CN113299813B

CN113299813B - LED packaging structure, LED packaging structure manufacturing method and display module

Info

Publication number: CN113299813B
Application number: CN202110519735.5A
Authority: CN
Inventors: 向昌明
Original assignee: TCL Huaxing Photoelectric Technology Co Ltd
Current assignee: TCL Huaxing Photoelectric Technology Co Ltd
Priority date: 2021-05-13
Filing date: 2021-05-13
Publication date: 2022-11-08
Anticipated expiration: 2041-05-13
Also published as: CN113299813A

Abstract

The embodiment of the application discloses an LED packaging structure, a manufacturing method of the LED packaging structure and a display module, wherein the LED packaging structure comprises: a lower housing including a bottom plate and a concave space formed by surrounding sidewalls; the LED chip is arranged on the bottom plate; the quantum dot layer is arranged in the concave space; a transparent member connected with the sidewall of the lower housing; and the reflecting part is fixedly arranged on one side of the transparent component close to the LED chip and is positioned on the light emitting side of the LED chip. The LED packaging structure can reduce the technical process difficulty of the quantum dot display module, improve the display effect and reduce blue light components.

Description

LED packaging structure, manufacturing method of LED packaging structure and display module

Technical Field

The application relates to the field of display, in particular to an LED packaging structure, a manufacturing method of the LED packaging structure and a display module.

Background

Quantum dot televisions have gained wide popularity since the market to date, and due to the excellent properties of quantum dot materials, a novel LCD display panel combining an LCD (liquid crystal display panel) and a quantum dot backlight source has excellent display effects of wide color gamut, high color saturation and color purity, and the color and display quality of the novel LCD display panel approach or even exceed that of an OLED display (organic light emitting display panel).

At present, a quantum dot television is in a form of a quantum dot backlight source and an LCD display panel, the quantum dot backlight source mostly adopts an optical structure of a blue light LED chip (light emitting diode) and a quantum dot film, but the blue light component of the backlight source is high and runs counter to the trend of current health display, and the preparation of a large-area quantum dot film has the advantages of high process difficulty, high cost, difficulty in controlling thickness uniformity, formation of a large number of nonuniform quenching centers locally and influence on display effect.

Therefore, it is necessary to provide an LED package structure to solve the problems of high process difficulty, poor display effect, and high blue light component in the prior art.

Disclosure of Invention

The embodiment of the application provides an LED packaging structure, an LED packaging structure manufacturing method and a display module, wherein the LED packaging structure comprises: a lower housing including a bottom plate and a concave space formed by surrounding sidewalls; the LED chip is arranged on the bottom plate; quantum dot layers distributed in the concave space; a transparent member connected with the sidewall of the lower housing; and the reflecting part is fixedly arranged on one side of the transparent component, which faces the LED chip, and is positioned on the light emitting side of the LED chip. This LED packaging structure sets up the reflection part reflection light to quantum dot layer through the concave space at lower part shell, sets up reflection part reflection light to quantum dot layer at LED chip light-emitting side, and the blue light that the blue light LED chip sent finally excites out the white light through quantum dot layer, and the white light is followed transparent member outgoing again, can solve the technical process degree of difficulty height of prior art, the display effect is poor, the problem that the blue light composition is high.

The embodiment of the application provides a LED packaging structure, includes:

a lower housing including a concave space formed by a bottom plate and peripheral side walls;

the LED chip is arranged on the bottom plate;

quantum dot layers distributed in the concave space;

a transparent member connected with the sidewall of the lower housing;

and the reflecting part is fixedly arranged on one side of the transparent component, which faces the LED chip, and is positioned on the light emitting side of the LED chip.

Optionally, in some embodiments of the present application, a surface of the transparent member away from the LED chip is provided with a lens structure.

Optionally, in some embodiments of the present application, the lens structure is a convex lens or a prism structure.

Optionally, in some embodiments of the present application, the reflection portion is disposed separately from the LED chip, and a reflection layer is disposed on a surface of the reflection portion close to the LED chip.

Optionally, in some embodiments of the present application, an orthogonal projection of the reflection portion on the bottom plate covers an orthogonal projection of the LED chip on the bottom plate.

Optionally, in some embodiments of the present application, the lower housing is a ceramic material.

Optionally, in some embodiments of the present application, the LED chip is a blue chip.

Optionally, in some embodiments of the present application, the quantum dot layer includes green quantum dots, red quantum dots, or the quantum dot layer includes white quantum dots.

Correspondingly, the embodiment of the application also provides a manufacturing method of the LED packaging structure, which comprises the following steps:

step S100: manufacturing a light source module;

step S200: manufacturing a lens module;

step S300: hermetically bonding the light source module and the lens module;

wherein the step S100 includes:

s110: providing a lower housing comprising a floor and a surrounding sidewall defining a concave space;

s120: installing an LED chip, preparing a conductive wire on the inner surface of the bottom plate and installing the LED chip, wherein the conductive wire is electrically connected with the LED chip;

s130: manufacturing a quantum dot layer, shielding the LED chip and the conductive wires by using a light cover, wherein the light cover is provided with an opening exposing the bottom plate at any side part of the LED chip, and manufacturing the quantum dot layer on the bottom plate at any side part of the LED chip through the opening by using a spraying method;

wherein the step S200 includes:

s210: manufacturing a transparent member, wherein the outer surface of the transparent member comprises a lens structure;

s220: manufacturing a reflecting part, wherein the reflecting part comprises an inner surface provided with a reflecting layer;

s230: assembling the transparent member and the reflecting part, fixedly combining the reflecting part and the inner surface of the transparent member through an adhesive layer, and exposing the inner surface of the reflecting part provided with the reflecting layer in a direction far away from the outer surface of the transparent member;

wherein the step S300 includes:

s310: and the light source module and the lens module are hermetically combined, the lens module and the peripheral side wall of the lower shell are hermetically combined through packaging glue, and the reflection part is fixedly arranged on one side of the transparent component close to the LED chip and positioned on the light emitting side of the LED chip.

Correspondingly, the embodiment of the application also provides a display module, which comprises the backlight module or the display panel manufactured by adopting the LED packaging structure.

The embodiment of the application provides an LED packaging structure, LED packaging structure manufacturing method and display module assembly, through set up the quantum dot layer in the concave space of lower part shell, set up reflection part reflection light to quantum dot layer at LED chip light-emitting side, the blue light that the blue light LED chip sent finally arouses out the white light through the quantum dot layer, the white light is followed transparent member outgoing again, can reduce the technical process degree of difficulty of quantum dot display module assembly, promote the display effect, can reduce blue light composition simultaneously.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the description below are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a first schematic cross-sectional view of an LED package structure according to an embodiment of the present application;

fig. 2 is a schematic cross-sectional view of an LED package structure according to an embodiment of the present application;

FIG. 3 is a schematic cross-sectional view of a third LED package structure according to an embodiment of the present application;

FIG. 4 is a cross-sectional schematic view of a lower housing provided by an embodiment of the present application;

FIG. 5 is a schematic cross-sectional view of a lower housing of an embodiment of the present application after an LED chip is mounted in the concave space;

fig. 6 is a schematic diagram illustrating a process of manufacturing a quantum dot layer by a spray coating method according to an embodiment of the present application;

fig. 7 is a schematic cross-sectional view of a light source module according to an embodiment of the present application;

FIG. 8 is a schematic cross-sectional view of a structure of a transparent member and a reflective portion provided in an embodiment of the present application;

FIG. 9 is a schematic cross-sectional view of a lens module provided by an embodiment of the present application;

fig. 10-13 are schematic diagrams illustrating steps of a method for fabricating an LED package structure according to an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application. Furthermore, it should be understood that the detailed description and specific examples, while indicating preferred embodiments of the present application, are given by way of illustration and explanation only, and are not intended to limit the present application. In the present application, unless indicated to the contrary, the use of the directional terms "upper" and "lower" generally refer to the upper and lower positions of the device in actual use or operation, and more particularly to the orientation of the figures of the drawings; while "inner" and "outer" are with respect to the outline of the device.

The embodiment of the application provides an LED packaging structure, an LED packaging structure manufacturing method and a display module. The following are detailed descriptions. It should be noted that the following description of the embodiments is not intended to limit the preferred order of the embodiments.

The first embodiment,

Referring to fig. 1, fig. 1 is a cross-sectional view of an LED package structure 10 according to an embodiment of the present disclosure, where the LED package structure 10 includes a lower housing 100, an LED chip 200, a quantum dot layer 300, a transparent member 400, and a reflective portion 500. The lower housing 100 includes a concave space 103 formed by a bottom plate 101 and a surrounding sidewall 102; the LED chip 200 is disposed on the bottom plate 101; quantum dot layer 300 is distributed and disposed in concave space 103; the transparent member 400 is connected with the sidewall 102 of the lower case 100; the reflection part 500 is fixedly disposed on one side of the transparent member 400 facing the LED chip 200 and is located on the light emitting side of the LED chip 200.

Specifically, in some embodiments, the lower housing 100 includes a concave space 103 formed by a bottom plate 101 and a surrounding sidewall 102, the concave space 103 is used for accommodating the quantum dot layer 300 and the LED chip 200, the transparent member 400 is fixedly sealed with the sidewall 102 of the lower housing 100, the transparent member 400 can be hermetically combined with the surrounding sidewall 102 of the lower housing 100 by a packaging adhesive material, the light emitting side of the LED chip 200 is a side of the transparent member 400, and the light emitting side of the LED package structure 10 is a side of an outer surface of the transparent member 400 where the lens structure 401 is disposed.

In some embodiments, the surface of the transparent member 400 remote from the LED chip 200 is provided with a lens structure 401.

In some embodiments, the lens structure 401 is a convex lens or a prism structure.

Specifically, in some embodiments, the surface of the transparent member 400 away from the LED chip 200 is provided with the lens structure 401, that is, the surface of the transparent member 400 on the light emitting side of the LED chip 200 is provided with the lens structure 401, and the lens structure 401 may be a convex lens or a prism structure, but is not limited thereto. The transparent member 400 further includes a transparent member body portion 402, and the lens structure 401 is disposed on a surface of the transparent member body portion 402.

Specifically, in some embodiments, the material of the transparent member 400 may be PMMA (polymethyl methacrylate), PC (polycarbonate), PVC (polyvinyl chloride), and the like, and the transparent member 400 may be manufactured by an integral injection molding process, and the manufactured transparent member 400 has the lens structure 401.

In some embodiments, the reflection part 500 is provided separately from the LED chip 200, and the surface of the reflection part 500 near the LED chip 200 is provided with a reflection layer.

Specifically, in some embodiments, the material of the reflection part 500 may be PMMA (polymethyl methacrylate), PC (polycarbonate), PVC (polyvinyl chloride), and the like, the reflection part 500 may be manufactured by an integral injection molding process, and a reflection layer may be formed on the inner surface of the reflection part 500 by plating, spraying, and the like, and the material of the reflection layer may be Al, ag, and the like, but is not limited thereto.

In some embodiments, the orthographic projection of the reflecting part 500 on the base plate 101 covers the orthographic projection of the LED chip on the base plate 101.

Specifically, the orthogonal projection of the reflection part 500 on the bottom plate 101 covers less than the orthogonal projection of the transparent member 400 on the bottom plate 101.

In some embodiments, the lower housing 100 is a ceramic material.

Specifically, the lower housing 100 is made of a ceramic material, and the inner surface of the concave space 103 of the lower housing 100 may have a smooth surface, which may improve the reflectivity of light.

In some embodiments, the LED chip 200 is a blue chip.

In some embodiments, quantum dot layer 300 includes green quantum dots, red quantum dots, or quantum dot layer 300 includes white light quantum dots.

Specifically, in some embodiments, the operating principle of the LED package structure 10 is as follows: the LED chip emits light that is reflected by the reflection portion 500, the light is reflected onto the quantum dot layer 300, the light is excited by the quantum dot layer 300, the excited light is reflected by the lower housing 100 and exits from the transparent member 400, the lens structure 401 on the outer surface of the transparent member 400 is used to reduce fresnel reflection, the light emitting direction of the LED package structure 10 can be adjusted, and the light emitting efficiency can be improved.

Specifically, in some embodiments, the LED chip 200 is a blue light chip, the quantum dot layer 300 includes green quantum dots and red quantum dots, the LED chip emits blue light, the blue light is reflected by the reflection portion 500, the blue light is reflected onto the quantum dot layer 300, a portion of the blue light is excited by the quantum dot layer 300 to emit red light and green light, a portion of the blue light is not excited, the red light, the green light and the blue light are mixed to form white light, the white light is reflected by the lower housing 100 and exits from the transparent member 400, the lens structure 401 on the outer surface of the transparent member 400 is used for reducing fresnel reflection, the light emitting direction of the LED package structure 10 can be adjusted, and the light emitting efficiency can be improved.

Specifically, in some embodiments, the LED chip 200 is a blue light chip, the quantum dot layer 300 includes white light quantum dots, the LED chip emits blue light, the blue light is reflected by the reflection portion 500, the blue light is reflected onto the quantum dot layer 300, the blue light is excited by the quantum dot layer 300 to form white light, the white light is reflected by the lower housing 100 to exit from the transparent member 400, the lens structure 401 on the outer surface of the transparent member 400 is used to reduce fresnel reflection, the light emitting direction of the LED package structure 10 can be adjusted, and the light emitting efficiency can be improved. Specifically, the white light quantum dots may be melamine resin and graphene quantum dot composite microspheres, and the white light quantum dots may be graphene quantum dot white light materials or other white light quantum dot materials, but not limited thereto.

Specifically, in some embodiments, referring to fig. 1, the quantum dot layer 300 is disposed on the bottom plate 101 and disposed on either side of the LED chip 200, for example, the quantum dot layer 300 is disposed on the bottom plate 101 and around the LED chip 200.

Specifically, in some embodiments, referring to fig. 2, the quantum dot layer 300 is disposed on the bottom plate 101 and the sidewall 102, and is disposed on either side of the LED chip 200, for example, the quantum dot layer 300 is disposed on the bottom plate 101 and the sidewall 102 and around the LED chip 200.

Specifically, in some embodiments, referring to fig. 3, a quantum dot layer 300 is disposed in the concave space 103, and the quantum dot layer 300 may cover the LED chip 200.

In the embodiment of the application, the LED packaging structure is simple, and the LED packaging structure is applied to a display module, so that the technical process difficulty of a quantum dot display module can be reduced; meanwhile, each LED packaging structure can be independently detected and replaced, so that the display effect of the display module can be improved; in addition, the LED chip with the LED packaging structure is a blue light chip, and in the concave space, the blue light is fully excited by the quantum dot layer to form white light, so that the blue light component can be reduced.

Example II,

Referring to fig. 4-13, a method for fabricating an LED package structure is provided in the present embodiment. As shown in fig. 10, the method for manufacturing the LED package structure includes the following steps S100 to S300:

step S100: manufacturing a light source module 11;

step S200: manufacturing a lens module 12;

step S300: the light source module 11 and the lens module 12 are hermetically bonded.

As shown in fig. 11, step S100 includes steps S110 to S130:

s110: providing a lower housing 100, the lower housing 100 comprising a bottom plate 101 and a surrounding sidewall 102 forming a concave space 103;

specifically, as shown in fig. 4, fig. 4 illustrates the structure of the lower housing 100, and the lower housing 100 includes a concave space 103 formed by a bottom plate 101 and a surrounding sidewall 102.

S120: installing an LED chip, preparing a conductive wire on the inner surface of the bottom plate 101 and installing the LED chip 200, wherein the conductive wire is electrically connected with the LED chip 200;

specifically, as shown in fig. 5, fig. 5 illustrates a structure in which the LED chip 200 is mounted in the concave space 103 of the lower housing 100.

S130: fabricating the quantum dot layer 300, shielding the LED chip 200 and the conductive traces with the mask 600, wherein the mask 600 has an opening 601 exposing the bottom plate 101 at any side of the LED chip 200, and fabricating the quantum dot layer 300 on the bottom plate 101 at any side of the LED chip 200 through the opening 601 by a spraying method.

Specifically, as shown in fig. 6, fig. 6 illustrates a process of manufacturing the quantum dot layer 300 by a spray method, in which the quantum dot material 301 is formed on the base plate through the opening 601 by the spray method, and the dense quantum dot layer 300 is formed after annealing. Referring to fig. 1 to 3 of the first embodiment, an opening 601 of the mask 600 may be disposed at a position corresponding to the quantum dot layer 300 in the concave space 103.

Specifically, as shown in fig. 7, fig. 7 illustrates the structure of the light source module 11.

As shown in fig. 12, wherein step S200 includes steps S210-S230:

s210: manufacturing a transparent member 400, wherein the outer surface of the transparent member 400 comprises a lens structure 401;

specifically, as shown in fig. 8, fig. 8 illustrates the structures of the transparent member 400 and the reflective part 500, the transparent member 400 includes a transparent member body 402 and a lens structure 401, and the lens structure 401 may be a convex lens or a prism structure, but is not limited thereto.

S220: manufacturing a reflecting part 500, wherein the reflecting part 500 comprises an inner surface provided with a reflecting layer;

S230: the transparent member 400 and the reflective part 500 are assembled, the reflective part 500 and the inner surface of the transparent member 400 are fixedly coupled by a glue layer, and the inner surface of the reflective part 500 provided with the reflective layer is exposed in a direction away from the outer surface of the transparent member 400.

Specifically, as shown in fig. 9, fig. 9 illustrates the structure of the lens module 12.

As shown in fig. 13, step S300 includes step S310:

s310: the light source module 11 and the lens module 12 are hermetically bonded, and the lens module 12 and the peripheral sidewall 102 of the lower housing 100 are hermetically bonded by a packaging adhesive, wherein the reflective portion 500 is fixedly disposed on one side of the transparent member 400 close to the LED chip 200 and on the light emitting side of the LED chip 200.

The positional relationship between the components in the light source module 11 and the lens module 12, the structure and the components of the components, and the like are the same as those in the first embodiment, and are not described again.

In the embodiment of the application, the manufacturing method of the LED packaging structure is simple, and the LED packaging structure is applied to a display module and can reduce the technical process difficulty of the quantum dot display module; meanwhile, each LED packaging structure manufactured by the manufacturing method of the LED packaging structure can be independently detected and replaced, so that the display effect of the display module can be improved; in addition, the LED chip of the LED packaging structure is a blue light chip, and in the concave space, blue light is fully excited by the quantum dot layer to form white light, so that the blue light component can be reduced.

Example III,

The embodiment of the application further provides a display module which comprises a backlight module or a display panel manufactured by adopting the LED packaging structure in any one of the embodiments.

Specifically, the LED package structure in the embodiment of the present application may be used as a backlight of a liquid crystal display panel, and the LED package structure in the embodiment of the present application may also be used to manufacture a display panel and be used as a light emitting pixel of the display panel, which is not limited herein.

The LED package structure, the method for manufacturing the LED package structure, and the display module provided in the embodiments of the present application are described in detail above, and specific examples are applied herein to explain the principle and the implementation of the present application, and the description of the embodiments is only used to help understand the method and the core idea of the present application; meanwhile, for those skilled in the art, according to the idea of the present application, the specific implementation manner and the application scope may be changed, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims

1. An LED package structure, comprising:

a lower housing including a bottom plate and a concave space formed by surrounding sidewalls;

the LED chip is arranged on the bottom plate;

quantum dot layers distributed in the concave space;

a transparent member connected with the sidewall of the lower housing;

the reflecting part is fixedly arranged on one side of the transparent component facing the LED chip and is positioned on the light emitting side of the LED chip;

wherein, the surface of the transparent component far away from the LED chip is provided with a lens structure, and the quantum dot layer is arranged on the bottom plate and the side wall and is positioned around the LED chip.

2. The LED package structure of claim 1,

the lens structure is a convex lens or prism structure.

3. The LED package structure of claim 2,

the reflecting part and the LED chip are arranged in a separated mode, and a reflecting layer is arranged on the surface, close to the LED chip, of the reflecting part.

4. The LED package structure of claim 3,

the orthographic projection of the reflecting part on the bottom plate covers the orthographic projection of the LED chip on the bottom plate.

5. The LED package structure of claim 4,

the lower housing is a ceramic material.

6. The LED package structure of claim 1,

the LED chip is a blue light chip.

7. The LED package structure of claim 6, wherein,

the quantum dot layer comprises green quantum dots, red quantum dots, or the quantum dot layer comprises white light quantum dots.

8. A manufacturing method of an LED packaging structure is characterized by comprising the following steps:

step S100: manufacturing a light source module;

step S200: manufacturing a lens module;

step S300: hermetically bonding the light source module and the lens module;

wherein the step S100 includes:

s130: manufacturing a quantum dot layer, shielding the LED chip and the conductive routing by using a light cover, wherein the light cover is provided with an opening of the bottom plate exposing any side part of the LED chip, manufacturing the quantum dot layer on the bottom plate on any side part of the LED chip by a spraying method through the opening, and the quantum dot layer is arranged on the bottom plate and the side wall and is positioned around the LED chip;

wherein the step S200 includes:

wherein the step S300 includes:

s310: and the light source module and the lens module are hermetically combined, the lens module and the peripheral side wall of the lower shell are hermetically combined through packaging glue, the reflection part is fixedly arranged on one side of the transparent component close to the LED chip and positioned on the light-emitting side of the LED chip, and the lens structure of the transparent component is positioned on the surface of the transparent component far away from the LED chip.

9. A display module comprising a backlight module or a display panel manufactured by using the LED package structure according to any one of claims 1 to 7.