CN113288419A - Laser device and appearance that moults - Google Patents
Laser device and appearance that moults Download PDFInfo
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- CN113288419A CN113288419A CN202110591317.7A CN202110591317A CN113288419A CN 113288419 A CN113288419 A CN 113288419A CN 202110591317 A CN202110591317 A CN 202110591317A CN 113288419 A CN113288419 A CN 113288419A
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B18/00—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body
- A61B18/18—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body by applying electromagnetic radiation, e.g. microwaves
- A61B18/20—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body by applying electromagnetic radiation, e.g. microwaves using laser
- A61B18/203—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body by applying electromagnetic radiation, e.g. microwaves using laser applying laser energy to the outside of the body
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B18/00—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body
- A61B2018/00005—Cooling or heating of the probe or tissue immediately surrounding the probe
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B18/00—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body
- A61B2018/00315—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body for treatment of particular body parts
- A61B2018/00452—Skin
- A61B2018/00476—Hair follicles
Abstract
The embodiment of the invention discloses a laser depilation device and a laser depilation instrument. The laser emitting module includes: a substrate; the light emitting units are positioned on one side of the substrate, and emergent rays of part of the light emitting units are overlapped to form emergent light spots of the laser depilation device; the light-emitting unit comprises a light-emitting chip positioned on one side of the substrate and a lens positioned on the light-emitting side of the light-emitting chip; in the partial light-emitting unit, the optical axis of the light-emitting chip is staggered with the optical axis of the lens. Through the position of reasonable setting light-emitting unit, guarantee the good heat dissipation of laser epilation device to adjust the position relation of the optical axis of light-emitting chip and the optical axis that is located the lens of light-emitting chip light-emitting side, make the emergent ray of a plurality of light-emitting units form even emergent facula, guarantee the effect that moults of laser epilation device.
Description
Technical Field
The embodiment of the invention relates to the photoelectronic technology, in particular to a laser depilation device and a depilation instrument.
Background
Along with the improvement of living standard, more and more people begin to pay attention to beauty and face care, and a laser hair removal device, also called an intense pulse light hair removal device, emits intense pulse light beams to act on the root of hair follicles and destroys the activity of the hair follicles by utilizing the heat energy of instant explosion of the hair follicles, so that the hairs are not grown any longer, a permanent hair removal effect is achieved, and the laser hair removal device is popular among more and more women.
The laser depilation instrument in the prior art usually needs active air cooling or water cooling for heat dissipation to ensure that heat is not accumulated, and the laser depilation instrument cannot be burnt due to overheating; and the service life of the laser depilating instrument can be correspondingly reduced due to high temperature, so that the light emitting effect is influenced, and the maintenance and replacement cost is increased.
However, the active heat dissipation structure is complex and has high cost, and how to ensure the heat dissipation effect of the laser depilation instrument becomes a research hotspot.
Disclosure of Invention
The embodiment of the invention provides a laser depilation device and a depilation instrument, which are used for realizing good fitness of a light-emitting surface and a body curved surface, ensuring the uniformity of emergent rays while ensuring the heat dissipation effect.
In a first aspect, an embodiment of the present invention provides a laser depilation device, including a laser emission module;
the laser emitting module includes:
a substrate;
the light emitting units are positioned on one side of the substrate, and emergent rays of part of the light emitting units are overlapped to form emergent light spots of the laser depilation device;
the light-emitting unit comprises a light-emitting chip positioned on one side of the substrate and a lens positioned on the light-emitting side of the light-emitting chip; in part in the light-emitting unit, the optical axis of light-emitting chip staggers with the optical axis of lens.
Optionally, the placement positions of the light-emitting chip and the lens are determined according to the following formula,
d/f＝L/h
wherein, d is the same in the light-emitting unit the optical axis of light-emitting chip with the distance between the optical axis of lens, f does the focus of lens, L does the optical axis of light-emitting chip with the distance between the center of emergent facula, h does the light-emitting chip with the distance between the light-emitting window of laser device that moults.
Optionally, a plurality of the light emitting units are arranged in an array;
the distance L between the light emitting chips of two adjacent light emitting units satisfies that L is more than or equal to 5mm and less than or equal to 10 mm.
Optionally, the substrate includes a first substrate, and the light emergent units are disposed on one side of the first substrate;
the first substrate includes a flexible substrate.
Optionally, the substrate includes a plurality of second substrates, and at least one light emitting unit is disposed on one side of each second substrate;
two adjacent be provided with coupling assembling between the second base plate, coupling assembling is used for adjusting two of being connected with it contained angle between the second base plate.
Optionally, the connection assembly comprises a movable connection assembly, and/or a flexible connection assembly.
Optionally, the laser depilation device further comprises a flexible circuit board and a pressure sensor, the flexible circuit board and the pressure sensor are located on one side of the substrate departing from the light emergent unit, the flexible circuit board is electrically connected with the pressure sensor, and the pressure sensor is used for sensing the bending stress of the flexible circuit board.
Optionally, the light emitting chip includes a VCSEL chip.
Optionally, the laser depilation device further includes a plurality of heat dissipation members located on the substrate away from the light emitting unit, and the heat dissipation members correspond to the light emitting unit one to one and are used for dissipating heat of the light emitting unit.
In a second aspect, an embodiment of the present invention further provides a laser depilation instrument, including any one of the laser depilation devices described above;
still include power supply, power supply is used for to the light-emitting chip power supply.
The invention provides a laser depilation device and a laser depilation instrument. The laser emitting module includes: a substrate; the light emitting units are positioned on one side of the substrate, and emergent rays of part of the light emitting units are overlapped to form emergent light spots of the laser depilation device; the light-emitting unit comprises a light-emitting chip positioned on one side of the substrate and a lens positioned on the light-emitting side of the light-emitting chip; in the partial light-emitting unit, the optical axis of the light-emitting chip is staggered with the optical axis of the lens. Through the position of reasonable setting light-emitting unit, guarantee the good heat dissipation of laser epilation device to adjust the position relation of the optical axis of light-emitting chip and the optical axis that is located the lens of light-emitting chip light-emitting side, make the emergent ray of a plurality of light-emitting units form even emergent facula, guarantee the effect that moults of laser epilation device.
Drawings
To more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, a brief description will be given below of the drawings required for the embodiments or the technical solutions in the prior art, and it is obvious that the drawings in the following description, although being some specific embodiments of the present invention, can be extended and extended to other structures and drawings by those skilled in the art according to the basic concepts of the device structure, the driving method and the manufacturing method disclosed and suggested by the various embodiments of the present invention, without making sure that these should be within the scope of the claims of the present invention.
Fig. 1 is a schematic top view of a laser depilation device according to an embodiment of the present invention;
FIG. 2 is a schematic cross-sectional view taken along line A-A' of FIG. 1;
FIG. 3 is a schematic structural diagram of a laser depilation device according to an embodiment of the present invention;
FIG. 4 is a schematic structural diagram of another laser depilation device according to the embodiment of the invention;
fig. 5 is a schematic structural diagram of a laser depilation instrument according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the technical solutions of the present invention will be clearly and completely described through embodiments with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the basic idea disclosed and suggested by the embodiments of the present invention, are within the scope of the present invention.
Fig. 1 is a schematic top view of a laser depilation device according to an embodiment of the present invention, and fig. 2 is a schematic cross-sectional view taken along the line a-a' in fig. 1, as shown in fig. 1 and 2, the laser depilation device 101 includes a laser emission module;
the laser emitting module includes:
a substrate 102;
a plurality of light-emitting units 103 located on one side of the substrate 102, wherein the emergent light rays of some light-emitting units 103 are overlapped to form an emergent light spot of the laser depilation device 101;
the light-emitting unit 103 comprises a light-emitting chip 104 positioned on one side of the substrate 102 and a lens 105 positioned on the light-emitting side of the light-emitting chip 104; in the partial light-emitting unit 103, the optical axis of the light-emitting chip 104 is shifted from the optical axis of the lens 105.
The substrate 102 further includes a copper circuit, the copper circuit is used to ensure that the light-emitting chip 104 on the substrate 102 is electrically connected to an external power supply, and the copper circuit can be prepared by printing, electroplating or etching. Sixteen light-exiting units 103 are exemplarily shown in fig. 1, and the light-exiting units 103 are arranged in a distributed array on the substrate 102. As shown in fig. 1 and 2, the outgoing light rays of the light outgoing unit 103 overlap in the column direction, i.e., the Y direction in the figure, forming a linear light spot 1031. The light-exiting unit 103 in the column direction, in combination with the plurality of light-exiting units 103 in the row direction, i.e. the X direction in the figure, forms a stripe-shaped exit spot of the laser depilation device 101 as shown in figure 1. The interval between two adjacent light-emitting units 103 needs to be controlled in the working process of the laser depilation device 101 to prevent that there is large-area overlapping in the line light spot 1031 of outgoing between two continuous light-emitting units 103, which affects the depilation effect, and also can control two adjacent light-emitting units 103 to emit light at intervals, thereby avoiding the line light spots of two adjacent light-emitting units 103 to be overlapped, and the light intensity is too strong, and the activity of hair follicles in the region to be depilated is damaged.
The light-emitting unit 103 includes a light-emitting chip 104 located on one side of the substrate 102 and a lens 105 located on the light-emitting side of the light-emitting chip 104, the lens 105 may be prepared by injection molding or other processes on the substrate 102, and the lens 105 may play a role in changing the divergence angle, the beam width and the direction of the main optical axis. The lens needs to select a proper focal length and an aperture, and controls the position relation between the optical axis of the light-emitting chip 104 and the optical axis of the lens 105, so that the light spot of the light-emitting chip 104 becomes a linear light spot with a proper shape; meanwhile, due to the imaging property of the lens 105, the light intensity of the emergent light spot is relatively uniform.
Further, fig. 3 is a schematic structural diagram of a laser depilation device according to an embodiment of the present invention, as shown in fig. 3 and continuously referring to fig. 1 and fig. 2, the laser depilation device 101 further includes a light exit window 106 located at a light exit side of the light exit unit 103, the light exit window 106 can be made of flexible materials with good light transmittance, such as flexible glass, and the flexible light exit window can be directly attached to a region to be depilated, a distance between the flexible light exit window and the light exit chip is within a range of 5mm to 10mm, and a reasonable distance can ensure a high transmittance of the light exit window 106 to the light exit of the light exit unit 103.
Further, as shown in fig. 3, the laser depilation device 101 further includes a handle 110, the handle 110 is convenient for a user to operate during depilation using the laser depilation device 101, and a driving circuit is further disposed in the handle 110 for driving the power supply to supply power to ensure normal operation of the laser depilation device 101.
The embodiment of the invention provides the laser depilation device, the position relation of the optical axis of the light-emitting chip in the light-emitting unit and the optical axis of the specific lens positioned on the light-emitting side of the light-emitting chip is controlled, the emergent light spot with uniform light intensity is formed, the shape or material of the substrate is changed to be combined with the light-emitting unit, the adhesion degree of the laser light-emitting device and the region to be depilated is ensured, and a better depilation effect is achieved.
Alternatively, the placement positions of the light-exiting chip 104 and the lens 105 are determined according to the following formula,
d/f＝L/h
wherein d is the distance between the optical axis of the light-emitting chip and the optical axis of the lens in the same light-emitting unit, f is the focal length of the lens, L is the distance between the optical axis of the light-emitting chip and the center of the emergent light spot, and h is the distance between the light-emitting chip and the light-emitting window of the laser depilation device.
The distance L between the optical axis of the light-emitting chip 104 and the center of the emergent light spot and the distance between the light-emitting chip 104 and the light-emitting window of the laser depilation device are both fixed values due to the limitation of geometric configurations. Only the distance d between the optical axis of the light-emitting chip 104 and the optical axis of the lens 105 in the same light-emitting unit and the focal length f of the lens 105 need to be determined to ensure the light-emitting effect of the light-emitting unit 103, and the focal length f of the lens 105 can be determined by taking the distance d between the optical axis of the light-emitting chip 104 and the optical axis of the lens 105 in the same light-emitting unit 103 as a fixed value, or the distance d between the optical axis of the light-emitting chip 104 and the optical axis of the lens 105 in the same light-emitting unit 103 as a fixed value, respectively. The placement positions of the light-emitting chip 104 and the lens 104 are reasonably adjusted, so that light emitted by the light-emitting chip 104 at a relatively long distance is gathered together, the energy density is increased, and the effect of adjusting the emergent light spots is achieved.
Optionally, a plurality of light emitting units 103 are arranged in an array;
the distance L between the light-emitting chips 104 of two adjacent light-emitting units 103 satisfies that L is more than or equal to 5mm and less than or equal to 10 mm.
Compared with the arrangement mode of a plurality of chips on a substrate in the prior art, the mounting of the chips is too concentrated, active air cooling or water cooling heat dissipation is usually needed to ensure that the heat of the chips is not accumulated, otherwise the chips are burnt out due to overheating; the distance L between the light emitting chips 104 of two adjacent light emitting units 103 is controlled to meet the requirement that L is not less than 5mm and not more than 10mm, the distance between the light emitting chips 104 is ensured, the heat dissipation of the light emitting chips 104 is facilitated, an active heat dissipation element is not required to be additionally arranged, and the manufacturing cost is effectively reduced.
With reference to fig. 3, optionally, the substrate 102 includes a first substrate 1021, and the light-emitting units 103 are disposed on one side of the first substrate 1021;
the first substrate 1021 includes a flexible substrate.
The first substrate 1021 is a flexible substrate, which may be a polymer material such as polyimide, and can increase the curvature of the substrate. The light-emitting units 103 are disposed on the light-emitting side of the flexible substrate and combined with the light-emitting window 106, so as to ensure the adhesion of the laser depilation device 101 to the to-be-depilated area.
Fig. 4 is a schematic structural view of another laser depilation device according to an embodiment of the present invention, as shown in fig. 4, optionally, the substrate 102 includes a plurality of second substrates 1022, and at least one light extraction unit 103 is disposed on one side of each second substrate 1022;
a connecting assembly 107 is disposed between two adjacent second substrates 1022, and the connecting assembly 107 is used for adjusting an included angle between the two second substrates 1022 connected thereto.
As shown in fig. 4, the exemplary substrate includes four second substrates 1022, the second substrates 1022 may be flexible substrates or rigid substrates, and when the second substrates 1022 are rigid substrates, they may be inflexible materials such as hard ceramics. Since the connecting component 107 is arranged between two adjacent second base plates 1022, and the connecting component is used for adjusting the included angle between the two second base plates 1022 connected with the connecting component, the flexibility of the whole laser depilation device 101 is ensured by the connecting component 107. Meanwhile, at least one light-emitting unit 103 is arranged on one side of each second substrate 1022, each light-emitting unit 103 corresponds to one light-emitting window 106, the substrates comprise a plurality of second substrates 1022, and the second substrates 1022 are arranged in a segment-by-segment manner, so that the curvature of the laser depilation device 101 is further increased, and the overall mobility is increased.
Optionally, the connection assembly 107 includes a movable connection assembly, and/or a flexible connection assembly.
The connecting assembly 107 may be a flexible movable connecting assembly, and the movable connecting assembly is located between adjacent second substrates 1022, so as to increase the overall mobility of the plurality of second substrates 1022. The connecting member 107 may also be a flexible connecting member, which is made of a flexible material and has a flexible characteristic, so as to further ensure good mobility of the laser hair removal device 101. Meanwhile, the substrate comprises a plurality of second substrates 1022, the manufacturing process of mounting the optical chip 104 and the lens 105 on each second substrate 1022 is much simpler, and then each second substrate 1022 is electrically connected through the connecting component 107, so that the connecting component 107 is a flexible connecting component, the substrate 102 can be guaranteed to have the bending characteristic with larger curvature, and the manufacturing difficulty of integrally bending the integrated substrate is reduced. The light-emitting window 106 is correspondingly arranged for each light-emitting unit 103, and compared with the light-emitting window 106 on the whole surface, the light-emitting window 106 is divided into a plurality of light-emitting units 103 which are respectively spliced with the light-emitting windows, so that the difficulty in manufacturing the laser depilation device 101 is further reduced.
With continued reference to fig. 4, optionally, the laser epilation device 101 further comprises a flexible circuit board 109 and a pressure sensor (not shown in fig. 4) located on a side of the substrate 102 facing away from the light exit unit 103, the flexible circuit board 109 being electrically connected to the pressure sensor, the pressure sensor being configured to sense a bending stress of the flexible circuit board 109.
Wherein, be provided with flexible circuit board 109 on the side of deviating from light-emitting unit 103 at base plate 102, wherein flexible circuit board 109 can the whole layer setting, also can only be located between adjacent light-emitting unit 103, and flexible circuit board 109 is connected with pressure sensor electricity, and in the laser depilation device course of operation, pressure sensor passes through response flexible circuit board 109 and at the laser depilation in-process bending stress, indirectly acquires the laminating degree of the light-emitting window 106 of laser depilation device 101 and the position of waiting to moult, guarantees the laser depilation effect.
Optionally, the light-emitting chip 104 includes a VCSEL chip.
The light-emitting chip 104 may include a VCSEL chip, and the VCSEL chip is a laser chip emitting light from a vertical cavity surface and made of a gallium arsenide semiconductor material. The VCSEL chip emits laser light perpendicular to the top surface, and different from the edge laser light emitting mode of a traditional edge emitting laser, the VCSEL chip can realize good transverse light field limitation, can accurately control a detection area, and has high working beam power, small divergence angle and stronger safety. Meanwhile, the VCSEL chip can meet the requirement of 20J/cm for laser depilation2The energy density of the left and right parts ensures good depilationAnd (5) effect.
With continuing reference to fig. 3 and 4, optionally, the laser depilation device 101 further includes a plurality of heat dissipation members 108 located on the substrate 102 away from the light exit unit 103, and the heat dissipation members 108 are in one-to-one correspondence with the light exit unit 103 and are used for dissipating heat for the light exit unit 103.
Wherein, one side of the substrate 102 departing from the light-emitting unit 103 is provided with a plurality of heat dissipation members 108, the heat dissipation members 108 can be arranged in one-to-one correspondence with the light-emitting unit 103, one light-emitting unit 103 can also correspond to a plurality of heat dissipation members 108, or one heat dissipation member 108 corresponds to a plurality of light-emitting units 103, so as to ensure the heat dissipation effect of the heat dissipation members 108 on the light-emitting units 103. The heat dissipation member 108 may be a copper block, or may be a metal such as aluminum or a ceramic such as aluminum nitride, which has a high thermal conductivity.
Fig. 5 is a schematic structural diagram of a laser hair removal apparatus 300 according to an embodiment of the present invention, wherein the laser hair removal apparatus 300 includes a laser hair removal device 301 according to any one of the embodiments described above;
the LED chip further comprises a power supply 302, wherein the power supply 302 is used for supplying power to the light-emitting chip.
The laser depilation instrument provided by the embodiment of the invention has the same or corresponding beneficial effects of the laser depilation device provided by the embodiment, and details are not repeated herein.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious modifications, rearrangements, combinations and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.
Claims (10)
1. A laser depilation device is characterized by comprising a laser outgoing module;
the laser emitting module includes:
a substrate;
the light emitting units are positioned on one side of the substrate, and emergent rays of part of the light emitting units are overlapped to form emergent light spots of the laser depilation device;
the light-emitting unit comprises a light-emitting chip positioned on one side of the substrate and a lens positioned on the light-emitting side of the light-emitting chip; in part in the light-emitting unit, the optical axis of light-emitting chip staggers with the optical axis of lens.
2. The laser depilation device of claim 1, wherein the placement positions of the light extraction chip and the lens are determined according to the following formula,
d/f＝L/h
wherein, d is the same in the light-emitting unit the optical axis of light-emitting chip with the distance between the optical axis of lens, f does the focus of lens, L does the optical axis of light-emitting chip with the distance between the center of emergent facula, h does the light-emitting chip with the distance between the light-emitting window of laser device that moults.
3. The laser depilation device of claim 1, wherein a plurality of the light extraction units are arranged in an array;
the distance L between the light emitting chips of two adjacent light emitting units satisfies that L is more than or equal to 5mm and less than or equal to 10 mm.
4. The laser depilation device of claim 1, wherein the substrate comprises a first substrate, and the light extraction units are disposed on one side of the first substrate;
the first substrate includes a flexible substrate.
5. The laser depilation device of claim 1, wherein the substrate comprises a plurality of second substrates, each of the second substrates having at least one light extraction unit disposed at one side thereof;
two adjacent be provided with coupling assembling between the second base plate, coupling assembling is used for adjusting two of being connected with it contained angle between the second base plate.
6. A laser epilation device according to claim 5, wherein the connection assembly comprises a movable connection assembly, and/or a flexible connection assembly.
7. The laser depilation device of claim 1, further comprising a flexible circuit board and a pressure sensor on a side of the substrate facing away from the light extraction unit, the flexible circuit board being electrically connected to the pressure sensor, and the pressure sensor being configured to sense bending stress of the flexible circuit board.
8. The laser depilation device of claim 1, wherein the light extraction chip comprises a VCSEL chip.
9. The laser depilation device of claim 1, further comprising a plurality of heat dissipation members located on the substrate away from the light exit unit, wherein the heat dissipation members correspond to the light exit unit one to one for dissipating heat from the light exit unit.
10. A laser hair removal apparatus comprising the laser hair removal device of any one of claims 1-9;
still include power supply, power supply is used for to the light-emitting chip power supply.
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Cited By (1)
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| CN114098950A (en) * | 2021-11-23 | 2022-03-01 | 固安翌光科技有限公司 | Adjustable light extraction assembly for applying light to subject to remove hair and light application device |
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