CN113290296B - PCB circuit board soldering equipment and PCB circuit board processing technology - Google Patents

PCB circuit board soldering equipment and PCB circuit board processing technology Download PDF

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Publication number
CN113290296B
CN113290296B CN202110544296.3A CN202110544296A CN113290296B CN 113290296 B CN113290296 B CN 113290296B CN 202110544296 A CN202110544296 A CN 202110544296A CN 113290296 B CN113290296 B CN 113290296B
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fixedly connected
circuit board
soldering
clamping
pcb
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CN202110544296.3A
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CN113290296A (en
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徐琳
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Zhejiang Hangdu Technology Co ltd
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Zhejiang Hangdu Technology Co ltd
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08Auxiliary devices therefor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3421Leaded components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447Lead-in-hole components
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/36Electric or electronic devices
    • B23K2101/42Printed circuits

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

The invention relates to the technical field of circuit board soldering equipment, and discloses PCB circuit board soldering equipment and a PCB circuit board processing technology, wherein a hot melting gun extrudes hot melt adhesive towards a circuit board, a sliding hemisphere is contacted with the circuit board to enable an extrusion spring to generate elastic deformation, a pressing top ring moves towards the direction of a fixed bottom ring, so that a user can be prevented from accidentally touching and burning skin when extruding the hot melt adhesive, a driving motor is started, an output end of the driving motor drives an input shaft to rotate through a coupler, the input shaft further enables a fan to rotate, the fan rotates at high speed to generate certain air volume, air is blown into a cooling box through a cooling pipe and is blown onto the circuit board through a rectangular air outlet hole, the bonding pad can be cooled, a metal plate of the bonding pad is prevented from generating large temperature difference due to higher temperature, the bonding pad falls off due to heat and cold shrinkage, and the circuit board can slide in an operation table through the arrangement of a plurality of balls, thereby be convenient for the circuit board take out in the operation panel, labour saving and time saving.

Description

PCB circuit board soldering equipment and PCB circuit board processing technology
Technical Field
The invention relates to the technical field of circuit board soldering equipment, in particular to PCB circuit board soldering equipment and a PCB circuit board processing technology.
Background
In recent years, in the development process of electronic industry technologies, a circuit board, a PCB and a soldering technology, a very obvious trend is noticed to be a reflow soldering technology. In principle, conventional cartridges may also be subjected to a reflow process, known as through-hole reflow soldering. The advantage is that it is possible to complete all solder joints at the same time, minimizing production costs, while temperature sensitive components limit the application of reflow soldering, whether the cartridge or smd, and then one turns his eyes to selective soldering, most applications will use selective soldering after reflow soldering, which will be an economical and efficient method of soldering the remaining cartridge, and will be fully compatible with future lead-free soldering, first the solvent used to achieve the required viscosity and screening properties will start to evaporate, the temperature rise must be slow to limit boiling and splashing, to prevent formation of small tin beads, and some components will be sensitive to internal stresses, which if the external temperature of the component rises too fast will cause breakage, the flux will be active, chemical cleaning actions will start, water soluble flux and no-clean flux will all take place the same cleaning actions, only slightly different temperatures, to remove metal oxides and some contamination from the metal and solder particles to be joined, good metallurgical soldering points require "clean" surfaces, and as the temperature continues to rise, the solder particles first melt individually and begin the "rush" process of liquification and surface wicking of tin, thus covering all possible surfaces and initiating the formation of soldering points.
Among the prior art, when welding the pad on the circuit board, often because of flatiron high temperature and long-time circulation spot welding, the metal sheet that leads to the pad produces great difference in temperature because of higher temperature, expend with heat and contract with cold make the pad drop, and in the real life, operating personnel often adopts the sticky mode of hot melt adhesive to fix the pad, but the hot melt adhesive is because of the jiao kou does not set up protector when using, make the user mistake touch easily and lead to scalding skin, consequently, we have disclosed a PCB circuit board soldering equipment and have satisfied the welding demand.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides a PCB circuit board soldering device which has the advantages of cooling a bonding pad, preventing hot melt adhesive from scalding operators and the like, and solves the problems that the bonding pad falls off and the operators touch the hot melt adhesive by mistake to scald the bonding pad.
(II) technical scheme
In order to achieve the purpose, the invention provides the following technical scheme:
the utility model provides a PCB circuit board soldering equipment, includes base 1, its characterized in that: the top of the base 1 is fixedly connected with four supporting and fixing columns 2, the top ends of the four supporting and fixing columns 2 are fixedly connected with the same operating platform 3, a circuit board 12 is arranged in the operating platform 3, the top of the circuit board 12 is provided with a bonding pad 13, the top of the operating platform 3 is fixedly connected with an arc placing block 34, the top of the arc placing block 34 is provided with a tin soldering gun 35, the top of the base 1 is fixedly connected with a base 20, the top of the base 20 is fixedly connected with an air inlet cylinder 21, one end of the air inlet cylinder 21 is fixedly connected with a cooling pipe 28, one end of the cooling pipe 28 is fixedly connected with a cooling box 29, the cooling box 29 is positioned in one side of the operating platform 3, the two ends of the cooling box 29 are respectively connected with the inner walls of the two sides of the operating platform 3, and the position of the cooling box 29 corresponds to the position of the circuit board 12, one side of the cooling box 29 is provided with a rectangular air outlet 30.
Furthermore, a connecting hole 31 is formed in one side of the rectangular air outlet 30, the connecting hole 31 is communicated with the rectangular air outlet 30, and one end of the cooling pipe 28 extends into the connecting hole 31.
Further, post 14 is accomodate to the top fixedly connected with elasticity of operation panel 3, be equipped with hot melt gun 15 in the elasticity is accomodate the post 14, fixed bottom ring 16 has been cup jointed to the upside of hot melt gun 15 fixed, the upper end fixedly connected with of hot melt gun 15 compresses tightly top ring 17, the position that compresses tightly top ring 17 with fixed bottom ring 16's position is corresponding, compress tightly two slip hemispheres 18 of upper end fixedly connected with of top ring 17, the fixed cup joints of the upside of fixed bottom ring 16 has pressure spring 19, pressure spring 19's position with fixed bottom ring 16 the position that compresses tightly top ring 17 is corresponding, pressure spring 19's both ends respectively with fixed bottom ring 16 compress tightly top ring 17 and be connected.
Further, one side fixedly connected with controller 22 of air inlet cylinder 21, one side inner wall fixedly connected with retainer plate 23 of air inlet cylinder 21, a plurality of evenly distributed inlet ports 24 have been seted up to one side of retainer plate 23, the fixed cover of one side inner wall of retainer plate 23 has been connect driving motor 25, driving motor 25's output fixedly connected with shaft coupling, the one end fixedly connected with input shaft 26 of shaft coupling, the one end fixedly connected with fan 27 of input shaft 26, the position of fan 27 with the position of inlet port 24 is corresponding.
Furthermore, the top of the base 1 is fixedly connected with two connecting columns 32, the top ends of the two connecting columns 32 are fixedly connected with the same tin furnace 33, and the tin furnace 33 is communicated with a tin soldering gun 35.
Further, one end fixedly connected with display panel 36 of tin welder 35, one side of tin welder 35 is fixed to be cup jointed fixed disk 37, the position of fixed disk 37 with display panel 36's position is corresponding, tin welder 35 with electrically connected with same data wire between display panel 36, two cameras 38 of one end fixedly connected with of fixed disk 37, two image processor 39 of one side fixedly connected with of display panel 36, two image processor 39's position respectively with two cameras 38 corresponding, two cameras 38 of same relative position with equal fixedly connected with same formation of image wire 40 between the image processor 39, two the both ends of formation of image wire 40 with corresponding two image processor 39, camera 38 is electric connection.
Furthermore, a transmission groove 4 has been seted up to one side of operation panel 3, one side inner wall fixedly connected with rubber strip 5 of operation panel 3, the position of rubber strip 5 is in the top of the position of transmission groove 4, transmission groove 4 with a plurality of same dead levers 6 of fixedly connected with between 3 opposite sides of operation panel, a plurality of evenly distributed dead lever 6 all rotates and has cup jointed ball 7.
Furthermore, a slide hole is formed in the side wall of the other side of the operating platform 3, a clamping rod 8 is sleeved in the slide hole in a sliding mode, two ends of the clamping rod 8 penetrate through the slide hole respectively and extend to the outer side of the slide hole respectively, a pull disc 9 is fixedly connected to one end of the clamping rod 8, a clamping rubber pad 10 is fixedly connected to the other end of the clamping rod 8, the clamping rubber pad 10 is located in the operating platform 3, a clamping spring 11 is fixedly sleeved on one side of the clamping rod 8, two ends of the clamping spring 11 are connected with the clamping rubber pad 10 and the inner wall of the operating platform 3 respectively, the circuit board 12 is located above the balls 7, and two ends of the circuit board 12 are attached to the rubber strip 5 and one side of the clamping rubber pad 10 respectively.
A PCB board processing process using a PCB board soldering apparatus as claimed in any one of claims 1 to 8.
(III) advantageous effects
Compared with the prior art, the invention provides PCB circuit board soldering equipment, which has the following beneficial effects:
1. this PCB circuit board soldering equipment, through starting driving motor, driving motor's output passes through the shaft coupling and drives the input shaft rotation, the input shaft and then makes the fan rotate, the high-speed certain amount of wind that produces that rotates of fan, wind blows into the cooler bin through the cooling tube in, blow on the circuit board through the rectangle exhaust vent at last, thereby can cool down the pad, prevent that the metal sheet of pad from producing great difference in temperature because of higher temperature, expend with heat and contract with cold makes the pad drop.
2. This PCB circuit board soldering equipment aims at the circuit board through the hot melt rifle and extrudes the hot melt adhesive, and the slide hemisphere contacts with the circuit board, makes extrusion spring take place elastic deformation through the extrusion, compresses tightly the direction removal of apical ring toward fixed bottom ring to the user touches by mistake and leads to the skin scald when can preventing to extrude the hot melt adhesive.
3. This PCB circuit board soldering equipment draws the dish through outside pulling, drives clamping bar for clamping bar drives and presss from both sides tight rubber pad and outwards slides, makes clamping spring take place elastic deformation, places the circuit board on a plurality of balls, loosens and draws the dish, makes clamping bar return under clamping spring's effect, and one side and the circuit board of pressing from both sides tight rubber pad are laminated, thereby can carry out the centre gripping to the circuit board and fix.
4. This PCB circuit board soldering equipment through the setting of two cameras, can shoot the welding process of soldering gun to the pad, and then will shoot the signal through image processor and formation of image wire and spread into display panel in, enlarge it through display panel for welding process is more clear, thereby is convenient for the operating personnel more and welds.
5. This PCB circuit board soldering equipment through the setting of a plurality of balls for the circuit board can slide in the operation panel, thereby is convenient for the circuit board and takes out labour saving and time saving in the operation panel.
Drawings
FIG. 1 is a perspective view of a first embodiment of the present invention;
FIG. 2 is a perspective view of a second embodiment of the present invention;
FIG. 3 is a schematic perspective view of the operation table according to the present invention;
FIG. 4 is a schematic perspective view of the circuit board of the present invention;
FIG. 5 is a perspective view of the clamping bar of the present invention;
FIG. 6 is a perspective view of the heat gun of the present invention;
FIG. 7 is a schematic sectional perspective view of an air intake barrel according to the present invention;
fig. 8 is a schematic perspective view of a tin solder gun according to the present invention.
In the figure: 1. a base; 2. supporting and fixing columns; 3. an operation table; 4. a transmission groove; 5. a rubber strip; 6. fixing the rod; 7. a ball bearing; 8. a clamping lever; 9. pulling the disc; 10. clamping the rubber pad; 11. a clamping spring; 12. a circuit board; 13. a bonding pad; 14. an elastic receiving column; 15. a hot melting gun; 16. fixing the bottom ring; 17. compressing the top ring; 18. a sliding hemisphere; 19. a compression spring; 20. a base; 21. an air inlet cylinder; 22. a controller; 23. a stationary ring; 24. an air inlet; 25. a drive motor; 26. an input shaft; 27. a fan; 28. a cooling tube; 29. a cooling box; 30. a rectangular air outlet hole; 31. connecting holes; 32. connecting columns; 33. a tin furnace; 34. an arc-shaped placing block; 35. a tin soldering gun; 36. a display panel; 37. fixing the disc; 38. a camera; 39. an image processor; 40. the wire is imaged.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, belong to the protection scope of the present invention.
As mentioned in the background, the prior art has deficiencies, and in order to solve the technical problems, the application provides a PCB circuit board soldering device
In a typical embodiment of the present application, as shown in fig. 1-8, a PCB circuit board soldering apparatus includes a base 1, four supporting and fixing columns 2 are fixedly connected to the top of the base 1, the top ends of the four supporting and fixing columns 2 are fixedly connected to the same operation platform 3, a transmission groove 4 is formed in one side of the operation platform 3, a rubber strip 5 is fixedly connected to the inner wall of the same side of the operation platform 3, the position of the rubber strip 5 corresponds to the position of the transmission groove 4, a plurality of same fixing rods 6 are fixedly connected to the side of the transmission groove 4 close to the operation platform 3, a plurality of uniformly distributed fixing rods 6 are rotatably sleeved with balls 7, a slide hole is formed in the side wall of the other side of the operation platform 3, a clamping rod 8 is slidably sleeved in the slide hole, two ends of the clamping rod 8 respectively penetrate through the slide hole and respectively extend to the outside of the slide hole, a pull disc 9 is fixedly connected to one end of the clamping rod 8, the other end of the clamping rod 8 is fixedly connected with a clamping rubber pad 10, the clamping rubber pad 10 is located in the operating table 3, one side of the clamping rod 8 is fixedly sleeved with a clamping spring 11, and two ends of the clamping spring 11 are respectively connected with the clamping rubber pad 10 and the inner wall of one side of the operating table 3.
Further, in the above scheme, be equipped with circuit board 12 in operation panel 3, circuit board 12 is located one side of a plurality of balls 7, and the both ends of circuit board 12 laminate with rubber strip 5, the one side of pressing from both sides tight rubber pad 10 respectively mutually, and the top of circuit board 12 is equipped with pad 13, and the top fixedly connected with elasticity of operation panel 3 accomodates post 14, is equipped with hot melt gun 15 in the elasticity accomodates the post 14, through hot melt gun 15's setting, can extrude the hot melt adhesive on circuit board 12, is convenient for fix pad 13.
Further, in above-mentioned scheme, one side of hot melt gun 15 is fixed to be cup jointed fixed bottom ring 16, the one end fixedly connected with of hot melt gun 15 compresses tightly top ring 17, the position that compresses tightly top ring 17 is corresponding with the position of fixed bottom ring 16, compress tightly two slip hemispheres 18 of one end fixedly connected with of top ring 17, one side of hot melt gun 15 is fixed to be cup jointed the quota and presses spring 19, pressure spring 19's position and fixed bottom ring 16, the position that compresses tightly top ring 17 is corresponding, through pressure spring 19, compress tightly the setting of top ring 17 and fixed bottom ring 16, can prevent that operating personnel mistake from touching the hot melt adhesive and leading to the skin scald.
Further, in the above scheme, the both ends of pressure spring 19 are connected with fixed bottom ring 16, compress tightly top ring 17 respectively, the top fixedly connected with base 20 of base 1, the top fixedly connected with air inlet cylinder 21 of base 20, one side fixedly connected with controller 22 of air inlet cylinder 21, one side inner wall fixedly connected with retainer plate 23 of air inlet cylinder 21, a plurality of evenly distributed inlet ports 24 have been seted up to one side of retainer plate 23, through the setting of inlet port 24, be convenient for outside air gets into in the air inlet cylinder 21.
Further, in the above scheme, the fixed cover that has connect with driving motor 25 on one side inner wall of retainer plate 23, driving motor 25's output fixedly connected with shaft coupling, the one end fixedly connected with input shaft 26 of shaft coupling, the one end fixedly connected with fan 27 of input shaft 26, the position of fan 27 is corresponding with the position of inlet port 24, the one end fixedly connected with cooling tube 28 of air inlet tube 21, through the setting of fan 27, can cool down pad 13, prevent that expend with heat and contract with cold from resulting in pad 13 to drop.
Further, in the above solution, the position of the cooling tube 28 corresponds to the position of the fan 27, one end of the cooling tube 28 is fixedly connected with the cooling box 29, the cooling box 29 is located in one side of the console 3, two ends of the cooling box 29 are respectively connected with the inner walls of two sides of the console 3, and the position of the cooling box 29 corresponds to the position of the circuit board 12.
Further, in the above scheme, rectangular exhaust vent 30 has been seted up to one side of cooling box 29, and connecting hole 31 has been seted up to one side of rectangular exhaust vent 30, and connecting hole 31 is linked together with rectangular exhaust vent 30, and the one end of cooling tube 28 extends to in connecting hole 31, two spliced poles 32 of the top fixedly connected with of base 1, and the same tin stove 33 of top fixedly connected with of two spliced poles 32, through the setting of rectangular exhaust vent 30, the wind of being convenient for is discharged.
Further, in the above scheme, the position of the tin furnace 33 corresponds to the position of the air inlet cylinder 21, the arc-shaped placing block 34 is fixedly connected to the top of the operating platform 3, the top of the arc-shaped placing block 34 is provided with the tin soldering gun 35, one end of the tin soldering gun 35 is fixedly connected with the display panel 36, the fixed disk 37 is fixedly sleeved on one side of the tin soldering gun 35, the position of the fixed disk 37 corresponds to the position of the display panel 36, the same data wire is electrically connected between the tin soldering gun 35 and the display panel 36, the welding process can be amplified through the arrangement of the display panel 36, and the welding can be performed by an operator more conveniently.
Further, in the above solution, two cameras 38 are fixedly connected to one end of the fixed disk 37, two image processors 39 are fixedly connected to one side of the display panel 36, the positions of the two image processors 39 correspond to the positions of the two cameras 38, the same imaging wire 40 is fixedly connected between the two cameras 38 and the image processors 39 at the same relative position, the two ends of the two imaging wires 40 are electrically connected to the two corresponding image processors 39 and the cameras 38, and the welding process can be photographed through the arrangement of the cameras 38.
A PCB board processing process using a PCB board soldering apparatus as claimed in any one of claims 1 to 8.
When the clamping device is used, the pull disc 9 is pulled outwards to drive the clamping rod 8, so that the clamping rod 8 drives the clamping rubber pad 10 to slide outwards, the clamping spring 11 elastically deforms, the circuit board 12 is placed on the balls 11, the pull disc 9 is loosened, the clamping rod 8 returns under the action of the clamping spring 11, one side of the clamping rubber pad 10 is attached to the circuit board 12, and the circuit board 12 can be clamped and fixed.
Hot melt gun 15 aims at circuit board 12 and extrudes the hot melt adhesive, and sliding hemisphere 18 contacts with circuit board 12, makes extrusion spring 19 take place elastic deformation through the extrusion, compresses tightly top ring 17 and removes toward the direction of fixed bottom ring 16 to user's mistake touches when can preventing to extrude the hot melt adhesive and leads to the skin scald.
Start driving motor 25, driving motor 25's output passes through the shaft coupling and drives input shaft 26 and rotate, input shaft 26 and then makes fan 27 rotate, fan 27 rotates at a high speed and produces certain amount of wind, wind blows into cooler bin 29 through cooling tube 28 in, blow on circuit board 12 through the rectangle exhaust vent at last, thereby can cool down pad 13, prevent that the metal sheet of pad 13 from producing great difference in temperature because of higher temperature, expend with heat and contract with cold makes pad 13 drop.
Through the setting of two cameras 38, can shoot the welding process of soldering gun 35 to pad 13, and then will shoot the signal through image processor 39 and imaging wire 40 and spread into display panel 36 in, enlarge it through display panel 36 for the welding process is more clear, thereby is convenient for the operating personnel to weld more.
Through the setting of a plurality of balls 7 for circuit board 12 can slide in operation panel 3, thereby be convenient for circuit board 12 takes out labour saving and time saving in operation panel 3.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (8)

1. A PCB circuit board soldering equipment, includes base (1), its characterized in that: the top of the base (1) is fixedly connected with four supporting and fixing columns (2), the top ends of the four supporting and fixing columns (2) are fixedly connected with the same operating platform (3), a circuit board (12) is arranged in the operating platform (3), the top of the circuit board (12) is provided with a welding disc (13), the top of the operating platform (3) is fixedly connected with an arc-shaped placing block (34), the top of the arc-shaped placing block (34) is provided with a soldering gun (35), the top of the base (1) is fixedly connected with a base (20), the top of the base (20) is fixedly connected with an air inlet cylinder (21), one end of the air inlet cylinder (21) is fixedly connected with a cooling pipe (28), one end of the cooling pipe (28) is fixedly connected with a cooling box (29), the cooling box (29) is positioned in one side of the operating platform (3), and two ends of the cooling box (29) are respectively connected with inner walls on two sides of the operating platform (3), the position of the cooling box (29) corresponds to the position of the circuit board (12), and one side of the cooling box (29) is provided with a rectangular air outlet (30); the top fixed connection of operation panel (3) has elasticity to accomodate post (14), be equipped with hot melt gun (15) in elasticity accomodates post (14), the upside of hot melt gun (15) is fixed to have cup jointed solid fixed bottom ring (16), the upper end fixedly connected with of hot melt gun (15) compresses tightly top ring (17), the position that compresses tightly top ring (17) with the position of fixed bottom ring (16) is corresponding, compress tightly two slip hemispheres (18) of upper end fixedly connected with of top ring (17), the upside of fixed bottom ring (16) is fixed to have cup jointed pressure spring (19), the position of pressure spring (19) with fixed bottom ring (16) the position that compresses tightly top ring (17) is corresponding, the both ends of pressure spring (19) respectively with fixed bottom ring (16) compress tightly top ring (17) and be connected.
2. A PCB board soldering apparatus according to claim 1, wherein: connecting hole (31) have been seted up to one side of rectangle exhaust vent (30), connecting hole (31) with rectangle exhaust vent (30) are linked together, the one end of cooling tube (28) extends to in connecting hole (31).
3. A PCB board soldering apparatus according to claim 1, wherein: one side fixedly connected with controller (22) of air inlet cylinder (21), one side inner wall fixedly connected with retainer plate (23) of air inlet cylinder (21), a plurality of evenly distributed inlet ports (24) have been seted up to one side of retainer plate (23), one side inner wall fixed cup joint driving motor (25) of retainer plate (23), the output fixedly connected with shaft coupling of driving motor (25), the one end fixedly connected with input shaft (26) of shaft coupling, the one end fixedly connected with fan (27) of input shaft (26), the position of fan (27) with the position of inlet port (24) is corresponding.
4. A PCB board soldering apparatus according to claim 1, wherein: the tin soldering machine is characterized in that two connecting columns (32) are fixedly connected to the top of the base (1), the top ends of the two connecting columns (32) are fixedly connected with the same tin furnace (33), and the tin furnace (33) is communicated with a tin soldering gun (35).
5. A PCB board soldering apparatus according to claim 1, wherein: one end fixedly connected with display panel (36) of tin soldering rifle (35), fixed disk (37) has been cup jointed to one side of tin soldering rifle (35) is fixed, the position of fixed disk (37) with the position of display panel (36) is corresponding, tin soldering rifle (35) with electric connection has same data wire between display panel (36), two cameras (38) of one end fixedly connected with of fixed disk (37), two image processor (39) of one side fixedly connected with of display panel (36), two image processor (39)'s position is corresponding with the position of two cameras (38) respectively, two cameras (38) of same relative position with equal fixedly connected with is same formation of image wire (40) between image processor (39), two the both ends of formation of image wire (40) and two that correspond image processor (39), The cameras (38) are all electrically connected.
6. A PCB board soldering apparatus according to claim 1, wherein: transmission groove (4) have been seted up to one side of operation panel (3), one side inner wall fixedly connected with rubber strip (5) of operation panel (3), the position of rubber strip (5) is in the top of the position of transmission groove (4), transmission groove (4) with a plurality of same dead levers of fixedly connected with (6), a plurality of evenly distributed between operation panel (3) the opposite side dead lever (6) all rotate and have cup jointed ball (7).
7. A PCB circuit board soldering apparatus according to claim 6, wherein: a slide hole is arranged on the side wall of the other side of the operating platform (3), a clamping rod (8) is sleeved in the slide hole in a sliding manner, two ends of the clamping rod (8) respectively penetrate through the slide hole, and respectively extend to the outer side of the sliding hole, one end of the clamping rod (8) is fixedly connected with a pull disc (9), the other end of the clamping rod (8) is fixedly connected with a clamping rubber pad (10), the clamping rubber pad (10) is positioned in the operating table (3), one side of the clamping rod (8) is fixedly sleeved with a clamping spring (11), two ends of the clamping spring (11) are respectively connected with the clamping rubber pad (10) and the inner wall of the operating platform (3), the circuit board (12) is located a plurality of the top of ball (7), the both ends of circuit board (12) respectively with rubber strip (5) one side laminating mutually of pressing from both sides tight rubber pad (10).
8. A PCB circuit board processing technology is characterized in that: the PCB circuit board processing technology uses the PCB circuit board soldering device as claimed in any one of claims 1 to 7.
CN202110544296.3A 2021-05-19 2021-05-19 PCB circuit board soldering equipment and PCB circuit board processing technology Active CN113290296B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110544296.3A CN113290296B (en) 2021-05-19 2021-05-19 PCB circuit board soldering equipment and PCB circuit board processing technology

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110544296.3A CN113290296B (en) 2021-05-19 2021-05-19 PCB circuit board soldering equipment and PCB circuit board processing technology

Publications (2)

Publication Number Publication Date
CN113290296A CN113290296A (en) 2021-08-24
CN113290296B true CN113290296B (en) 2022-07-22

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CN115055774A (en) * 2022-08-18 2022-09-16 徐州佳智信息科技有限公司 Chip soldering equipment for computer system integration

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CN211977326U (en) * 2020-05-07 2020-11-20 吉林省新立恒星科技有限公司 Cooling device for automobile mechanical parts
CN212094742U (en) * 2019-12-03 2020-12-08 浙江凯耀照明有限责任公司 Automatic change LED light module welding machine
CN212665122U (en) * 2020-06-30 2021-03-09 芜湖新迪科技有限公司 Full-automatic PCB circuit board soldering tin device
CN213033840U (en) * 2020-06-24 2021-04-23 万起(昆山)电子科技有限公司 Integrated circuit board welding auxiliary device
CN112822867A (en) * 2020-12-31 2021-05-18 杨亚军 False-soldering and missing-soldering prevention equipment for PCB (printed circuit board) of integrated circuit carrier and use method

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Publication number Priority date Publication date Assignee Title
JP2012124201A (en) * 2010-12-06 2012-06-28 Hitachi Ltd Soldering mechanism and soldering method
CN207201095U (en) * 2017-07-20 2018-04-06 吴忠市中心电焊机有限公司 A kind of welding circuit board workbench
CN108296583A (en) * 2018-02-06 2018-07-20 海宁双迪电子照明有限公司 A kind of LED lamp circuit plate Soldering machine
CN212094742U (en) * 2019-12-03 2020-12-08 浙江凯耀照明有限责任公司 Automatic change LED light module welding machine
CN211977326U (en) * 2020-05-07 2020-11-20 吉林省新立恒星科技有限公司 Cooling device for automobile mechanical parts
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CN212665122U (en) * 2020-06-30 2021-03-09 芜湖新迪科技有限公司 Full-automatic PCB circuit board soldering tin device
CN112822867A (en) * 2020-12-31 2021-05-18 杨亚军 False-soldering and missing-soldering prevention equipment for PCB (printed circuit board) of integrated circuit carrier and use method

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