CN109166889B - Display substrate, manufacturing method thereof and display device - Google Patents

Display substrate, manufacturing method thereof and display device Download PDF

Info

Publication number
CN109166889B
CN109166889B CN201810997636.6A CN201810997636A CN109166889B CN 109166889 B CN109166889 B CN 109166889B CN 201810997636 A CN201810997636 A CN 201810997636A CN 109166889 B CN109166889 B CN 109166889B
Authority
CN
China
Prior art keywords
substrate
layer
inorganic
thin film
hollow structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201810997636.6A
Other languages
Chinese (zh)
Other versions
CN109166889A (en
Inventor
田宏伟
牛亚男
谢明哲
李栋
李小龙
刘政
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BOE Technology Group Co Ltd filed Critical BOE Technology Group Co Ltd
Priority to CN201810997636.6A priority Critical patent/CN109166889B/en
Publication of CN109166889A publication Critical patent/CN109166889A/en
Application granted granted Critical
Publication of CN109166889B publication Critical patent/CN109166889B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/88Dummy elements, i.e. elements having non-functional features
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/1201Manufacture or treatment
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

The invention discloses a display substrate, a manufacturing method thereof and a display device, and belongs to the technical field of display. The display substrate includes: a first substrate; a first inorganic layer on a first side of the first substrate; the display functional layer is positioned on one side, far away from the first substrate, of the first inorganic layer; the first substrate is provided with a hollow structure, the second side of the first substrate is used for arranging a camera, the first side and the second side are opposite two sides, and the hollow structure is configured to transmit light entering the camera. The invention increases the light quantity entering the camera and weakens the influence on the imaging effect of the camera. The invention is used for displaying images.

Description

Display substrate, manufacturing method thereof and display device
Technical Field
The invention relates to the technical field of display, in particular to a display substrate, a manufacturing method of the display substrate and a display device.
Background
An Organic Light-Emitting Diode (OLED) display device includes a display substrate, a camera, and other components. The display substrate comprises a substrate, and an inorganic layer, an anode, an organic light emitting layer, a cathode, an inorganic packaging layer and the like which are arranged on one side of the substrate in a laminated mode. When realizing full-screen display, this camera setting is at the first side of display substrate, and the camera shoots required light and gets into the camera from the second side of this display substrate via display substrate, and this first side and this second side are relative both sides.
In the process of light entering the camera via the second side of the display substrate, the light needs to pass through the various film layers in the display substrate. For example, light needs to pass through an inorganic encapsulation layer, a cathode, an organic light emitting layer, an anode, an inorganic layer, and a substrate in this order. In the related art, the substrate is usually made of Polyimide (PI) for transmitting visible light therethrough, and the substrate is usually a whole layer structure since the substrate is used to provide support for other layers.
However, the substrate made of polyimide has a certain blocking effect on light, so that the light supplement provided for the camera to collect images is less, and the imaging effect of the camera is further influenced.
Disclosure of Invention
The embodiment of the invention provides a display substrate, which can solve the problem that in the related art, a substrate made of polyimide has a certain blocking effect on light, so that less supplementary lighting is provided for collecting images by a camera, and the imaging effect of the camera is further influenced. The technical scheme is as follows:
in one aspect, a display substrate is provided, the display substrate including:
a first substrate;
a first inorganic layer on a first side of the first substrate;
the display functional layer is positioned on one side, far away from the first substrate, of the first inorganic layer;
the first substrate is provided with a hollow structure, the second side of the first substrate is used for arranging a camera, the first side and the second side are opposite two sides, and the hollow structure is configured to transmit light entering the camera.
Optionally, a hollow structure is arranged on the first inorganic layer, and the hollow structure on the first inorganic layer is the same as the hollow structure on the first substrate in arrangement position and arrangement shape.
Optionally, a hollow structure is arranged on the display function layer, and the hollow structure on the display function layer is the same as the hollow structure on the first substrate in arrangement position and arrangement shape.
Optionally, the hollow structure includes: a plurality of strip-shaped holes or a net-shaped structure which are arranged in an array.
In another aspect, a method of manufacturing a display substrate is provided, the method including:
providing a substrate base plate;
forming a first base on the substrate base plate, and forming a first inorganic layer on a first side of the first base, wherein a hollow structure is arranged on the first base, a second side of the first base is used for arranging a camera, the first side and the second side are opposite sides, and the hollow structure is configured to transmit light rays entering the camera;
and forming a display function layer on the substrate with the first inorganic layer.
Optionally, the forming a first base on the substrate base plate and forming a first inorganic layer on a first side of the first base include:
forming a first base thin film layer on the substrate base plate;
forming a first inorganic thin film layer on a first side of the first base thin film layer;
and respectively carrying out graphical processing on the first inorganic thin film layer and the first substrate thin film layer to obtain a first substrate and a first inorganic layer.
Optionally, the performing a patterning process on the first inorganic thin film layer and the first substrate thin film layer respectively to obtain a first substrate and a first inorganic layer includes:
based on a target mask, carrying out graphical processing on the first inorganic thin film layer to obtain the first inorganic layer, wherein the first inorganic layer is provided with a hollow structure, and the hollow structure on the first inorganic layer and the hollow structure on the first substrate are identical in arrangement position and arrangement shape;
and carrying out graphical processing on the first substrate film layer by taking the first inorganic layer as a mask to obtain the first substrate.
Optionally, the forming a display function layer on the substrate with the first inorganic layer formed thereon includes:
forming a display function thin film layer on the substrate base plate on which the first inorganic layer is formed;
based on the target mask, the display function film layer is subjected to graphical processing to obtain the display function layer, a hollow structure is arranged on the display function layer, and the setting position and the setting shape of the hollow structure on the display function layer are identical to those of the hollow structure on the first substrate.
Optionally, the hollow structure includes: a plurality of strip-shaped holes or a net-shaped structure which are arranged in an array.
In still another aspect, there is provided a display device including: the display substrate of the first aspect, and the camera is located on a second side of the first base in the display substrate.
According to the display substrate, the manufacturing method of the display substrate and the display device, the hollow structure is arranged on the first base in the display substrate and is configured to transmit light entering the camera, and compared with the related art, the blocking effect of the first base on the light is weakened, the light quantity entering the camera is increased, and the influence on the imaging effect of the camera is weakened.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic cross-sectional view of a display substrate according to an embodiment of the invention;
FIG. 2 is a schematic partial structure diagram of a hollow-out structure on a first substrate according to an embodiment of the present invention;
FIG. 3 is a schematic partial structure diagram of an alternative first substrate with an opening structure provided thereon according to an embodiment of the present invention;
FIG. 4 is a schematic partial structure diagram of a hollow-out structure on a first substrate according to another embodiment of the present invention;
FIG. 5 is a schematic partial structure view of a hollow-out structure on a first substrate according to another embodiment of the present invention;
FIG. 6 is a schematic cross-sectional view of another display substrate provided in an embodiment of the invention;
FIG. 7 is a schematic cross-sectional view of another display substrate provided in an embodiment of the invention;
FIG. 8 is a flow chart of a method for fabricating a display substrate according to an embodiment of the present invention;
FIG. 9 is a flow chart of another method for manufacturing a display substrate according to an embodiment of the present invention;
fig. 10 is a schematic structural diagram of a substrate on which a first base thin film layer, a first inorganic thin film layer, a second base thin film layer, and a second inorganic thin film layer are sequentially formed according to an embodiment of the present invention;
FIG. 11 is a schematic structural diagram of a second inorganic thin film layer shown in FIG. 10 after being patterned according to an embodiment of the present invention;
fig. 12 is a schematic structural diagram of a second substrate obtained by patterning a thin film layer of the second substrate according to an embodiment of the present invention;
fig. 13 is a schematic structural diagram of a first inorganic thin film layer and a first substrate thin film layer after patterning processing according to an embodiment of the present invention;
fig. 14 is a schematic front view of a display device according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
An embodiment of the present invention provides a display substrate, as shown in fig. 1, the display substrate may include: a first substrate 101, a first inorganic layer 102 on a first side of the first substrate 101, and a display function layer 103 on a side of the first inorganic layer 102 remote from the first substrate 101.
The first substrate 101 is provided with a hollow structure, the second side of the first substrate 101 is used for arranging the camera S, the first side and the second side are opposite sides, and the hollow structure is configured to transmit light entering the camera S. For example, as shown in fig. 1, the first base 101 may be provided with a hollow structure in the target area a, and light rays required for shooting by the camera S may enter the camera S from the side of the display function layer 103 away from the substrate through the target area a, where a direction of a dotted line in fig. 1 is a transmission direction of the light rays. It should be noted that, in an ideal state, the cross section of the hollow structure shown in fig. 1 in the direction perpendicular to the first substrate should be rectangular, but due to the influence of the manufacturing process and the like, the cross section of the hollow structure in the direction perpendicular to the first substrate generally appears trapezoidal as shown in fig. 1.
In summary, embodiments of the present invention provide a display substrate, in which a first base of the display substrate is provided with a hollow structure, and the hollow structure is configured to transmit light entering a camera, so that compared with the related art, a blocking effect of the first base on light is weakened, a light amount entering the camera is increased, and an influence on an imaging effect of the camera is weakened.
Wherein, the hollow structure provided on the first substrate 101 may include: a plurality of strip-shaped holes or porous structures such as a net structure and the like which are arranged in an array. For example, as shown in fig. 2, fig. 3, fig. 4, or fig. 5, the hollowed-out structures disposed on the first substrate 101 in the target area a may be strip-shaped holes arranged in an array as shown in fig. 2, fig. 3, fig. 4, or fig. 5. At this time, in the process that light required for shooting by the camera is irradiated to the camera from the side of the display functional layer 103 far away from the first substrate 101, part of the light can directly penetrate through the holes of the hollow structure, and then the light quantity entering the camera is increased. And when the hollow structure is a plurality of bar-shaped holes or porous structures such as a net structure arranged in an array, when light passes through each film layer in the display substrate, the porous structure can destroy the condition of the phenomenon that the light interferes or diffracts, the probability of the phenomenon that the light interferes or diffracts is reduced, and compared with the related art, the influence of the interference or diffract phenomenon on the imaging effect of the camera can be weakened. Among them, the reason for the phenomenon of interference or diffraction of light in the related art is: since a device made of metal such as a Thin Film Transistor (TFT) in a display substrate reflects light, and since the device is generally in a regular pattern, the reflected light is subject to a diffraction phenomenon.
Alternatively, the hollow structure may include: a through hole, i.e., the target area a, may not be provided with a material for manufacturing the first substrate 101. At this time, in the process that light required for shooting by the camera is irradiated to the camera from the side of the display functional layer 103 far away from the first substrate 101, the hollow structure cannot block the light, and further the light quantity entering the camera is increased.
The first inorganic layer 102 and the display function layer 103 may be formed by a coating process. For example: the first inorganic layer 102 may include: a first barrier layer, a first active layer (P-Si), a first Gate Insulator (GI), and a first interlayer Insulator (ILD). The first blocking layer may include an Amorphous silicon (a-Si) material, and the first gate insulating layer may include a first sub-gate insulating layer and a second sub-gate insulating layer that are disposed at an interval, and the first sub-gate insulating layer and the second sub-gate insulating layer may form a capacitor for maintaining a pixel voltage. The display function layer 103 may include: source and drain electrodes, a planarization layer, an anode electrode, a pixel defining layer, an organic light emitting layer, a cathode electrode, a support layer, and the like. In addition, in order to ensure the display effect of the display substrate, the display substrate may further include an inorganic encapsulation layer.
Alternatively, the first substrate 101 may be a flexible substrate. At this time, the display substrate may be provided in a flexible display device, and the flexible substrate serves to provide support when the flexible display device is bent. The first substrate 101 may be made of polyimide, polycarbonate, polyacrylate, polyetherimide, polyethersulfone, polyethylene terephthalate, polyethylene naphthalate, and the like. For example: the first substrate 101 may be a substrate made of polyimide.
In one implementation, as shown in fig. 6, the first inorganic layer 102 may also have a hollow structure disposed thereon. And the hollow structures on the first inorganic layer 102 may be the same as the hollow structures on the first substrate 101 in terms of the arrangement positions and the arrangement shapes. That is, the first inorganic layer 102 may also have a hollow structure in the target region a. The hollow structures on the first inorganic layer 102 and the first substrate 101 are disposed at the same position, which means that the hollow structures on the first inorganic layer 102 can be disposed right above the hollow structures on the first substrate 101. At this time, part of light required for shooting by the camera can sequentially penetrate through the holes of the hollow structures on the first inorganic layer 102 and the first substrate 101, so that the light quantity entering the camera is increased, and the influence on the imaging effect of the camera is further weakened.
Further, as shown in fig. 6, a hollow structure may be disposed on the display function layer 103. And the hollow structures on the display function layer 103 and the first substrate 101 may be identical in arrangement position and arrangement shape. That is, the display function layer 103 may also have a hollow structure in the target area a. At this time, part of light required for shooting by the camera can sequentially penetrate through the holes of the hollow structures on the display functional layer 103, the hollow structures on the first inorganic layer 102 and the hollow structures on the first substrate 101, so that the light quantity entering the camera can be further increased, and the influence on the imaging effect of the camera is weakened.
Alternatively, in order to ensure the water and oxygen isolation effect, a plurality of substrates and a plurality of inorganic layers may be disposed in the display substrate, and one substrate may be disposed between every two inorganic layers. For example, as shown in fig. 6, the display substrate may include a first inorganic layer 102, a second base 104, and a second inorganic layer 105 stacked on a first base 101. At this time, the display function layer 103 may be positioned on a side of the second inorganic layer 105 away from the second substrate 104. The first substrate 101 and the first inorganic layer 102 are disposed in a manner corresponding to that shown in fig. 1.
In one implementation, the second substrate 104 may also have a hollow structure disposed thereon. The positions and shapes of the hollow structures on the second substrate 104 and the hollow structures on the first substrate 101 may be the same. That is, the second substrate 104 may also be provided with a hollow structure in the target area a. At this time, the blocking effect of the second substrate 104 on light can be reduced, and the imaging effect of the camera is further ensured.
Further, a hollow structure may also be disposed on the second inorganic layer 105. And the hollow structures on the second inorganic layer 105 may be the same as the hollow structures on the first substrate 101 in terms of the arrangement positions and the arrangement shapes. At this time, the blocking effect of the second inorganic layer 105 on light can be reduced, thereby ensuring the imaging effect of the camera.
When the display substrate includes a first inorganic layer 102, a second base 104, and a second inorganic layer 105 stacked on a first base 101, the second base 104 and the first base 101 may be made of polyimide. Also, as shown in fig. 7, the first inorganic layer 102 may include a first barrier layer, the second inorganic layer 105 may include a second barrier layer 1051, a second active layer (not shown in fig. 7), a second gate insulating layer 1052, a second interlayer insulating layer 1053, and the like, and the second gate insulating layer 1052 may include third and fourth sub gate insulating layers disposed at intervals, the third and fourth sub gate insulating layers being used to form a capacitor.
In summary, the invention provides a display substrate, in which a first base is provided with a hollow structure, and the hollow structure is configured to transmit light entering a camera, so that compared with the related art, the blocking effect of the first base on light is weakened, the light quantity entering the camera is increased, and the influence on the imaging effect of the camera is weakened.
An embodiment of the present invention provides a method for manufacturing a display substrate, where the method for manufacturing a display substrate may be used to manufacture the display substrate provided in the embodiment of the present invention, referring to fig. 8, the method may include:
step 201, a substrate is provided.
Step 202, forming a first base on the substrate, and forming a first inorganic layer on a first side of the first base, wherein a hollow structure is disposed on the first base, a second side of the first base is used for disposing a camera, the first side and the second side are opposite sides, and the hollow structure is configured to transmit light entering the camera.
Step 203, forming a display function layer on the base substrate on which the first inorganic layer is formed.
In summary, in the method for manufacturing a display substrate according to the embodiment of the present invention, the first base of the display substrate manufactured by the method is provided with the hollow structure, and the hollow structure is configured to transmit the light entering the camera.
Fig. 9 is a flowchart of another method for manufacturing a display substrate according to an embodiment of the invention. The manufacturing method of the display substrate can be used for manufacturing the display substrate provided by the embodiment of the invention. In the following, the method is described in the embodiment of the present invention by taking an example that the first substrate, the first inorganic layer, and the display functional layer are all provided with the hollow structures, and the hollow structures on the first inorganic layer and the hollow structures on the display functional layer are all the same as the hollow structures on the first substrate in the arrangement positions and the arrangement shapes. Referring to fig. 9, the method may include:
step 301, a substrate is provided.
Alternatively, the substrate may be a transparent substrate, which may be specifically a substrate made of a light-guiding and non-metallic material having a certain hardness, such as glass, quartz, transparent resin, or the like.
Step 302, a first base film layer is formed on a substrate base plate.
Alternatively, a base layer material with a certain thickness may be deposited on the substrate by magnetron sputtering, thermal evaporation, or Plasma Enhanced Chemical Vapor Deposition (PECVD), to obtain the first base thin film layer. Wherein, the base layer material can be at least one of polyimide, polycarbonate, polyacrylate, polyetherimide, polyethersulfone, polyethylene terephthalate and polyethylene naphthalate. Moreover, the thickness of the first base film layer can be set according to actual needs.
Step 303, forming a first inorganic thin film layer on a first side of the first base thin film layer.
Alternatively, the first inorganic layer may include, according to display needs: a first barrier layer, a first active layer, a first gate insulating layer, a first interlayer insulating layer, and the like. Accordingly, the implementation of step 303 may include: a first blocking thin film layer, a first active thin film layer, a first grid insulation thin film layer, a first interlayer insulation thin film layer and the like are sequentially formed on the first side of the first substrate thin film layer.
Wherein the process of manufacturing the first barrier thin film layer may include: and depositing a layer of barrier layer material with a certain thickness on the first substrate thin film layer by adopting methods such as magnetron sputtering, thermal evaporation or PECVD (plasma enhanced chemical vapor deposition) and the like to obtain a first barrier thin film layer. In addition, the implementation process of manufacturing the first active thin film layer, the first gate insulating thin film layer, the first interlayer insulating thin film layer, and the like may be referred to as the implementation process of manufacturing the first blocking thin film layer, and details are not repeated here.
And 304, carrying out graphical processing on the first inorganic thin film layer based on the target mask to obtain a first inorganic layer.
Optionally, the process of performing the patterning process on the first inorganic thin film layer may include: and coating a layer of photosensitive material with a certain thickness on one side of the first inorganic thin film layer, which is far away from the first substrate thin film layer, so as to obtain a photoresist film layer. And then, covering a target mask plate at one end of the photoresist film layer far away from the first inorganic film layer. And exposing the photoresist film layer from one side of the target mask plate far away from the photoresist film layer. After exposure, the photoresist layer is developed. And etching the first inorganic thin film layer coated with the photoresist film layer by an etching process. And stripping the photoresist after the etching is finished to obtain the first inorganic layer. The first inorganic layer is formed with a hollow structure, and the hollow structure on the first inorganic layer is configured to transmit light entering the camera. The first inorganic layer may include: the first barrier layer, the first active layer, the first gate insulating layer, and the first interlayer insulating layer. And, this fretwork structure can include: a plurality of strip-shaped holes or a net-shaped structure which are arranged in an array.
Step 305, the first inorganic layer is used as a mask to perform a patterning process on the first substrate thin film layer to obtain a first substrate.
When the first substrate thin film layer is made of polyimide, oxygen can be selected for etching the polyimide. In addition, since oxygen does not react with the first interlayer insulating layer in the first inorganic layer, the first substrate thin film layer can be etched by using oxygen to obtain the first substrate using the first interlayer insulating layer in the first inorganic layer as a mask. The first substrate is formed with a hollow structure, and the hollow structure on the first substrate is the same as the hollow structure on the first inorganic layer in arrangement position and arrangement shape. When the first interlayer insulating layer is used as the mask, the use of the mask in the manufacturing process of the display substrate can be reduced, and the manufacturing cost of the display substrate can be further reduced.
It should be noted that, when performing step 305, the first base thin film layer may also be patterned based on the target mask, which is not specifically limited in this embodiment of the present invention.
It should be noted that, in order to ensure the water and oxygen isolation effect, a plurality of substrates and a plurality of inorganic layers may be disposed in the display substrate, and one substrate may be disposed between every two inorganic layers. For example, with continued reference to fig. 6, the display substrate may include a first inorganic layer 102, a second base 104, and a second inorganic layer 105 stacked on a first base 101. At this time, the display function layer 103 may be disposed on a side of the second inorganic layer 105 away from the second substrate 104. Also, as shown in fig. 7, the first inorganic layer 102 may include a first barrier layer (not shown in fig. 7), and the second inorganic layer 105 may include a second barrier layer 1051, a second active layer (not shown in fig. 7), a second gate insulating layer 1052, a second interlayer insulating layer 1053, and the like.
Accordingly, when the structure of the display substrate is the structure shown in fig. 7, the manufacturing process of the display substrate may include: form first basement thin film layer, first inorganic thin film layer, second basement thin film layer and second inorganic thin film layer on this substrate base plate in proper order, wherein, first inorganic thin film layer includes: the first blocking film layer and the second inorganic film layer comprise a second blocking film layer, a second active film layer, a second grid insulation film layer and a second interlayer insulation film layer. Then, the second inorganic thin film layer, the second substrate thin film layer, the first inorganic thin film layer and the first substrate thin film layer are subjected to graphical processing in sequence respectively to obtain a second inorganic layer, a second substrate, a first inorganic layer and a first substrate.
Wherein, the process of respectively carrying out the graphical processing to the second inorganic thin film layer, the second substrate thin film layer, the first inorganic thin film layer and the first substrate thin film layer in turn can include: based on the target mask, carrying out graphical processing on the second inorganic thin film layer to obtain a second inorganic layer; then, with the second inorganic layer as a mask, carrying out graphical processing on the second substrate thin film layer to obtain a second substrate; then based on the target mask, carrying out graphical processing on the first inorganic thin film layer to obtain a first inorganic layer; and then, the second inorganic layer is used as a mask to carry out graphical processing on the first substrate film layer so as to obtain the first substrate. The first substrate, the first inorganic layer, the second substrate and the second inorganic layer can be provided with hollow structures, and the setting positions and the setting shapes of the hollow structures on the first substrate, the first inorganic layer, the second substrate and the second inorganic layer are the same.
For example, please refer to fig. 10, which shows a schematic structural diagram after a first base thin film layer 101a, a first inorganic thin film layer 102a, a second base thin film layer 104a and a second inorganic thin film layer 105a are sequentially formed on a substrate 106 according to an embodiment of the present invention, wherein the first inorganic thin film layer 102a may include a first blocking thin film layer, and the second inorganic thin film layer 105a may include a second blocking thin film layer 1051a, a second active thin film layer, a second gate insulating thin film layer 1052a and a second interlayer insulating thin film layer 1053 a.
Referring to fig. 11, a schematic structural diagram of the second inorganic thin film layer 105a shown in fig. 10 after patterning is shown, in which the second inorganic layer 105 has a hollow structure in a target region a, and the second inorganic layer 105 includes a second blocking layer 1051, a second active layer, a second gate insulating layer 1052 and a second interlayer insulating layer 1053.
Referring to fig. 12, a schematic structural diagram of a second substrate 104 obtained by performing a patterning process on a second substrate thin film layer according to an embodiment of the invention is shown, wherein the second substrate 104 is provided with a hollow structure in a target area a.
Referring to fig. 13, a schematic structural diagram of a first inorganic thin film layer 102a and a first substrate thin film layer 101a after patterning is shown, in which the first substrate 101 and the first inorganic layer 102 are both provided with a hollow structure in a target area a, and the first inorganic layer 102 includes a first blocking layer.
Step 306, forming a display function layer on the base substrate on which the first inorganic layer is formed.
The display function layer may include: source and drain electrodes, a planarization layer, an anode, a pixel defining layer, an organic light emitting layer, a cathode, a supporting layer and the like. Accordingly, the implementation of step 305 may include: a source/drain electrode, a planarization layer, an anode, a pixel defining layer, an organic light emitting layer, a cathode, a supporting layer, and other film layers are sequentially formed on a substrate with a first inorganic layer, and a structural schematic diagram of the display function layer is shown in fig. 7. In the process of forming the display function layer, after each thin film layer corresponding to one film layer is formed, the film layer can be subjected to patterning treatment to obtain a corresponding film layer pattern. For example, when forming the source and drain electrodes in the display function layer, the implementation process may include: and forming a source and drain electrode thin film layer on the substrate with the first inorganic layer, and carrying out graphical processing on the source and drain electrode thin film layer based on a target mask to obtain a source and drain electrode. At the moment, a hollow structure is arranged on the source drain electrode, and the arrangement position and the arrangement shape of the hollow structure on the source drain electrode and the hollow structure on the first substrate can be identical. The implementation process of forming other layers in the display function layer should share the implementation process of forming the source and drain electrodes, which is not described herein again.
Optionally, each film layer in the display function layer may be provided with a hollow structure. And the hollow structure on each film layer can be the same as the hollow structure on the first substrate in arrangement position and arrangement shape. That is, the display functional layer may also be provided with a hollow structure in the target region. And when the display function layer is provided with the hollow structure in the target area, the display effect in the area can be ensured, and the light blocking effect of the display function layer is reduced.
In summary, in the method for manufacturing a display substrate according to the embodiment of the present invention, the first base of the display substrate manufactured by the method is provided with the hollow structure, and the hollow structure is configured to transmit the light entering the camera.
It should be noted that, the sequence of the steps of the method for manufacturing the display substrate provided in the embodiment of the present invention may be appropriately adjusted, and the steps may be increased or decreased according to the circumstances, and any method that can be easily conceived by a person skilled in the art within the technical scope of the present invention shall be included in the protection scope of the present invention, and therefore, the details are not described again.
An embodiment of the present invention provides a display device, which may include: the camera is positioned on the second side of the first base in the display substrate. For example, fig. 14 is a schematic front view of the display device, which includes: the display substrate comprises a camera and a display substrate, wherein an overlapping area 107 exists between a display area 108 of the display substrate and a target area, and a camera is arranged on the second side of the first substrate behind the overlapping area 107 and is a front-facing camera.
Optionally, the display device may be: the display device comprises any product or component with a display function, such as a liquid crystal panel, electronic paper, an organic light emitting diode panel, a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator and the like.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.

Claims (8)

1. A display device, characterized in that the display device comprises: a camera and a display substrate; the display substrate includes:
a first substrate;
a first inorganic layer on a first side of the first substrate;
the display functional layer is positioned on one side, far away from the first substrate, of the first inorganic layer;
the camera comprises a first substrate, a second substrate, a camera and a camera, wherein the first substrate is provided with a hollow structure, the camera is positioned on the second side of the first substrate, the first side and the second side are opposite, and the hollow structure is used for transmitting light rays entering the camera;
the first substrate and the first inorganic layer are obtained by forming a first substrate thin film layer on a substrate base plate, and respectively carrying out graphical processing on the first inorganic thin film layer and the first substrate thin film layer after forming the first inorganic thin film layer on the first side of the substrate thin film layer.
2. The display device according to claim 1, wherein the first inorganic layer is provided with a hollow structure, and the hollow structure on the first inorganic layer and the hollow structure on the first substrate are arranged at the same position and in the same shape.
3. The display device according to claim 2, wherein the display functional layer is provided with a hollow structure, and the hollow structure on the display functional layer and the hollow structure on the first substrate are arranged at the same position and in the same shape.
4. The display device according to any one of claims 1 to 3, wherein the hollow structure comprises: a plurality of strip-shaped holes or a net-shaped structure which are arranged in an array.
5. A method of manufacturing a display device, the method comprising:
providing a substrate base plate;
forming a first base on the substrate base plate, and forming a first inorganic layer on the first side of the first base, wherein the first base is provided with a hollow structure;
forming a display function layer on the base substrate on which the first inorganic layer is formed;
arranging a camera on a second side of the first substrate, wherein the first side and the second side are opposite sides, and the hollow structure is used for transmitting light rays entering the camera;
the forming a first base on the substrate base plate and a first inorganic layer on a first side of the first base includes:
forming a first base thin film layer on the substrate base plate;
forming a first inorganic thin film layer on a first side of the first base thin film layer;
and respectively carrying out graphical processing on the first inorganic thin film layer and the first substrate thin film layer to obtain a first substrate and a first inorganic layer.
6. The method of claim 5, wherein the patterning the first inorganic thin film layer and the first substrate thin film layer to obtain a first substrate and a first inorganic layer respectively comprises:
based on a target mask, carrying out graphical processing on the first inorganic thin film layer to obtain the first inorganic layer, wherein the first inorganic layer is provided with a hollow structure, and the hollow structure on the first inorganic layer and the hollow structure on the first substrate are identical in arrangement position and arrangement shape;
and carrying out graphical processing on the first substrate film layer by taking the first inorganic layer as a mask to obtain the first substrate.
7. The method according to claim 5 or 6, wherein the forming a display function layer on the base substrate on which the first inorganic layer is formed comprises:
forming a display function thin film layer on the substrate base plate on which the first inorganic layer is formed;
based on the target mask, the display function film layer is subjected to graphical processing to obtain the display function layer, a hollow structure is arranged on the display function layer, and the setting position and the setting shape of the hollow structure on the display function layer are identical to those of the hollow structure on the first substrate.
8. The method according to claim 5 or 6, wherein the hollowed-out structure comprises: a plurality of strip-shaped holes or a net-shaped structure which are arranged in an array.
CN201810997636.6A 2018-08-29 2018-08-29 Display substrate, manufacturing method thereof and display device Active CN109166889B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810997636.6A CN109166889B (en) 2018-08-29 2018-08-29 Display substrate, manufacturing method thereof and display device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201810997636.6A CN109166889B (en) 2018-08-29 2018-08-29 Display substrate, manufacturing method thereof and display device

Publications (2)

Publication Number Publication Date
CN109166889A CN109166889A (en) 2019-01-08
CN109166889B true CN109166889B (en) 2021-10-12

Family

ID=64893231

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810997636.6A Active CN109166889B (en) 2018-08-29 2018-08-29 Display substrate, manufacturing method thereof and display device

Country Status (1)

Country Link
CN (1) CN109166889B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110048005B (en) * 2019-03-29 2020-06-16 武汉华星光电半导体显示技术有限公司 OLED display device and preparation method thereof
US10969623B2 (en) 2019-08-22 2021-04-06 Wuhan China Star Optoelectronics Technology Co., Ltd. Display panel, method of manufacturing same, and terminal
CN110534550A (en) * 2019-08-22 2019-12-03 武汉华星光电技术有限公司 Display panel and preparation method thereof and terminal
CN110739339A (en) * 2019-10-28 2020-01-31 武汉华星光电半导体显示技术有限公司 kinds of display panel and display device
CN110729335B (en) * 2019-10-28 2022-02-01 武汉华星光电半导体显示技术有限公司 Display panel and preparation method thereof

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106505086A (en) * 2015-09-04 2017-03-15 三星显示有限公司 Display device

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100462861B1 (en) * 2002-04-15 2004-12-17 삼성에스디아이 주식회사 Flat Panel Display with Black Matrix and Fabrication Method thereof
US9143668B2 (en) * 2010-10-29 2015-09-22 Apple Inc. Camera lens structures and display structures for electronic devices
KR101488660B1 (en) * 2013-08-14 2015-02-02 코닝정밀소재 주식회사 Substrate for oled, method of fabricating thereof and oled including the same
KR102206385B1 (en) * 2014-04-11 2021-01-22 엘지전자 주식회사 Mobile terminal and method for controlling the same
CN104377315B (en) * 2014-11-07 2017-11-14 南京邮电大学 A kind of white light OLED device and preparation method thereof
KR102175991B1 (en) * 2014-12-26 2020-11-09 삼성디스플레이 주식회사 Display apparatus and manufacturing method thereof
CN105047677B (en) * 2015-09-09 2017-12-12 京东方科技集团股份有限公司 Display base plate and preparation method thereof and display device
US9823694B2 (en) * 2015-10-30 2017-11-21 Essential Products, Inc. Camera integrated into a display
CN105895663B (en) * 2016-05-19 2018-11-13 京东方科技集团股份有限公司 A kind of electro-luminescence display device, its production method and display device
KR102626884B1 (en) * 2016-11-28 2024-01-19 삼성전자주식회사 Electronic device comprising antenna
CN108281458B (en) * 2017-01-03 2020-09-22 昆山工研院新型平板显示技术中心有限公司 Flexible OLED display device and preparation method thereof
KR20180083459A (en) * 2017-01-12 2018-07-23 삼성디스플레이 주식회사 The deposition mask assembly
CN107731888B (en) * 2017-11-23 2020-07-03 京东方科技集团股份有限公司 Flexible display panel, manufacturing method thereof and display device
CN108255349B (en) * 2018-01-31 2021-10-01 京东方科技集团股份有限公司 Display substrate and display device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106505086A (en) * 2015-09-04 2017-03-15 三星显示有限公司 Display device

Also Published As

Publication number Publication date
CN109166889A (en) 2019-01-08

Similar Documents

Publication Publication Date Title
CN109166889B (en) Display substrate, manufacturing method thereof and display device
CN109103231B (en) Display substrate, manufacturing method thereof and display device
US9543443B2 (en) Thin film transistor assembly, array substrate method of manufacturing the same, and display device
US10002847B2 (en) OLED pixel unit, transparent display device, method for fabricating the same, display apparatus
CN109244269B (en) Display panel, manufacturing method thereof and display device
US8426259B2 (en) Array substrate and method for manufacturing the same
US10381382B2 (en) Array substrate, method for manufacturing the same and display device
CN110943112B (en) Array substrate, preparation method thereof and display panel
US11960689B2 (en) Touch-control display panel and preparation method therefor, and touch-control display apparatus
KR20080060400A (en) Method of manufacturing array substrate and method of manufacturing organic light emitting device using the method
US9893206B2 (en) Thin film transistor, array substrate, their manufacturing methods, and display device
WO2020199548A1 (en) Display panel, display apparatus, and method of fabricating display panel
US10026608B2 (en) Array substrate, method for manufacturing the same, and display device
US20170110587A1 (en) Array substrate and manufacturing method thereof, display panel, display device
US11385732B2 (en) Array substrate, manufacturing method thereof, touch display panel and touch display device
US20190043898A1 (en) Array substrate motherboard, method for manufacturing the same, and display device
CN114127946B (en) Organic light-emitting display substrate, manufacturing method thereof and organic light-emitting display device
US11874984B2 (en) Touch display panel and manufacturing method therefor, and touch display device
CN115995470A (en) Display substrate, manufacturing method thereof and display device
US20200348784A1 (en) Touch display substrate, method of manufacturing the same and display device
US20140080254A1 (en) Fabricating Method Of Thin Film Transistor, Fabricating Method Of Array Substrate And Display Device
US10134769B2 (en) Array substrate, method for manufacturing thereof, and display device
CN108305879A (en) Thin-film transistor array base-plate and production method and display device
US20210335848A1 (en) Substrate for electronic device, display apparatus, method of fabricating substrate for electronic device
CN102280369B (en) Method for forming thin film pattern and flat display device having same

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant