CN113284825B - Semiconductor refrigeration temperature control device - Google Patents
Semiconductor refrigeration temperature control device Download PDFInfo
- Publication number
- CN113284825B CN113284825B CN202110542989.9A CN202110542989A CN113284825B CN 113284825 B CN113284825 B CN 113284825B CN 202110542989 A CN202110542989 A CN 202110542989A CN 113284825 B CN113284825 B CN 113284825B
- Authority
- CN
- China
- Prior art keywords
- semiconductor refrigeration
- plate
- heat exchange
- control device
- temperature control
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000005057 refrigeration Methods 0.000 title claims abstract description 40
- 239000004065 semiconductor Substances 0.000 title claims abstract description 38
- 239000007788 liquid Substances 0.000 claims abstract description 25
- 239000003814 drug Substances 0.000 claims abstract description 24
- 230000007246 mechanism Effects 0.000 claims abstract description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 16
- 229920002396 Polyurea Polymers 0.000 claims description 8
- 229920001971 elastomer Polymers 0.000 claims description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 9
- 238000001816 cooling Methods 0.000 abstract description 7
- 238000000034 method Methods 0.000 abstract description 4
- 238000012545 processing Methods 0.000 abstract description 3
- 238000012546 transfer Methods 0.000 abstract description 3
- 238000001514 detection method Methods 0.000 abstract description 2
- 238000005530 etching Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- KHXKESCWFMPTFT-UHFFFAOYSA-N 1,1,1,2,2,3,3-heptafluoro-3-(1,2,2-trifluoroethenoxy)propane Chemical compound FC(F)=C(F)OC(F)(F)C(F)(F)C(F)(F)F KHXKESCWFMPTFT-UHFFFAOYSA-N 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 230000005679 Peltier effect Effects 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910000963 austenitic stainless steel Inorganic materials 0.000 description 1
- 238000010009 beating Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000002457 bidirectional effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 210000005056 cell body Anatomy 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009474 hot melt extrusion Methods 0.000 description 1
- 239000005457 ice water Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B49/00—Arrangement or mounting of control or safety devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention provides a semiconductor refrigeration temperature control device, which comprises fixing plates positioned on two sides of a liquid medicine cavity, wherein a first heat exchange plate is arranged in the center of each fixing plate, one surface of each first heat exchange plate is positioned in the liquid medicine cavity, the other surface of each first heat exchange plate is connected with a semiconductor refrigeration piece, and a second heat exchange plate is arranged outside each semiconductor refrigeration piece; the fixed plate is equipped with fast-assembling pressure mechanism all around, fast-assembling pressure mechanism is used for compressing tightly two the fixed plate, this semiconductor refrigeration temperature control device have two-way control by temperature change function, and the control by temperature change precision can be controlled at required temperature within range 0.1 ℃, has better application in some higher processing procedures of temperature requirement, in addition, in order to guarantee the radiating effect, compress tightly two fixed plates through continuous, can reduce the compactness between each heat transfer board and the semiconductor refrigeration piece, guarantee the cooling effect, and prevent that heat transfer does not closely influence the detection temperature.
Description
Technical Field
The invention relates to the field of temperature control of liquid medicine in semiconductor processing, in particular to a semiconductor refrigeration temperature control device.
Background
Etching is an important link in semiconductor production, generally referred to as photochemical etching, and refers to removing a protective film of an area to be etched after exposure plate making and development, and contacting with a chemical solution during etching to achieve the effect of dissolution and corrosion and form concave-convex or hollow-out forming. After the etching is accomplished, need wash semiconductor wafer, the cleaning process traditional chinese medicine liquid temperature can take place thereupon and rise the change, for the temperature that makes the liquid medicine reduces, guarantees simultaneously that the temperature after the new liquid medicine adds rapidly reduces, can set up cooling body in the liquid medicine groove usually, and the majority that uses at present is refrigeration type ice water machine, and the inside cooling coil temperature control of cell body, it is bulky, and the energy consumption is big, and the temperature control precision is poor, and basic control is at 0.5 ℃. Existing water chiller is mostly air-cooled water chiller and water-cooled water chiller, need regularly maintain the maintenance, and mostly one-way accuse temperature, after cooling to being less than preset temperature at every turn, just need stop the cooling, wait the temperature slowly rise again, the control by temperature change scope is uncontrollable like this, be difficult to the control when the higher processing procedure of some control by temperature change required precision, in addition, to current equipment, because between liquid medicine and the middle heat-conducting component, and the heat-conducting component contact each other is not inseparable enough to make the temperature heat dissipation inhomogeneous, and the radiating efficiency is low, influence the refrigeration effect greatly, and when the ageing must be changed of inner structure, dismounting device is comparatively loaded down with trivial details.
Disclosure of Invention
In order to solve the technical problem, the invention provides a semiconductor refrigeration temperature control device, which comprises fixing plates positioned at two sides of a liquid medicine cavity, wherein a first heat exchange plate is arranged at the center of each fixing plate, one surface of each first heat exchange plate is positioned in the liquid medicine cavity, the other surface of each first heat exchange plate is connected with a semiconductor refrigeration piece, and a second heat exchange plate is arranged outside each semiconductor refrigeration piece; and fast-assembly pressure mechanisms are arranged on the periphery of the fixed plates and are used for compressing the two fixed plates.
Preferably, the first heat exchange plate comprises a first plate body, and a PFA film is attached to one surface of the liquid medicine cavity of the first plate body.
Preferably, the second heat exchange plate comprises two groups of second plate bodies, and cold water pipes arranged in an S shape are arranged between the second plate bodies.
Preferably, the fast-assembling pressure mechanism comprises a plurality of connecting nails, the end parts of the adjacent connecting nails are connected through a connecting rod, the head part of the connecting nail is provided with an annular first pressure bag, and the first pressure bag is connected with a cold water pump of a refrigeration system; the other end of the connecting nail is provided with a second pressure bag, the second pressure bag is provided with an internal threaded sheet, the internal threaded sheet is screwed on the screw rod, and the second pressure bag is positioned between the internal threaded sheet and the fixing plate.
Preferably, the first pressure bag and the second pressure bag are made of rubber, the rubber is coated with polyurea on the outer portion, the first pressure bag is connected with the second pressure bag through a connecting pipe, and the second pressure bag is connected with the first pressure bag through a connecting pipe.
Preferably, the connecting rod is connected with the end part of the connecting nail in a coating mode through spraying polyurea.
Preferably, a supporting metal plate is arranged between the fixing plates.
Preferably, the lower part of the fixing plate is fixed with a mounting plate through a connecting piece.
Preferably, heat-conducting silica gel is filled in gaps between the first heat exchange plate and the semiconductor refrigeration plate and between the second heat exchange plate and the semiconductor refrigeration plate.
The semiconductor refrigeration temperature control device provided by the invention has the following beneficial effects: this semiconductor refrigeration temperature control device has two-way control by temperature change function, and the temperature control precision can be controlled at the within range of the 0.1 ℃ of required temperature, has better application in some temperature requirement higher processes, in addition, in order to guarantee the radiating effect, compresses tightly two fixed plates through continuous, can reduce the compactness between each heat transfer board and the semiconductor refrigeration piece, guarantees the cooling effect, and prevents to conduct heat and closely influence the detection temperature.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below.
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a side schematic view of the present invention;
FIG. 3 is a cross-sectional view of the present invention;
FIG. 4 is a schematic view of the quick load pressure mechanism of the present invention;
wherein, 1, fixing the plate; 2. a first heat exchange panel; 3. a semiconductor refrigeration sheet; 4. a second heat exchange panel; 5. quickly installing a pressure mechanism; 6. a liquid medicine cavity; 7. a PFA film; 8. a cold water pipe; 9. a connecting nail; 10. a connecting rod; 11. a first pressure bladder; 12. a second pressure bladder; 13. an internal thread piece; 14. a polyurea; 15. mounting a plate; 16. supporting the metal plate; 17. a liquid medicine inlet; 18. a liquid medicine outlet; 19. and (4) connecting the pipes.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
As shown in fig. 1 and 2, the invention provides a semiconductor refrigeration temperature control device, which comprises fixing plates 1 positioned at two sides of a liquid medicine cavity 6, wherein a first heat exchange plate 2 is arranged at the center of the fixing plate 1, one surface of the first heat exchange plate 2 is positioned in the liquid medicine cavity 6, a liquid medicine inlet 17 and a liquid medicine outlet 18 are connected to the liquid medicine cavity 6, the first heat exchange plate 2 comprises a first plate body, the first plate body is positioned at one surface of the liquid medicine cavity 6 and is pasted with a PFA film 7, the PFA film is a hot-melt extrusion casting film made of PFA resin, the PFA resin is a copolymer of perfluoropropyl perfluorovinyl ether and polytetrafluoroethylene, the PFA film 7 can effectively prevent the liquid medicine from corroding the first plate body, the first plate body can be austenitic stainless steel, titanium and titanium alloy, nickel and nickel alloy, and the like, the other surface is connected with a semiconductor refrigeration sheet 3, the working principle of the semiconductor refrigeration sheet 3 is based on the peltier principle, namely, when a circuit composed of two different conductors A and B is electrified with direct current, the joint can release other heat besides joule heat, the other joint absorbs heat, the phenomenon caused by the Peltier effect is reversible, and the joints which release and absorb heat are changed when the current direction is changed, so that bidirectional temperature change can be realized, as shown in figure 3, a second heat exchange plate 4 is arranged outside the semiconductor refrigeration plate 3, the second heat exchange plate 4 comprises two groups of second plate bodies, a cold water pipe 8 which is arranged in an S shape is arranged between the second plate bodies, one side of the semiconductor refrigeration plate 3 close to the first plate body is refrigerated, one side close to the second plate body is used for generating heat, after cold water is introduced into the second plate body, the second plate body takes away a large amount of heat generated by the semiconductor refrigeration plate 3, so that the liquid medicine between the first plate bodies is rapidly cooled, after a certain temperature is reached, the current direction is adjusted to heat the original refrigerating surface and heat the refrigerating surface to balance the cooling effect, so that the temperature control precision is realized, and the temperature can be basically controlled to be within +/-0.1 ℃; and in order to guarantee the compactness between each plate body, just can increase the effect and the homogeneity of temperature transmission between each plate body, at first, the clearance intussuseption between first heat exchange plate 2 and second heat exchange plate 4 and the semiconductor refrigeration piece 3 is filled with heat conduction silica gel, with the clearance packing between first heat exchange plate 2 and the second exchange heat exchange plate 4, guarantees to contact closely, and in order to further guarantee sufficient compactness to can quick assembly disassembly, fixed plate 1 is equipped with fast-assembling pressure mechanism 5 all around, fast-assembling pressure mechanism 5 is used for compressing tightly two fixed plate 1.
Specifically, as shown in fig. 4, the quick-assembly pressure mechanism 5 includes a plurality of connecting nails 9, the end portions of the adjacent connecting nails 9 are connected through a connecting rod 10, the head portions of the connecting nails 9 are provided with annular first pressure bags 11, and the first pressure bags 11 are connected with a cold water pump of a refrigeration system; the other end of the connecting nail 9 is provided with a second pressure bag 12, the second pressure bag 12 is provided with an internal thread sheet 13, the internal thread sheet 13 is screwed on the screw rod, and the second pressure bag 12 is positioned between the internal thread sheet 13 and the fixing plate 1. The connecting nails 9 are connected through connecting rods 10, inserted into one side of the fixing plate 1 and penetrate through another fixing plate 1, a row of design can be assembled simultaneously, efficiency is improved, the other end of each connecting nail is locked on the corresponding connecting nail 9 through a threaded sheet, the first pressure bag 11 and the second pressure bag 12 are made of rubber, polyurea 14 is coated on the outer portion of the rubber, the first pressure bags 11 are connected through connecting pipes 19, the second pressure bags 12 are connected through connecting pipes 19, cold water is continuously conveyed to the second heat exchange plate 4 through a cold water system, a shunt pipe can be arranged to be connected to the second pressure bags 12 and the first pressure bags 11 and filled with the cold water, at the moment, the two pressure bags can continuously extrude the fixing plate 1, tightness between the fixing plates 1 is guaranteed, and tightness of each plate body inside is guaranteed. The polyurea 14 has good toughness, can provide a good coating effect on rubber, can increase strength, and can prevent damage to the outside of the pressure bladder after long-term use, and the polyurea 14 can prevent problems such as water leakage after aging of rubber.
Be equipped with between the fixed plate 1 and support the panel beating 16, fixed plate 1 lower part is fixed with mounting panel 15 through the connecting piece, can be convenient for install whole device on equipment, and it is convenient to implement.
Claims (8)
1. The semiconductor refrigeration temperature control device is characterized by comprising fixing plates positioned on two sides of a liquid medicine cavity, wherein a first heat exchange plate is arranged in the center of each fixing plate, one surface of each first heat exchange plate is positioned in the liquid medicine cavity, the other surface of each first heat exchange plate is connected with a semiconductor refrigeration piece, and a second heat exchange plate is arranged outside each semiconductor refrigeration piece; a quick-mounting pressure mechanism is arranged on the periphery of the fixed plate and used for pressing the two fixed plates; the quick-assembling pressure mechanism comprises a plurality of connecting nails, the end parts of the adjacent connecting nails are connected through a connecting rod, the head part of each connecting nail is provided with an annular first pressure bag, and the first pressure bag is connected with a cold water pump of a refrigeration system; the other end of the connecting nail is provided with a second pressure bag, the second pressure bag is provided with an internal thread sheet, the internal thread sheet is screwed on the screw rod, and the second pressure bag is positioned between the internal thread sheet and the fixing plate; the shunt pipe of the cold water pump is connected to the second pressure bag and the first pressure bag.
2. A semiconductor refrigeration temperature control device according to claim 1, wherein the first heat exchange plate includes a first plate body having a PFA film attached to one surface of the chemical liquid chamber.
3. A semiconductor refrigeration temperature control device according to claim 1, wherein the second heat exchange plates include two sets of second plate bodies with cold water pipes arranged in an S-shape therebetween.
4. The semiconductor refrigeration temperature control device according to claim 1, wherein the first pressure bladder and the second pressure bladder are made of rubber, the rubber is externally coated with polyurea, and the first pressure bladder is connected with the second pressure bladder through a connecting pipe.
5. The semiconductor refrigeration temperature control device of claim 1, wherein the connecting rod is connected with the end of the connecting nail through coating of polyurea.
6. The semiconductor refrigeration temperature control device of claim 1, wherein a support sheet metal is arranged between the fixing plates.
7. The semiconductor refrigeration temperature control device according to claim 1, wherein a mounting plate is fixed to a lower portion of the fixing plate by a connecting member.
8. The semiconductor refrigeration temperature control device according to claim 1, wherein gaps between the first and second heat exchange plates and the semiconductor refrigeration sheet are filled with heat-conducting silica gel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110542989.9A CN113284825B (en) | 2021-05-19 | 2021-05-19 | Semiconductor refrigeration temperature control device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110542989.9A CN113284825B (en) | 2021-05-19 | 2021-05-19 | Semiconductor refrigeration temperature control device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113284825A CN113284825A (en) | 2021-08-20 |
| CN113284825B true CN113284825B (en) | 2022-01-25 |
Family
ID=77279689
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110542989.9A Active CN113284825B (en) | 2021-05-19 | 2021-05-19 | Semiconductor refrigeration temperature control device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113284825B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1715194A (en) * | 2004-06-28 | 2006-01-04 | 上海万森水处理有限公司 | Semiconductor constant temperature medicine dissolving device |
| CN106444915A (en) * | 2016-09-13 | 2017-02-22 | 冠礼控制科技（上海）有限公司 | Electronic HF (hydrogen fluoride) temperature increasing and decreasing system |
| CN107449217A (en) * | 2017-09-23 | 2017-12-08 | 广东富信科技股份有限公司 | Semiconductor cooling water system |
| CN210242074U (en) * | 2019-07-22 | 2020-04-03 | 扬州思普尔科技有限公司 | Chemical agent refrigerating device |
| CN212263221U (en) * | 2020-04-29 | 2021-01-01 | 杭州新龙化工有限公司 | Temperature control safety structure for preparation process of dilute nitric acid |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7578976B1 (en) * | 2000-05-10 | 2009-08-25 | Lawrence Livermore National Security, Llc | Sleeve reaction chamber system |
| CN112546981A (en) * | 2018-11-16 | 2021-03-26 | 尚福平 | Chemical production multiple circulating cooling device |
-
2021
- 2021-05-19 CN CN202110542989.9A patent/CN113284825B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1715194A (en) * | 2004-06-28 | 2006-01-04 | 上海万森水处理有限公司 | Semiconductor constant temperature medicine dissolving device |
| CN106444915A (en) * | 2016-09-13 | 2017-02-22 | 冠礼控制科技（上海）有限公司 | Electronic HF (hydrogen fluoride) temperature increasing and decreasing system |
| CN107449217A (en) * | 2017-09-23 | 2017-12-08 | 广东富信科技股份有限公司 | Semiconductor cooling water system |
| CN210242074U (en) * | 2019-07-22 | 2020-04-03 | 扬州思普尔科技有限公司 | Chemical agent refrigerating device |
| CN212263221U (en) * | 2020-04-29 | 2021-01-01 | 杭州新龙化工有限公司 | Temperature control safety structure for preparation process of dilute nitric acid |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113284825A (en) | 2021-08-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN113284825B (en) | Semiconductor refrigeration temperature control device | |
| CN208423107U (en) | Heat management connector and heat management device | |
| KR102088374B1 (en) | Heat Exchanger for Chiller | |
| CN210292940U (en) | Flat evaporator and loop heat pipe applying same | |
| TW202033922A (en) | Heat dissipation device | |
| CN108679885B (en) | A kind of low-temperature corrosion protection evaporator | |
| CN213958000U (en) | Double-return-stroke efficient computer water-cooling radiator | |
| CN210892782U (en) | Fin type heat exchanger | |
| CN221859324U (en) | Central heat conduction's heat dissipation aluminum pipe | |
| CN220967166U (en) | Circulation all-in-one that cold water bath was used | |
| CN219454767U (en) | Semiconductor heat exchanger | |
| CN215177136U (en) | Heat pipe type heat exchange system and evaporative cooling condensing device | |
| CN215724270U (en) | Novel semiconductor electronic refrigeration ice container device | |
| CN219938785U (en) | Frequency conversion plate heat radiation structure and frequency conversion heat pump | |
| CN110480384A (en) | A kind of samming freezing clamping device and its control method | |
| CN219301044U (en) | Miniature refrigerating device | |
| CN216077585U (en) | Spray liquid cooling device of screw rod compressor | |
| CN219998002U (en) | Transformer heat abstractor and transformer | |
| CN220959196U (en) | Water cooling device based on thermal conductivity coefficient tester | |
| CN220830013U (en) | Direct cooling plate for battery refrigerant | |
| CN221329149U (en) | Die-casting heating element | |
| CN218955525U (en) | Corrugated plate heat exchanger assembly for direct expansion machine | |
| CN220750496U (en) | Cooling heat exchanger convenient to maintenance | |
| CN221381558U (en) | Case with double-sided replaceable liquid cooling plates | |
| CN221529147U (en) | Cooling system for server |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Room 3, no.299, Yuyang Road, Yushan Town, Kunshan City, Suzhou City, Jiangsu Province Patentee after: Suzhou Zhicheng Semiconductor Technology Co.,Ltd. Address before: Room 3, no.299, Yuyang Road, Yushan Town, Kunshan City, Suzhou City, Jiangsu Province Patentee before: Zhicheng semiconductor equipment technology (Kunshan) Co.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder | ||
| CP03 | Change of name, title or address |
Address after: No. 889 Zhonghua Road, Bacheng Town, Kunshan City, Suzhou City, Jiangsu Province, 215300 Patentee after: Suzhou Zhicheng Semiconductor Technology Co.,Ltd. Country or region after: China Address before: Room 3, no.299, Yuyang Road, Yushan Town, Kunshan City, Suzhou City, Jiangsu Province Patentee before: Suzhou Zhicheng Semiconductor Technology Co.,Ltd. Country or region before: China |