CN113284834A - 12-inch semiconductor wafer rewinding machine based on sliding table robot - Google Patents
12-inch semiconductor wafer rewinding machine based on sliding table robot Download PDFInfo
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- CN113284834A CN113284834A CN202110656565.5A CN202110656565A CN113284834A CN 113284834 A CN113284834 A CN 113284834A CN 202110656565 A CN202110656565 A CN 202110656565A CN 113284834 A CN113284834 A CN 113284834A
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- section bar
- table module
- semiconductor wafer
- bar frame
- station
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a 12-inch semiconductor wafer sheet-rewinding machine based on a sliding table robot, which comprises a section bar frame, wherein an ion eliminator is fixedly installed at the top of the section bar frame, a first station is arranged on the surface of one side of the section bar frame, a second station is arranged on one side of the first station, an X-axis sliding table module is fixedly installed in the section bar frame, a Z-axis sliding table module is fixedly installed at the top of the X-axis sliding table module, and a Y-axis sliding table module is fixedly installed at one side of the Z-axis sliding table module. This 12 cun semiconductor wafer inverting machine based on slip table robot carries out daily use in-process, can realize rewinding and the processing of patch between the OC-FOUP according to on-the-spot actual demand, accords with workshop environment requirement more, and equipment be stand-alone equipment, need not with automation equipment, butt joint such as OHT, AGV, RGV, consequently cost is controlled as far as when solving the problem.
Description
Technical Field
The invention relates to the technical field of semiconductor manufacturing, in particular to a 12-inch semiconductor wafer rewinding machine based on a sliding table robot.
Background
12' wafer processing has gradually become an international standard. The task of improving the production efficiency is the priority of 300mm (12 ') semiconductor factories, and in order to realize high-efficiency low-cost automatic production lines in a short time and at low cost, standardized modularization of the technologies is also necessary, wherein a process machine platform requires a designated wafer to load a wafer box, so that the actions of rewinding, patching and the like between different wafer boxes are inevitably required, for this reason, a correlation device Sorter also becomes one of necessary devices, the 12 ' wafer size is 300mm, the manual operation cannot realize the 12 ' process requirements, and the actions are the work of mechanical device carrying, processing and the like, the Sorter is responsible for various actions of wafers in different types of wafer box carriers, the selection of function modules in the Sorter determines the function actions which can be completed, and the general standard Sorter comprises: a plurality of FOUP uncapping machine Load Port, cylinder coordinate robot, robot walking axis, look for the appearance etc. other parts are the required part of detection sensor and trade, and its function action that can accomplish also includes: rewinding, patching, searching for reference sheets, reading the code number reaching the standard and the like.
The existing 12' wafer processing equipment can not realize rewinding and patching among OC-FOUPs according to actual field requirements, does not meet the requirements of workshop environment, and needs to be in butt joint with automatic equipment, such as an OHT (overhead hoist transport vehicle), an AGV (automatic guided vehicle), an RGV (graphics gateway) and the like, so that the processing cost is greatly increased.
Disclosure of Invention
The invention aims to provide a 12-inch semiconductor wafer rewinding machine based on a sliding table robot, which aims to solve the problems that the existing 12' wafer processing equipment in the background technology cannot realize rewinding and patching among OC-FOUPs according to actual field requirements, does not meet the requirements of workshop environment, needs to be in butt joint with automatic equipment such as an OHT (overhead hoist transport vehicle), an AGV (automatic guided vehicle), an RGV (graphics gateway) and the like, and greatly increases the processing cost.
In order to achieve the purpose, the invention provides the following technical scheme: 12 cun semiconductor wafer sheet inverting machine based on slip table robot, including the section bar frame, the top fixed mounting of section bar frame has ion eliminator, a side surface of section bar frame is provided with first station, one side of first station is provided with the second station, the inside fixed mounting of section bar frame has X axle slip table module, the top fixed mounting of X axle slip table module has Z axle slip table module, one side fixed mounting of Z axle slip table module has Y axle slip table module, be provided with the round crystal adjustment ware on the Y axle slip table module.
Preferably, the bottom of the profile frame is provided with lifting grooves near four corners, and the inner sides of the lifting grooves are fixedly provided with electric lifting columns.
Preferably, the bottom of electronic lift post all fixed mounting have a supporting seat, the constant head tank has all been seted up to the bottom of supporting seat, and the inboard of constant head tank all fixed mounting have the location sucking disc.
Preferably, the bottom of section bar frame is close to four edges and all fixed mounting have the universal wheel, and the universal wheel all fixed mounting has the stopper.
Preferably, a connecting plate is fixedly arranged on one side surface of the section bar frame, and a control panel is fixedly arranged on the surface of the connecting plate in an embedded mode.
Preferably, the first station and the second station are Load Port stations.
Compared with the prior art, the invention has the beneficial effects that:
this 12 cun semiconductor wafer inverting machine based on slip table robot carries out daily use in-process, can realize rewinding and the processing of patch between the OC-FOUP according to on-the-spot actual demand, accords with workshop environment requirement more, and equipment be stand-alone equipment, need not with automation equipment, butt joint such as OHT, AGV, RGV, consequently cost is controlled as far as when solving the problem.
This 12 cun semiconductor wafer chip inverting machine based on slip table robot carries out daily in-process that uses, removes the whole arbitrary place of equipment through the universal wheel and uses, goes up and down in real time through electronic lift post simultaneously and carries out altitude mixture control, through the adsorption efficiency of positioning suction cup increase with mounting surface, has improved the flexibility and the stability of wafer processing greatly.
Drawings
FIG. 1 is a front view of the present invention;
figure 2 is a bottom plan view of the positioning socket portion of the present invention;
fig. 3 is a schematic view of the internal structure of the profile frame of the present invention.
In the figure: 1. an ion eliminator; 2. a profile frame; 3. a wafer adjuster; 4. a Y-axis sliding table module; 5. a Z-axis sliding table module; 6. a control panel; 7. an X-axis sliding table module; 8. a first station; 9. a supporting seat; 10. a second station; 11. positioning a groove; 12. positioning a sucker; 13. a universal wheel; 14. a connector tile; 15. a lifting groove; 16. an electric lifting column.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-3, the present invention provides a technical solution: 12 cun semiconductor wafer back-chipping machine based on slip table robot, including section bar frame 2, section bar frame 2's top fixed mounting has ion eliminator 1, section bar frame 2 is convenient for load and unload, the size and shape is nimble, be applicable to the customization of specific demand, to the change demand, increase and seek reference reading station, also expand the change easily, section bar frame 2's a side surface is provided with first station 8, one side of first station 8 is provided with second station 10, section bar frame 2's inside fixed mounting has X axle slip table module 7, the top fixed mounting of X axle slip table module 7 has Z axle slip table module 5, robot walking axle module in the standard Sorter has been banned, the cost can be controlled. In addition, if the functions of searching for parameters and reading codes are added, only one functional station needs to be added, and the appropriate Z-axis sliding table module can be correspondingly changed, so that the adaptive capacity is strong, one side of the Z-axis sliding table module 5 is fixedly provided with a Y-axis sliding table module 4, a three-axis robot module is formed by adopting a clean room electric sliding table, and comprises an X/Y/Z direction moving pair, a Z-axis rotating pair is lacked relative to a cylindrical coordinate, but the three-axis sliding table module has own advantages in size customization and cost control, is free and flexible in three-axis forming mode, different load ports can be designed into different three-axis forming modes to realize optimal functions, a wafer regulator 3 is arranged on the Y-axis sliding table module 4 to work a wafer in a wafer carrier, the function of the wafer regulator has no obvious difference from a standard cylindrical coordinate robot, and lifting grooves 15 are formed in the bottom of the section, and the inner side of the lifting groove 15 is fixedly provided with an electric lifting column 16, and the positioning sucker 12 is contacted and adsorbed with the ground by stretching the electric lifting column 16, so that the processing stability is improved.
The bottom ends of electric lifting columns 16 are fixedly provided with supporting seats 9, the bottoms of the supporting seats 9 are respectively provided with a positioning groove 11, the inner sides of the positioning grooves 11 are respectively and fixedly provided with a positioning sucker 12, the bottoms of the profile frames 2 close to four corners are respectively and fixedly provided with universal wheels 13, the universal wheels 13 are respectively and fixedly provided with a brake, the whole equipment is moved to any place through the universal wheels 13 and is fixed through the brakes, one side surface of each profile frame 2 is fixedly provided with a connecting plate 14, the surface of each connecting plate 14 is embedded and fixedly provided with a control panel 6, the first station 8 and the second station 10 are Load Port stations, and non-calibration functions can be increased or reduced according to different requirements, such as the conversion of an upper loading cassette carrier into an OC cassette, the customization of information functions, the addition of RFID reading functions and the Barcode reading functions, the sensor with the AGV butt joint function and the single machine equipment are added to control cost, mark products can be customized to correspond to the fixed carrying platforms, and the functions of information interaction and the like are avoided.
The working principle is as follows: when 12' wafer processing work is carried out to needs, at first accessible universal wheel 13 is whole with the equipment and is removed to arbitrary place and use, and fix the whole equipment through the stopper, stretch out and draw back through electronic lift post 16 simultaneously and make positioning suction cup 12 adsorb with ground contact, then according to actual processing station position difference, through control panel 6 control X axle slip table module 7, Y axle slip table module 4 and Z axle slip table module 5 run in real time, realize adjusting in real time the different position and the angle of processing, make it can correspond with different stations each other, can be according to on-the-spot actual demand, realize the processing of the back sheet and the patch between OC-FOUP, accord with workshop environment requirement more, and the equipment is stand-alone equipment, need not with automation equipment, such as OHT, AGV, RGV etc. butt joint.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. 12 cun semiconductor wafer sheet inverting machine based on slip table robot, including section bar frame (2), its characterized in that: the top fixed mounting of section bar frame (2) has ion eliminator (1), a side surface of section bar frame (2) is provided with first station (8), one side of first station (8) is provided with second station (10), the inside fixed mounting of section bar frame (2) has X axle slip table module (7), the top fixed mounting of X axle slip table module (7) has Z axle slip table module (5), one side fixed mounting of Z axle slip table module (5) has Y axle slip table module (4), be provided with round crystal adjuster (3) on Y axle slip table module (4).
2. The slide robot-based 12-inch semiconductor wafer rewinding machine according to claim 1, wherein: lifting grooves (15) are formed in the bottom of the profile frame (2) close to four corners, and electric lifting columns (16) are fixedly mounted on the inner sides of the lifting grooves (15).
3. The slide robot-based 12-inch semiconductor wafer rewinding machine according to claim 2, wherein: the bottom of electronic lift post (16) all fixed mounting have supporting seat (9), constant head tank (11) have all been seted up to the bottom of supporting seat (9), and the inboard of constant head tank (11) all fixed mounting have location sucking disc (12).
4. The slide robot-based 12-inch semiconductor wafer rewinding machine according to claim 1, wherein: the bottom of section bar frame (2) is close to four edges and all fixed mounting have universal wheel (13), and universal wheel (13) all fixed mounting have the stopper.
5. The slide robot-based 12-inch semiconductor wafer rewinding machine according to claim 1, wherein: and a connecting plate (14) is fixedly arranged on the surface of one side of the section bar frame (2), and a control panel (6) is fixedly arranged on the surface of the connecting plate (14) in an embedded mode.
6. The slide robot-based 12-inch semiconductor wafer rewinding machine according to claim 1, wherein: the first station (8) and the second station (10) are Load Port stations.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110656565.5A CN113284834A (en) | 2021-06-11 | 2021-06-11 | 12-inch semiconductor wafer rewinding machine based on sliding table robot |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110656565.5A CN113284834A (en) | 2021-06-11 | 2021-06-11 | 12-inch semiconductor wafer rewinding machine based on sliding table robot |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113284834A true CN113284834A (en) | 2021-08-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110656565.5A Pending CN113284834A (en) | 2021-06-11 | 2021-06-11 | 12-inch semiconductor wafer rewinding machine based on sliding table robot |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113284834A (en) |
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2021
- 2021-06-11 CN CN202110656565.5A patent/CN113284834A/en active Pending
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