CN113270702A - Microstrip filter based on circular ground connection through hole structure - Google Patents
Microstrip filter based on circular ground connection through hole structure Download PDFInfo
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- CN113270702A CN113270702A CN202110593874.2A CN202110593874A CN113270702A CN 113270702 A CN113270702 A CN 113270702A CN 202110593874 A CN202110593874 A CN 202110593874A CN 113270702 A CN113270702 A CN 113270702A
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- microstrip filter
- circular
- hole
- hole structure
- filter
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/201—Filters for transverse electromagnetic waves
- H01P1/203—Strip line filters
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Abstract
The invention provides a microstrip filter with a circular grounding through hole structure. The ground via of the microstrip filter is circular, which is different from the conventional square. The beneficial effects are as follows: the more ideal return loss can be obtained, the processing difficulty is reduced, and the processing precision is easy to control.
Description
Technical Field
The invention belongs to the field of microwave communication devices, and particularly relates to a microstrip filter based on a circular grounding through hole structure.
Background
A miniaturized, integrated, high-performance band-pass filter is one of the indispensable modules of modern wireless communication systems. In order to realize the advantages of large power capacity, ultralow time delay, beam forming and the like of a millimeter wave communication frequency band, through holes needing to be arranged in MEMS communication devices such as antennas, filters and the like become extremely small, the precision requirement reaches the micron level, the existing square through hole type is widely applied, and the realization method mainly comprises the modes of precision die machining, slow-running wire cutting machining, laser cutting, mirror surface electric spark forming machining and the like. The laser cutting method has been developed rapidly in the present year, and for a plate material with a thickness of less than 2mm, the cutting precision is about 0.04mm, but the processing roughness is large. How to reduce the cost and effectively realize the through hole manufacturing has important significance on the research of the substrate integrated waveguide.
Square hole processing easily produces the error, and the acutance of edge angle, straightness accuracy are all difficult to guarantee, but can replace the square hole with the round hole, realize the simplification of processing. The round hole manufacturing process is mature earlier, has various selectable modes and relatively lower cost, and can realize the processing of a small hole or a wafer on a plate with the thickness of 3mm to realize the roughness of 0.8um in the grinding process in the early 20 th century. The round hole with the diameter of 0.2mm can be easily processed by a slow-moving wire cutting processing method. It is contemplated that the metal vias in the waveguide may be implemented with circular vias.
Simulation and test show that the square ground through hole and the circular ground through hole have no obvious difference on the key indexes of the final result, but the circular ground through hole is better in return loss performance than the square ground through hole.
Disclosure of Invention
The invention aims to provide a through hole shape design suitable for a microstrip filter, which is used for reducing the processing difficulty of the through hole. The circular through hole equivalent waveguide electric wall is adopted to realize the manufacture of the high-performance microwave device under lower processing difficulty.
The invention relates to a micro-strip filter based on a circular grounding through hole structure,
and the microstrip filter is provided with a circular grounding through hole.
Furthermore, the microstrip filter is an interdigital filter.
Furthermore, the number of the circular grounding through holes is not less than that of the resonance units of the interdigital filter.
Drawings
Fig. 1 is a schematic structural diagram of a microstrip filter based on a circular ground via structure according to the present invention.
Detailed Description
The invention will be described in detail below with reference to the following drawings:
referring to fig. 1, the microstrip filter based on the circular ground via structure disclosed in this embodiment,
and the microstrip filter is provided with a circular grounding through hole.
Specifically, the microstrip filter is an interdigital filter.
Specifically, the number of the circular grounding through holes is not less than the number of the resonance units of the interdigital filter.
The circular grounding through hole is suitable for the shape design of the through hole of the microstrip filter, and the processing difficulty of the through hole is reduced. The circular through hole equivalent waveguide electric wall is adopted, and the manufacturing of the high-performance microwave device can be realized under the lower processing difficulty.
Claims (3)
1. The utility model provides a microstrip filter based on circular ground connection via hole structure which characterized in that:
and the microstrip filter is provided with a circular grounding through hole.
2. The microstrip filter according to claim 1, wherein the microstrip filter comprises:
the microstrip filter is an interdigital filter.
3. The microstrip filter according to claim 1, wherein the microstrip filter comprises:
the number of the circular grounding through holes is not less than that of the resonance units of the interdigital filter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110593874.2A CN113270702A (en) | 2021-05-28 | 2021-05-28 | Microstrip filter based on circular ground connection through hole structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110593874.2A CN113270702A (en) | 2021-05-28 | 2021-05-28 | Microstrip filter based on circular ground connection through hole structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113270702A true CN113270702A (en) | 2021-08-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110593874.2A Pending CN113270702A (en) | 2021-05-28 | 2021-05-28 | Microstrip filter based on circular ground connection through hole structure |
Country Status (1)
| Country | Link |
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| CN (1) | CN113270702A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104282968A (en) * | 2013-07-12 | 2015-01-14 | 南京理工大学 | Substrate integration waveguide high-pass filter |
| CN112467318A (en) * | 2020-11-19 | 2021-03-09 | 中国电子科技集团公司第二十九研究所 | Microstrip band-pass filter |
| CN212874710U (en) * | 2020-09-28 | 2021-04-02 | 杭州友旺电子有限公司 | Thin film filter |
| CN212935860U (en) * | 2020-09-28 | 2021-04-09 | 杭州友旺电子有限公司 | Thin film filter |
-
2021
- 2021-05-28 CN CN202110593874.2A patent/CN113270702A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104282968A (en) * | 2013-07-12 | 2015-01-14 | 南京理工大学 | Substrate integration waveguide high-pass filter |
| CN212874710U (en) * | 2020-09-28 | 2021-04-02 | 杭州友旺电子有限公司 | Thin film filter |
| CN212935860U (en) * | 2020-09-28 | 2021-04-09 | 杭州友旺电子有限公司 | Thin film filter |
| CN112467318A (en) * | 2020-11-19 | 2021-03-09 | 中国电子科技集团公司第二十九研究所 | Microstrip band-pass filter |
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Application publication date: 20210817 |