CN113284835A - Integrated circuit packaging, mounting and positioning device - Google Patents
Integrated circuit packaging, mounting and positioning device Download PDFInfo
- Publication number
- CN113284835A CN113284835A CN202110543726.XA CN202110543726A CN113284835A CN 113284835 A CN113284835 A CN 113284835A CN 202110543726 A CN202110543726 A CN 202110543726A CN 113284835 A CN113284835 A CN 113284835A
- Authority
- CN
- China
- Prior art keywords
- plate
- integrated circuit
- wheel
- frame
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Automatic Assembly (AREA)
- Auxiliary Devices For And Details Of Packaging Control (AREA)
Abstract
The invention discloses an integrated circuit packaging, mounting and positioning device which comprises a base plate, a circumferential adjusting mechanism, a supporting main frame, a transverse supporting plate, a front-back inclination adjusting mechanism, a pushing-out mechanism, a supporting frame plate, a fixed transverse plate, a positioning lock rod and an auxiliary heat dissipation device. The invention has the advantages that the circumferential adjusting mechanism is arranged, after the first hand wheel is rotated, the driving wheel and the driven wheel are in matched transmission, the integrated circuit can be driven to carry out circumferential position adjustment during packaging, so the flexibility of the integrated circuit during packaging is improved, and the packaging working efficiency is improved.
Description
Technical Field
The invention relates to the field related to integrated circuit packaging, in particular to an integrated circuit packaging, mounting and positioning device.
Background
An integrated circuit is a microelectronic device or component. The transistor, resistor, capacitor and inductor elements and wiring required in a circuit are interconnected together by a certain process, and are manufactured on a small semiconductor wafer or a plurality of small semiconductor wafers or medium substrates, and then are packaged in a package to form the micro-structure with the required circuit function.
And integrated circuit need encapsulate it when production, need fix a position it when encapsulating, and then carry out the point and glue the encapsulation and seal, ensure electronic component's steady operation, current installation positioner is inconvenient to integrated circuit location installation to after to the integrated circuit location, can't adjust its position, its flexibility is not enough, inconvenient subsequent point is glued and is encapsulated, simultaneously, just can glue after the colloid needs to heat, and the heat dissipation of point gluey back colloid is slower, influences subsequent work efficiency.
Disclosure of Invention
Therefore, in order to solve the above-mentioned disadvantages, the present invention provides an integrated circuit package mounting and positioning apparatus.
The invention is realized in such a way that an integrated circuit packaging, mounting and positioning device is constructed, the device comprises a base plate, a circumferential adjusting mechanism, a supporting main frame, a transverse supporting plate, a front-back inclination adjusting mechanism, a pushing mechanism, a supporting frame plate, a fixed transverse plate, positioning lock rods and an auxiliary heat dissipation device, the circumferential adjusting mechanism is arranged on the base plate, the supporting main frame is arranged at the upper end of the circumferential adjusting mechanism, the transverse supporting plate is fixed at the upper side of the front end of the supporting main frame, the front-back inclination adjusting mechanism is arranged at the front end of the transverse supporting plate, the pushing mechanism is arranged at the lower end of the front-back inclination adjusting mechanism, the supporting frame plate is arranged on the pushing mechanism, the supporting frame plate is provided with the fixed transverse plate, the fixed transverse plate is connected to the pushing mechanism, the three positioning lock rods are arranged on the fixed transverse plate, the auxiliary heat dissipation device is arranged in a groove arranged in the middle part of the front end of the supporting main frame, circumference guiding mechanism includes drive wheel, first drive lever, first hand wheel, follows driving wheel, location pivot, first drive belt and circumference rolling disc, the drive wheel is installed on bed plate one side to the middle part is connected with first drive lever, first drive lever passes and installs first hand wheel on bed plate bottom one side, install middle part on the bed plate from the driving wheel to the middle part is through location pivot installation location, be connected through a drive belt transmission from between driving wheel and the drive wheel, circumference rolling disc is installed at location pivot top, circumference rolling disc and support body frame bottom fixed connection.
Preferably, the front-back inclination adjusting mechanism comprises a first fixed frame plate, a second fixed frame plate, a connecting cross frame, a first turnover plate, a second turnover plate, a first rotating shaft and a second rotating shaft, the first fixed frame plate and the second fixed frame plate are respectively fixed on the two sides of the front end of the transverse support plate, the connecting cross frame is connected between the first fixed frame plate and the second fixed frame plate, the first turnover plate and the second turnover plate are respectively arranged on the lower side between the first fixed frame plate and the second fixed frame plate, and the two sides of the first turnover plate and the second turnover plate are respectively rotatably connected with the first fixed frame plate and the second fixed frame plate through the first rotating shaft and the second rotating shaft.
Preferably, tilt adjustment mechanism still includes second transfer line, hand wheel bedplate, second hand wheel, action wheel, vice driving wheel, second driving belt and locking mechanism around, first fixed frame board and second fixed frame board are passed in second transfer line lateral positioning, the second hand wheel passes through the hand wheel bedplate and installs in horizontal backup pad front end one side to the second hand wheel meets with second transfer line one end, the second transfer line passes and installs the action wheel on the other end of second fixed frame board, vice driving wheel is installed in the second axis of rotation that passes the second fixed frame board, be connected through second driving belt transmission between action wheel and the vice driving wheel, install locking mechanism on the second axis of rotation right side tip to this locking mechanism is fixed with the installation in the horizontal backup pad.
Preferably, the locking mechanism comprises a locking shell, a fixed top plate, a movable groove, a synchronous rotating wheel and a locking bolt, the upper end of the locking shell is fixedly installed on the transverse supporting plate through the fixed top plate, the movable groove is formed in the inner side of the locking shell, the synchronous rotating wheel is installed at the end of the second rotating shaft, one side of the synchronous rotating wheel is embedded into the movable groove, and the locking bolt is arranged in the middle of the right side of the locking shell.
Preferably, the ejecting mechanism comprises a first slide rail, a second slide rail, a first slide block, a second slide block, a first pushing connecting plate, a second pushing connecting plate, an electric push rod and a pushing connecting frame, wherein the first slide rail and the second slide rail are respectively installed on the first turnover plate and the second turnover plate, and are respectively connected to the first slide rail and the second slide rail in a sliding manner, the upper ends of the first slide block and the second slide block are respectively fixed with the first pushing connecting plate and the second pushing connecting plate, the electric push rod is installed on the first turnover plate on one side of the first slide rail, the pushing connecting frame is installed on the ejecting end of the front end of the electric push rod, and one side of the pushing connecting frame is fixedly connected with the upper end of the first pushing connecting plate.
Preferably, supplementary heat abstractor is including installation support body, installation after-frame, fan, air outlet and defeated wind channel, installation support body rear end both sides are fixed with the installation after-frame to through the installation after-frame with support the notch internal fixation who the body frame front end middle part set up, the fan is installed in installation support body rear end, the air outlet is installed to installation support body front end, be provided with the defeated wind channel that is used for fan and air outlet intercommunication on the installation support body.
Preferably, a locking rod piece is arranged on the first transmission rod between the upper end of the first hand wheel and the bottom of the base plate, and one end of the locking rod piece is fixedly arranged on the bottom of the base plate.
Preferably, the first turnover plate and the second turnover plate are arranged in bilateral symmetry, are parallel to each other in position and have the same angle.
Preferably, the first slide rail and the second slide rail are arranged symmetrically left and right, and the first slide block and the second slide block are arranged symmetrically.
Preferably, the number of the fans, the air outlet and the air conveying duct is two.
The invention has the following advantages: the invention provides an integrated circuit package mounting and positioning device through improvement, compared with the same type of equipment, the integrated circuit package mounting and positioning device has the following improvement:
the method has the advantages that: according to the integrated circuit packaging, mounting and positioning device, the circumferential adjusting mechanism is arranged, and after the first hand wheel is rotated, the driving wheel and the driven wheel are in matched transmission, so that the integrated circuit can be driven to circumferentially adjust the position during packaging, the flexibility of the integrated circuit during packaging is improved, and the packaging working efficiency is improved.
The method has the advantages that: according to the integrated circuit packaging, mounting and positioning device, due to the fact that the front-back inclination adjusting mechanism is arranged, after the second hand wheel is rotated, the integrated circuit can be driven by the first turnover plate and the second turnover plate to be subjected to front-back inclination adjustment during packaging, and therefore flexibility of the integrated circuit during packaging is improved again, and working efficiency is improved.
The method has the advantages that: according to the integrated circuit packaging, mounting and positioning device, the locking mechanism is arranged, the synchronous rotating wheel can be locked by the arranged locking bolt, and the second rotating shaft is locked, so that the integrated circuit is positioned after the inclination angle is adjusted during packaging, and the condition of autonomous deviation is prevented.
The advantages are that: according to the integrated circuit packaging, mounting and positioning device, the pushing-out mechanism is arranged, the integrated circuit can be pushed out outwards when being positioned and mounted under the driving of the electric push rod through the matching of the slide block and the slide rail, so that the integrated circuit is convenient to disassemble and assemble, and meanwhile, the packaging and dispensing work can be conveniently carried out.
The advantages are that: according to the integrated circuit package mounting and positioning device, the auxiliary heat dissipation device is arranged, the two fans are used for blowing air after working, and then the air is blown to the integrated circuit package dispensing position through the air outlet, so that auxiliary heat dissipation is performed after dispensing, and the efficiency of dispensing work is improved.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of an auxiliary heat sink assembly according to the present invention;
FIG. 3 is a schematic view of the circumferential adjustment mechanism of the present invention;
FIG. 4 is a schematic structural view of the fore-aft tilt adjustment mechanism of the present invention;
FIG. 5 is a schematic view of the locking mechanism of the present invention;
FIG. 6 is a schematic view of the ejector mechanism of the present invention;
FIG. 7 is a schematic view of an auxiliary heat sink according to the present invention;
fig. 8 is a schematic structural view of the mounting bracket of the present invention.
Wherein: a base plate-1, a circumferential adjusting mechanism-2, a supporting main frame-3, a transverse supporting plate-4, a front and back inclination adjusting mechanism-5, a pushing mechanism-6, a supporting frame plate-7, a fixed transverse plate-8, a positioning lock rod-9, an auxiliary heat sink-10, a driving wheel-21, a first transmission rod-22, a first hand wheel-23, a driven wheel-24, a positioning rotating shaft-25, a first transmission belt-26, a circumferential rotating disc-27, a first fixed frame plate-51, a second fixed frame plate-52, a connecting transverse frame-53, a first turnover plate-54, a second turnover plate-55, a first rotating shaft-56, a second rotating shaft-57, a second transmission rod-58, a hand wheel base plate-59, a second hand wheel-510, a transverse support plate-4, a front and back inclination adjusting mechanism-5, a pushing mechanism-6, a supporting frame plate-7, a fixed transverse rotating disc-27, a first fixed frame plate-51, a second fixed frame plate-52, a connecting transverse frame-53, a connecting transverse frame-54, a second turnover plate-55, a second rotating shaft-56, a second rotating shaft-57, a second rotating shaft-58, a second rotating mechanism, a third mechanism, a fourth, The device comprises a driving wheel-511, an auxiliary driving wheel-512, a second transmission belt-513, a locking mechanism-514, a locking shell-5141, a fixed top plate-5142, a movable groove-5143, a synchronous rotating wheel-5144, a locking bolt-5145, a first slide rail-61, a second slide rail-62, a first slide block-63, a second slide block-64, a first pushing connecting plate-65, a second pushing connecting plate-66, an electric push rod-67, a pushing connecting frame-68, an installation frame body-101, an installation rear frame-102, a fan-103, an air outlet-104, an air conveying duct-105 and a locking rod-201.
Detailed Description
The present invention will be described in detail below with reference to fig. 1 to 8, and the technical solutions in the embodiments of the present invention will be clearly and completely described, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example one
Referring to fig. 1-2, the present invention provides an integrated circuit package mounting and positioning device by improvement, which includes a base plate 1, a circumferential adjusting mechanism 2, a supporting main frame 3, a transverse supporting plate 4, a front and back tilt adjusting mechanism 5, a push-out mechanism 6, a supporting frame plate 7, a fixing transverse plate 8, a positioning lock rod 9 and an auxiliary heat sink 10, wherein the base plate 1 is fixed to an external device by bolts, the circumferential adjusting mechanism 2 is mounted on the base plate 1, the supporting main frame 3 is mounted on the upper end of the circumferential adjusting mechanism 2, the transverse supporting plate 4 is fixed on the upper side of the front end of the supporting main frame 3, the front and back tilt adjusting mechanism 5 is mounted on the front and back tilt adjusting mechanism 5, the push-out mechanism 6 is mounted on the lower end of the front and back tilt adjusting mechanism 5, the supporting frame plate 7 is mounted on the push-out mechanism 6, and the supporting frame plate 7 is provided with the fixing transverse plate 8, the fixed transverse plate 8 is connected to the pushing mechanism 6, three positioning lock rods 9 are mounted on the fixed transverse plate 8, and the auxiliary heat dissipation device 10 is mounted in a notch formed in the middle of the front end of the supporting main frame 3.
Referring to fig. 3, the present invention provides an integrated circuit package mounting and positioning device through improvement, a circumferential adjustment mechanism 2 includes a driving wheel 21, a first transmission rod 22, a first hand wheel 23, a driven wheel 24, a positioning rotation shaft 25, a first transmission belt 26 and a circumferential rotation disc 27, the driving wheel 21 is mounted on one side of a base plate 1, the middle part of the driving wheel is connected with the first transmission rod 22, the first transmission rod 22 is mounted with the first hand wheel 23 through one side of the bottom of the base plate 1, the driven wheel 24 is mounted on the middle part of the base plate 1, the middle part of the driving wheel is mounted and positioned through the positioning rotation shaft 25, the driven wheel 24 is in transmission connection with the driving wheel 21 through the first transmission belt 26, the circumferential rotation disc 27 is mounted on the top of the positioning rotation shaft 25, the circumferential rotation disc 27 is fixedly connected with the bottom of a support main frame 3, a lock rod member 201 is mounted on the first transmission rod 22 between the upper end of the first hand wheel 23 and the bottom of the base plate 1, and this locking lever spare 201 one end and the installation of base plate 1 bottom are fixed, and the locking lever spare 20 that sets up is used for locking first transfer line 22, prevents its rotation.
Referring to fig. 4, the present invention provides an integrated circuit package mounting and positioning device by improvement, wherein the front-back tilt adjusting mechanism 5 includes a first fixed frame plate 51, a second fixed frame plate 52, a connecting cross frame 53, a first turning plate 54, a second turning plate 55, a first rotating shaft 56 and a second rotating shaft 57, the first fixed frame plate 51 and the second fixed frame plate 52 are respectively fixed on two sides of the front end of the transverse support plate 4, the connecting cross frame 53 is connected between the first fixed frame plate 51 and the second fixed frame plate 52, the first turning plate 54 and the second turning plate 55 are respectively arranged on the inner lower side between the first fixed frame plate 51 and the second fixed frame plate 52, two sides of the first turning plate 54 and the second turning plate 55 are respectively rotatably connected with the first fixed frame plate 51 and the second fixed frame plate 52 through the first rotating shaft 56 and the second rotating shaft 57, the front-back tilt adjusting mechanism 5 further includes a second driving rod 58, a hand wheel seat plate 59, A second hand wheel 510, a driving wheel 511, an auxiliary driving wheel 512, a second driving belt 513 and a locking mechanism 514, wherein the second driving rod 58 is transversely positioned through the first fixed frame plate 51 and the second fixed frame plate 52, the second hand wheel 510 is arranged on one side of the front end of the transverse support plate 4 through a hand wheel seat plate 59, the second hand wheel 510 is connected with one end of the second driving rod 58, the second driving rod 58 is arranged on the other end of the second fixed frame plate 52 through the driving wheel 511, the auxiliary driving wheel 512 is arranged on a second rotating shaft 57 penetrating through the second fixed frame plate 52, the driving wheel 511 is in transmission connection with the auxiliary driving wheel 512 through the second driving belt 513, the right end of the second rotating shaft 57 is provided with the locking mechanism 514, the locking mechanism 514 is fixedly arranged on the transverse support plate 4, the first turnover plate 54 and the second turnover plate 55 are arranged in bilateral symmetry and are parallel to each other and have the same angle, the first turnover plate 54 and the second turnover plate 55 can synchronously drive the integrated circuit to turn over, so as to ensure the stability during the inclination adjustment.
Referring to fig. 5, the present invention provides an ic package mounting and positioning device by way of improvement, wherein the locking mechanism 514 includes a locking housing 5141, a fixed top plate 5142, a movable groove 5143, a synchronous pulley 5144 and a locking bolt 5145, the upper end of the locking housing 5141 is fixedly mounted on the transverse support plate 4 via the fixed top plate 5142, the inner side of the locking housing 5141 is provided with the movable groove 5143, the synchronous pulley 5144 is mounted at the end of the second rotating shaft 57, and one side of the synchronous pulley is embedded in the movable groove 5143, and the middle part of the right side of the locking housing 5141 is provided with the locking bolt 5145.
Referring to fig. 6, the present invention provides an ic package mounting and positioning device through improvement, the ejecting mechanism 6 includes a first slide rail 61, a second slide rail 62, a first slide block 63, a second slide block 64, a first ejecting link plate 65, a second ejecting link plate 66, an electric push rod 67 and an ejecting link frame 68, the first slide rail 61 and the second slide rail 62 are respectively mounted on the first turning plate 54 and the second turning plate 55, the first slide rail 61 and the second slide rail 62 are respectively connected to the first slide block 63 and the second slide block 64 in a sliding manner, the upper ends of the first slide block 63 and the second slide block 64 are respectively fixed with the first ejecting link plate 65 and the second ejecting link plate 66, the electric push rod 67 is mounted on the first turning plate 54 at one side of the first slide rail 61, the ejecting end at the front end of the electric push rod 67 is mounted with the ejecting link frame 68, one side of the ejecting link frame 68 is fixedly connected with the upper end of the first ejecting link plate 65, first slide rail 61 and second slide rail 62 bilateral symmetry set up to first slider 63 and second slider 64 set up for the symmetry together, and the convenience is more stable carries out the propelling movement to integrated circuit.
Referring to fig. 7-8, the present invention provides an integrated circuit package mounting and positioning device through improvement, the auxiliary heat dissipation device 10 includes a mounting frame body 101, a mounting rear frame 102, a fan 103, an air outlet 104 and an air duct 105, the mounting rear frame 102 is fixed on two sides of the rear end of the mounting frame body 101 and is fixedly connected with a notch formed in the middle of the front end of the supporting main frame 3 through the mounting rear frame 102, the fan 103 is mounted on the rear end of the mounting frame body 101, the air outlet 104 is mounted on the front end of the mounting frame body 101, the air duct 105 for communicating the fan 103 with the air outlet 104 is formed on the mounting frame body 101, and the two fans 103, the two air outlets 104 and the two air ducts 105 are respectively arranged to improve heat dissipation efficiency.
Example two
The invention provides an integrated circuit packaging, mounting and positioning device through improvement, before working, an electric push rod 67 and a fan 103 are electrically connected with an external power supply and a control device, so as to control the opening and closing of the electric push rod 67 and the fan 103, a locking bolt 5145 penetrates through a locking shell 5141 to abut against one side surface of a synchronous rotating wheel 5144, the synchronous rotating wheel 5144 at the inner side of a movable groove 5143 can be locked through the rotation of the locking bolt 5145, the synchronous rotating wheel 5144 can not rotate, so as to realize the locking of a second turnover plate 55, two ends of a supporting frame plate 7 and a fixed transverse plate 8 are respectively fixed on a first pushing connecting plate 65 and a second pushing connecting plate 66, so that after the first pushing connecting plate 65 and the second pushing connecting plate 66 are pushed out, the supporting frame plate 7 and the fixed transverse plate 8 can be driven to push, so that an integrated circuit can be pushed out and is convenient to disassemble and assemble, and conveniently carry out some glue encapsulation work, location pivot 25 and follow driving wheel 24 are synchronous rotation, make can drive location pivot 25 after following driving wheel 24 rotates and rotate, drive circumference rolling disc 27 again and rotate to drive by circumference rolling disc 27 and support body frame 3 and make circumferential direction.
The invention provides an integrated circuit packaging, mounting and positioning device through improvement, which has the following working principle:
firstly, the arranged base plate 1 can be fixedly connected with external equipment through bolts, the arranged support frame plate 7 can be used for installing and placing integrated circuits, the rear end of the support frame plate 7 is provided with a fixed transverse plate 8, and the fixed transverse plate 8 is provided with three positioning lock rods 9 which can lock the integrated circuits installed on the support frame plate 7 so as to facilitate the subsequent packaging and dispensing work;
secondly, a circumferential adjusting mechanism 2 is installed on the base plate 1, after a first hand wheel 23 is rotated, a first transmission rod 22 can be driven to rotate, then the first transmission rod 22 drives a driving wheel 21 positioned and installed on the base plate 1 to rotate, a first transmission belt 26 drives a driven wheel 24 to rotate, the driven wheel 24 is positioned and installed on the base plate 1 through a positioning rotating shaft 25, the positioning rotating shaft 25 and the driven wheel 24 rotate synchronously, a circumferential rotating disc 27 is installed on the positioning rotating shaft 25, so that the circumferential rotating disc 27 is driven to rotate, the circumferential rotating disc 27 drives the supporting main frame 3 to rotate circumferentially, the integrated circuit can be driven to adjust the position circumferentially during packaging, the flexibility of the integrated circuit during packaging is improved, and the working efficiency of packaging is improved;
thirdly, a supporting main frame 3 is arranged at the upper end of the circumferential adjusting mechanism 2, a transverse supporting plate 4 is fixed at the upper side of the front end of the supporting main frame 3, a front-back inclination adjusting mechanism 5 is arranged at the front end of the transverse supporting plate 4, after the second wheel 510 is rotated, the second transmission rod 58 is driven to rotate, and at the same time, the second transmission rod 58 drives the driving wheel 511 at one end to rotate, the auxiliary driving wheel 512 is rotated by the transmission of the second transmission belt 513, and the auxiliary driving wheel 512 drives the second rotating shaft 57 to rotate, so that the second turnover plate 55 can rotate and turn over, and the first turnover plate 54 and the first rotating shaft 56 are rotated along with the second turnover plate 55 and the second rotating shaft 57 through the connection of the push-out mechanism 6, the support frame plate 7 and the fixed cross plate 8, therefore, the integrated circuit can be driven to be inclined and adjusted back and forth during packaging, the flexibility of the integrated circuit during packaging is improved again, and the working efficiency is improved;
fourthly, the front and rear tilt adjusting mechanism 5 is provided with a locking mechanism 514, the synchronizing wheel 5144 is mounted on the second rotating shaft 57, one side of the synchronizing wheel 5144 is embedded in the movable groove 5143 of the locking housing 5141, after the locking bolt 5145 is rotated, the locking bolt 5145 is inserted into the locking housing 5141 to lock the synchronizing wheel 5144, and the second rotating shaft 57 is locked, so that the integrated circuit is positioned after the tilt angle is adjusted during packaging, and the self-offset is prevented;
fifthly, the lower end of the front and back inclination adjusting mechanism 5 is provided with a push-out mechanism 6, after the electric push rod 67 works, the push-out connecting frame 68 is driven to push, the push-out connecting frame 68 is connected with the first push connecting plate 65, so that the bottom of the first push connecting plate 65 slides on the first slide rail 61 through the first slide block 63, the second push connecting plate 66 synchronously moves along with the first push connecting plate 65 through the connection of the support frame plate 7 and the fixed transverse plate 8, the second slide block 64 at the bottom slides on the second slide rail 62, so that the support frame plate 7 and the fixed transverse plate 8 can push, and the integrated circuit can be pushed outwards during positioning and installation, and is convenient to disassemble and assemble, and can also be conveniently packaged;
sixthly, the auxiliary heat dissipation device 10 is installed in a notch formed in the middle of the front end of the supporting main frame 3, the two fans 103 are arranged to blow air after working, air is conveyed through an air conveying channel 105 formed in the installation frame body 101, an air outlet 104 is blown out, and the air is blown to the packaging glue dispensing position of the integrated circuit, so that auxiliary heat dissipation is performed after glue dispensing, and the efficiency of glue dispensing work is improved.
The invention provides an integrated circuit packaging, mounting and positioning device through improvement, and the device is provided with a circumferential adjusting mechanism 2, after a first hand wheel 23 is rotated, the integrated circuit can be driven to circumferentially adjust the position during packaging through the matched transmission of a driving wheel 21 and a driven wheel 24, so that the flexibility of the integrated circuit during packaging is improved, and the working efficiency of packaging is improved; by arranging the front-back inclination adjusting mechanism 5, after the second hand wheel 510 is rotated, the integrated circuit can be driven by the first turnover plate 54 and the second turnover plate 55 to perform front-back inclination adjustment during packaging, so that the flexibility of the integrated circuit during packaging is improved again, and the working efficiency is improved; by arranging the locking mechanism 514, the arranged locking bolt 5145 can lock the synchronous rotating wheel 5144 and lock the second rotating shaft 57, so that the integrated circuit is positioned after the inclination angle is adjusted during packaging, and the situation of autonomous deviation is prevented; through the arrangement of the pushing-out mechanism 6, the integrated circuit can be pushed out outwards when being positioned and installed under the driving of the electric push rod 67 and through the matching of the slide block and the slide rail, so that the integrated circuit is convenient to disassemble and assemble, and meanwhile, the packaging and dispensing work can be conveniently carried out; through having set up supplementary heat abstractor 10, blow after two fans 103 work that set up, blow to integrated circuit encapsulation point glue department by air outlet 104 again to for the point glue is carried out supplementary heat dissipation after working, improve the efficiency of point glue work.
The foregoing shows and describes the general principles, essential features, and advantages of the invention. The standard parts used in the invention can be purchased from the market, the special-shaped parts can be customized according to the description of the specification and the description of the attached drawings, the specific connection mode of each part adopts conventional means such as bolt, rivet, welding and the like mature in the prior art, the machines, the parts and equipment adopt conventional models in the prior art, and the circuit connection adopts the conventional connection mode in the prior art, so that the detailed description is omitted.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. An integrated circuit package installation positioner, includes bed plate (1), its characterized in that: the heat dissipation device is characterized by further comprising a circumferential adjusting mechanism (2), a supporting main frame (3), a transverse supporting plate (4), a front and back inclination adjusting mechanism (5), an ejecting mechanism (6), a supporting frame plate (7), a fixed transverse plate (8), a positioning locking rod (9) and an auxiliary heat dissipation device (10), wherein the circumferential adjusting mechanism (2) is installed on the base plate (1), the supporting main frame (3) is installed at the upper end of the circumferential adjusting mechanism (2), the transverse supporting plate (4) is fixed on the upper side of the front end of the supporting main frame (3), the front and back inclination adjusting mechanism (5) is installed at the front end of the transverse supporting plate (4), the ejecting mechanism (6) is installed at the lower end of the front and back inclination adjusting mechanism (5), the supporting frame plate (7) is installed on the ejecting mechanism (6), the fixed transverse plate (8) is arranged on the supporting frame plate (7), and the, and three positioning lock rods (9) are arranged on the fixed transverse plate (8), the auxiliary heat dissipation device (10) is arranged in a notch arranged in the middle of the front end of the support main frame (3), the circumferential adjusting mechanism (2) comprises a driving wheel (21), a first transmission rod (22), a first hand wheel (23), a driven wheel (24), a positioning rotating shaft (25), a first transmission belt (26) and a circumferential rotating disc (27), the driving wheel (21) is arranged on one side of the base plate (1), the middle part of the driving wheel is connected with the first transmission rod (22), the first transmission rod (22) penetrates through one side of the bottom of the base plate (1) to be provided with the first hand wheel (23), the driven wheel (24) is arranged in the middle of the base plate (1), the middle part of the driving wheel is arranged and positioned through the positioning rotating shaft (25), and the driven wheel (24) and the driving wheel (21) are in transmission connection through the first transmission belt (26), circumferential rotating disk (27) is installed at location pivot (25) top, circumferential rotating disk (27) and support body frame (3) bottom fixed connection.
2. The integrated circuit package mounting and positioning device of claim 1, wherein: front and back slope guiding mechanism (5) include first fixed frame board (51), second fixed frame board (52), connect crossbearer (53), first returning face plate (54), second returning face plate (55), first axis of rotation (56) and second axis of rotation (57), first fixed frame board (51), second fixed frame board (52) are fixed respectively on horizontal backup pad (4) front end both sides to be connected with between the two and connect crossbearer (53), interior downside is provided with first returning face plate (54), second returning face plate (55) respectively between first fixed frame board (51), second fixed frame board (52), first returning face plate (54), second returning face plate (55) both sides are connected with first fixed frame board (51), second fixed frame board (52) rotation through first axis of rotation (56) and second axis of rotation (57) respectively.
3. The integrated circuit package mounting and positioning device of claim 2, wherein: the front-back inclination adjusting mechanism (5) further comprises a second transmission rod (58), a hand wheel seat plate (59), a second hand wheel (510), a driving wheel (511), an auxiliary wheel (512), a second transmission belt (513) and a locking mechanism (514), the second transmission rod (58) transversely positions and passes through a first fixed frame plate (51) and a second fixed frame plate (52), the second hand wheel (510) is installed on one side of the front end of the transverse support plate (4) through the hand wheel seat plate (59), the second hand wheel (510) is connected with one end of the second transmission rod (58), the second transmission rod (58) passes through the other end of the second fixed frame plate (52) and is provided with the driving wheel (511), the auxiliary wheel (512) is installed on a second rotating shaft (57) passing through the second fixed frame plate (52), and the driving wheel (511) is in transmission connection with the auxiliary wheel (512) through the second transmission belt (513), and a locking mechanism (514) is arranged on the right end part of the second rotating shaft (57), and the locking mechanism (514) and the transverse supporting plate (4) are fixedly arranged.
4. The integrated circuit package mounting and positioning device of claim 3, wherein: the locking mechanism (514) comprises a locking shell (5141), a fixed top plate (5142), a movable groove (5143), a synchronous rotating wheel (5144) and a locking bolt (5145), the upper end of the locking shell (5141) is fixedly installed on the transverse supporting plate (4) through the fixed top plate (5142), the movable groove (5143) is arranged on the inner side of the locking shell (5141), the synchronous rotating wheel (5144) is installed at the end part of the second rotating shaft (57), one side of the synchronous rotating wheel is embedded in the movable groove (5143), and the locking bolt (5145) is arranged in the middle of the right side of the locking shell (5141).
5. The integrated circuit package mounting and positioning device of claim 1, wherein: the pushing mechanism (6) comprises a first slide rail (61), a second slide rail (62), a first slide block (63), a second slide block (64), a first pushing connecting plate (65), a second pushing connecting plate (66), an electric push rod (67) and a pushing connecting frame (68), the first slide rail (61) and the second slide rail (62) are respectively arranged on the first turnover plate (54) and the second turnover plate (55), the first slide rail (61) and the second slide rail (62) are respectively connected with the first slide block (63) and the second slide block (64) in a sliding manner, the upper ends of the first slide block (63) and the second slide block (64) are respectively fixed with the first pushing connecting plate (65) and the second pushing connecting plate (66), the electric push rod (67) is arranged on the first turnover plate (54) at one side of the first slide rail (61), and the pushing connecting frame (68) is arranged at the pushing end of the front end of the electric push rod (67), one side of the pushing connecting frame (68) is fixedly connected with the upper end of the first pushing connecting plate (65).
6. The integrated circuit package mounting and positioning device of claim 1, wherein: auxiliary heat abstractor (10) is including installation support body (101), installation after-frame (102), fan (103), air outlet (104) and defeated wind channel (105), installation support body (101) rear end both sides are fixed with installation after-frame (102) to through installation after-frame (102) and the notch internal fixation who supports main frame (3) front end middle part and set up, fan (103) are installed in installation support body (101) rear end, air outlet (104) are installed to installation support body (101) front end, be provided with defeated wind channel (105) that are used for fan (103) and air outlet (104) intercommunication on installation support body (101).
7. The integrated circuit package mounting and positioning device of claim 1, wherein: a lock rod piece (201) is installed on a first transmission rod (22) between the upper end of the first hand wheel (23) and the bottom of the base plate (1), and one end of the lock rod piece (201) is fixedly installed at the bottom of the base plate (1).
8. The integrated circuit package mounting and positioning device of claim 2, wherein: the first turnover plate (54) and the second turnover plate (55) are arranged in bilateral symmetry, are parallel to each other and have the same angle.
9. The integrated circuit package mounting and positioning device of claim 5, wherein: the first slide rail (61) and the second slide rail (62) are arranged in a left-right symmetrical mode, and the first sliding block (63) and the second sliding block (64) are arranged in a symmetrical mode.
10. The integrated circuit package mounting and positioning device of claim 6, wherein: the number of the fans (103), the number of the air outlets (104) and the number of the air conveying ducts (105) are two.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110543726.XA CN113284835B (en) | 2021-05-19 | 2021-05-19 | Integrated circuit packaging, mounting and positioning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110543726.XA CN113284835B (en) | 2021-05-19 | 2021-05-19 | Integrated circuit packaging, mounting and positioning device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113284835A true CN113284835A (en) | 2021-08-20 |
| CN113284835B CN113284835B (en) | 2022-09-02 |
Family
ID=77279791
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110543726.XA Active CN113284835B (en) | 2021-05-19 | 2021-05-19 | Integrated circuit packaging, mounting and positioning device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113284835B (en) |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103599871A (en) * | 2013-10-25 | 2014-02-26 | 深圳市恒睿智达科技有限公司 | Separated type dispensing mechanism |
| CN106807591A (en) * | 2015-12-01 | 2017-06-09 | 鸿骐新技股份有限公司 | The glue applying mechanism of adjustable dispensing angle |
| CN107433251A (en) * | 2017-08-30 | 2017-12-05 | 柏跃龙 | A kind of dispensing head assembly applied to point gum machine and a kind of point gum machine |
| KR20180051835A (en) * | 2016-11-09 | 2018-05-17 | (주) 팬옵틱스 | Packaged semiconductor chip detecting device |
| CN109317369A (en) * | 2018-11-23 | 2019-02-12 | 东莞市奥海科技股份有限公司 | A kind of coating machine and its coating method for the red glue coating of wiring board |
| CN109499812A (en) * | 2018-11-13 | 2019-03-22 | 江苏澳芯微电子有限公司 | Chip package dispenser |
| CN110711674A (en) * | 2019-10-30 | 2020-01-21 | 龙东华 | Dispensing equipment convenient to fix for integrated circuit packaging |
| CN110861017A (en) * | 2019-12-07 | 2020-03-06 | 肖彬 | A fixed clamping device for processing of gate valve sealing cover |
| CN210378973U (en) * | 2019-07-12 | 2020-04-21 | 山东省科学院激光研究所 | Chip position and angle adjusting mechanism in chip packaging process |
| CN112139706A (en) * | 2020-09-23 | 2020-12-29 | 泉州市高谦机械产品有限公司 | Automatic assembly welding device for machining heat pipe radiator |
| CN112164669A (en) * | 2020-09-07 | 2021-01-01 | 江苏盐芯微电子有限公司 | Integrated circuit packaging rotary positioning device |
| CN112354806A (en) * | 2020-11-21 | 2021-02-12 | 深圳中科精工科技有限公司 | Intelligent dispensing equipment for semiconductor products |
-
2021
- 2021-05-19 CN CN202110543726.XA patent/CN113284835B/en active Active
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103599871A (en) * | 2013-10-25 | 2014-02-26 | 深圳市恒睿智达科技有限公司 | Separated type dispensing mechanism |
| CN106807591A (en) * | 2015-12-01 | 2017-06-09 | 鸿骐新技股份有限公司 | The glue applying mechanism of adjustable dispensing angle |
| KR20180051835A (en) * | 2016-11-09 | 2018-05-17 | (주) 팬옵틱스 | Packaged semiconductor chip detecting device |
| CN107433251A (en) * | 2017-08-30 | 2017-12-05 | 柏跃龙 | A kind of dispensing head assembly applied to point gum machine and a kind of point gum machine |
| CN109499812A (en) * | 2018-11-13 | 2019-03-22 | 江苏澳芯微电子有限公司 | Chip package dispenser |
| CN109317369A (en) * | 2018-11-23 | 2019-02-12 | 东莞市奥海科技股份有限公司 | A kind of coating machine and its coating method for the red glue coating of wiring board |
| CN210378973U (en) * | 2019-07-12 | 2020-04-21 | 山东省科学院激光研究所 | Chip position and angle adjusting mechanism in chip packaging process |
| CN110711674A (en) * | 2019-10-30 | 2020-01-21 | 龙东华 | Dispensing equipment convenient to fix for integrated circuit packaging |
| CN110861017A (en) * | 2019-12-07 | 2020-03-06 | 肖彬 | A fixed clamping device for processing of gate valve sealing cover |
| CN112164669A (en) * | 2020-09-07 | 2021-01-01 | 江苏盐芯微电子有限公司 | Integrated circuit packaging rotary positioning device |
| CN112139706A (en) * | 2020-09-23 | 2020-12-29 | 泉州市高谦机械产品有限公司 | Automatic assembly welding device for machining heat pipe radiator |
| CN112354806A (en) * | 2020-11-21 | 2021-02-12 | 深圳中科精工科技有限公司 | Intelligent dispensing equipment for semiconductor products |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113284835B (en) | 2022-09-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101710565B (en) | Device for realizing picking-up and turning-over of chip | |
| CN113284835B (en) | Integrated circuit packaging, mounting and positioning device | |
| KR20140139065A (en) | Bonding tool cooling apparatus and method for cooling bonding tool | |
| CN106356743A (en) | Power distribution cabinet with internal cyclic heat dissipation | |
| CN208368539U (en) | A kind of width bracket LED crystal solidifying apparatus | |
| CN206207066U (en) | Driving power supply assembly of LED lamp | |
| CN106040531A (en) | Online full-vision high-speed precision gluing machine | |
| CN116406157A (en) | Plug-in components machine for PCB board | |
| CN106672552A (en) | Pneumatic type controlled-interval conveying device | |
| CN208083838U (en) | A kind of cleaner motor component automatic assembling | |
| CN114334783A (en) | Wafer mounting device | |
| CN107611789A (en) | A kind of regulator cubicle | |
| CN218190710U (en) | Integrated circuit plastic packaging equipment with adjustable direction | |
| US20040129754A1 (en) | High speed linear and rotary split-axis wire bonder | |
| CN220626444U (en) | Integrated circuit package testing device | |
| CN106328564A (en) | Integrated circuit package wire | |
| CN207467108U (en) | A kind of energy saving thermoplastic machine | |
| CN1630007B (en) | Workpiece rotating device | |
| CN113078077A (en) | Chip intermittent mounting equipment capable of automatically feeding | |
| CN210029023U (en) | A unloading platform for crest welder | |
| CN210296236U (en) | High-safety integrated circuit relay | |
| CN214864888U (en) | A adhesive deposite device for circuit board processing | |
| CN202603053U (en) | BGA pickup-assembly adjusting device in BGA repair work station | |
| CN214314904U (en) | Arc-shaped iron core motor doing circular motion | |
| CN215624573U (en) | Blanking conveying belt with high temperature resistance function |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20220815 Address after: Room 1301, Building 3, Shenzhen New Generation Industrial Park, No. 136, Zhongkang Road, Meidu Community, Meilin Street, Futian District, Shenzhen, Guangdong 518000 Applicant after: SHENZHEN GANG CHEUNG FAIR ELECTRONICS Co.,Ltd. Address before: 362100 shop 105-106, building 6, Jinshi garden, Luocheng Town, Hui'an County, Quanzhou City, Fujian Province Applicant before: Quanzhou runxie Product Design Co.,Ltd. |
|
| TA01 | Transfer of patent application right | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |