CN113284810A - Full-automatic terminal installation device - Google Patents

Full-automatic terminal installation device Download PDF

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Publication number
CN113284810A
CN113284810A CN202110478425.3A CN202110478425A CN113284810A CN 113284810 A CN113284810 A CN 113284810A CN 202110478425 A CN202110478425 A CN 202110478425A CN 113284810 A CN113284810 A CN 113284810A
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CN
China
Prior art keywords
frame
fixedly arranged
crimping
bending
plate
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Granted
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CN202110478425.3A
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Chinese (zh)
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CN113284810B (en
Inventor
李梦雄
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Suzhou Harmontronics Intelligent Technology Co ltd
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Suzhou Harmontronics Intelligent Technology Co ltd
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Priority to CN202110478425.3A priority Critical patent/CN113284810B/en
Publication of CN113284810A publication Critical patent/CN113284810A/en
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Publication of CN113284810B publication Critical patent/CN113284810B/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814Conductive parts
    • H01L21/4885Wire-like parts or pins
    • H01L21/4896Mechanical treatment, e.g. cutting, bending
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52Mounting semiconductor bodies in containers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742Mechanical parts of transfer devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Wire Processing (AREA)

Abstract

The invention discloses a full-automatic terminal installation device which comprises a machine table and a conveying line arranged on the machine table and used for conveying a shell, wherein a bending conveying mechanism used for bending and forming an IC pin and conveying the IC pin into the shell, a crimping mechanism used for crimping the IC pin and the shell, a cutting mechanism used for cutting a connecting part on the IC pin, and a shaping mechanism used for shaping the IC pin and the shell after crimping are sequentially arranged on the machine table along the movement direction of the conveying line. The invention has the following beneficial effects: the device realizes automatic feeding, bends, crimping, cuts and is the plastic, and whole journey need not manual operation to reach and improve machining efficiency when mass production, simultaneously, reduce cost of labor, processing cost and artifical intensity of labour's technological effect, can make the enterprise effectively utilize manpower resources, and it is convenient to collect. In addition, the layout is ingenious and reasonable, the occupied space is reduced, and the utilization rate of the space is improved to the maximum extent.

Description

Full-automatic terminal installation device
Technical Field
The invention relates to the technical field of automation, in particular to an automatic terminal installation device.
Background
In recent years, along with industrial automation degree is higher and higher, the application range and the kind of terminal are more and more, and product assembly mostly relies on the manual work to accomplish in the terminal, and not only production efficiency is low, and the cost of labor is higher moreover, and manual assembly is accomplished still need to carry out the partial shipment to it, extravagant labour. As disclosed in chinese patent No. CN110797725, a terminal crimping apparatus and a terminal crimping method, the terminal crimping apparatus includes: a cutting portion configured to cut each of two or more terminals belonging to one terminal group at one end side of the terminal connecting body from the carrier; a terminal conveying part configured to: conveying two or more terminals cut at a cutting portion to crimping positions corresponding to a predetermined interval while adjusting a terminal interval of the two or more terminals to an arrangement interval of the covered electric wires at the crimping positions in a conveying direction (a length direction) of the terminal connecting body; and a crimping portion configured to crimp and connect the two or more terminals conveyed to the crimping position to the electric wire together. The terminal mounting structure is complex, the operation difficulty is high, in addition, a plurality of persons are required to perform cutting and shaping operations after the terminal mounting structure is mounted, manpower is wasted, therefore, the existing requirements are not met, the existing technology needs to be improved based on the defects, and the terminal full-automatic mounting device is provided.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provides a full-automatic terminal mounting device.
The purpose of the invention is realized by the following technical scheme:
the utility model provides a full-automatic installation device of terminal, includes the board and sets up the transfer chain that is used for carrying the casing above that, follows the direction of motion of transfer chain, be equipped with in proper order on the board and be used for bending the shaping of IC pin and carry to bend conveying mechanism in the casing, be used for with the crimping mechanism of IC pin and casing crimping, be used for with connecting portion on the IC pin cut the mechanism, be used for with the crimping back the plastic mechanism of IC pin and casing plastic.
Preferably, the crimping mechanism comprises a crimping frame and a lower crimping plate arranged on the crimping frame, and a driving assembly capable of driving the lower crimping plate to slide is arranged on the crimping frame; an upper crimping plate capable of moving up and down relative to the lower crimping plate is arranged right above the lower crimping plate, and the upper crimping plate and the lower crimping plate are matched with each other to complete crimping of the shell and the IC pins.
Preferably, the driving assembly comprises a driving cylinder fixedly arranged on the crimping frame, a connecting frame is fixedly arranged on a driving piston of the driving cylinder, a sliding groove is formed in the connecting frame, and an included angle formed by a central axis of the sliding groove and a horizontal plane is an acute angle; the compression joint frame is characterized in that a positioning rail is further fixedly arranged on the compression joint frame, a positioning block matched with the positioning rail is arranged on the positioning rail, a positioning plate is fixedly arranged on the positioning block, a positioning pin and the lower compression joint plate are fixedly arranged on the positioning plate, and at least part of the positioning pin extends into the sliding groove.
Preferably, the crimping frame is further provided with a crimping cylinder, and the upper crimping plate is fixedly arranged on the crimping cylinder.
Preferably, the cutting mechanism comprises a cutting frame fixedly arranged on the machine table, a supporting cylinder is fixedly arranged on the cutting frame, a supporting slide block is arranged on a cylinder shaft of the supporting cylinder, and a waist-shaped hole is formed in the supporting slide block; the support frame is also provided with a sliding block in a sliding manner, the sliding block is fixedly provided with a sliding pin, and at least part of the sliding pin extends into the waist-shaped hole; the cutting frame is further provided with a cutting cylinder, a cutting knife is fixedly arranged on a cylinder shaft of the cutting cylinder, and the cutting knife is matched with a lower cutting block arranged on the sliding block to complete cutting of the connecting portion.
Preferably, the shaping mechanism comprises a shaping frame fixedly arranged on the machine table, a lower shaping cylinder is fixedly arranged on the shaping frame, and a lower shaping sliding block used for bearing the shell is fixedly arranged on a cylinder shaft of the lower shaping cylinder; the shaping frame is further fixedly provided with an upper shaping cylinder, a cylinder shaft of the upper shaping cylinder is fixedly provided with an upper shaping sliding block, the upper shaping sliding block is fixedly provided with a roller, and the roller can be tightly attached to the IC pin.
Preferably, the bending conveying mechanism comprises a bending frame fixedly arranged on the machine table, a feeding assembly used for conveying the IC pins and a bending assembly used for primarily bending and secondarily bending the IC pins are arranged on the bending frame, and a conveying assembly used for conveying the IC pins at the primarily bent positions to the secondarily bent positions is arranged on one side of the bending assembly; and the bending frame is also provided with a clamping assembly used for clamping and placing the IC pins on the feeding assembly onto the bending assembly.
Preferably, the feeding assembly comprises a feeding frame fixedly arranged on the bending frame, a rotating roller capable of rotating automatically is arranged on the feeding frame, the rotating roller is driven by a feeding motor arranged on the feeding frame, and a feeding disc for accommodating IC pins is arranged on the rotating roller; the feeding assembly further comprises a feeding block fixedly arranged on the bending frame, a rotating motor is fixedly arranged on the feeding block, a rotating gear is fixedly arranged on the rotating motor, and a protruding portion of the outer circumferential surface of the rotating gear is meshed with a clamping groove on the end side of the IC pin.
Preferably, the bending assembly comprises a lower module fixedly arranged on the bending frame, a bearing plate used for bearing the IC pins is arranged on the lower module, and a clamping groove I used for bearing the IC pins, a clamping groove II used for primarily bending the IC pins, a clamping groove III used for secondarily bending the IC pins and a clamping groove IV used for accommodating the bent IC pins are sequentially formed in the bearing plate at equal intervals; an upper module capable of moving up and down relative to the lower module is arranged right above the lower module, and a bending block capable of extending to be arranged in the clamping groove II to vertically bend the IC pins and a profiling block capable of extending to be arranged in the clamping groove III to profile bend the IC pins are arranged at the bottom of the upper module.
Preferably, the conveying assembly comprises a bottom plate fixedly arranged on the bending frame, a sliding rail I is fixedly arranged on the bottom plate, a sliding block I matched with the sliding rail I is arranged on the sliding rail I, a fixed plate is arranged on the sliding block I, an upward jacking cylinder is fixedly arranged on the fixed plate, an upper top plate is fixedly arranged on a cylinder shaft of the upward jacking cylinder, a sliding rail II is fixedly arranged on the upper top plate, a sliding block II matched with the sliding rail II is arranged on the sliding rail II, a push plate is fixedly arranged on the sliding block II, and a group of IC suction nozzles are equidistantly arranged on the push plate; the clamping assembly comprises a clamping frame fixedly arranged on the bending frame, a sliding rail III is fixedly arranged on the clamping frame, a sliding block III matched with the sliding rail III is arranged on the sliding rail III, a clamping plate is fixedly arranged on the sliding block III, and the clamping plate is connected with a pushing cylinder fixedly arranged on the clamping frame; the clamping plate is further fixedly provided with a clamping cylinder, a connecting plate is fixedly arranged on a cylinder shaft of the clamping cylinder, and an IC suction claw is fixedly arranged on the connecting plate.
The invention has the following beneficial effects: the device realizes automatic feeding, bends, crimping, cuts and is the plastic, and whole journey need not manual operation to reach and improve machining efficiency when mass production, simultaneously, reduce cost of labor, processing cost and artifical intensity of labour's technological effect, can make the enterprise effectively utilize manpower resources, and it is convenient to collect. In addition, the layout is ingenious and reasonable, the occupied space is reduced, and the utilization rate of the space is improved to the maximum extent.
Drawings
The technical scheme of the invention is further explained by combining the accompanying drawings as follows:
FIG. 1: the structure of the terminal in the preferred embodiment of the invention is shown schematically;
FIG. 2: top view of the preferred embodiment of the present invention;
FIG. 3: a perspective view of the crimping mechanism in a preferred embodiment of the invention;
FIG. 4: a perspective view of a cutting mechanism in a preferred embodiment of the present invention;
FIG. 5: a perspective view of a shaping mechanism in a preferred embodiment of the invention;
FIG. 6: a perspective view of a bending conveying mechanism in a preferred embodiment of the invention;
FIG. 7: the perspective view of the conveying mechanism is bent in the preferred embodiment of the invention, at this time, the clamping assembly is removed;
FIG. 8: a front view of a bending assembly in a preferred embodiment of the invention;
FIG. 9: a perspective view of a clamping assembly in a preferred embodiment of the invention;
FIG. 10: a partial enlarged view of portion a in fig. 7;
FIG. 11: a partial enlarged view of portion B in fig. 7.
Detailed Description
The present invention will be described in detail below with reference to specific embodiments shown in the drawings. These embodiments are not intended to limit the present invention, and structural, methodical, or functional changes that may be made by one of ordinary skill in the art in light of these embodiments are intended to be within the scope of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention. Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.
The present invention will be described in detail below with reference to the embodiments with reference to the attached drawings.
As shown in fig. 1 to 11, the present invention discloses a full-automatic terminal installation device, which includes a machine table 1 and a conveyor line 2 disposed thereon for conveying a housing 200, wherein the conveyor line 2 may be belt-conveyed or transmission chain-conveyed, and is provided with a receiving block for receiving the housing 200.
In the preferred embodiment, along the moving direction of the conveyor line 2, the machine table 1 is sequentially provided with a bending conveying mechanism 4 for bending and molding the IC pin 100 and conveying the IC pin into the housing 200, a crimping mechanism 5 for crimping the IC pin 100 and the housing 200, a cutting mechanism 3 for cutting the connecting portion 102 on the IC pin 100, and a shaping mechanism 6 for shaping the IC pin 100 and the housing 200 after crimping. Above-mentioned structure realizes automatic feeding, bends, crimping, cuts and is the plastic, and whole journey need not manual operation to reach and improve machining efficiency when mass production, simultaneously, reduce cost of labor, processing cost and artifical intensity of labour's technological effect, can make the enterprise effectively utilize manpower resources, and it is convenient to collect. In addition, the layout is ingenious and reasonable, the occupied space is reduced, and the utilization rate of the space is improved to the maximum extent.
The bending conveying mechanism 4 comprises a bending frame 41, a feeding assembly 42 for conveying the IC pins 100 is arranged on the bending frame 41, the feeding assembly 42 comprises a feeding frame 421 fixedly arranged on the bending frame 41, a rotatable rotating roller is arranged on the feeding frame 421, the rotating roller is driven by a feeding motor 423 arranged on the feeding frame 421, and a feeding tray 422 for accommodating the IC pins is arranged on the rotating roller. The feeding assembly 442 further includes a feeding block 428 fixed on the bending frame 441, a rotating motor is fixed on the feeding block 428, a rotating gear 425 is fixed on the rotating motor, and a protruding portion 4251 on the outer circumferential surface of the rotating gear 425 is engaged with the slot 101 on the end side of the IC pin 100. The rotary gear can drive the IC pins to feed and convey one by one, so that the stability is high, and the condition of missing conveying is avoided.
Further, an upright rod 424 is further disposed on the feeding frame 421, a fixed block 426 is fixedly disposed on the upright rod 424, a tension wheel 427 capable of rotating is disposed on the fixed block 426, and the tension wheel 427 can ensure that the IC pins are always in a tensioned state in the conveying process, so as to ensure the stability of conveying.
The design key points of the invention are as follows: the bending frame 41 is provided with a bending assembly 43 for primarily bending and secondarily bending the IC pin 100, the bending assembly 43 comprises a lower module 431 fixedly arranged on the bending frame 41, the lower module 431 is provided with a bearing plate 4311 for bearing the IC pin 100, and the bearing plate 4311 is equidistantly and sequentially provided with a clamping groove I43111 for bearing the IC pin 100, a clamping groove II 43112 for primarily bending the IC pin 100, a clamping groove III 43113 for secondarily bending the IC pin 100 and a clamping groove IV 43114 for accommodating the IC pin 100 after bending is completed; an upper module 432 capable of moving up and down relative to the lower module 431 is arranged right above the lower module 431, and a bending block 4321 capable of extending and being arranged in the clamping groove II 43112 to vertically bend the IC pin 100 and a profiling block 4322 capable of extending and being arranged in the clamping groove III 43113 to profile bend the IC pin 100 are arranged at the bottom of the upper module 432. In this preferred embodiment, the IC pins 100 in the card slots iv 43114 may be taken down manually, or may be taken by an automated device, for example, after the IC pins are turned by 90 ° by a turning mechanism, the IC pins are taken by a manipulator, where the turning mechanism does not belong to the protection point of the present invention, and is disclosed in the prior art, and the present invention is not described in detail herein.
A driving cylinder 436 is further fixedly arranged on the bending frame 41, and a cylinder shaft of the driving cylinder 436 is fixedly connected with the upper module 432 through a coupling 437. Two sides of the lower module 431 are provided with upright posts 433, a spring 434 is fixedly sleeved on the upright posts 433, and the other end of the spring 434 is fixedly connected with a shaft sleeve 435 sleeved on the upright posts 433; the other end of the shaft sleeve 435 is fixedly connected to the upper module 432. The arrangement of the posts 433 and the bosses 435 ensures the stability of the upper module 32 in sliding.
One side of the bending component 3 is provided with a conveying component 44 for conveying the IC pin 100 at the primary bending position to the secondary bending position, the conveying component 44 comprises a bottom plate 441 fixedly arranged on the bending frame 41, the bottom plate 441 is fixedly provided with a slide rail i 4411, the slide rail i 4411 is provided with a slide block i 4412 matched with the slide rail i 4411, the slide block i 4412 is provided with a fixed plate 442, the fixed plate 442 is fixedly provided with an upper jacking cylinder 4421, a cylinder shaft of the upper jacking cylinder 4421 is fixedly provided with an upper top plate 4422, the upper top plate 4422 is fixedly provided with a slide rail ii 4423, the slide rail ii 4423 is provided with a slide block ii 4424 matched with the slide rail ii 4423, the slide block ii 4424 is fixedly provided with a push plate 443, and the push plate 43 is equidistantly provided with a group of suction nozzles IC 444. The upper top plate 4422 is further fixedly provided with a pushing cylinder 445, a cylinder shaft of the pushing cylinder 445 is fixedly connected with the push plate 443, and the moving direction of the push plate 443 is spatially perpendicular to the moving direction of the fixed plate 442. In the invention, the conveying assembly has an exquisite structure, can move in three axes to meet different working conditions, and has wide applicability.
The bending frame 41 is further provided with a clamping assembly 45 for clamping and placing the IC pin 100 on the feeding assembly 442 onto the bending assembly 43, the clamping assembly 45 comprises a clamping frame 451 fixedly arranged on the bending frame 441, the clamping frame 451 is fixedly provided with a slide rail iii 452, the slide rail iii 452 is provided with a slide block iii 453 matched with the slide rail iii 452, the slide block iii 453 is fixedly provided with a clamping plate 454, and the clamping plate 454 is connected with a pushing cylinder 458 fixedly arranged on the clamping frame 451; the clamping plate 454 is further fixedly provided with a clamping cylinder 455, a connecting plate 456 is fixedly arranged on a cylinder shaft of the clamping cylinder 455, and an IC suction claw 457 is fixedly arranged on the connecting plate 456.
The crimping mechanism 5 comprises a crimping frame 51 and a lower crimping plate 52 arranged on the crimping frame 51, and a driving assembly 53 capable of driving the lower crimping plate 52 to slide is arranged on the crimping frame 51; an upper press-connection plate 54 capable of moving up and down relative to the lower press-connection plate 52 is arranged right above the lower press-connection plate 52, and the upper press-connection plate 54 and the lower press-connection plate 52 are matched with each other to complete press-connection of the shell 200 and the IC pins 100. The driving assembly 53 comprises a driving cylinder 531 fixedly arranged on the crimping frame 51, a connecting frame 532 is fixedly arranged on a driving piston of the driving cylinder 531, a sliding groove 533 is arranged on the connecting frame 532, and an included angle formed by a central axis of the sliding groove 533 and a horizontal plane is an acute angle; the pressing frame 51 is further fixedly provided with a positioning rail 534, the positioning rail 534 is provided with a positioning block 535 adapted to the positioning rail 534, the positioning block 535 is fixedly provided with a positioning plate 536, the positioning plate 536 is fixedly provided with a positioning pin 537 and the lower pressing plate 52, and the positioning pin 537 at least partially extends into the sliding groove 533. The pressing frame 51 is further provided with a pressing cylinder 511, and the upper pressing plate 54 is fixedly arranged on the pressing cylinder 511.
The cutting mechanism 3 comprises a cutting frame 31 fixedly arranged on the machine table 1, a supporting cylinder 32 is fixedly arranged on the cutting frame 31, a supporting slide block 33 is arranged on a cylinder shaft of the supporting cylinder 32, and a waist-shaped hole 34 is formed in the supporting slide block 33; the supporting frame 31 is further provided with a sliding block 35 in a sliding manner, the sliding block 35 is fixedly provided with a sliding pin 36, and at least part of the sliding pin 36 extends into the kidney-shaped hole 34; the cutting frame 31 is further provided with a cutting cylinder 37, a cutting knife 38 is fixedly arranged on a cylinder shaft of the cutting cylinder 37, and the cutting knife 38 is matched with a lower cutting block 39 arranged on the sliding block 35 to complete cutting of the connecting part 102.
The shaping mechanism 6 comprises a shaping frame 61 fixedly arranged on the machine table 1, a lower shaping cylinder 62 is fixedly arranged on the shaping frame 61, and a lower shaping slide block 63 for bearing the shell 200 is fixedly arranged on a cylinder shaft of the lower shaping cylinder 62; an upper shaping cylinder 64 is fixedly arranged on the shaping frame 61, an upper shaping slide block 65 is fixedly arranged on a cylinder shaft of the upper shaping cylinder 64, a roller 66 is fixedly arranged on the upper shaping slide block 65, and the roller 66 can be tightly attached to the IC pin 100.
The working process of the invention is briefly described as follows:
the conveying line 2 is started to convey the shell 200 to a corresponding position, simultaneously, the feeding motor 423 is started to convey the IC pins through the feeding disc 422, and the convex part on the outer circumferential surface of the rotary gear 425 is meshed with the clamping groove 101 to drive the IC pins to move forwards one by one. The pushing cylinder 458 and the clamping cylinder 455 are matched with each other to clamp the IC pins to the card slot i 43111, at this time, the conveying assembly 44 pushes the IC pins to slide one by one in the card slot i 43111, the card slot ii 43112, the card slot iii 43113 and the card slot iv 43114, and the bending block 4321 and the profiling block 4322 move downward to complete bending. After bending, will the IC pin send to on the casing 200, transfer chain 2 continues to start, accomplishes crimping, the guillootine plastic processing to the terminal through crimping mechanism 5, cutting mechanism and plastic mechanism in proper order.
It should be understood that although the present description refers to embodiments, not every embodiment contains only a single technical solution, and such description is for clarity only, and those skilled in the art should make the description as a whole, and the technical solutions in the embodiments can also be combined appropriately to form other embodiments understood by those skilled in the art.
The above-listed detailed description is only a specific description of a possible embodiment of the present invention, and they are not intended to limit the scope of the present invention, and equivalent embodiments or modifications made without departing from the technical spirit of the present invention should be included in the scope of the present invention.

Claims (10)

1. Full-automatic installation device of terminal, including board (1) and set up transfer chain (2) that are used for carrying casing (200) above that, its characterized in that: along the moving direction of the conveying line (2), a bending conveying mechanism (4) used for bending and forming the IC pins (100) and conveying the IC pins into the shell (200), a crimping mechanism (5) used for crimping the IC pins (100) and the shell (200), a cutting mechanism (3) used for cutting the connecting parts (102) on the IC pins (100) and a shaping mechanism (6) used for shaping the IC pins (100) and the shell (200) after crimping are sequentially arranged on the machine table (1).
2. The fully automatic terminal mounting device according to claim 1, wherein: the crimping mechanism (5) comprises a crimping frame (51) and a lower crimping plate (52) arranged on the crimping frame (51), and a driving assembly (53) capable of driving the lower crimping plate (52) to slide is arranged on the crimping frame (51); an upper crimping plate (54) capable of moving up and down relative to the lower crimping plate (52) is arranged right above the lower crimping plate (52), and the upper crimping plate (54) and the lower crimping plate (52) are matched with each other to complete crimping of the shell (200) and the IC pins (100).
3. The fully automatic terminal mounting device according to claim 2, wherein: the driving assembly (53) comprises a driving air cylinder (531) fixedly arranged on the crimping frame (51), a connecting frame (532) is fixedly arranged on a driving piston of the driving air cylinder (531), a sliding groove (533) is formed in the connecting frame (532), and an included angle formed by the central axis of the sliding groove (533) and the horizontal plane is an acute angle; the crimping frame (51) is further fixedly provided with a positioning rail (534), the positioning rail (534) is provided with a positioning block (535) matched with the positioning rail, the positioning block (535) is fixedly provided with a positioning plate (536), the positioning plate (536) is fixedly provided with a positioning pin (537) and the lower crimping plate (52), and at least part of the positioning pin (537) extends into the sliding groove (533).
4. The fully automatic terminal mounting device of claim 3, wherein: the crimping frame (51) is further provided with a crimping cylinder (511), and the upper crimping plate (54) is fixedly arranged on the crimping cylinder (511).
5. The fully automatic terminal mounting device of claim 3, wherein: the cutting mechanism (3) comprises a cutting frame (31) fixedly arranged on the machine table (1), a supporting cylinder (32) is fixedly arranged on the cutting frame (31), a supporting slide block (33) is arranged on a cylinder shaft of the supporting cylinder (32), and a waist-shaped hole (34) is formed in the supporting slide block (33); the supporting frame (31) is further provided with a sliding block (35) in a sliding mode, a sliding pin (36) is fixedly arranged on the sliding block (35), and at least part of the sliding pin (36) extends into the waist-shaped hole (34); the cutting frame (31) is further provided with a cutting cylinder (37), a cutting knife (38) is fixedly arranged on a cylinder shaft of the cutting cylinder (37), and the cutting knife (38) is matched with a lower cutting block (39) arranged on the sliding block (35) to finish cutting of the connecting part (102).
6. The fully automatic terminal mounting device of claim 3, wherein: the shaping mechanism (6) comprises a shaping frame (61) fixedly arranged on the machine table (1), a lower shaping cylinder (62) is fixedly arranged on the shaping frame (61), and a lower shaping sliding block (63) used for bearing the shell (200) is fixedly arranged on a cylinder shaft of the lower shaping cylinder (62); an upper shaping cylinder (64) is fixedly arranged on the shaping frame (61), an upper shaping sliding block (65) is fixedly arranged on a cylinder shaft of the upper shaping cylinder (64), a roller (66) is fixedly arranged on the upper shaping sliding block (65), and the roller (66) can be tightly attached to the IC pin (100).
7. The fully automatic terminal mounting device according to claim 1, wherein: the bending conveying mechanism (4) comprises a bending frame (41) fixedly arranged on the machine table (1), a feeding assembly (42) used for conveying the IC pins (100) and a bending assembly (43) used for primarily bending and secondarily bending the IC pins (100) are arranged on the bending frame (41), and a conveying assembly (44) used for conveying the IC pins (100) at the primarily bent positions to the secondarily bent positions is arranged on one side of the bending assembly (43); the bending frame (41) is further provided with a clamping assembly (45) used for clamping and placing the IC pins (100) on the feeding assembly (42) onto the bending assembly (43).
8. The fully automatic terminal mounting device of claim 7, wherein: the feeding assembly (42) comprises a feeding frame (421) fixedly arranged on the bending frame (41), a rotatable rotating roller is arranged on the feeding frame (421), the rotating roller is driven by a feeding motor (423) arranged on the feeding frame (421), and a feeding disc (422) used for containing IC pins is arranged on the rotating roller; the feeding assembly (42) further comprises a feeding block (428) fixedly arranged on the bending frame (41), a rotating motor is fixedly arranged on the feeding block (428), a rotating gear (425) is fixedly arranged on the rotating motor, and a protruding portion (4251) on the outer circumferential surface of the rotating gear (425) is meshed with a clamping groove (101) on the end side of the IC pin (100).
9. The fully automatic terminal mounting device of claim 8, wherein: the bending assembly (43) comprises a lower module (431) fixedly arranged on the bending frame (41), a bearing plate (4311) used for bearing an IC pin (100) is arranged on the lower module (431), a clamping groove I (43111) used for bearing the IC pin (100), a clamping groove II (43112) used for primarily bending the IC pin (100), a clamping groove III (43113) used for secondarily bending the IC pin (100) and a clamping groove IV (43114) used for accommodating the bent IC pin (100) are sequentially arranged on the bearing plate (4311) at equal intervals; an upper module (432) capable of moving up and down relative to the lower module (431) is arranged right above the lower module (431), and a bending block (4321) capable of extending and being arranged in the clamping groove II (43112) to vertically bend the IC pin (100) and a profiling block (4322) capable of extending and being arranged in the clamping groove III (43113) to profile-bend the IC pin (100) are arranged at the bottom of the upper module (432).
10. The fully automatic terminal mounting device of claim 9, wherein: the conveying assembly (44) comprises a bottom plate (441) fixedly arranged on the bending frame (41), a sliding rail I (4411) is fixedly arranged on the bottom plate (441), a sliding block I (4412) matched with the sliding rail I (4411) is arranged on the sliding rail I (4412), a fixing plate (442) is arranged on the sliding block I (4412), an upper jacking cylinder (4421) is fixedly arranged on the fixing plate (442), an upper top plate (4422) is fixedly arranged on a cylinder shaft of the upper jacking cylinder (4421), a sliding rail II (4423) is fixedly arranged on the upper top plate (4422), a sliding block II (4424) matched with the sliding rail II (4423) is arranged on the sliding rail II (4423), a push plate (443) is fixedly arranged on the sliding block II (4424), and a group of IC suction nozzles (444) are equidistantly arranged on the push plate (443); the clamping assembly (45) comprises a clamping frame (451) fixedly arranged on the bending frame (41), a sliding rail III (452) is fixedly arranged on the clamping frame (451), a sliding block III (453) matched with the sliding rail III (452) is arranged on the sliding rail III (452), a clamping plate (454) is fixedly arranged on the sliding block III (453), and the clamping plate (454) is connected with a pushing cylinder (458) fixedly arranged on the clamping frame (451); the clamping plate (454) is further fixedly provided with a clamping cylinder (455), a connecting plate (456) is fixedly arranged on a cylinder shaft of the clamping cylinder (455), and an IC suction claw (457) is fixedly arranged on the connecting plate (456).
CN202110478425.3A 2021-04-30 2021-04-30 Full-automatic terminal mounting device Active CN113284810B (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113858642A (en) * 2021-09-15 2021-12-31 苏州瀚川智能科技股份有限公司 Multifunctional special machine
CN114039151A (en) * 2021-11-01 2022-02-11 苏州瀚川智能科技股份有限公司 Special machine for overturning and pressing rubber shell to form
CN115091689A (en) * 2022-06-13 2022-09-23 苏州瀚川智能科技股份有限公司 Full-automatic feeding device for injection molding line body

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JPH11167974A (en) * 1997-12-03 1999-06-22 Sumitomo Wiring Syst Ltd Terminal crimp machine
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WO2008087938A1 (en) * 2007-01-16 2008-07-24 Japan Automatic Machine Co., Ltd. Terminal crimping method, terminal crimping device, and terminal-crimped electric wire manufacturing apparatus
CN210535993U (en) * 2019-10-21 2020-05-15 广东中德电缆有限公司 Automatic terminal pin cutter

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Publication number Priority date Publication date Assignee Title
JPH0697342A (en) * 1992-09-16 1994-04-08 Sony Corp Processing and manufacturing device and method for semiconductor device
JPH11167974A (en) * 1997-12-03 1999-06-22 Sumitomo Wiring Syst Ltd Terminal crimp machine
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Publication number Priority date Publication date Assignee Title
CN113858642A (en) * 2021-09-15 2021-12-31 苏州瀚川智能科技股份有限公司 Multifunctional special machine
CN114039151A (en) * 2021-11-01 2022-02-11 苏州瀚川智能科技股份有限公司 Special machine for overturning and pressing rubber shell to form
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CN115091689A (en) * 2022-06-13 2022-09-23 苏州瀚川智能科技股份有限公司 Full-automatic feeding device for injection molding line body

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