315, and a reverse extrusion force of the extruding spring 4316 is provided, so that the screw rod 4315 is more stable and cannot be easily loosened after being connected with the supporting rod 439, thereby ensuring that the workpiece 438 to be plated does not drop during plating.

The invention provides another technical scheme that: an electroplating process of an electroplating device is provided, which comprises the following steps:

the method comprises the following steps: sleeving the to-be-plated part 438 on the outer side of the supporting rod 439, and then connecting the adjusting part 4312 with the supporting rod 439 by screw threads, so that the upper stabilizing disc 4313 is spaced from the upper end of the to-be-plated part 438 by 0.6-1.2 cm;

step two: inserting the cathode plating mechanism 4 into the plating tank 1 into which the plating solution is injected, and energizing the anode member 2 and the cathode lead 42, optionally energizing the heating member 3;

step three: the external air pump is started, air flows to the spray head 416 through the main air pipe 411, high-pressure air sprayed by the spray head 416 has a certain pushing force on the pressure-bearing ball 414, so that the pressure-bearing ball 414 is driven to move downwards, the pressure-bearing ball 414 drives the connecting pipe 413 and the movable pipe 415 inside to move downwards, and then the connecting pipe 413 rotates in a small range under the action of the matching of the sliding head 417 and the sliding groove 418;

step four: the gas entering the pressure-bearing ball 414 is increased continuously, the pressure is increased continuously, and then the gas opens the first one-way valve 432 and the second one-way valve 433 in sequence and is sprayed out from the upper end of the gas outlet pipe 434, which not only can drive the surrounding plating solution to flow, and further increase the contact amount of the piece to be plated 438 and the plating solution, but also can push the piece to be plated 438 to move on the supporting rod 439;

step five: and stopping the external air pump, turning off the power supply and finishing electroplating.

In summary, the following steps: the invention relates to an electroplating device and a process, wherein an external air pump is opened, air flows to a spray head 416 through a main air pipe 411, high-pressure air sprayed by the spray head 416 has certain pushing force on a pressure-bearing ball 414 so as to drive the pressure-bearing ball 414 to move downwards, the pressure-bearing ball 414 drives a connecting pipe 413 and an internal movable pipe 415 to move downwards, then under the action that a sliding head 417 is matched with a sliding groove 418, the sliding head 417 drives the connecting pipe 413 to integrally rotate in a small amplitude when sliding in the sliding groove 418, the connecting pipe 413 rotates in a small amplitude, the whole process enables a plating part supporting component 43 to slightly rotate while moving downwards, the contact amount of a to-be-plated part 438 and an electroplating solution is increased, the electroplating effect is improved, the amount of air entering the pressure-bearing ball 414 is continuously increased, the pressure is continuously increased, and then the air sequentially opens a first one-way valve 432 and a second one-way valve 433 to be sprayed out from the upper end of an air outlet pipe 434, the lead screw 4315 is in threaded connection with the upper end of the supporting rod 439, the lead screw 4315 can be adjusted to rotate in the supporting rod 439 to stabilize the workpieces 438 to be plated in different lengths and improve the use flexibility of the electroplating device, the lower end of the lead screw 4315 is provided with the extrusion spring 4316, the backward extrusion force of the extrusion spring 4316 is extruded, so that the lead screw 4315 is more stable and cannot be easily loosened after being connected with the supporting rod 439, and the workpieces 438 to be plated cannot fall off when being plated.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be able to cover the technical solutions and the inventive concepts of the present invention within the technical scope of the present invention.

Claims (4)

1. An electroplating device comprises an electroplating box (1) and anode pieces (2) arranged at two ends of the inner side of the electroplating box (1), wherein the anode pieces (2) are electrically connected with the anode of an external power supply, heating pieces (3) are arranged on the electroplating box (1) between the anode pieces (2), the heating pieces (3) are symmetrically arranged about the middle part of the electroplating box (1), a frame plate (5) is placed on the electroplating box (1) between the heating pieces (3), and the length of the frame plate (5) is greater than the width of the electroplating box (1), and is characterized in that a cathode electroplating mechanism (4) is arranged in the middle part of the frame plate (5);

the cathode electroplating mechanism (4) comprises an air guide part (41) and a cathode lead (42) arranged on the outer side of the air guide part (41), the cathode lead (42) is electrically connected with a cathode of an external power supply, a plated part supporting part (43) is arranged at the lower end of the air guide part (41), and the tail end of the cathode lead (42) is fixedly connected with the plated part supporting part (43);

the air guide part (41) comprises a main air pipe (411) and an elastic pipe (412) arranged at the lower end of the main air pipe (411), the lower end of the elastic pipe (412) is provided with a connecting pipe (413), the lower end of the connecting pipe (413) is provided with a pressure bearing ball (414), and the plated part supporting part (43) is arranged on the outer side of the connecting pipe (413);

a movable pipe (415) is fixedly arranged on the inner side of the connecting pipe (413), sliding heads (417) are arranged on two sides of the upper end of the movable pipe (415), the sliding heads (417) are matched with sliding grooves (418) formed in the inner side of the lower end of the main air pipe (411), the sliding grooves (418) are C-shaped, and a spray head (416) is arranged at the lower end of the movable pipe (415);

the nozzle (416) is in a conical shape with an upper end opening larger than a lower end opening, the lower end of the nozzle is inserted into the middle of an inner cavity of the pressure bearing ball (414), and the pressure bearing ball (414) is in a hollow state;

the plated part supporting part (43) comprises a gas distribution pipe (431) and a first one-way valve (432) arranged at the gas inlet end of the gas distribution pipe (431), the gas outlet end of the gas distribution pipe (431) is provided with a second one-way valve (433), the upper end of the second one-way valve (433) is provided with a gas outlet pipe (434), and the upper end of the gas outlet pipe (434) is provided with a part (435) to be plated;

the to-be-plated fixing component (435) comprises an adjusting fixing component (437) and a supporting column (436) arranged at the lower end of the adjusting fixing component (437), and the adjusting fixing component (437) is sleeved with the to-be-plated part (438);

the adjusting and stabilizing assembly (437) comprises a supporting rod (439) and a lower stabilizing mesh disc (4310) arranged at the lower end of the supporting rod (439), one side of the supporting rod (439) is provided with a conductive core (4311), the conductive core (4311) is in contact connection with the part to be plated (438), and the upper end of the supporting rod (439) is movably provided with an adjusting part (4312).

2. A plating apparatus according to claim 1, wherein the adjusting means (4312) comprises an upper stabilizing disc (4313) and an engaging column (4314) provided at a lower end of the upper stabilizing disc (4313), a screw rod (4315) being provided at a lower end of the engaging column (4314), the screw rod (4315) being screw-coupled to an upper end of the supporting rod (439).

3. An electroplating apparatus according to claim 2, wherein the lower end of the lead screw (4315) is provided with a pressing spring (4316), and the pressing force of the pressing spring (4316) is reversed to make the lead screw (4315) more stable when connected to the supporting rod (439).

4. An electroplating process of an electroplating apparatus according to claim 3, comprising the steps of:

s1: sleeving the to-be-plated part (438) on the outer side of the support rod (439), and then connecting the adjusting part (4312) with the support rod (439) in a threaded manner, wherein the upper stabilizing disc (4313) is spaced from the upper end of the to-be-plated part (438) by 0.6-1.2 cm;

s2: inserting a cathode plating mechanism (4) into a plating tank (1) filled with plating solution, and electrifying an anode member (2) and a cathode lead (42);

s3: an external air pump is started, air flows to the spray head (416) through the main air pipe (411), high-pressure air sprayed by the spray head (416) has certain pushing force on the pressure bearing ball (414), the pressure bearing ball (414) is driven to move downwards, the pressure bearing ball (414) drives the connecting pipe (413) and the movable pipe (415) inside the connecting pipe to move downwards, and then the connecting pipe (413) rotates in a small range under the action of the matching of the sliding head (417) and the sliding groove (418);

s4: the gas entering the pressure-bearing ball (414) is increased continuously, the pressure is increased continuously, and then the gas opens the first one-way valve (432) and the second one-way valve (433) in sequence and is sprayed out from the upper end of the gas outlet pipe (434), so that not only can the surrounding plating solution be driven to flow, the contact amount of the piece to be plated (438) and the plating solution is increased, but also the piece to be plated (438) can be pushed to move on the supporting rod (439);

s5: and stopping the external air pump, turning off the power supply and finishing electroplating.

Images