CN113270559A

CN113270559A - Display panel, manufacturing method of display panel and display device

Info

Publication number: CN113270559A
Application number: CN202110538668.1A
Authority: CN
Inventors: 李曼曼; 许传志; 张露; 胡思明
Original assignee: Kunshan Govisionox Optoelectronics Co Ltd
Current assignee: Kunshan Govisionox Optoelectronics Co Ltd
Priority date: 2021-05-18
Filing date: 2021-05-18
Publication date: 2021-08-17
Anticipated expiration: 2041-05-18
Also published as: CN113270559B

Abstract

The embodiment of the application provides a display panel, display panel's manufacturing method and display device, set up the isolation unit on the substrate through display panel transition zone, the isolation unit includes isolation part and is used for supporting the supporting part of isolation part, the isolation part has the breach along two at least isolation unit both sides of arranging the orientation, the opening direction of breach is towards the substrate with the set angle, thereby make when the coating by vaporization luminescent material, luminescent material is more difficult to remain in breach department, can break off the luminescent material layer more effectively in isolation unit department, and then avoid water oxygen to permeate to the display area along the luminescent material layer more effectively, display panel's encapsulation reliability and product property ability and quality have been promoted.

Description

Display panel, manufacturing method of display panel and display device

Technical Field

The present disclosure relates to the field of display technologies, and in particular, to a display panel, a method for manufacturing the display panel, and an electronic device.

Background

With the rapid development of display technology and the increasing popularity of electronic devices, the requirements of users on the screen occupation ratio of display devices are higher and higher. In order to utilize the space around the optical devices such as the front camera and the optical sensor and to increase the ratio of the effective display area of the screen as much as possible, holes may be formed in the display panel, and the optical devices such as the front camera and the optical sensor may be disposed at positions corresponding to the holes in the screen. However, the openings of the display panel are easily invaded by water and oxygen, and the invaded oxygen and water vapor may spread along the material layer, thereby affecting the performance and quality of the display panel.

Disclosure of Invention

In order to solve the problems in the prior art, an object of the present application is to provide a display panel including a display area, an opening area, and a transition area between the display area and the opening area; the transition zone comprises:

a substrate;

the light-emitting device comprises a substrate, at least one isolation unit and a light-emitting unit, wherein the substrate is arranged on the substrate, the isolation unit comprises an isolation part and a supporting part used for supporting the isolation part, at least one side of the isolation part is provided with a notch in the direction parallel to the light-emitting surface of the display panel, the opening direction of the notch faces the substrate at a set angle, and the isolation unit isolates and disconnects the light-emitting material layers on the display area and the transition area.

In a possible implementation manner, the support portion includes a first sub-support portion close to the substrate and a second sub-support portion far from the substrate, which are stacked, wherein a side of the second sub-support portion facing away from the substrate is convex toward a direction facing away from the substrate.

In a possible implementation manner, the display panel further includes an array substrate disposed on the substrate, and the first sub-support portion and at least one film layer of the array substrate are disposed on the same layer; or the like, or, alternatively,

the first sub-supporting part and part of the substrate are arranged on the same layer;

preferably, the film layer of the array substrate includes one or more of a buffer layer, a gate insulating layer, a capacitor insulating layer, a dielectric insulating layer and a passivation layer which are stacked;

preferably, the first sub-support portion and the second sub-support portion are integrally formed and are disposed in the same layer as part of the substrate.

In a possible implementation manner, the isolation portion includes a first metal layer, a second metal layer, and a third metal layer that are sequentially stacked, the first metal layer is located on the support portion, and at least one side of the second metal layer is provided with the notch; or the like, or, alternatively,

the isolation part comprises an inorganic layer which is stacked, and the material of the inorganic layer comprises silicon oxide or silicon nitride;

preferably, the material of the first metal layer and the third metal layer includes one of titanium, molybdenum or indium tin oxide, and the material of the second metal layer includes one of aluminum or silver.

In a possible implementation manner, a first orthographic projection of the isolation part on the plane of the substrate is positioned in a second orthographic projection of the support part on the plane of the substrate;

preferably, at least one side of the first orthographic projection has a distance with a corresponding side of the second orthographic projection;

preferably, the spacing ranges from 0.5um to 2.5 um.

In one possible implementation, the display panel includes at least two of the isolation units;

preferably, the isolation unit is an annular isolation structure at least partially surrounding the opening region;

preferably, the gaps are formed on two sides of the at least two isolation units in the arrangement direction of the isolation units.

The present application also provides a method of manufacturing a display panel having a display region, an opening region, and a transition region between the display region and the opening region, the method comprising:

providing a substrate, wherein the substrate comprises a first area corresponding to the display area, a second area corresponding to the transition area and a third area corresponding to the opening area;

forming at least one isolation unit in a second area of the substrate, wherein the isolation unit comprises an isolation part and a supporting part for supporting the isolation part, at least one side of the isolation part is provided with a notch in a direction parallel to a light-emitting surface of the display panel, and the opening direction of the notch faces the substrate at a set angle;

and preparing a luminescent material layer on the substrate after the isolation unit is formed, wherein the luminescent material layer on the first area and the second area is isolated and disconnected by the isolation unit.

In one possible implementation, the step of forming at least one isolation unit in the second region of the substrate includes:

forming an array substrate on the substrate;

forming a support material layer on the array substrate corresponding to the transition region;

etching the support material layer from one side of the support material layer far away from the substrate to form the support part, wherein the support part comprises a first sub-support part and a second sub-support part, the first sub-support part and the second sub-support part are arranged on the same layer of at least one film layer of the array substrate, and one side face, far away from the substrate, of the second sub-support part protrudes towards the direction far away from the substrate;

and forming the isolating part with at least one side provided with a notch on one side of the supporting part far away from the substrate.

In one possible implementation, the support portion includes a first sub-support portion and a second sub-support portion; the step of forming at least one isolation unit in the second region of the substrate comprises:

etching a second region of the substrate to form a first sub-support part close to the substrate and a second sub-support part far away from the substrate, wherein the first sub-support part and the second sub-support part are in the same layer with part of the substrate, and one side surface of the second sub-support part, which is far away from the substrate, is raised towards the direction far away from the substrate;

the second sub-support portion is formed with the spacer portion having a notch at least one side.

The application further provides a display device, and the display device comprises the display panel provided by any embodiment of the application.

The embodiment of the application provides a display panel, display panel's manufacturing method and display device, through setting up the isolation unit, and set up the breach of isolation portion both sides in the isolation unit to orientation substrate with the set angle, thereby make when the coating by vaporization luminescent material, luminescent material is more difficult to remain in breach department, can break off the luminescent material layer more effectively in isolation unit department, and promote the encapsulation reliability of transition zone, and then avoid water oxygen to permeate to the display area along the luminescent material layer more effectively, with the product property and the quality that improve display panel.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained from the drawings without inventive effort.

FIG. 1 is a structural diagram of a display panel with an opening;

FIG. 2 is a schematic diagram of a structure of an isolation unit in some implementations;

fig. 3 is one of the schematic structural diagrams of the isolation unit provided in this embodiment;

fig. 4 is a second schematic structural diagram of an isolation unit provided in this embodiment;

fig. 5 is a third schematic structural diagram of an isolation unit provided in this embodiment;

fig. 6 is a schematic projection view of the supporting portion and the isolating portion provided in this embodiment;

fig. 7 is a schematic line width diagram of the supporting portion and the isolation portion provided in this embodiment;

fig. 8 is a schematic flow chart illustrating a process of a method for manufacturing a display panel according to the present embodiment;

fig. 9 is a second schematic step flow chart of the manufacturing method of the display panel according to the present embodiment;

fig. 10 is a third schematic step flow chart of the method for manufacturing a display panel according to the present embodiment;

fig. 11 is one schematic diagram illustrating a substrate layer etching manner of the display panel provided in this embodiment;

fig. 12 is a second schematic diagram illustrating a substrate layer etching method of the display panel according to the present embodiment.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present application, presented in the accompanying drawings, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present application, it should be noted that the terms "upper", "lower", and the like refer to orientations or positional relationships based on orientations or positional relationships shown in the drawings or orientations or positional relationships that the products of the application usually place when using, are only used for convenience of description and simplification of description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present application. Furthermore, the terms "first," "second," and the like are used merely to distinguish one description from another, and are not to be construed as indicating or implying relative importance.

It should be noted that, in case of conflict, different features in the embodiments of the present application may be combined with each other.

Referring to fig. 1, fig. 1 is a schematic view of a display panel 100, and the display panel 100 may include a display area 101, a transition area 102, and an opening area 103. The position of the opening region 103 may be a position where an optical device such as a front camera or an optical sensor is required to be provided. The region between the open region 103 and the display region 101 is a transition region 102.

Referring to fig. 2, fig. 2 is a schematic longitudinal sectional view perpendicular to the display surface of the display panel 100, and in some embodiments, at least one isolation unit 200 is disposed in the transition region 102 to prevent water and oxygen from entering the display region 101 from the opening region 103. Taking the example of disposing a plurality of isolation units 200, the isolation units 200 may be disposed in a multi-layer manner around the open region 103, and sequentially arranged from a position close to the center of the open region 103 to a direction away from the center of the open region 103, so as to form a multi-layer structure like an "annual ring". Referring to fig. 2, a certain interval exists between adjacent isolation units 200 to form a groove, and when the light emitting material layer 205 is formed by depositing the light emitting material on the display panel 100, the light emitting material layer 205 is disconnected at the isolation unit 200 due to a certain height difference Y1 (forming a step difference) between the top of the isolation unit and the groove, thereby blocking the channel through which water and oxygen enter the display region 101 through the light emitting material layer 205.

In some implementations, the gaps 204 are disposed on both sides of the isolation unit 200, so that the light emitting material layer 205 can be more effectively disconnected when the light emitting material layer 205 is formed by evaporation. However, if the light emitting material layer 205 is formed by evaporation, the light emitting material may remain in the gap 204, and the light emitting material layer 205 may not be effectively broken. Alternatively, in the manufacturing process of other film layers of the display panel, materials such as photoresist may remain at the notch 204, which affects the packaging stability of the transition region.

In view of this, the present embodiment provides a display panel, a method for manufacturing the display panel, and a display device, in which the gap is set to face the substrate at a certain angle, so that the luminescent material is not easily remained in the gap during the evaporation process, thereby more effectively disconnecting the luminescent material layer, and simultaneously avoiding the photoresist in other film processes remaining at the gap, so as to improve the packaging stability of the display panel. Several alternative embodiments for implementing the present embodiment will be described in detail below with reference to the accompanying drawings.

The display panel 100 provided in this embodiment may include a display area 101, an opening area 103, and a transition area 102 located between the display area 101 and the opening area 103.

Referring to fig. 3, in the present embodiment, the transition region 102 may include a substrate 301 and at least one isolation unit 300 located at one side of the substrate.

The substrate 301 may be a Polyimide (PI) film layer.

The isolation unit 300 may include a supporting portion 302 and an isolating portion 303, the supporting portion 302 is used for supporting the isolating portion 303, and at least one side of the isolating portion 303 is provided with a notch 304 in a direction parallel to the light emitting surface of the display panel 100. For example, the notch 304 may be provided on the side of the isolation portion 303 close to the display region 101, the notch 304 may be provided on the side of the isolation portion 303 close to the open region 103, or both the side of the isolation portion 303 close to the display region 101 and the side of the open region 103 may be provided with the notches 304. In this embodiment, the opening direction of the notch 304 faces the substrate 301 at a predetermined angle.

Preferably, in this embodiment, the number of the isolation units 300 may be two or more. The respective barrier cells 300 may be arranged circumferentially in a direction from a central position near the opening area 103 toward the display area 101. Meanwhile, the isolation portion 303 may be provided with notches 304 along both sides in a direction from a central position close to the opening region 103 to a central position far from the opening region 103.

Further, in the present embodiment, the isolation unit 300 may isolate the light emitting material layer 305 located on the display region 101 and the transition region 102. The light emitting material layer 305 may be a film layer related to the OLED light emitting material, and may be formed by evaporation.

In the present embodiment, the support 302 includes a first sub-support 3021 close to the substrate 301 and a second sub-support 3022 far from the substrate 301, which are stacked, wherein one side of the second sub-support 3022 facing away from the substrate 301 is convex in a direction facing away from the substrate 301.

Taking the example that the transition region 120 may include at least two isolation units 300, the thicknesses of the second sub-support 3022 near the display region 101 and on both sides of the opening region 103 are less than the thickness in the middle. For example, the thickness of the second sub-support 3022 gradually increases from both sides to the middle in the extending direction along the opening region 103 toward the display region 101. The thickness of the second sub-support 3022 is the thickness in the direction perpendicular to the light emitting surface of the display panel 100. The extension line of the surface of the second sub-support 3022 on the side away from the substrate 301 or the tangent line of the surface forms an acute angle with the plane of the substrate 301, for example, the surface of the second sub-support 3022 away from the substrate 301 forms an arc shape that is arched in the direction away from the substrate 301.

In this manner, when the spacer 303 is formed based on the second sub-support 3022, the spacer 303 can be made to conform to the shape of the surface of the second sub-support 3022 on the side away from the substrate 301, which corresponds to the second sub-support 3022 lifting up the spacer 303 from the middle. In the process of forming the notch 304 by side-etching the second sub-support 3022, the notches 304 on both sides of the isolation portion 303 may be inclined at an angle toward the substrate 301. For example, in fig. 3, the opening of the notch 304 is oriented as indicated by the dashed arrow, and the opening of the notch 304 is oriented at an acute angle with respect to the plane of the substrate 301, so that the notch 304 is inclined downward.

In the display panel 100 provided in this embodiment, due to the existence of the gap 304, when the evaporation of the light emitting material (such as the OLED material) is performed from the side of the isolation portion 303 away from the substrate 301, the light emitting material can be ensured to be disconnected at the position of the isolation unit 300, so that the light emitting material layer located on the display region 101 and the transition region 102 can be isolated and disconnected. Meanwhile, the orientation of the notch 304 is inclined downwards and towards the substrate 301, so that the light-emitting material can be further prevented from remaining in the notch 304, and the effect of isolating water and oxygen can be further improved. Meanwhile, the residues of materials such as photoresist at the notch 304 in other film processes of the display panel 100 can be avoided, and the packaging stability of the display panel 100 can be improved.

Optionally, in the present embodiment, in order to ensure that the luminescent material layer 305 is effectively disconnected at the notch 304, the depth of the notch 304 may be designed. For example, the notches 304 may be formed with a set width and/or a set depth. It will be appreciated that the gaps 304 may have different widths and/or depths depending on the material from which the spacers 303 are formed or from which the supports 302 are formed.

In a possible implementation manner, referring to fig. 4, the display panel 100 further includes an array substrate located on the substrate 301, and the first sub-support 3021 is disposed on the same layer as at least one layer of the array substrate.

For example, in the process of manufacturing the display panel 100, an array substrate for driving the light emitting units needs to be manufactured in the display region 101 of the display panel 100, and when the array substrate is formed, the array substrate may be formed in both the display region 101 and the transition region 102. Then, the array substrate located in the transition region 102 is etched to form a first sub-support 3021. The array substrate may include one or more layers, for example, one or more of a Buffer layer (Buffer), a Gate Insulator (GI), a Capacitor Insulator (CI), and an interlayer Dielectric (ILD).

Alternatively, a buffer layer may be formed on the substrate 301, and the buffer layer may be made of an inorganic material, such as silicon oxide, silicon nitride, silicon oxynitride, or the like. The gate insulating layer may be an inorganic layer formed on the gate (the first metal layer M1) in the driving film structure and located on a side of the buffer layer away from the substrate 301, and the gate insulating layer may be made of, but not limited to, silicon oxide or silicon nitride. The capacitor insulating layer may be an inorganic film layer formed on the capacitor device (the second metal layer M2) in the driving film structure and located on a side of the gate insulating layer away from the buffer layer. The interlayer dielectric layer may be an inorganic film layer formed on the source/drain (third metal layer M3) in the driving film layer structure, and is located on a side of the capacitor insulating layer away from the gate insulating layer.

In this implementation, the first sub-support 3021 may be formed by etching the array substrate located in the transition region 102, and after the etching, a plurality of mutually spaced grooves are formed on the array substrate in the transition region 102, and the first sub-support 3021 protruding from the substrate 301 is formed between the grooves.

In this implementation, the isolation portion 303 may be a metal isolation pillar, and the isolation portion 303 may include a plurality of metal layers, for example, may include a first metal layer, a second metal layer, and a third metal layer.

In this embodiment, the distance between the gap 304 and the bottom of the groove of the isolation unit 300 is further increased by disposing the isolation portion 303 on the supporting portion 302 protruding from the substrate 301, so that the connection between the luminescent material at the bottom of the groove and the luminescent material on the isolation unit 300 during the evaporation of the luminescent material can be more effectively avoided, and the luminescent material layer 305 can be effectively disconnected.

Alternatively, the first metal layer and the third metal layer in the isolation portion 303 may be one of titanium, molybdenum, or indium tin oxide, and the second metal layer may be one of aluminum or silver. For example, the first metal layer, the second metal layer, and the third metal layer may form a sandwich metal structure of Ti/Al/Ti. When the notch 304 is formed, side etching may be performed on the isolation portion 303, and at least a part of aluminum in the middle of the three metal layers is slightly etched in the side etching process, but the influence on the upper and lower titanium layers is not great, so that the isolation portion 303 with the notch 304 on at least one side may be formed. In other words, in this embodiment, the notch 304 may be formed on at least one side of the second metal layer, for example, the notch 304 may be formed on one side of the second metal layer close to the display area 101, the notch 304 may be formed on one side of the second metal layer close to the opening area 103, or the notches 304 may be formed on the first metal layer close to both sides of the display area 101 and the opening area 103.

In another possible implementation manner, referring to fig. 5, the first sub-support 3021 may be disposed in the same layer as part of the substrate. For example, the first sub-support 3021 is integrally formed with the second sub-support 3022 and is disposed in the same layer as a portion of the substrate. The spacer 303 may be an inorganic layer including a material including silicon oxide SiOx or silicon nitride SiNx, which is stacked. In other words, the first and second

sub-support parts

3021 and 3022 may be raised support pillars formed by etching the substrate 301 located in the transition region 102.

In this implementation, the substrate 301 located in the transition region 102 may be etched by a photolithography process (PI Asher), at least two grooves are etched in the substrate 301, a support portion 302 is formed between adjacent grooves, and a second raised sub-support portion 3022 may be formed on a side of the support portion 302 away from the substrate 301 by controlling light transmittance or etching for multiple times during the etching process.

Thus, the isolation unit 300 with a certain height is formed by etching the substrate 301, and the distance between the gap 304 and the bottom of the groove is further increased, so that the connection between the luminescent material at the bottom of the groove and the luminescent material on the isolation unit 300 during the evaporation of the luminescent material can be more effectively avoided.

In one possible implementation, referring to fig. 6, a first orthographic projection 601 of the isolation portion 303 on the plane of the substrate 301 is located in a second orthographic projection 602 of the support portion 302 on the plane of the substrate 301. Preferably, at least one side of the first orthographic projection has a distance from a corresponding side of the second orthographic projection. Thus, the notch 304 can be ensured to have a sufficient depth to effectively break the light-emitting material layer 305. For example, referring to fig. 6, a distance d exists between a side of the first orthographic projection 601 close to the display area 101 and a side of the second orthographic projection 602 close to the display area 101, or a distance d exists between a side of the first orthographic projection 601 close to the opening area 103 and a side of the second orthographic projection 602 close to the opening area 103, or a distance d exists between a side of the first orthographic projection 601 close to the display area 101 and a side of the second orthographic projection 602 close to the display area 101, and a distance d also exists between a side of the first orthographic projection 601 close to the opening area 103 and a side of the second orthographic projection 602 close to the opening area 103. In the present embodiment, it is shown that two opposite sides of the first orthographic projection 601 respectively have a distance d from two opposite sides of the second orthographic projection 602, and preferably, in the present embodiment, the distance d ranges from 0.5um to 2.5 um. In other words, referring to fig. 7, the line width of the supporting portion 302 is greater than the line width of the isolation portion 303, and any one side of the supporting portion 302 exceeds the corresponding side of the isolation portion 303 by 0.5 to 2.5 um.

On the basis of the above, the present embodiment also provides a display device including the display panel 100 provided by the present embodiment. The display device may be a mobile phone, a tablet computer, a notebook computer, or other portable terminal device with a display function, and is not limited herein. The display apparatus may further include an optical device (e.g., a front camera, an optical sensor, etc.) disposed under the display panel 100 at a position corresponding to the perforated region 103. In the display panel 100, the opening direction of the notch 304 of the isolation unit 300 faces the substrate 301 at a set angle, so that the light emitting material layer 305 is effectively disconnected in the isolation unit 300 when the light emitting material layer 305 is formed by evaporation, and water vapor is prevented from invading other areas of the display panel 100 through the light emitting material layer 305, thereby improving the packaging reliability of the display panel 100 and the performance and quality of products.

On the basis of the above, the present embodiment further provides a method for manufacturing the display panel 100, please refer to fig. 8, and the steps of the method will be explained in detail below.

In step S101, a substrate 301 is provided, where the substrate 301 includes a first region corresponding to the display region 101, a second region corresponding to the transition region 102, and a third region corresponding to the opening region 103.

Step S102 is to form at least one isolation unit 300 in a second region of the substrate 301, where the isolation unit 300 includes an isolation portion 303 and a support portion 302 for supporting the isolation portion 303, at least one side of the isolation portion 303 has a notch 304 in a direction parallel to the light emitting surface of the display panel, and an opening direction of the notch 304 faces the substrate 301 at a set angle.

In step S103, a light emitting material layer 305 is prepared on the substrate 301 after the isolation unit 300 is formed, and the light emitting material layer 305 on the first region and the second region is isolated by the isolation unit 300.

In this embodiment, the gap 304 of the isolation portion 303 faces the substrate 301 at a predetermined angle, so that the light-emitting material is less likely to remain in the gap 304 when the light-emitting material layer 305 is formed by evaporation, and the light-emitting material layer 305 can be effectively disconnected at the isolation unit 300, thereby preventing water and oxygen from invading into other regions of the display panel 100 from the opening region 103, and improving the packaging reliability and product performance and quality of the display panel 100.

In one implementation, the support 302 includes a first sub-support 3021 and a second sub-support 3022. Based on this, referring to fig. 9, step S102 may include the following sub-steps.

In step S201, an array substrate is formed on the substrate 301 corresponding to the transition region 102.

In general, in manufacturing the display panel 100, an inorganic film layer for isolating each conductive device (such as a gate electrode, a capacitor, a source/drain electrode, and the like) needs to be formed, and in this embodiment, an array substrate may be formed in all of the display region 101, the transition region 102, and the opening region 103 when the array substrate is formed.

In step S202, a support material layer is formed on the array substrate corresponding to the transition region 102.

In this embodiment, a supporting material layer may be coated on the array substrate corresponding to the transition region 102. The support material layer may have a certain inclination angle (taper angle) at a position where the isolation unit 300 is desired to be formed.

In step S203, the support material layer is etched from a side of the support material layer away from the substrate, so as to form a support portion 302.

In order to increase the light transmittance of the open region 103 when the display panel 100 is manufactured, it is generally necessary to use CF₄And O₂The array substrate of the open region 103 is etched, and at this stage, the array substrate of the transition region 102 may also be etched. In the etching process, the positions between the isolation units 300 can be etched from the support material layer to the substrate 301 through the inorganic film layer to form a plurality of grooves spaced from each other, so that the protrusion parts protruding from the substrate 3 are formed between the grooves01, a first sub-support section 3021 and a second sub-support section 3022 formed of a support material layer. And the second support 3022 formed by etching may have a structure protruding away from one side of the substrate 301 toward a direction away from the substrate 301 due to a certain inclination angle at a position where the isolation unit 300 needs to be formed when the support material layer is coated.

In step S204, a spacer 303 having notches 304 on both sides is formed on the support 302.

After the second sub-support 3022 is formed, a plurality of metal layers may be further formed on the second sub-support 3022. The plurality of metal layers are then etched laterally, at least a portion of the metal layer in the middle is etched away from both sides, thereby forming notches 304 on both sides of the spacer 303. Of course, the spacer may be formed of other materials.

In another implementation, the supporting portion 302 may be formed by the substrate 301, and the isolation portion 303 may be made of an inorganic material, but of course, the isolation portion may be formed by other materials, such as a metal material. Based on this, referring to fig. 10, step S102 may include the following sub-steps.

In step S301, a second region of the substrate 301 is etched to form a first sub-support 3021 close to the substrate 301 and a second sub-support 3022 far from the substrate 301, where the first sub-support 3021 and the second sub-support 3022 are in the same layer as a part of the substrate 301, and a side of the second sub-support 3022 facing away from the substrate 301 is protruded toward a direction facing away from the substrate 301.

Alternatively, a half tone (Halftone) photomask may be used to allow different heights to be formed during the etching of the substrate 301 by setting different prescribed light transmittances. For example, referring to fig. 11, through the light transmittance of the photomask, a partial light transmittance etching is performed on the position where the isolation unit 300 needs to be formed, and a full light transmittance etching is performed on the position between two isolation units 300. Grooves are formed at the positions of the full light-transmitting etching, and bulges with gradually changed thicknesses can be formed at the positions of the partial light-transmitting etching, so that the supporting parts 302 with the bulges are formed between the grooves.

Alternatively, the different heights may also be formed by etching the substrate 301 multiple times. Referring to fig. 12, for example, a plurality of spaced grooves are formed in the transition region 102 of the substrate 301 by a first photolithography process, and support pillars are formed between adjacent grooves. Then, the supporting pillar is subjected to a second photolithography process, and at least a portion of the supporting pillar near two sides of the groove is removed, so as to form a second sub-support 3022 having a convex shape.

In step S302, an inorganic layer is formed on the second sub-support 3022.

After the second sub-support 3022 is formed, a SiO layer may be formed on the substrate 301 after the second sub-support 3022 is formed_xOr SiN_xAnd forming an inorganic layer. Then, after completing the structure fabrication of the film layers related to the Pixel Definition Layer (PDL), the Support Pillar (SPC), and the indium zinc oxide (IOZ) of the whole display panel 100, the transparent insulating Layer and the substrate 301 are etched to form the isolation portion 303 with the gap 304 on both sides. After that, the film layer related to Indium Zinc Oxide (IZO) and the like in the transition region 102 is removed. Finally, Thin-Film Encapsulation (TFE) is formed by Chemical Vapor Deposition (CVD), and TFE is effectively combined with the transparent insulating layer to form an effective Encapsulation.

Step S303, at least one side of the inorganic layer is etched to form an isolation portion 303 having a notch 304 on at least one side.

Since the second sub-support 3022 has a convex structure, the isolation portion 303 formed by evaporation may have a shape (e.g., an arc shape) matching the second sub-support 3022. When a subsequent side etching process is performed on the second sub-support 3022, the notch 304 facing the substrate 301 at an angle can be formed.

The display panel, the manufacturing method of the display panel and the display device provided by the embodiment of the application are characterized in that the isolation unit is arranged, gaps on two sides of the isolation part in the isolation unit are arranged to face towards the substrate at a set angle, so that when the luminescent material is evaporated, the luminescent material is not easy to remain at the gaps, the luminescent material layer can be effectively disconnected at the isolation unit, and then the water and oxygen are effectively prevented from permeating into the display area along the luminescent material layer. Meanwhile, materials such as photoresist in other film layer processes are remained at the notch, so that the packaging stability of the display panel is further improved, and the product performance and the quality of the display panel are further improved.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. A display panel is characterized by comprising a display area, an opening area and a transition area positioned between the display area and the opening area; the transition zone comprises:

a substrate;

2. The display panel according to claim 1, wherein the support portion comprises a first sub-support portion close to the substrate and a second sub-support portion far from the substrate, which are stacked, wherein one side of the second sub-support portion facing away from the substrate is convex in a direction facing away from the substrate.

3. The display panel according to claim 2, wherein the display panel further comprises an array substrate disposed on the substrate, and the first sub-supporting portion is disposed on the same layer as at least one film layer of the array substrate; or the like, or, alternatively,

4. The display panel according to any one of claims 1 to 3, wherein the isolation portion comprises a first metal layer, a second metal layer and a third metal layer stacked in sequence, the first metal layer is located on the support portion, and at least one side of the second metal layer is provided with the notch; or the like, or, alternatively,

5. The display panel according to any one of claims 1 to 3, wherein a first orthographic projection of the spacer portion on the plane of the substrate is located within a second orthographic projection of the support portion on the plane of the substrate;

preferably, the spacing ranges from 0.5um to 2.5 um.

6. A display panel according to any one of claims 1 to 3, wherein the display panel comprises at least two of the barrier cells;

7. A method of manufacturing a display panel having a display region, an opening region, and a transition region between the display region and the opening region, the method comprising:

8. The method of claim 7, wherein the step of forming at least one isolation cell in the second region of the substrate comprises:

forming an array substrate on the substrate;

etching the support material layer from one side of the support material layer far away from the substrate to form the support part, wherein the support part comprises a first sub-support part and a second sub-support part, the first sub-support part and the second sub-support part are arranged in the same layer of at least one film layer of the array substrate, the second sub-support part is formed by the support material layer, and one side of the second sub-support part, which is far away from the substrate, is raised towards the direction far away from the substrate;

9. The method of claim 7, wherein the support portion comprises a first sub-support portion and a second sub-support portion; the step of forming at least one isolation unit in the second region of the substrate comprises:

the second sub-support portion is formed with the spacer portion having a notch at least at one side thereof.

10. A display device, characterized in that the display device comprises a display panel as claimed in any one of claims 1 to 6.