CN113319524A - Manufacturing method for reducing iron loss of oriented silicon steel by laser scoring - Google Patents
Manufacturing method for reducing iron loss of oriented silicon steel by laser scoring Download PDFInfo
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- CN113319524A CN113319524A CN202110413499.9A CN202110413499A CN113319524A CN 113319524 A CN113319524 A CN 113319524A CN 202110413499 A CN202110413499 A CN 202110413499A CN 113319524 A CN113319524 A CN 113319524A
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- silicon steel
- oriented silicon
- laser
- iron loss
- manufacturing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
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- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D1/00—General methods or devices for heat treatment, e.g. annealing, hardening, quenching or tempering
- C21D1/26—Methods of annealing
Abstract
The invention discloses a manufacturing method for reducing iron loss of oriented silicon steel by laser scoring, which adopts the oriented silicon steel with the thickness of 0.23-0.35mm as a raw material, and carries out laser scoring treatment after a steel strip is taken out of a furnace by a stretching hot leveling line, so as to refine magnetic domains, further reduce the iron loss value of the finished product of the oriented silicon steel and achieve the purpose of optimizing magnetic performance. The improvement rate of the iron loss of the oriented silicon steel subjected to laser scoring treatment can reach 9-16%, and the iron loss is restored to the state before scoring after annealing at the temperature of more than 500 ℃.
Description
Technical Field
The invention relates to the technical field of oriented silicon steel, in particular to a manufacturing method for reducing iron loss of oriented silicon steel through laser scoring.
Background
Oriented silicon steel is a soft magnetic alloy with excellent magnetic property, and is widely applied to the power industry as a transformer iron core material. When the transformer runs, the oriented silicon steel inevitably generates hysteresis loss, eddy current loss and abnormal loss, and electric energy is lost in the form of heat energy, namely iron loss. According to statistics, the electric energy loss caused by the oriented silicon steel in China is as high as billions of kilowatt hours every year, and the energy waste is very serious. Therefore, the performance of the oriented silicon steel is improved through technical improvement, and the loss of electric energy in the transmission process is urgently reduced.
The oriented silicon steel is used as a core material for determining the loss of the transformer, and the iron loss of the oriented silicon steel directly influences the overall loss of the transformer. The reduction of core loss by increasing the gaussian orientation and reducing the thickness has gradually entered the bottleneck stage of technological development.
The iron loss of the silicon steel sheet is composed of hysteresis loss and eddy current loss, and the eddy current loss is divided into classical eddy current loss and abnormal eddy current loss. At power frequency, the anomalous eddy current loss accounts for about 50% of the core loss. The abnormal eddy current loss is an eddy current loss based on the movement of a magnetic domain wall, which is proportional to the moving speed of the magnetic domain wall, which is proportional to the moving distance, and thus the larger the domain width, the larger the eddy current loss. The magnetic domain refining technology is a physical method for reducing eddy current loss of the oriented silicon steel by reducing the width of a main domain of the oriented silicon steel.
The magnetic domain is refined by reducing the rotation resistance of the magnetic domain, so that the magnetic domain can rotate more easily to reduce the abnormal eddy current loss of the silicon steel material. At present, common magnetic domain refining technologies include mechanical scoring, laser scoring, plasma spraying, and electrical discharge processing. Compared with other technologies, the laser scoring technology has high production efficiency and simple process. The laser scoring method is to irradiate the surface of the oriented silicon steel transversely by using continuous or pulse laser beams to form linear scores at certain intervals on the surface area of the silicon steel. The laser mainly has the main effects that the insulating film on the surface of the silicon steel is instantaneously evaporated to generate impact pressure of thousands of atmospheres, local heating is caused in the range near an irradiation point, a plastic strain area and a high-density dislocation area are formed, the width of a magnetic domain is greatly reduced, and the purpose of magnetic domain refinement is achieved.
By comparison, the laser scoring technique has its distinct technical advantages: (1) the laser energy is stable and the processing is uniform; (2) the laser processing speed is high, the efficiency is high, and the method is suitable for industrial scale production; (3) can utilize highly automated control system, accurate control nick parameter: (4) the equipment is not in direct contact with the silicon steel sheet, and the influence on the surface insulating coating is small.
The magnetic domain refining technology is divided into heat-resistant technology and non-heat-resistant technology according to whether the magnetic domain refining technology can withstand the stress relief annealing treatment at the temperature of more than 800 ℃. The heat-resisting nicking technology is characterized in that a nicking groove with a certain shape is formed on the surface of a silicon steel plate by adopting modes of chemical erosion, mechanical pressure and the like, the existence of a free magnetic pole generated at the nicking groove enables the energy of the material to be redistributed, the width of a magnetic domain is reduced, and the iron loss is reduced. The notch groove is not changed in the stress relief annealing process, so the oriented silicon steel plate produced by the technology can be applied to the manufacturing of the wound iron core transformer. The non-heat-resisting nicking technology is characterized by that it utilizes laser, plasma beam and electron beam to form linear heat stress zone on the surface at a certain interval, and makes the submagnetic domain appear around said zone so as to reduce 180 deg. magnetic domain width and attain the goal of reducing iron loss. The magnetic domain refining effect of the method disappears along with the thermal stress elimination at the nicking after stress elimination annealing, and the iron loss returns to the original level, so the technology is mainly used for manufacturing the laminated iron core transformer without stress elimination annealing.
At present, relatively few researches on non-heat-resistant scoring technology are carried out, and the problems of high iron loss value of the manufactured oriented silicon steel finished product and the like generally exist.
Disclosure of Invention
In order to solve the technical problems, the invention provides a manufacturing method for reducing the iron loss of oriented silicon steel by laser scoring, the iron loss improvement rate of the oriented silicon steel after the laser scoring treatment can reach 9-16%, and the iron loss is restored to the state before scoring after annealing at the temperature of more than 500 ℃.
In order to achieve the purpose, the invention adopts the following technical scheme:
a manufacturing method for reducing the iron loss of oriented silicon steel by laser scoring adopts the oriented silicon steel with the thickness of 0.23-0.35mm as a raw material, and steel strips are subjected to laser scoring treatment after being discharged from a furnace by a stretching hot leveling line to refine magnetic domains, so that the iron loss value of the finished oriented silicon steel product is reduced, and the aim of optimizing the magnetic performance is fulfilled.
Preferably, the thickness of the oriented silicon steel is 0.27 mm.
Preferably, the production speed of the steel strip is 50-70 m/min; further preferably 55-65 m/min; most preferably 60 m/min.
Preferably, the scanning speed of the laser scoring treatment is 350-950 mm/s; further preferably 400-900mm/s, most preferably 600 mm/s.
Preferably, the scanning interval of the laser scoring treatment is 2-8 mm; further preferably 3-5mm, most preferably 4 mm.
The invention provides non-heat-resistant laser-scored oriented silicon steel.
Preferably, the depth of the groove of the laser-scored oriented silicon steel is 0.4-3.0 μm; further preferably 0.5 to 2.6 μm; most preferably 2.0 μm.
Preferably, after the laser-scored oriented silicon steel is annealed at the temperature of more than 500 ℃, the iron loss value is recovered to the state before scoring.
The invention has the beneficial effects that:
(1) the depth of the laser nicks adopted by the invention is 0.4-3.0 μm, the bottom layer of the oriented silicon steel magnesium silicate is not damaged, the damage to the insulating coating is extremely small, and the purposes of reducing the iron loss and improving the magnetic performance can be achieved;
(2) the laser scoring depth adopted by the invention is 0.4-3.0 μm, and the iron loss returns to the state before scoring after annealing at the temperature of more than 500 ℃, thus having flexible application effect in the field of products without scoring;
(3) the scanning distance of the laser nicks adopted by the invention is 2-8mm, the controllable range is wider, and the proper refined magnetic domain distance can be selected according to the condition of the crystal grains of the supplied materials, so that the optimal value of improving the magnetic performance of the finished oriented silicon steel plate is achieved;
(4) the laser scoring adopted by the invention can reduce the iron loss of the oriented silicon steel by 9-16% compared with that before scoring, greatly improves the magnetic performance of finished products and increases the mark rate;
(5) the laser scoring speed adopted by the invention can flexibly change along with the production speed of the steel strip, thereby greatly improving the production efficiency.
Detailed Description
The following description of the embodiments is only intended to aid in the understanding of the method of the invention and its core ideas. It should be noted that, for those skilled in the art, it is possible to make various improvements and modifications to the present invention without departing from the principle of the present invention, and those improvements and modifications also fall within the scope of the claims of the present invention. The following description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein. Although any methods and materials similar or equivalent to those described herein can be used in the practice or testing of the present invention, the preferred methods and materials are now described.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs.
Basic embodiment
Non-heat-resistant laser-scored oriented silicon steel and manufacturing method thereof
A manufacturing method for reducing the iron loss of oriented silicon steel by laser scoring adopts the oriented silicon steel with the thickness of 0.23-0.35mm as a raw material, and steel strips are subjected to laser scoring treatment after being discharged from a furnace by a stretching hot leveling line to refine magnetic domains, so that the iron loss value of the finished oriented silicon steel product is reduced, and the aim of optimizing the magnetic performance is fulfilled.
The production steps of the oriented silicon steel processed by laser scoring are as follows: demanganizing molten iron, smelting, vacuum processing, casting, heating a plate blank, hot rolling, pickling, cold rolling, decarburization annealing, high-temperature annealing, stretching and hot leveling. The specific production flow of the stretching thermal leveling treatment is as follows: cleaning magnesium oxide on the surface of the steel strip, coating an oriented silicon steel insulating coating, carrying out thermal leveling treatment in a continuous annealing furnace, and carrying out laser scoring treatment after discharge.
The laser scoring method is a method in which a full-width pulse or continuous laser beam having an irradiation energy of several millijoules is irradiated in a spot or line shape to the surface of a finished steel strip having an insulating film at a pitch of about 5mm in a direction perpendicular to the rolling direction. The heat of the laser beam creates an elastic-plastic deformation zone below the surface of the steel sheet. The magnetic domain is refined by the compressive stress generated in the elastoplastic deformation region and the tensile stress between the notches.
Examples 1 to 5 non-heat-resistant laser-scored oriented silicon steel and method for manufacturing the same
The parameters of the laser scored oriented silicon steel and the method of making the same described in examples 1-5 are shown in table 1.
TABLE 1
Comparative examples 1 to 4 non-heat-resistant laser-scored oriented silicon steel and method for manufacturing the same
The parameters of the laser-scored oriented silicon steel and the manufacturing method thereof as described in comparative examples 1 to 4 are shown in table 2.
TABLE 2
The magnetic properties of the samples after scoring at different positions of the steel strips prepared in examples 1 to 5 and comparative examples 1 to 4 were measured, and the data are shown in table 3.
TABLE 3
As can be seen from the above table, the depth of the notch of the non-heat-resistant laser-scored oriented silicon steel manufactured by the method is 0.4-3.0 μm, the magnetic induction value B8 before and after scoring treatment is basically unchanged, and the iron loss increase rate is 9-16%. Meanwhile, the comparative examples 1 to 4 show that the thickness of the oriented silicon steel, the production speed of the steel strip, the laser scanning speed, the scanning interval and the grooving depth all have important influences on the iron loss of the prepared non-heat-resistant laser-scored oriented silicon steel.
Meanwhile, after the non-heat-resistant laser-scored oriented silicon steel prepared in examples 1 to 5 is annealed at a temperature of more than 500 ℃, the iron loss is restored to the state before scoring, specifically, the minimum annealing temperature in example 1 is 620 ℃, the minimum annealing temperature in example 2 is 720 ℃, and the minimum annealing temperature in example 3 is 580 ℃; example 4 had a minimum annealing temperature of 640 ℃; the minimum annealing temperature for example 5 was 500 ℃. The non-heat-resistant laser-scored oriented silicon steel prepared in comparative examples 1 to 4 can restore the iron loss to the state before scoring after annealing treatment at a temperature of more than 800 ℃, and specifically, the minimum annealing temperature of comparative example 1 is 820 ℃, the minimum annealing temperature of comparative example 2 is 860 ℃, the minimum annealing temperature of comparative example 3 is 900 ℃, and the minimum annealing temperature of comparative example 4 is 800 DEG C
In conclusion, the laser scoring depth adopted by the invention is 0.4-3.0 μm, the magnesium silicate bottom layer of the oriented silicon steel cannot be damaged, the damage to the insulating coating is extremely small, the purposes of reducing the iron loss and improving the magnetic performance can be achieved, the iron loss of the prepared non-heat-resistant laser scoring oriented silicon steel returns to the state before scoring after annealing at the temperature of more than 500 ℃, and the effect of flexible application is achieved in the field of products without scoring; the scanning distance of the laser nicks adopted by the invention is 2-8mm, the controllable range is wider, and the proper refined magnetic domain distance can be selected according to the condition of the crystal grains of the supplied materials, so that the optimal value of improving the magnetic performance of the finished oriented silicon steel plate is achieved; the adopted laser scoring can reduce the iron loss of the oriented silicon steel by 9-16 percent compared with the iron loss before scoring, greatly improves the magnetic performance of finished products and improves the mark rate; the laser scoring speed adopted by the invention can flexibly change along with the production speed of the steel strip, thereby greatly improving the production efficiency.
The present invention has been further described with reference to specific embodiments, which are only exemplary and do not limit the scope of the present invention. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention, and that such changes and modifications may be made without departing from the spirit and scope of the invention.
Claims (10)
1. A manufacturing method for reducing the iron loss of oriented silicon steel by laser scoring is characterized in that the oriented silicon steel with the thickness of 0.23-0.35mm is used as a raw material, and a steel strip is subjected to laser scoring treatment after a stretching hot leveling line is discharged from a furnace, so that magnetic domains are refined, the iron loss value of an oriented silicon steel finished product is reduced, and the aim of optimizing the magnetic performance is fulfilled.
2. The method of manufacturing of claim 1, wherein the oriented silicon steel has a thickness of 0.27 mm.
3. A method as claimed in claim 1, characterized in that the production speed of the steel strip is 50-70 m/min.
4. A method as claimed in claim 1, characterized in that the production speed of the steel strip is 55-65 m/min.
5. The manufacturing method as claimed in claim 1, wherein the scanning speed of the laser scoring process is 350-950 mm/s.
6. The manufacturing method as claimed in claim 1, wherein the scanning speed of the laser scoring process is 400-900 mm/s.
7. The manufacturing method according to claim 1, wherein a scanning pitch of the laser scoring process is 2-8 mm.
8. Non heat resistant laser scored oriented silicon steel manufactured according to the manufacturing method of any one of claims 1 to 7.
9. The laser-scored oriented silicon steel of claim 8, wherein the laser-scored oriented silicon steel has a score groove depth of 0.4 to 3.0 μm.
10. The laser-scored oriented silicon steel of claim 9, wherein the laser-scored oriented silicon steel has been annealed at a temperature of 500 ℃ or higher, and the core loss value returns to a state before scoring.
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Denomination of invention: A Manufacturing Method for Reducing Iron Loss of Oriented Silicon Steel by Laser Scoring Effective date of registration: 20230728 Granted publication date: 20221004 Pledgee: Huaxia Bank Co.,Ltd. Baotou Branch Pledgor: BAOTOU WEIFENG RARE EARTH ELECTROMAGNETIC MATERIAL CO.,LTD. Registration number: Y2023150000118 |