CN112054011A - Thin power module structure integrally formed by resin - Google Patents
Thin power module structure integrally formed by resin Download PDFInfo
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- CN112054011A CN112054011A CN202011052464.9A CN202011052464A CN112054011A CN 112054011 A CN112054011 A CN 112054011A CN 202011052464 A CN202011052464 A CN 202011052464A CN 112054011 A CN112054011 A CN 112054011A
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- power module
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- horizontal plane
- resin
- copper
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/62—Protection against overvoltage, e.g. fuses, shunts
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/49—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions wire-like arrangements or pins or rods
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Inverter Devices (AREA)
Abstract
The invention discloses a thin power module structure integrally formed by resin, which comprises a radiator, a copper-coated ceramic insulating substrate, a crystal source, positive and negative bus bar terminals and a plastic package shell, wherein the copper-coated ceramic insulating substrate is arranged on the surface of the radiator, the crystal source is arranged on a copper layer of the copper-coated ceramic insulating substrate, the plastic package shell covers the surface of the radiator, one end of each positive and negative bus bar terminal is connected with the copper layer of the copper-coated ceramic insulating substrate, the other end of each positive and negative bus bar terminal extends out of the plastic package shell, and the extending ends of the positive and negative bus bar terminals extend along an installation plane and then are bent by. The power module structure reduces surge voltage caused by stray inductance, avoids the danger of breakdown of the power module, ensures the switching characteristic of the power module, and improves the reliability of motor drive control.
Description
Technical Field
The invention relates to the technical field of motor control, in particular to a thin power module structure integrally formed by resin.
Background
High-frequency carrier is adopted in a three-phase alternating current motor driving system to drive a power module to open and close a tube at a high speed, surge voltage in proportion to the size of stray inductance of a driving main loop is loaded on the power module, and the surge voltage V is1Calculating the formula (1):
wherein the content of the first and second substances,
then
In the formula: l is stray inductance, phi is magnetic flux, I is current, B is magnetic induction intensity, a is length of the main loop connecting terminal busbar, w is width of the main loop connecting terminal busbar, h is interval of the laminated busbar, mu0Is a vacuum magnetic permeability.
Therefore, the stray inductance is reduced to the maximum extent, and the surge voltage V can be reduced1When surge voltage V1When the size of the power module is too large, the power module may be broken down, and therefore, how to reduce the stray inductance of the driving main loop is an important research subject.
Usually, the controller main loop is composed of a power module and a supporting capacitor, wherein the bus bar between the power module and the supporting capacitor is connected together by ultrasonic welding or laser welding. As shown in fig. 1, one side of a busbar 5 of a power module 1 is connected with a copper layer of an insulating substrate 2, the other side of the busbar is connected with a busbar 8 of a supporting capacitor 7 in a crimping mode through a crimping tool 9 and a crimping tool 10, and then the busbar 5 of the power module 1 is connected with the busbar 8 of the supporting capacitor 7 in an ultrasonic welding 4 mode; as shown in fig. 2, the busbar 5 of the power module 1 and the busbar 8 of the support capacitor 7 are crimped together by a crimping tool 11 and a crimping tool 12, and then the busbar 5 of the power module 1 and the busbar 8 of the support capacitor 7 are connected together by laser welding 13.
The interval A is the length of a welding connection part, and mainly considers the space required by welding (such as a welding head and the temperature during welding) and the space for using a tool and installing a crimping tool; the section B is a length from the insulating substrate 2 to the terminal portion of the busbar 5 inside the power module 1, and an electrical distance between the busbar and the heat sink is ensured by resin molding in the range of the section B.
The current loop in the interval a and the interval B can be regarded as forming a current loop with the ground, and the loop area S through which the current flows is larger, that is, a × h in equation 2 is larger, and as can be seen from equation 2, the stray inductance L is increased.
In the main loop, due to the stray inductance in the interval a and the interval B, the switching characteristics of the power module are seriously affected, and the reliability of motor drive control is reduced.
Disclosure of Invention
The technical problem to be solved by the invention is to provide a thin power module structure integrally formed by resin, which reduces surge voltage caused by stray inductance, avoids the danger of breakdown of the power module, ensures the switching characteristic of the power module and improves the reliability of motor drive control.
In order to solve the technical problem, the resin integrally formed thin power module structure comprises a radiator, a copper-clad ceramic insulating substrate, a crystal source, a positive busbar terminal, a negative busbar terminal and a plastic package shell, wherein the copper-clad ceramic insulating substrate is arranged on the surface of the radiator, the crystal source is arranged on a copper layer of the copper-clad ceramic insulating substrate, the plastic package shell covers the surface of the radiator, one end of the positive busbar terminal and the negative busbar terminal is connected with the copper layer of the copper-clad ceramic insulating substrate, the other end of the positive busbar terminal and the negative busbar terminal extend out of the plastic package shell, and the extending ends of the positive busbar terminal and the negative busbar terminal are bent by 180.
Further, the positive and negative busbar terminals are bent to form a first horizontal plane, a vertical plane and a second horizontal plane, the first horizontal plane and the second horizontal plane form opposite current directions, and the area of a current flowing through a loop is the smallest.
Further, the second horizontal plane of the positive and negative busbar terminals is connected with an external busbar in an ultrasonic welding or laser welding mode.
Further, the distance between the first horizontal plane and the second horizontal plane of the positive and negative busbar terminals is as small as possible, and the area of the current loop is the smallest at this time.
Further, no crystal source is arranged between the second horizontal plane and the first horizontal plane of the positive and negative busbar terminals.
Further, the plastic package shell is in plastic package with the surface of the radiator in an integrally formed injection molding mode.
Further, a PPS resin material or a peek resin material is adopted between the plastic package shell and the surface of the radiator for plastic package.
The resin integrally formed thin power module structure adopts the technical scheme, namely the power module structure comprises a radiator, a copper-coated ceramic insulating substrate, a crystal source, a positive busbar terminal, a negative busbar terminal and a plastic package shell, wherein the copper-coated ceramic insulating substrate is arranged on the surface of the radiator, the crystal source is arranged on a copper layer of the copper-coated ceramic insulating substrate, the plastic package shell covers the surface of the radiator, one end of the positive busbar terminal is connected with the copper layer of the copper-coated ceramic insulating substrate, the other end of the positive busbar terminal extends out of the plastic package shell, and the extending end of the positive busbar terminal and the extending end of the negative busbar terminal are bent by 180 degrees. The power module structure reduces surge voltage caused by stray inductance, avoids the danger of breakdown of the power module, ensures the switching characteristic of the power module, and improves the reliability of motor drive control.
Drawings
The invention is described in further detail below with reference to the following figures and embodiments:
FIG. 1 is a schematic diagram of a main circuit layout of a conventional controller connected by ultrasonic welding;
FIG. 2 is a schematic diagram of a main circuit layout of a conventional controller connected by laser welding;
FIG. 3 is a schematic structural diagram of a thin power module integrally formed with resin according to the present invention;
FIG. 4 is a schematic view of example 2 of the present invention;
fig. 5 is a schematic view of embodiment 3 of the present invention.
Detailed Description
Preferably, the positive and negative busbar terminals 5 are bent to form a first horizontal surface 51, a vertical surface 52 and a second horizontal surface 53, and the first horizontal surface 51 and the second horizontal surface 53 form opposite current directions, so that the area of a loop through which current flows is the smallest.
Preferably, the second horizontal plane 53 of the positive and negative busbar terminal 5 is connected with an external busbar by ultrasonic welding or laser welding.
Preferably, the distance between the first horizontal plane 51 and the second horizontal plane 53 of the positive and negative busbar terminal 5 is as small as possible, and a preferred value is less than 5mm, and at this time, the area of the current loop is the smallest.
Preferably, a crystal source is not provided between the second horizontal plane 53 and the first horizontal plane 51 of the positive and negative busbar terminal 5.
Preferably, the plastic package housing 13 is in plastic package with the surface of the heat sink 11 by adopting an integrally formed injection molding mode.
Preferably, the plastic package housing 13 and the surface of the heat sink 11 are plastically packaged by using PPS resin material or peek resin material.
As shown in fig. 4, the positive and negative bus bar terminals 5 of the power module extend along the mounting plane, then bend by 180 degrees, and extend to one side of the top surface of the plastic package housing 13 to form a welding position; the alternating current busbar terminal 6 extends along the installation plane, then is bent for 180 degrees, extends to the other side of the top surface of the plastic package shell 13 to form a welding position, and the bent parts form a first horizontal plane 61, a vertical plane 62 and a second horizontal plane 63 of the alternating current busbar terminal 6; the current I1 of the first horizontal plane 51 of the positive and negative busbar terminals 5 of the power module and the current I2 of the second horizontal plane 53 form opposite current directions, the area of the current flowing through the loop is the smallest, the current I3 of the first horizontal plane 61 of the alternating current busbar terminal 6 of the power module and the current I4 of the second horizontal plane 63 form opposite current directions, and the area of the current flowing through the loop is the smallest. And the distance between the first horizontal plane 51 and the second horizontal plane 53 of the positive and negative busbar terminals 5 is as small as possible, at this time, the area of the current loop is the smallest; the distance between the first horizontal plane 61 and the second horizontal plane 63 of the ac busbar terminal 6 is as small as possible, and a preferable value is less than 5mm, and at this time, the area of the current loop is the smallest.
In embodiment 3, as shown in fig. 5, an ac busbar terminal 6 of a power module extends along an installation plane, is bent by 180 degrees, and extends to the other side of the top surface of the plastic package housing 13 to form a welding position; the current I3 of the first horizontal plane 61 of the ac busbar terminal 6 of the power module and the current I4 of the second horizontal plane 63 form opposite current directions, and the area of the current flowing through the loop is the smallest. And the distance between the first horizontal plane 61 and the second horizontal plane 63 of the alternating current busbar terminal 6 is as small as possible, the preferable value is less than 5mm, and the area of the current loop is the smallest at the moment.
As shown in fig. 1 and 2, the positive and negative busbars between the power module and the supporting capacitor are respectively connected together by ultrasonic welding or laser welding, and the loop area through which the current of the power module flows is the smallest, that is, the a × h in formula 2 is the smallest, formed by the current I1 flowing from the first horizontal plane to the current I2 flowing from the positive and negative busbar terminals to the second horizontal plane, so that the stray inductance L is the smallest according to formula 2.
As shown in fig. 3 to 5, the positive and negative busbar terminals 5 of the power module extend along the mounting plane, and then are bent by 180 degrees to extend to the welding position, wherein the current flows from the first horizontal plane 51 to the second horizontal plane 535 of the positive and negative busbar terminals 5, I1 is the current of the first horizontal plane 51 of the positive and negative busbar terminals of the power module, I2 is the current of the second horizontal plane 53 of the positive and negative busbar terminals 5 of the power module, I3 is the current of the first horizontal plane 61 of the ac busbar terminal 6 of the power module, and I4 is the current of the second horizontal plane 63 of the ac busbar terminal 6 of the power module. The distance between the second horizontal plane 53 of the positive and negative busbar terminals 5 and the first horizontal plane 51 is as small as possible, and the current directions of I1 and I2 are opposite, so that the area of a loop through which current flows is the smallest, and stray inductance at the position is reduced; the distance between the second horizontal plane 63 of the ac busbar terminal 6 and the first horizontal plane 61 is as small as possible, preferably less than 5mm, and the current directions of I3 and I4 are opposite, so that the area of a loop through which current flows is the smallest, and stray inductance at the current position is reduced.
Therefore, adopt this power module structure can solve the power module and arrange the too big difficult problem of terminal junction stray inductance of arranging, reduce interval A, the stray inductance of interval B to reduce the stray inductance of whole major loop, reduce the surge voltage who arouses by stray inductance, avoid the danger that power module is punctured, ensure power module's switching characteristic, improve motor drive control's reliability.
Claims (7)
1. The utility model provides a resin integrated into one piece's slim power module structure, includes radiator, the female terminal and the plastic envelope shell of arranging of copper ceramic insulating substrate, crystal source, positive negative, the copper clad ceramic insulating substrate is located the radiator surface, crystal source locates the copper layer of copper ceramic insulating substrate, the plastic envelope cover fits the radiator surface, female terminal one end of arranging of positive negative is connected copper layer, the other end of copper ceramic insulating substrate extend the plastic envelope shell, its characterized in that: and the extending ends of the positive and negative busbar terminals extend along the mounting plane and then are bent by 180 degrees and extend to the position above the plastic package shell.
2. The resin-integrated thin power module structure according to claim 1, characterized in that: the positive and negative busbar terminals are bent to form a first horizontal plane, a vertical plane and a second horizontal plane, the first horizontal plane and the second horizontal plane form opposite current directions, and the area of a current flowing through a loop is the minimum at the moment.
3. The resin-integrated thin power module structure according to claim 2, characterized in that: and the second horizontal plane of the positive and negative busbar terminals is connected with an external busbar in an ultrasonic welding or laser welding mode.
4. The resin-integrated thin power module structure according to claim 2 or 3, characterized in that: the distance between the first horizontal plane and the second horizontal plane of the positive and negative busbar terminals is as small as possible, and the area of a current loop is the smallest at the moment.
5. The resin-integrated thin power module structure according to claim 4, characterized in that: and a crystal source is not arranged between the second horizontal plane and the first horizontal plane of the positive and negative busbar terminals.
6. The resin-integrated thin power module structure according to claim 4, characterized in that: the plastic package shell is in plastic package with the surface of the radiator in an integrally formed injection molding mode.
7. The resin-integrated thin power module structure according to claim 6, characterized in that: and the plastic package shell and the surface of the radiator are plastically packaged by adopting PPS resin material or peek resin material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011052464.9A CN112054011A (en) | 2020-09-29 | 2020-09-29 | Thin power module structure integrally formed by resin |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011052464.9A CN112054011A (en) | 2020-09-29 | 2020-09-29 | Thin power module structure integrally formed by resin |
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| CN112054011A true CN112054011A (en) | 2020-12-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202011052464.9A Pending CN112054011A (en) | 2020-09-29 | 2020-09-29 | Thin power module structure integrally formed by resin |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115513163A (en) * | 2022-09-28 | 2022-12-23 | 上海海姆希科半导体有限公司 | Optimized structure of positive and negative busbars of power module |
-
2020
- 2020-09-29 CN CN202011052464.9A patent/CN112054011A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115513163A (en) * | 2022-09-28 | 2022-12-23 | 上海海姆希科半导体有限公司 | Optimized structure of positive and negative busbars of power module |
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Effective date of registration: 20210727 Address after: 264006 33rd floor, Zhenghai building, 66 Zhujiang Road, Yantai Development Zone, Yantai area, China (Shandong) pilot Free Trade Zone, Yantai City, Shandong Province Applicant after: Zhenghai Group Co.,Ltd. Address before: 201114, C105, building 189, building 188, building 2, No. 1, Chun Chun Road, Shanghai, Minhang District Applicant before: SHANGHAI DAJUN TECHNOLOGIES, Inc. |
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