CN113295913A - Power module structure of integrated current sensor - Google Patents

Power module structure of integrated current sensor Download PDF

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Publication number
CN113295913A
CN113295913A CN202110594472.4A CN202110594472A CN113295913A CN 113295913 A CN113295913 A CN 113295913A CN 202110594472 A CN202110594472 A CN 202110594472A CN 113295913 A CN113295913 A CN 113295913A
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China
Prior art keywords
current
ceramic substrate
power module
shell
busbar
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Pending
Application number
CN202110594472.4A
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Chinese (zh)
Inventor
毛先叶
孙靖雅
唐玉生
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Zhenghai Group Co ltd
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Zhenghai Group Co ltd
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Priority to CN202110594472.4A priority Critical patent/CN113295913A/en
Publication of CN113295913A publication Critical patent/CN113295913A/en
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R19/00—Arrangements for measuring currents or voltages or for indicating presence or sign thereof
    • G01R19/0092—Arrangements for measuring currents or voltages or for indicating presence or sign thereof measuring current only
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/18—Screening arrangements against electric or magnetic fields, e.g. against earth's field
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M1/00—Details of apparatus for conversion
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings

Abstract

The invention discloses a power module structure of an integrated current sensor, which comprises a radiator, a plastic shell, a copper-clad ceramic substrate, a wafer, a cover plate and an alternating current bus bar, wherein the copper-clad ceramic substrate is arranged on the surface of the radiator, the wafer is arranged on the copper-clad ceramic substrate to form a control circuit, the plastic shell is arranged on the radiator and covers the copper-clad ceramic substrate, the alternating current bus bar is connected with the copper-clad ceramic substrate and extends out of the plastic shell, the cover plate is arranged on the top surface of the plastic shell, the structure also comprises a current induction chip, a current induction plate and a metal shielding cover, the current induction chip is welded on the current induction plate, the current induction plate is arranged on the plastic shell and just faces the alternating current bus bar extending out of the plastic shell, the metal. The structure improves the integration level of the power module and the current sensor, avoids the collected current signal from being interfered or interfering other signals, improves the current sampling precision and the sampling reliability, ensures the power density of the power module, and reduces the cost.

Description

Power module structure of integrated current sensor
Technical Field
The invention relates to the technical field of power semiconductors, in particular to a power module structure of an integrated current sensor.
Background
The power module is formed by combining and packaging wafers into a whole according to certain functions, has the advantages of small size, high power density and the like, and is widely applied to the field of new energy automobiles. With the development of high power and long endurance of new energy vehicles, the application environment of the power module is increasingly severe, and the integration of the power module is widely concerned.
As shown in fig. 1, the output signal of the current sensor is connected to the control board and detects the current signal flowing through the ac busbar, and when the current sensor detects the current of the ac busbar, according to the formula (1),
Figure DEST_PATH_IMAGE002
（1）
wherein B is a magnetic field passing through the current sensor, K is a coefficient, I is a current of the AC busbar, and W1The width of the alternating current busbar is shown, and h is the distance between the alternating current busbar and the current sensor.
It can be seen that the magnitude of the magnetic field B passing through the current sensor depends greatly on the width W of the AC bus bar1And the distance h between the alternating current busbar and the current sensor. In an actual manufacturing process, when the current sensor is mounted on the ac busbar, if a deviation occurs in the distance h between the two components, a measurement error of the current becomes large. In addition, when the structure is applied to occasions with large vibration such as new energy automobiles, the distance h is easy to change due to the influence of the vibration, and the measurement error of the current value is increased.
As shown in fig. 2 and 3, in a conventional new energy vehicle inverter, a current sensor 6 is generally used to detect a current value of an ac busbar 4 in a three-phase ac controller, a conventional power module is composed of a heat sink 1, a plastic casing 2, a copper-clad ceramic substrate 7 and a wafer 8, the copper-clad ceramic substrate 7 is disposed on a surface of the heat sink 1, the wafer 8 is disposed on the copper-clad ceramic substrate 7 to form a control circuit, the plastic casing 2 is disposed on the heat sink 1 and covers the copper-clad ceramic substrate 7, the ac busbar 4 is connected to the copper-clad ceramic substrate 7, a control board 3 of the controller is located on a top surface of the plastic casing 2, since the power module and the current sensor 6 are two independent components, a detection signal of the current sensor 6 needs to be transmitted to the control board 3, and the detection signal is generally transmitted to the control board 3 by using a signal line; the current sensor 6 needs to be fixedly installed and the alternating current busbar 4 needs to penetrate through the current sensor 6, so that a part of space needs to be reserved for installing and fixing the current sensor 6 by the controller; and because the current signal is transmitted by adopting a signal wire mode, the current signal is easily interfered by external environment or other signals, and is influenced by the vehicle running vibration, the relative displacement can be generated between the current sensor 6 and the alternating current bus bar 4, and the reliability of the new energy automobile inverter is reduced. At the present stage, the new energy automobile driving controller requires higher power density and lower cost, and the conventional independent arrangement mode of the power module and the current sensor cannot meet the application requirement of the vehicle-mounted driving power module.
Disclosure of Invention
The technical problem to be solved by the invention is to provide a power module structure of an integrated current sensor, which overcomes the defects of the traditional power module, improves the integration level of the power module and the current sensor, avoids the collected current signals from being interfered or interfering other signals, improves the sampling precision and the sampling reliability of the current, ensures the power density of the power module and reduces the cost.
In order to solve the above technical problems, the power module structure of the integrated current sensor of the present invention comprises a heat sink, a plastic housing, a copper-clad ceramic substrate, a wafer, a cover plate and an ac busbar, the copper-clad ceramic substrate is arranged on the surface of the radiator, the wafer is arranged on the copper-clad ceramic substrate to form a control circuit, the plastic shell is arranged on the radiator and covers the copper-clad ceramic substrate, the alternating current busbar is connected with the copper-clad ceramic substrate and extends out of the plastic shell, the cover plate is arranged on the top surface of the plastic shell, the structure also comprises a current induction chip, a current induction plate and a metal shielding cover, the current induction chip is welded on the current induction plate, the current induction plate is arranged on the plastic shell and is opposite to an alternating current bus bar extending out of the plastic shell, the metal shielding case wraps the alternating current busbar and the current induction plate, and the current induction chip detects a current signal of the alternating current busbar.
Further, this structure still includes drive control board, drive signal pin needle and current signal connector pin needle, drive control board locates the apron top surface, drive signal pin needle is located drive control board and extension are connected to cover copper ceramic substrate by the control circuit that the wafer constitutes, current signal connector pin needle is connected current induction board and drive control board, the highly uniform of drive signal pin needle and current signal connector pin needle.
Furthermore, the pin of the current signal connector is connected with the driving control board through welding or crimping.
Further, the metal shielding case is a C-shaped case, and the height of the opening end is lower than that of the driving control board and higher than that of the current sensing chip.
Furthermore, the metal shielding case is a C-shaped case formed by bending a metal flat plate twice, the opening width of the C-shaped case is greater than the width of the alternating current busbar, and the opening end is used for arranging the pin of the current signal connector to extend and connect to the driving control board.
Further, the plastic shell is provided with a buckle at the extension part of the alternating current busbar, and the current induction plate is arranged on the plastic shell through the buckle or the bonding and is positioned between the alternating current busbar and the driving control board.
Further, the plastic shell is formed by resin injection molding, the alternating current busbar and the plastic shell are integrally formed by injection molding, and the metal shielding cover and the plastic shell are integrally formed by injection molding or are fixed on the plastic shell by adopting an adhesive.
Further, the magnetic permeability of the metal shielding case is greater than or equal to 1000.
Further, the cross-sectional area of the alternating-current busbar in the metal shielding cover is greater than or equal to 5mm, the alternating-current busbar is welded on the copper-clad ceramic substrate by adopting ultrasonic waves, the distance length from the position where the alternating-current busbar is welded on the copper-clad ceramic substrate to the position of the current induction chip is less than or equal to 20mm, and the current flowing through the alternating-current busbar is 300-1000A.
Another kind of integrated current sensor's power module structure, it includes the radiator, moulds the shell, covers copper ceramic substrate, wafer, apron and exchanges female arranging, cover copper ceramic substrate locates the radiator surface, the wafer is located cover copper ceramic substrate constitutes control circuit, mould the shell and locate the radiator and the cladding cover copper ceramic substrate, exchange female the connection cover copper ceramic substrate and stretch out mould the shell, the apron is located mould the shell top surface, its characterized in that: still include current induction chip, drive control board and metal shielding cover, drive control board locates the apron top surface, current induction chip weld in drive control board to just stretching out female the arranging of interchange of moulding the shell, metal shielding cover parcel female arranging and current induction chip are exchanged to the open end stretches out drive control board, current induction chip detects female current signal who arranges of interchange.
The power module structure of the integrated current sensor adopts the technical scheme that the structure comprises a radiator, a plastic shell, a copper-coated ceramic substrate, a wafer, a cover plate and an alternating current bus, wherein the copper-coated ceramic substrate is arranged on the surface of the radiator, the wafer is arranged on the copper-coated ceramic substrate to form a control circuit, the plastic shell is arranged on the radiator and covers the copper-coated ceramic substrate, the alternating current bus is connected with the copper-coated ceramic substrate and extends out of the plastic shell, the cover plate is arranged on the top surface of the plastic shell, the structure also comprises a current induction chip, a current induction plate and a metal shielding cover, the current induction chip is welded on the current induction plate, the current induction plate is arranged on the plastic shell and just faces the alternating current bus extending out of the plastic shell, the metal shielding cover wraps the alternating current bus and the current induction plate, and the current induction chip detects current signals of the alternating current bus. The structure overcomes the defects of the traditional power module, improves the integration level of the power module and the current sensor, avoids the collected current signal from being interfered or interfering other signals, improves the sampling precision and the sampling reliability of the current, ensures the power density of the power module, and reduces the cost.
Drawings
The invention is described in further detail below with reference to the following figures and embodiments:
FIG. 1 is a schematic diagram of a principle of a current sensor detecting an AC busbar current;
FIG. 2 is a schematic diagram of a conventional power module;
fig. 3 is a schematic view of direction a-a in fig. 2.
FIG. 4 is a schematic diagram of a power module structure of the integrated current sensor of the present invention;
FIG. 5 is a top view of FIG. 4;
FIG. 6 is a view taken along line B-B of FIG. 5;
FIG. 7 is a schematic view of a portion of the unidirectional AC busbar of FIG. 4;
FIG. 8 is a schematic diagram of a power module structure of an integrated current sensor with a driving control board;
FIG. 9 is a schematic diagram of another integrated current sensor power module configuration in accordance with the present invention; (ii) a
FIG. 10 is a top view of FIG. 9;
FIG. 11 is a view taken along line C-C of FIG. 10;
fig. 12 is a schematic diagram illustrating a principle of detecting an ac busbar current by a current sensing chip in the power module structure.
Detailed Description
For example, as shown in fig. 2 to 7, the power module structure of the integrated current sensor of the present invention includes a heat sink 1, a plastic case 2, a copper-clad ceramic substrate 7, a wafer 8, a cover plate 22, and an ac busbar 4, wherein the copper-clad ceramic substrate 7 is disposed on the surface of the heat sink 1, the wafer 8 is disposed on the copper-clad ceramic substrate 7 to form a control circuit, the plastic case 2 is disposed on the heat sink 1 and covers the copper-clad ceramic substrate 7, the ac busbar 4 is connected to the copper-clad ceramic substrate 7 and extends out of the plastic case 2, the cover plate 22 is disposed on the top surface of the plastic case 2, the structure B further includes a current sensing chip 5, a current sensing plate 10, and a metal shielding cover 9, the current sensing chip 5 is welded to the current sensing plate 10, the current sensing plate 10 is disposed on the plastic case 2 and faces the ac busbar 4 extending out of the plastic case 2, and the metal shielding cover 9 covers the ac busbar 4 and the current sensing plate 10, the current sensing chip 5 detects a current signal of the alternating current busbar 4.
As shown in fig. 4 to 8, preferably, the structure further includes a drive control board 3, a drive signal pin 12, and a current signal connector pin 11, the drive control board 3 is disposed on the top surface of the cover plate 22, the drive signal pin 12 is disposed on the drive control board 3 and extends to be connected to the control circuit formed by the wafer 8 on the copper-clad ceramic substrate 7, the current signal connector pin 11 is connected to the current induction board 10 and the drive control board 3, and the heights of the drive signal pin 12 and the current signal connector pin 11 are the same.
Preferably, the current signal connector pin 11 is connected with the driving control board 3 by welding or crimping.
Preferably, the metal shielding case 9 is a C-shaped case, and the open end is lower than the driving control board 3 and higher than the current sensing chip 5.
Preferably, the metal shielding case 9 is a C-shaped case formed by bending a metal flat plate twice, the opening width of the C-shaped case is greater than the width of the ac busbar 4, and the opening end is used for arranging the pin 11 of the current signal connector to extend and connect to the driving control board 3.
Preferably, the plastic case 2 is provided with a buckle 21 at the extension part of the ac busbar 4, and the current induction plate 10 is arranged on the plastic case 2 through the buckle 21 or adhered to the plastic case and is located between the ac busbar 4 and the drive control board 3.
Preferably, the plastic housing 2 is formed by resin injection molding, the alternating current busbar 4 is integrated with the plastic housing 2 by injection molding, and the metal shielding cover 9 is integrated with the plastic housing 2 by injection molding or is fixed on the plastic housing 2 by an adhesive.
Preferably, the magnetic permeability of the metallic shielding can 9 is greater than or equal to 1000.
Preferably, the cross-sectional area of the ac busbar 4 in the metal shielding can 9 is greater than or equal to 5mm, the ac busbar 4 is ultrasonically welded on the copper-clad ceramic substrate 7, the distance between the position where the ac busbar 4 is welded on the copper-clad ceramic substrate 7 and the position of the current sensing chip 5 is less than or equal to 20mm, and the current flowing through the ac busbar 4 is 300-1000A.
As shown in fig. 2 to 3 and 9 to 11, another power module structure of an integrated current sensor includes a heat sink 1, a plastic case 2, a copper-clad ceramic substrate 7, a wafer 8, a cover plate 22 and an ac busbar 4, wherein the copper-clad ceramic substrate 7 is disposed on the surface of the heat sink 1, the wafer 8 is disposed on the copper-clad ceramic substrate 7 to form a control circuit, the plastic case 2 is disposed on the heat sink 1 and covers the copper-clad ceramic substrate 7, the ac busbar 4 is connected to the copper-clad ceramic substrate 7 and extends out of the plastic case 2, the cover plate 22 is disposed on the top surface of the plastic case 2, the structure further includes a current sensing chip 5, a driving control board 3 and a metal shielding cover 9, the driving control board 3 is disposed on the top surface of the cover plate 22, the current sensing chip 5 is welded to the driving control board 3 and is directly opposite to the ac busbar 4 extending out of the plastic case 2, the metal shielding cover 9 wraps the alternating current busbar 4 and the current induction chip 5, the opening end of the metal shielding cover extends out of the driving control board 3, and the current induction chip 5 detects a current signal of the alternating current busbar 4.
The principle of the power module structure for detecting the current of the alternating-current busbar is shown in fig. 12, namely, a current induction chip 5 is directly welded on a drive control board 3 and is opposite to an alternating-current busbar 4, similarly, a current induction plate 10 can be arranged on the alternating-current busbar, the current induction chip 5 is welded on the current induction plate 10, and a current signal output by the current induction plate 10 is transmitted to the drive control board through a pin 11 of a current signal connector; then, a metal shielding cover 9 is adopted to cover the current induction chip 5 and the alternating current busbar 4, and the opening width of the metal shielding cover 9 is W2The distance between the current sensing chip 5 and the alternating current bus bar 4 is h, the distance between the current sensing chip 5 and the opening end of the metal shielding case 9 is h1, and h1 is greater than 0. That is, when the periphery of the ac busbar is surrounded by the metal plate with high magnetic permeability, the magnetic field B passing through the current sensing chip 5 is largely determined by the opening width W of the metal shield case 92。
Figure DEST_PATH_IMAGE004
（2）
As can be seen from the formula (2), as long as the current sensing chip 5 is located in the metal shielding case 9, it is not easily affected by the height h of the ac busbar; however, when the opening width W of the metal shield case 9 is set2When the change occurs, the error of the current value will become larger, and in the structure of the power module, the opening width W of the metal shielding cover 9 is set2The current sampling circuit is constant and is not influenced by external factors such as vibration, the current sampling precision and the sampling reliability are effectively improved, and the power density of the power module is ensured. And the metal shielding case is simpler to manufacture, and only a metal flat plate is required to be bent twice to form a C-shaped cover shell and wrap the alternating current busbar and the current induction chip, so that the equipment cost is reduced, and meanwhile, the collected current signal is prevented from being interfered or interfering other signals.

Claims (10)

1. The utility model provides an integrated current sensor's power module structure, includes the radiator, moulds the shell, covers copper ceramic substrate, wafer, apron and exchanges female arranging, cover copper ceramic substrate and locate the radiator surface, the wafer is located cover copper ceramic substrate and constitute control circuit, mould the shell and locate the radiator and the cladding cover copper ceramic substrate, exchange female the connection cover copper ceramic substrate and stretch out mould the shell, the apron is located mould the shell top surface, its characterized in that: still include current induction chip, current induction board and metal shielding cover, the current induction chip weld in the current induction board, the current induction board is located the shell just is just stretching out the female row of interchange of shell, metal shielding cover parcel the female row of interchange and current induction board, the current induction chip detects the female current signal who arranges of interchange.
2. The current sensor-integrated power module structure of claim 1, wherein: this structure still includes drive control panel, drive signal pin needle and current signal connector pin needle, drive control panel locates the apron top surface, drive signal pin needle is located drive control panel extends to be connected to cover copper ceramic substrate by the control circuit that the wafer constitutes, current signal connector pin needle is connected current induction plate and drive control panel, the highly uniform of drive signal pin needle and current signal connector pin needle.
3. The current sensor-integrated power module structure of claim 2, wherein: and the pin of the current signal connector is connected with the driving control board through welding or crimping.
4. The current sensor-integrated power module structure of claim 2 or 3, wherein: the metal shielding case is a C-shaped case, and the height of the opening end is lower than that of the driving control board and higher than that of the current sensing chip.
5. The current sensor-integrated power module structure of claim 4, wherein: the metal shielding cover is a C-shaped cover shell formed by bending a metal flat plate twice, the opening width of the metal shielding cover is larger than that of the alternating current busbar, and the opening end is used for arranging the pin of the current signal connector to extend and connect to the driving control board.
6. The current sensor-integrated power module structure of claim 4, wherein: the plastic shell is provided with a buckle at the extension part of the alternating current busbar, and the current induction plate is arranged on the plastic shell through the buckle or the bonding and is positioned between the alternating current busbar and the drive control plate.
7. The current sensor-integrated power module structure of claim 1, wherein: the plastic shell is formed by resin injection molding, the alternating current busbar and the plastic shell are integrally formed by injection molding, and the metal shielding cover and the plastic shell are integrally formed by injection molding or are fixed on the plastic shell by adopting an adhesive.
8. The current sensor-integrated power module structure of claim 1, wherein: the magnetic permeability of the metal shielding case is greater than or equal to 1000.
9. The current sensor-integrated power module structure of claim 1, wherein: the cross-sectional area of the alternating-current busbar in the metal shielding cover is larger than or equal to 5mm, the alternating-current busbar is welded on the copper-clad ceramic substrate by adopting ultrasonic waves, the distance length from the position where the alternating-current busbar is welded on the copper-clad ceramic substrate to the position of the current induction chip is smaller than or equal to 20mm, and the current flowing through the alternating-current busbar is 300-1000A.
10. The utility model provides an integrated current sensor's power module structure, includes the radiator, moulds the shell, covers copper ceramic substrate, wafer, apron and exchanges female arranging, cover copper ceramic substrate and locate the radiator surface, the wafer is located cover copper ceramic substrate and constitute control circuit, mould the shell and locate the radiator and the cladding cover copper ceramic substrate, exchange female the connection cover copper ceramic substrate and stretch out mould the shell, the apron is located mould the shell top surface, its characterized in that: still include current induction chip, drive control board and metal shielding cover, drive control board locates the apron top surface, current induction chip weld in drive control board to just stretching out female the arranging of interchange of moulding the shell, metal shielding cover parcel female arranging and current induction chip are exchanged to the open end stretches out drive control board, current induction chip detects female current signal who arranges of interchange.
CN202110594472.4A 2021-05-28 2021-05-28 Power module structure of integrated current sensor Pending CN113295913A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113990835A (en) * 2021-10-12 2022-01-28 正海集团有限公司 Power semiconductor module structure based on copper-clad ceramic substrate arrangement
DE102022102966A1 (en) 2022-02-09 2023-08-10 Audi Aktiengesellschaft Semiconductor module with integrated current sensor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113990835A (en) * 2021-10-12 2022-01-28 正海集团有限公司 Power semiconductor module structure based on copper-clad ceramic substrate arrangement
DE102022102966A1 (en) 2022-02-09 2023-08-10 Audi Aktiengesellschaft Semiconductor module with integrated current sensor

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