CN113314453A - Micro-LED transferring method and device - Google Patents
Micro-LED transferring method and device Download PDFInfo
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- CN113314453A CN113314453A CN202110551123.4A CN202110551123A CN113314453A CN 113314453 A CN113314453 A CN 113314453A CN 202110551123 A CN202110551123 A CN 202110551123A CN 113314453 A CN113314453 A CN 113314453A
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- 238000000034 method Methods 0.000 title claims abstract description 34
- 238000012546 transfer Methods 0.000 claims abstract description 150
- 239000007788 liquid Substances 0.000 claims abstract description 107
- 239000000758 substrate Substances 0.000 claims abstract description 63
- 238000003860 storage Methods 0.000 claims abstract description 23
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 21
- 230000009471 action Effects 0.000 claims abstract description 15
- 238000007599 discharging Methods 0.000 claims abstract description 13
- 238000004064 recycling Methods 0.000 claims abstract description 13
- 238000001338 self-assembly Methods 0.000 claims abstract description 8
- 238000011084 recovery Methods 0.000 claims description 7
- 238000001035 drying Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 4
- 230000008569 process Effects 0.000 claims description 4
- 239000008367 deionised water Substances 0.000 claims description 2
- 229910021641 deionized water Inorganic materials 0.000 claims description 2
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- 238000005411 Van der Waals force Methods 0.000 description 2
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- 238000007603 infrared drying Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
- H01L2221/68322—Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
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Abstract
The application discloses a Micro-LED transferring method, which comprises the following steps: controlling a discharging device to place a preset number of chips according to the number of the assembly grooves on the transfer substrate; the chips are uniformly distributed in the liquid in the pre-arranged box under the action of the ultrasonic oscillator; opening a control valve at the bottom of the pre-placement box, and enabling the water to flow into the transfer box through a connected pipeline; the control valve is adjusted according to the liquid level in the transfer box to realize the stability of the liquid level; determining whether all the assembly grooves are correctly matched according to the comparison of the liquid flow rates flowing into the transfer box and the liquid flow rates flowing out of the transfer box; the redundant chips fall down from the transfer substrate along with the liquid flow and are discharged into the liquid storage tank through the drainage groove for recycling. Therefore, the Micro-LED chip is diffused under the action of liquid flow, self-assembly is carried out through suction, massive transfer is achieved, operation is simple, and meanwhile transfer completion rate detection is facilitated. The transfer device that this application provided simultaneously also has above-mentioned beneficial effect.
Description
Technical Field
The invention relates to the technical field of semiconductor display manufacturing, in particular to a Micro-LED transferring method and a transferring device.
Background
The micron-level pixel spacing of the Micro-LEDs can enable the Micro-LEDs to cover a plurality of application scenes from medium-small-size display to medium-large-size display and the like, compared with the traditional small-spacing LEDs, the display resolution and image quality are remarkably improved due to the miniature size, the visual angle can be wider in optical design, the contrast is higher, the image quality is better, and the Micro-LED Micro-display Micro-display Micro-display Micro display.
At present, a Micro-LED bulk transfer method mainly comprises methods such as accurate pickup, laser transfer, roller transfer, self-assembly and the like, an electrostatic force adsorption method is provided by American company LuxVue, a van der Waals force transfer method is provided by American company X-Celeprint, and an electromagnetic force adsorption method is provided by ITRI of Taiwan institute of technology, wherein the methods accurately adsorb a bulk Micro-LED chip and accurately release the chip onto a target substrate through the action of electrostatic force, van der Waals force and electromagnetic force; the fluid self-assembly technology proposed by the eLux company is a technology that Micro-LED chips fall into a prepared special structure by utilizing the action of fluid to achieve the self-assembly effect, and the magnetic self-assembly technology proposed by the SelfArray company is a technology that LEDs are self-assembled into an array by utilizing a magnet and a vibration mode.
In summary, the current method and device for transferring Micro-LEDs in huge quantities need a large number of transfer head matrixes or pretreatment of chips to realize the huge quantity transfer of Micro-LEDs, but these key dies and processing steps inevitably increase the cost, reduce the transfer efficiency, and are not convenient for detecting the transfer completion rate, so the above problems need to be solved.
Disclosure of Invention
The application aims to provide a Micro-LED transferring method and a Micro-LED transferring device, which are simple to operate and convenient to detect the transfer completion rate. The specific scheme is as follows:
the application provides a Micro-LED transfer method, which comprises the following steps:
placing the corresponding number of the Micro-LED chips according to the number of the assembly grooves of the transfer substrate;
under the action of gravity, enabling the liquid with the Micro-LED chip to flow to the transfer substrate;
diffusing the Micro-LED chip on the transfer substrate under the action of flowing along with the liquid;
under the action of suction force, the Micro-LED chip performs self-assembly of the matching assembly groove on the transfer substrate;
and the redundant Micro-LED chips fall down from the transfer substrate and are drained away through the drainage groove.
Controlling the emptying device to place a preset number of Micro-LED chips according to the number of the assembly grooves on the transfer substrate so that enough Micro-LED chips can be matched with all the assembly grooves on the transfer substrate, and after the redundant Micro-LED chips fall down from the transfer substrate, the method further comprises the following steps:
closing the control valve, waiting for discharging liquid in the transfer box, and controlling the mechanical arm to grab the transfer substrate and move out the transfer substrate carrying the Micro-LED when the Micro-LED is stabilized on the substrate;
and collecting redundant liquid with the Micro-LED chip through the liquid storage tank, and conveying the liquid to a recovery device.
The liquid reserve tank collects unnecessary Micro-LED chip to transport to recovery unit after, still include:
and controlling the mechanical arm to place the transfer substrate, and controlling the emptying device to place a preset number of Micro-LED chips according to the number of the assembly grooves on the transfer substrate.
The application provides a Micro-LED's transfer device, includes:
the transfer substrate is used for manufacturing an assembly groove matched with the structure shape of the Micro-LED chip at the bottom of the assembly groove of the transfer substrate through a Micro-electro-mechanical system (MEMS) lamination process according to the structure shape of the Micro-LED chip, and manufacturing a through hole at the bottom of the assembly groove;
the pre-setting box is used for placing a container carrying liquid of the Micro-LED chip;
a transfer box for placing a container for transferring the substrate and performing bulk transfer;
the discharging device is used for placing a preset number of Micro-LED chips so that enough Micro-LED chips can fill the assembly grooves on the transfer substrate, and redundant Micro-LED chips fall off from the transfer substrate through the liquid flowing effect, wherein the preset number is obtained according to the number of the assembly grooves on the transfer substrate;
the ultrasonic oscillator enables the Micro-LED chips to be uniformly distributed in the liquid in the pre-arranged box;
the control valve is used for controlling the flow of the liquid carrying the Micro-LED chip flowing into the transfer box;
the liquid level sensor is used for acquiring height information of the liquid level in the transfer box and sending the height information to the controller;
the controller is used for processing the signals acquired by the liquid level sensor and controlling the control valve and the discharging device;
the container bracket is used for placing the pre-placing box;
and the liquid storage tank is used for collecting redundant liquid carrying the Micro-LED chip.
The liftable container support is used for placing the transfer box and realizing the lifting separation of the transfer box and the liquid storage box;
the recovery and transportation device is used for transporting the redundant liquid with the Micro-LED chips to the recovery device;
and the mechanical arm is used for picking and placing the transfer substrate.
Therefore, the feeding device is controlled to place a preset number of chips according to the number of the assembly grooves on the transfer substrate; the chips are uniformly distributed in the liquid in the pre-arranged box under the action of the ultrasonic oscillator; opening a control valve at the bottom of the pre-placement box, and enabling the water to flow into the transfer box through a connected pipeline; the control valve is adjusted according to the liquid level in the transfer box to realize the stability of the liquid level; determining whether all the assembly grooves are correctly matched according to the comparison of the liquid flow rates flowing into the transfer box and the liquid flow rates flowing out of the transfer box; the redundant chips fall down from the transfer substrate along with the liquid flow and are discharged into the liquid storage tank through the drainage groove for recycling. Therefore, the Micro-LED chip is diffused under the action of liquid flow, self-assembly is carried out through suction, massive transfer is achieved, operation is simple, and meanwhile transfer completion rate detection is facilitated. The transfer device that this application provided simultaneously also has above-mentioned beneficial effect, and the no longer repeated description here.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, it is obvious that the drawings in the following description are only embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
FIG. 1 is a flow chart of a Micro-LED transfer method provided in an embodiment of the present application;
FIG. 2 is a diagram of a liquid forming process for carrying a chip in a pre-chamber according to an embodiment of the present application;
FIGS. 3 to 6 are diagrams illustrating the matching of the chip with the mounting slot on the transfer substrate during the bulk transfer of the chip;
FIG. 7 is a schematic overall structure diagram of a Micro-LED transfer device according to an embodiment of the present disclosure;
Detailed Description
To make the objects, technical solutions and advantages of the embodiments of the present application clearer, the embodiments of the present application will be combined
The technical scheme in the embodiment of the application is clearly and completely described by the attached drawings, and obviously, the described embodiment is
Some, but not all embodiments of the invention described herein. Based on the embodiments in this application, the ordinary skilled person in this field
All other embodiments obtained without making any inventive step are within the scope of protection of the present application.
At present, a huge amount of Micro-LED transferring methods and devices need a large amount of transferring head matrixes or pretreatment and other modes on chips to realize the huge amount of Micro-LED transferring, but the key dies and the processing steps inevitably increase the cost, reduce the transferring efficiency and are not convenient for detecting the transferring completion rate. Based on the above technical problem, the present embodiment provides a Micro-LED transferring method:
liquid is placed in the pre-placing box 102, the bottom of the pre-placing box is provided with a control valve 4 and a flow meter 5, the control valve 4 is connected with the liquid outlet 6 of the transfer box 101 through a pipeline 200, the liquid carrying the Micro-LED chip 1 flows into the transfer box 101 through the pipeline 200 and the liquid outlet 6, and the flow meter 5 is used for measuring the flow rate of the liquid flowing into the transfer box 101;
the transfer box 101 comprises a liquid outlet 6, a liquid level sensor 7 and a base 8 for placing a transfer substrate, wherein a drainage groove 9 is arranged on one side of the base 8 except the side where the liquid outlet 6 is located, redundant Micro-LED chips 1 or Micro-LED chips 1 which do not fall into the assembly groove 3 are washed away by water flow from the transfer substrate 2 under the action of water flow, and flow into a liquid storage box 10 at the bottom of the transfer box 101 through the drainage groove 9, so that huge transfer of Micro-LEDs is realized, high cost in the related art that massive transfer of Micro-LEDs can be realized only by preprocessing a large number of transfer head matrixes or chips is avoided, operation is simple, and transfer completion rate is convenient to detect, and referring to fig. 1, fig. 1 is a flow chart of a Micro-LED transfer method provided by the embodiment of the application, and specifically comprises the following steps:
s101, controlling the emptying device 300 according to the number of the assembly grooves on the transfer substrate to place a preset number of Micro-LED chips 1 into a preset box 102, and uniformly distributing the Micro-LED chips in liquid through an ultrasonic oscillator 500;
in order to ensure that each assembly groove on the transfer substrate 2 can receive the Micro-LED chips 1, the number of the placed Micro-LED chips 1 is greater than the number of the assembly grooves 3 on the transfer substrate 2, specifically, the preset number is not limited in this embodiment, and generally, in order to ensure that the Micro-LED chips 1 are fully distributed on the whole transfer substrate 2, the preset number is greater than the number of the assembly grooves 3, and may be any multiple of 5 times or 10 times of the number of the assembly grooves 3, or may be other multiples, as long as the purpose of the embodiment can be achieved. The discharging device 300 is approximately above the center of the preset box 102, and the position of the discharging device 300 is not limited in this embodiment, and is preferably set directly above the center of the preset box 102 as long as the purpose of this embodiment can be achieved.
S102, opening a control valve 4 at the bottom of a preset box 102 to enable liquid with the Micro-LED chip 1 to flow to a transfer box 101 through a pipeline 200;
s103, in the transfer box 101, the Micro-LED chips 1 flowing through the upper part of the assembly groove 3 of the transfer substrate 2 fall into the assembly groove 3 under the action of suction force to be assembled, and whether the transfer process is finished or not is judged according to signals collected by the flowmeter 5 and the liquid level sensor 7
When liquid flows through the transfer substrate 2, as the bottom of each assembly groove 3 on the transfer substrate 2 is provided with a through hole, and the transfer substrate 2 is in a suspended state, a part of liquid can flow into the liquid storage box 10 at the bottom of the transfer box 101 through the through hole in the assembly groove 3 on the transfer substrate, so that suction is generated at the assembly groove 3 on the transfer substrate 1, and an adsorption effect is generated on the Micro-LED chip 1 flowing above the assembly groove 3;
when the Micro-LED chip 1 falls into the assembly groove 3 on the transfer substrate 2 reversely, water flow can generate an acting force on a boss part on the Micro-LED chip 1, so that the Micro-LED chip 1 escapes from the assembly groove 3;
further, the liquid with the Micro-LED chip 1 in the liquid storage tank 10 may enter the preset tank 102 for recycling in some way, so as not to cause the waste of the Micro-LED chip 1, and an optional method includes that a recycling and transporting device 600 is arranged at the bottom of the liquid storage tank, the liquid storage tank 10 is moved by the recycling and transporting device 600, and the liquid in the liquid storage tank 10 and the Micro-LED chip 1 carried by the liquid storage tank are sent to a recycling place for recycling;
when the Micro-LED chip 1 is not correctly matched with the assembling groove 3, the Micro-LED chip 1 can rotate under the action of water flow and escape out of the assembling groove 3;
the size of the drainage channel 9 in the transfer tank 101 is determined according to the maximum flow of the pipeline 200, and to ensure that the maximum water inflow is greater than the drainage, the drainage of the drainage channel 9 is preferably selected to be one tenth of the maximum flow of the pipeline 200;
the liquid level sensor 7 in the transfer tank 101 is used to detect the liquid level in the transfer tank 101, which affects the transfer efficiency; the signal collected by the liquid level sensor 7 acts on the control valve 4 through the negative feedback of the controller 400, the water inflow is reduced until the water inflow is smaller than the water discharge of the water discharge tank 9, and in this case, the liquid level in the transfer box 101 is gradually reduced until the Micro-LED chip 1 can flow to the liquid level height of the assembly tank 3 on the transfer substrate 2 under the action of the suction force;
when the liquid level in the transfer box 101 reaches a set numerical value and keeps balance and stability, the flow meter 5 is used for measuring the flow rate flowing to the transfer substrate 2, if the measured water inflow is equal to the water drainage amount of the water drainage tank 9, it can be known that each assembly tank 3 on the transfer substrate has the Micro-LED chip 1 correctly falling, and at the moment, the transfer step of the Micro-LED chip 1 to the transfer substrate 2 is completed;
s104, taking out the transfer substrate, washing with deionized water and drying;
closing the control valve 4 at the bottom of the pre-setting box 102 to reduce the water inflow to zero, after the liquid on the Micro-LED chip 1 in the transfer box 101 is discharged from the drainage tank, slowly taking out the transfer substrate 2 through the mechanical arm 700 grabbing device, and putting the transfer substrate into the drying device;
a hot air type drying device cannot be adopted during drying, so that air flow can blow away the Micro-LED chips 1 in the assembly grooves 3 on the transfer substrate 2, and methods such as infrared drying or electromagnetic drying are selected;
based on the technical scheme, according to the embodiment, by the principle that suction force is generated by discharging part of liquid from the through holes in the assembly grooves 3 on the transfer substrate 2, the Micro-LED chips 1 in the liquid are automatically assembled in the assembly grooves 3 in the corresponding shapes on the transfer substrate 2, the Micro-LED chips 1 which do not fall into the assembly grooves 3 or are correctly matched with the assembly grooves 3 are flushed out of the transfer substrate 2 by the acting force of water flow, discharged into the liquid storage tank 10 through the water discharge tank 9 and then sent to the recovery part for recycling, the mass transfer of the Micro-LEDs is realized, the high cost that the mass transfer of the Micro-LEDs can be realized only by a large number of transfer head matrixes or chips in the related technology is avoided, the operation is simple, and the transfer completion rate is convenient to detect.
Referring to fig. 7, fig. 7 is a schematic structural diagram of a transfer device for Micro-LED chips provided in an embodiment of the present application, including:
the transfer box 101 is used for placing the transfer substrate 2 and is provided with a liquid outlet 6, a base 8, a water drainage tank 9 and a liquid storage box 10, the liquid storage box 10 is used for collecting redundant liquid with the Micro-LED chip 1, and the specific liquid storage box 10 can be set by a user in a self-defined mode.
The pre-tank 102 is used for containing liquid capable of carrying the Micro-LED chip 1, and the bottom of the pre-tank is provided with a control valve 4, and the control valve 4 is controlled by the controller 400.
A conduit 200 connects the transfer tank 101 to the initialization tank 102 and carries a flow meter 5 for measuring flow.
And the discharging device 300 is used for placing a preset number of Micro-LED chips 1 so that the Micro-LED chips 1 can be uniformly diffused in the liquid in the pre-tank 102 under the action of the ultrasonic oscillator 500, wherein the preset number is obtained according to the number of the assembling grooves 3 on the transfer substrate 2. Specifically, in the present embodiment, the shape and the material of the discharging device 300 are not limited, and only the Micro-LED chip 1 can be placed as long as the purpose of the present embodiment is achieved. Meanwhile, a plurality of emptying devices can be arranged according to actual requirements.
And the controller 400 is used for receiving the signal of the liquid level sensor 7 and the signal of the flowmeter 5 and sending a control signal to the control valve 4.
A container holder 800 for holding the tote 102. To ensure the holding of the pre-tank 102 and avoid the situation that the pre-tank 102 moves and the liquid therein shakes and impacts the control valve 4 when vibration occurs. The shape and material of the container support can be set by a user in a self-defined way. As long as the purpose of fixing the preset box 102 can be achieved.
And the recycling and conveying device 600 is used for conveying the redundant liquid storage tank 10 with the Micro-LED chip 1 liquid to a recycling position for recycling. The configuration user of the recycling delivery device 600 can customize the settings.
The container support 900 can be lifted and lowered for placing the transfer tank 101 and the liquid storage tank 10. In order to ensure the fixed of transfer case 101, avoid the Micro-LED chip 1 that causes of the vibration of transfer case 101 that causes under the water impact to shift the mistake, can make liquid reserve tank 10 and transfer case 101 separation through the mode that goes up and down simultaneously to change liquid reserve tank 10 through retrieving conveyer 600. The shape and material of the container support can be set by a user in a self-defined way. As long as the purpose of fixing the transfer tank 101 so as to be separable from the liquid storage tank 10 can be achieved.
A robot arm 700 for placing and taking out the transfer substrate 2.
Since the embodiment of the Micro-LED transferring method corresponds to the embodiment of the Micro-LED transferring method, reference is made to the description of the embodiment of the Micro-LED transferring method for the embodiment of the Micro-LED transferring method, and details are not repeated here.
Those of skill would further appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, computer software, or combinations of both, and that the various illustrative components and steps have been described above generally in terms of their functionality in order to clearly illustrate this interchangeability of hardware and software. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the implementation. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present application.
The Micro-LED transferring method and the Micro-LED transferring device provided by the application are described in detail above. The principles and embodiments of the present application are explained herein using specific examples, which are provided only to help understand the method and the core idea of the present application. It should be noted that, for those skilled in the art, it is possible to make several improvements and modifications to the present application without departing from the principle of the present application, and such improvements and modifications also fall within the scope of the claims of the present application.
Claims (7)
1. A transfer method of Micro-LEDs is characterized by comprising the following steps:
controlling a discharging device to put a preset number of chips according to the number of the assembly grooves on the transfer substrate, and uniformly distributing the chips in the liquid by using the action of an ultrasonic oscillator; opening a control valve at the bottom of the pre-placement box to enable liquid carrying the chips to flow to a liquid outlet through a pipeline and flow into the transfer box from the liquid outlet; the chip is diffused on the transfer box and the transfer substrate in the transfer box along with the liquid; determining whether all the assembly grooves on the transfer substrate are correctly matched by the chips according to the comparison between the liquid flow flowing into the transfer box and the liquid flow flowing out of the transfer box from the drainage groove, which is measured by a flowmeter arranged on the pipeline; and the redundant liquid carrying the chips flows away from the transfer substrate and is collected into a liquid storage tank below the transfer tank through a drainage tank.
2. A transfer method of Micro-LEDs as claimed in claim 1, wherein the control valve at the bottom of the pre-tank is controlled according to the liquid level in the transfer tank, thereby controlling the liquid level such that the suction force is sufficient to suck the chips flowing over the transfer substrate.
3. The method for transferring Micro-LEDs as set forth in claim 1, wherein the controlling tank collects the excess Micro-LED chip liquid and transports the excess Micro-LED chip liquid to a recycling device, further comprising:
and closing the control valve, controlling the mechanical arm to take out the transfer substrate, washing with deionized water and drying.
4. A Micro-LED transfer method according to claim 1, wherein when the liquid level is stable and the flow rate of the liquid flowing into the transfer box and the flow rate of the liquid flowing out of the transfer box measured by the flow meter are equal, all the mounting grooves on the transfer substrate have been correctly matched by the Micro-LED chips, and the self-assembly process is completed.
5. A Micro-LED transfer device, comprising:
the device comprises a preset box, a transfer box, a pipeline, a discharging device, an ultrasonic oscillator, a transfer substrate, a control valve, a flowmeter and a liquid level sensor; the pre-placing box is connected with a liquid outlet of the transfer box through the control valve arranged at the bottom of the pre-placing box through the pipeline, and a gravity potential difference exists between the pre-placing box and the liquid outlet; the top of the preset box is provided with the material discharging device, and the periphery of the box body is provided with an ultrasonic oscillator; the flowmeter is arranged on the pipeline; the transfer base plate is placed in the transfer box, and the liquid level sensor is installed in the transfer box; an assembly groove and a through hole which are adaptive to the shape of the chip are formed on the transfer substrate;
the controller is used for receiving signals collected by the liquid level sensor and the flowmeter and controlling the opening of the control valve and the opening and closing of the discharging device;
6. the Micro-LED transfer device of claim 5, further comprising:
the container bracket is used for placing the pre-placing box;
and the lifting container support is used for placing the transfer box and the liquid storage box.
7. The Micro-LED transfer device of claim 5, further comprising:
the liquid storage tank is used for collecting redundant liquid with the Micro-LED chips;
and the recovery and transportation device is used for conveying the liquid storage tank to the recovery device.
And the mechanical arm is used for picking and placing the transfer substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110551123.4A CN113314453A (en) | 2021-05-20 | 2021-05-20 | Micro-LED transferring method and device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110551123.4A CN113314453A (en) | 2021-05-20 | 2021-05-20 | Micro-LED transferring method and device |
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| CN113314453A true CN113314453A (en) | 2021-08-27 |
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| CN202110551123.4A Pending CN113314453A (en) | 2021-05-20 | 2021-05-20 | Micro-LED transferring method and device |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114335262A (en) * | 2021-12-29 | 2022-04-12 | 深圳市思坦科技有限公司 | Transfer device and LED chip transfer method |
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