CN113280538A - Cooling device for semiconductor process - Google Patents
Cooling device for semiconductor process Download PDFInfo
- Publication number
- CN113280538A CN113280538A CN202110191290.2A CN202110191290A CN113280538A CN 113280538 A CN113280538 A CN 113280538A CN 202110191290 A CN202110191290 A CN 202110191290A CN 113280538 A CN113280538 A CN 113280538A
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- CN
- China
- Prior art keywords
- passage
- line
- temperature control
- controlled
- tank
- Prior art date
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Links
- 238000000034 method Methods 0.000 title claims abstract description 39
- 238000001816 cooling Methods 0.000 title claims abstract description 27
- 239000004065 semiconductor Substances 0.000 title claims abstract description 13
- 238000011084 recovery Methods 0.000 claims abstract description 13
- 239000000498 cooling water Substances 0.000 claims abstract description 12
- 239000003507 refrigerant Substances 0.000 claims abstract description 12
- 238000005057 refrigeration Methods 0.000 claims abstract description 6
- 239000007788 liquid Substances 0.000 abstract description 4
- 238000010438 heat treatment Methods 0.000 description 6
- 230000004043 responsiveness Effects 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K11/00—Multiple-way valves, e.g. mixing valves; Pipe fittings incorporating such valves
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B39/00—Evaporators; Condensers
- F25B39/02—Evaporators
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B49/00—Arrangement or mounting of control or safety devices
- F25B49/02—Arrangement or mounting of control or safety devices for compression type machines, plants or systems
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Disclosed is a cooling apparatus for a semiconductor process, which can minimize the influence of temperature control while controlling the liquid level balance of tanks of respective channels. The temperature control module is configured to correspond to two passages connected to a hot zone and a cold zone of the process chamber, and is configured such that a tank, a circulation pump, an evaporator coupled to the refrigeration cycle, and a line heater are disposed in order from a recovery line to a supply line in a first passage connected to the cold zone, and is configured such that a tank, a circulation pump, a cooling water heat exchanger, and a line heater are disposed in order from a recovery line to a supply line in a second passage connected to the hot zone, and refrigerant flowing through the respective passages is controlled to be cooled in the evaporator of the first passage and the cooling water heat exchanger of the second passage, and controlled to be heated in the line heaters of the first passage and the second passage.
Description
Technical Field
The present invention relates to a cooling apparatus for a semiconductor process, and more particularly, to a technique capable of minimizing the influence of temperature control even when the liquid level balance of a tank is controlled for each channel.
Background
Development of 3D memory related technologies of the semiconductor market is actively proceeding. The 3D memory technology is a method of stacking semiconductor elements in a vertical direction to form a multi-layered element due to the limitation of the micro-processing technology in the fabrication of the existing 2D memory.
Such a 3D memory process is a necessary technology of the fourth industrial age requiring large capacity and high-speed processing, and the market scale thereof is rapidly increasing. In order to ensure high productivity and efficiency when performing a 3D memory process, it is required to have a wider temperature range and faster responsiveness than the existing process.
The cooling apparatus for a semiconductor is an apparatus for maintaining precise temperature control of an electrostatic CHUCK (ESC) which controls the internal temperature of a chamber in which the process as described above is performed and the temperature of the surface of a wafer.
For example, korean patent laid-open No. 2070455, which was filed by the present applicant, discloses a cooling apparatus for a semiconductor process and a temperature control method thereof.
Recently, in order to improve a conventional process that takes much time to raise or lower the temperature of a system according to a desired set value in a process temperature range (for example, -20 to 90 ℃), a process of performing a rapid temperature response by mixing or switching two channels of a hot zone (hot zone) and a cold zone (cold zone) has been gradually increased.
However, when the mixing or switching process is performed, a portion where the two temperature regions are mixed and the temperature fluctuates becomes a problem.
Further, the temperature controllability of the cooling device is adversely affected by the deviation of the refrigerant between the tanks, that is, the imbalance in the refrigerant flow rate, which is generated when the mixing or switching process is performed.
Disclosure of Invention
It is therefore an object of the present invention to provide a cooling device capable of responding quickly to changes in process temperature.
Another object of the present invention is to provide a cooling device that can minimize the influence of temperature control even when the liquid level balance of the tank is controlled for each channel.
Another object of the present invention is to provide a cooling device capable of improving temperature responsiveness by instantaneous heating.
The above objects are achieved by a cooling apparatus for a semiconductor process, comprising a temperature control module disposed between a refrigeration cycle and a process chamber, the temperature control module is configured to correspond to two channels connected to a hot zone (hot zone) and a cold zone (cold zone) of the process chamber, in the first passage connected to the cold zone, it is provided that a tank, a circulation pump, an evaporator combined with the refrigerating cycle, and a line heater are arranged in this order from a recovery line to a supply line, in a second passage connected to the hot zone, it is arranged that a tank, a circulation pump, a cooling water heat exchanger, and a line heater are arranged in this order from a recovery line to a supply line, and refrigerant flowing through each passage is controlled to be cooled in the evaporator of the first passage and the cooling water heat exchanger of the second passage, and controlled to be heated in the line heaters of the first passage and the second passage.
Preferably, a three-way valve further connected to the recovery line of each passage may be provided at the rear end of the line heater of each passage, thereby adjusting the flow rate of the supply line of each passage.
Preferably, the cold and hot zones perform mixing (mixing) control by orbit adjustment of a three-way valve or switching (switching) control by open/close control of a two-way solenoid valve.
According to the present invention, since the temperature is controlled at the rear end of the tanks of the respective channels during the cycle, the influence of the temperature control can be minimized also in controlling the balance between the tanks, and the control responsiveness can be improved.
As a result, the hot and cold zones in the cooling device can be always maintained at constant temperatures by temperature control (i.e., cooling control and heating control) of the refrigerant during the cycle, and the temperature control is not affected when the liquid level balance between the tanks of the cooling device is controlled due to the occurrence of an external flow rate distribution problem.
Further, by applying the wire heater in the exhaust pipe during the circulation without performing the heater heating in the tank, a smaller volume can be instantaneously heated, and thus the temperature responsiveness is also excellent.
Drawings
Fig. 1 shows a system diagram of a cooling device according to an embodiment of the invention.
Fig. 2 shows the configuration of the temperature control module.
Description of reference numerals:
10: refrigeration cycle
20: process chamber
100: temperature control module
110. 210: recovery wire
112. 212, and (3): supply line
120. 220, and (2) a step of: box
130. 230: circulating pump
140: evaporator with a heat exchanger
150. 250: line heater (line heater)
160. 260: three-way valve
240: cooling water heat exchanger
Detailed Description
Technical terms used in the present invention are used only for illustrating specific embodiments and are not intended to limit the present invention. Also, technical terms used in the present invention should be construed as meanings commonly understood by those skilled in the art, and should not be construed as excessively generalized or excessively limited, as long as they are not particularly defined as other meanings in the present invention. Also, when technical terms used in the present invention are erroneous technical terms that do not accurately express the idea of the present invention, they should be replaced and understood by technical terms that can be accurately understood by those skilled in the art. Also, general terms used in the present invention should be interpreted according to contents defined in a dictionary or according to context, not in an excessively restrictive sense.
The present invention will be described in detail below with reference to the accompanying drawings.
Fig. 1 shows a system diagram of a cooling apparatus according to an embodiment of the present invention, and fig. 2 shows a configuration of a temperature control module.
The cooling apparatus includes a temperature control module 100 provided between a refrigeration cycle 10 having a compressor and a condenser and a process chamber 20.
The temperature control module 100 is configured to correspond to two channels of a hot zone (hot zone) and a cold zone (cold zone) of an electrostatic chuck coupled to the process chamber 20.
In other words, in the cooling apparatus for a semiconductor process, in order to shorten the time required for the temperature in the cooling apparatus to rise and fall during the process temperature change and the time required for the process to start after stabilization, a switching control by a mixing control of adjusting the trajectory of a three-way valve or an on/off control of a two-way solenoid valve is introduced.
Correspondingly, the temperature control module 100 of the present invention always prepares to control the respective channels of the cold zone of, for example, -40 ℃ and the hot zone of +90 ℃ and supplies the respective temperatures by a predetermined flow rate control, and if so, can adjust the temperature required for the process between-30 ℃ and +80 ℃ in the process chamber 20.
Referring to fig. 1, a first passage connected to the cold zone of the process chamber 20 includes a recovery line 110 and a supply line 112 to constitute a circulation line, and a second passage connected to the hot zone includes a recovery line 210 and a supply line 212 to constitute a circulation line.
In the first passage, it is provided that the tank 120, the circulation pump 130, the evaporator 140, and the line heater 150 are sequentially arranged, and the first passage constitutes a refrigeration cycle to be controlled to be cooled in the evaporator 140 and controlled to be heated in the line heater 150.
In the second passage, it is arranged that the tank 220, the circulation pump 230, the cooling water heat exchanger 240, and the line heater 250 are arranged in this order, and the second passage constitutes a cooling water cooling circulation to be controlled for cooling in the cooling water heat exchanger 240 and controlled for heating in the line heater 250.
Accordingly, the flow of the refrigerant is performed in the order of the suction cup of the process chamber 20 → the first channel tank 120 → the first channel circulation pump 130 → the evaporator 140 → the first channel wire heater 150 → the suction cup → the second channel tank 220 → the second channel circulation pump 230 → the cooling water heat exchanger 240 → the second channel wire heater 250.
In this process, the refrigerant is controlled to be cooled in the evaporator 140 of the first pass and the cooling water heat exchanger 240 of the second pass, and controlled to be heated in the line heater 150 of the first pass and the line heater 250 of the second pass.
In general, since the flow rate of the refrigerant supplied to the suction cups differs depending on the temperature for each channel, the flow rate of the refrigerant finally recovered from the suction cups may differ, and as a result, the water levels of the tanks 120 and 220 for the respective channels may differ. To prevent this, the water level is adjusted by the connection valve 170 between the tanks 120, 220, and at this time, the refrigerant phases in different temperature controls of the respective channels are mixed to generate temperature control fluctuation.
However, since the temperature during the cycle is controlled at the rear end of the tanks 120, 220 of the respective channels as in the present invention, the influence of the temperature control can be minimized also when the balance between the tanks is controlled, and the control responsiveness can be improved.
As described above, the hot zone and the cold zone in the cooling device can always maintain constant temperatures by temperature control (i.e., cooling control and heating control) of the refrigerant during the cycle, and the temperature control is not affected when control of the balance between the tanks of the cooling device is performed due to occurrence of an external flow rate distribution problem.
Further, the wire heaters 150 and 250 are applied to the inside of the pipe in the circulation process, instead of performing heater heating in the tank, so that a smaller volume can be instantaneously heated, and thus the temperature responsiveness thereof is also excellent.
Referring again to fig. 2, a buffer tank 320 provided with the recovery lines 110, 210 and tanks 120, 220 connected to each channel may be used to collect water when discharged into the drain.
Further, three- way valves 160, 260 further connected to the recovery lines 110, 210 are provided at the rear ends of the line heaters 150, 250 of the respective passages, so that the flow rates of the supply lines 112, 212 can be controlled.
Although the above description has been focused on the embodiments of the present invention, it is obvious that various modifications can be made at the level of those skilled in the art. Therefore, the scope of the claims of the present invention should not be construed as limited to the embodiments, but interpreted according to the scope of the claims.
Claims (3)
1. A cooling apparatus for a semiconductor process, equipped with a temperature control module disposed between a refrigeration cycle and a process chamber,
the temperature control module is configured to correspond to two channels connected to a hot zone and a cold zone of the process chamber,
in the first passage connected to the cold zone, it is provided that a tank, a circulation pump, an evaporator combined with the refrigerating cycle, and a line heater are arranged in this order from a recovery line to a supply line,
in a second passage connected to the hot zone, it is provided that a tank, a circulation pump, a cooling water heat exchanger, and a line heater are arranged in this order from a recovery line to a supply line,
the refrigerant flowing through the respective passages is controlled to be cooled in the evaporator of the first passage and the cooling water heat exchanger of the second passage, and controlled to be heated in the line heaters of the first passage and the second passage.
2. The cooling apparatus for semiconductor process according to claim 1,
a three-way valve further connected to the recovery line of each channel is provided at the rear end of the line heater of each channel to adjust the flow rate of the supply line of each channel.
3. The cooling apparatus for semiconductor process according to claim 1,
the cold and hot zones perform a mixing control by a track adjustment of a three-way valve or a switching control by an on/off control of a two-way solenoid valve.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020200020296A KR102403661B1 (en) | 2020-02-19 | 2020-02-19 | Chiller apparatus for semiconductor process |
| KR10-2020-0020296 | 2020-02-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113280538A true CN113280538A (en) | 2021-08-20 |
Family
ID=77275877
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110191290.2A Pending CN113280538A (en) | 2020-02-19 | 2021-02-19 | Cooling device for semiconductor process |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR102403661B1 (en) |
| CN (1) | CN113280538A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20210381783A1 (en) * | 2020-06-03 | 2021-12-09 | Disco Corporation | Processing water supply system |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090126378A1 (en) * | 2007-11-20 | 2009-05-21 | Hyun-Myung Oh | Chiller of etch equipment for semiconductor processing |
| US20100206519A1 (en) * | 2007-10-18 | 2010-08-19 | Global Standard Technology Co., Ltd. | Temperature control system for semiconductor manufacturing equipment |
| CN103930843A (en) * | 2011-11-15 | 2014-07-16 | 东京毅力科创株式会社 | Temperature control system, semiconductor manufacturing device, and temperature control method |
| CN108155140A (en) * | 2016-12-05 | 2018-06-12 | 全球标准科技股份有限公司 | The high-tech temperature regulating device of semiconductor manufacturing facility |
| US20190219614A1 (en) * | 2016-06-01 | 2019-07-18 | Adtex Inc. | Cooling device for semiconductor inspection apparatus |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101367086B1 (en) * | 2013-10-17 | 2014-02-24 | (주)테키스트 | Temperature control system for semiconductor manufacturing system |
| JP5841281B1 (en) * | 2015-06-15 | 2016-01-13 | 伸和コントロールズ株式会社 | Chiller device for plasma processing equipment |
| JP2018076995A (en) * | 2016-11-08 | 2018-05-17 | 株式会社ナカヤ | Circulation liquid temperature control method using parameter control-by-area type chiller by remote control, and maintenance method |
| KR101975007B1 (en) * | 2018-09-19 | 2019-05-07 | (주)본씨앤아이 | cooling system for semiconductor parts cooling |
-
2020
- 2020-02-19 KR KR1020200020296A patent/KR102403661B1/en active IP Right Grant
-
2021
- 2021-02-19 CN CN202110191290.2A patent/CN113280538A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100206519A1 (en) * | 2007-10-18 | 2010-08-19 | Global Standard Technology Co., Ltd. | Temperature control system for semiconductor manufacturing equipment |
| US20090126378A1 (en) * | 2007-11-20 | 2009-05-21 | Hyun-Myung Oh | Chiller of etch equipment for semiconductor processing |
| CN103930843A (en) * | 2011-11-15 | 2014-07-16 | 东京毅力科创株式会社 | Temperature control system, semiconductor manufacturing device, and temperature control method |
| US20190219614A1 (en) * | 2016-06-01 | 2019-07-18 | Adtex Inc. | Cooling device for semiconductor inspection apparatus |
| CN108155140A (en) * | 2016-12-05 | 2018-06-12 | 全球标准科技股份有限公司 | The high-tech temperature regulating device of semiconductor manufacturing facility |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20210381783A1 (en) * | 2020-06-03 | 2021-12-09 | Disco Corporation | Processing water supply system |
| US11754353B2 (en) * | 2020-06-03 | 2023-09-12 | Disco Corporation | Processing water supply system |
Also Published As
| Publication number | Publication date |
|---|---|
| KR102403661B1 (en) | 2022-05-31 |
| KR20210105616A (en) | 2021-08-27 |
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Application publication date: 20210820 |
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