CN113260147A - Circuit board and display device - Google Patents

Circuit board and display device Download PDF

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Publication number
CN113260147A
CN113260147A CN202110576517.5A CN202110576517A CN113260147A CN 113260147 A CN113260147 A CN 113260147A CN 202110576517 A CN202110576517 A CN 202110576517A CN 113260147 A CN113260147 A CN 113260147A
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CN
China
Prior art keywords
signal transmission
pad
coupled
target signal
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202110576517.5A
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Chinese (zh)
Inventor
吴绍祥
王奇
梁恒镇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by BOE Technology Group Co Ltd, Chengdu BOE Optoelectronics Technology Co Ltd filed Critical BOE Technology Group Co Ltd
Priority to CN202110576517.5A priority Critical patent/CN113260147A/en
Publication of CN113260147A publication Critical patent/CN113260147A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor

Abstract

The invention provides a circuit board and a display device, relates to the technical field of circuit board layout, and aims to effectively shield the interference of an external environment to an SPI signal while overcoming the problems of the level of a manufacturing process, high manufacturing cost, poor stability and the like. The circuit board includes: the conductive structure comprises a first conductive layer and a second conductive layer which are arranged in different layers, wherein an insulating layer is arranged between the first conductive layer and the second conductive layer; the first conductive layer comprises a plurality of device pads comprising a fixed signal transmission pad and a target signal transmission pad, the fixed signal transmission pad being adjacent to the target signal transmission pad; the second conductive layer comprises a first target signal transmission line coupled with a corresponding target signal transmission pad; an orthographic projection of the first target signal transmission line on the first conductive layer at least partially overlaps the fixed signal transmission pad. The circuit board provided by the invention is used for connecting the display panel and the mainboard.

Description

Circuit board and display device
Technical Field
The invention relates to the technical field of circuit board layout, in particular to a circuit board and a display device.
Background
In an active matrix organic light emitting diode display product, a display panel is generally coupled to a main board through a flexible circuit board. In the process of transmitting a touch signal in the display panel from the flexible circuit board to the main board, an SPI (Serial Peripheral Interface, chinese) bus technology is mostly adopted to transmit data information, and the SPI signal is easily interfered by a low-frequency signal, so that the signal is distorted and no longer conforms to an SPI communication protocol.
In order to reduce the interference of external signals to the transmitted SPI signals as much as possible, the flexible circuit board adopts a multi-layer board scheme at present, namely, an independent GND layer is arranged as a signal shielding layer to shield the interference of other signals to the SPI signals. But is limited by the level of fabrication technology, the cost of fabricating multi-layer boards is high, and the supply stability is poor. Therefore, how to overcome the problems of the level of the manufacturing process, high manufacturing cost, poor stability and the like is important to effectively shield the interference of the external environment to the SPI signal.
Disclosure of Invention
The invention aims to provide a circuit board and a display device, which are used for effectively shielding the interference of an external environment to an SPI signal while overcoming the problems of the level of a manufacturing process, high manufacturing cost, poor stability and the like.
In order to achieve the above purpose, the invention provides the following technical scheme:
a first aspect of the present invention provides a circuit board comprising: the conductive structure comprises a first conductive layer and a second conductive layer which are arranged in different layers, wherein an insulating layer is arranged between the first conductive layer and the second conductive layer;
the first conductive layer comprises a plurality of device pads comprising a fixed signal transmission pad and a target signal transmission pad, the fixed signal transmission pad being adjacent to the target signal transmission pad;
the second conductive layer includes a first target signal transmission line coupled with the corresponding target signal transmission pad;
an orthographic projection of the first target signal transmission line on the first conductive layer at least partially overlaps the fixed signal transmission pad.
The plurality of device pads includes: the signal transmission device comprises a fixed signal transmission welding disc group and a target signal transmission welding disc group, wherein the fixed signal transmission welding disc group comprises a plurality of fixed signal transmission welding discs which are arranged along a first direction; the target signal transmission pad group comprises a plurality of target signal transmission pads which are arranged along a first direction; the fixed signal transmission pad group and the target signal transmission pad group are arranged along a second direction, and the second direction is intersected with the first direction.
Optionally, the second conductive layer includes a plurality of first target signal transmission lines, and the plurality of first target signal transmission lines are coupled to the plurality of target signal transmission pads in a one-to-one correspondence;
the first target signal transmission line includes a portion extending in the first direction, and orthographic projections of the first target signal transmission line on the first conductive layer at least partially overlap the plurality of fixed signal transmission pads, respectively.
Optionally, the second conductive layer further includes: a shield line forming a semi-enclosed structure, an end of the first target signal transmission line coupled with the target signal transmission pad being located inside the semi-enclosed structure.
Optionally, the shielding line is electrically connected to the fixed signal transmission pad.
Optionally, the destination signal transmission pads include a first pad and a second pad, and the first pad is coupled to the corresponding first destination signal transmission line;
the circuit board further comprises a touch chip and an electronic device; the touch chip is coupled with the second bonding pad; the electronic device comprises a first pin and a second pin, the first pin of the electronic device is coupled with the corresponding first bonding pad, and the second pin of the electronic device is coupled with the corresponding second bonding pad.
Optionally, the plurality of first target signal transmission lines include at least one of a MISO signal transmission line, a MOSI signal transmission line, and a clock signal line.
Optionally, the circuit board further includes: a protection circuit and a first filter circuit;
the protection circuit includes: a first protection diode and a second protection diode;
the first filter circuit includes: a first capacitor, a second capacitor, a third capacitor and a fourth capacitor;
the circuit board includes: first to sixth fixed signal transmission pads arranged in sequence in a first direction; first to sixth operating signal transmission pads arranged in sequence along the first direction; the first working signal transmission pad to the sixth working signal transmission pad and the first fixed signal transmission pad to the sixth fixed signal transmission pad are arranged along a second direction; the first to third operating signal transmission pads are formed into an integral structure, and the fourth to sixth operating signal transmission pads are formed into an integral structure; the first to sixth fixed signal transmission pads are formed as an integral structure;
a first pin of the first protection diode is coupled with the first working signal transmission pad, and a second pin of the first protection diode is coupled with the first fixed signal transmission pad;
a first pin of the first capacitor is coupled with the second working signal transmission bonding pad, and a second pin of the first capacitor is coupled with the second fixed signal transmission bonding pad;
the first pin of the second capacitor is coupled with the third working signal transmission bonding pad, and the second pin of the second capacitor is coupled with the third fixed signal transmission bonding pad;
a first pin of the third capacitor is coupled with the fourth working signal transmission pad, and a second pin of the third capacitor is coupled with the fourth fixed signal transmission pad;
a first pin of the fourth capacitor is coupled with the fifth working signal transmission pad, and a second pin of the fourth capacitor is coupled with the fifth fixed signal transmission pad;
a first pin of the second protection diode is coupled to the sixth operating signal transmission pad, and a second pin of the second protection diode is coupled to the sixth fixed signal transmission pad.
Optionally, the circuit board includes: a first target signal transmission pad, a second target signal transmission pad and a third target signal transmission pad arranged in sequence along a first direction;
the circuit board further includes a second filter circuit, the second filter circuit including: a first magnetic bead device, a second magnetic bead device and a third magnetic bead device;
a first pin of the first magnetic bead device is coupled with a first pad of the first target signal transmission pad, and a second pin of the first magnetic bead device is coupled with a second pad of the first target signal transmission pad;
a first pin of the second magnetic bead device is coupled with a first pad of the second target signal transmission pad, and a second pin of the second magnetic bead device is coupled with a second pad of the second target signal transmission pad;
a first pin of the third magnetic bead device is coupled to a first pad of the third target signal transmission pad, and a second pin of the third magnetic bead device is coupled to a second pad of the third target signal transmission pad.
Based on the technical scheme of the circuit board, a second aspect of the invention provides a display device, which comprises the circuit board, a display panel, a connector and a main board, wherein the display panel is electrically connected with the circuit board, and the circuit board is connected with the main board through the connector.
Optionally, the display panel includes a touch layer, and the touch layer includes: the touch control device comprises a plurality of first touch control electrodes, a plurality of second touch control electrodes, a first function wire electrically connected with the first touch control electrodes, and a second function wire electrically connected with the second touch control electrodes; the first functional wire and the second functional wire are respectively coupled with a touch chip in the circuit board;
the touch control chip is also respectively coupled with a second bonding pad in the circuit board; a first pad in the circuit board is coupled to a first target signal transmission line in the circuit board, which is connected to the motherboard through the connector.
In the technical scheme provided by the invention, the circuit board comprises the first conducting layer and the second conducting layer; the first conductive layer includes a fixed signal transmission pad and a target signal transmission pad that are oppositely disposed. When the circuit board is in practical application, the fixed signal transmission bonding pad transmits a fixed signal with a stable potential, so that the interference of an external signal on a target signal transmitted on the target signal transmission bonding pad can be effectively shielded, and the stability of the target signal transmitted on the target signal transmission bonding pad is ensured. In addition, the circuit board only comprises two conductive layers, so that the manufacturing process difficulty and the manufacturing cost of the circuit board are effectively reduced. Therefore, the technical scheme provided by the invention can effectively shield the interference of the external environment to the target signal while overcoming the problems of the level of the manufacturing process, high manufacturing cost, poor stability and the like.
In the technical scheme provided by the invention, through the optimized layout of the first conducting layer and the second conducting layer, the orthographic projection of the first target signal transmission line on the first conducting layer is at least partially overlapped with the fixed signal transmission pad, so that the first target signal transmission line can effectively shield the interference of an external signal on a target signal transmitted on the first target signal transmission line by using the fixed signal transmission pad in a limited layout space.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 is an overall schematic diagram of a circuit board according to an embodiment of the present invention;
FIG. 2 is an enlarged view of portion A of FIG. 1;
FIG. 3 is a layout diagram of the first conductive layer in FIG. 2;
FIG. 4 is a schematic layout diagram of the first target signal transmission line and the shield line of FIG. 2;
FIG. 5 is a schematic diagram of a protection circuit according to an embodiment of the present invention;
FIG. 6 is a diagram of a first filter circuit according to an embodiment of the present invention;
FIG. 7 is a diagram of a second filter circuit according to an embodiment of the present invention;
FIG. 8 is a partial schematic diagram of a bridging scheme provided by an embodiment of the present invention;
fig. 9 is a schematic view of the soldered device in fig. 3.
Reference numerals:
102-a second fixed signal transfer pad, 103-a third fixed signal transfer pad,
104-a fourth fixed signal transfer pad, 105-a fifth fixed signal transfer pad,
106-sixth fixed signal transmission pad, 112-second working signal transmission pad,
113-a third operating signal transmitting pad, 114-a fourth operating signal transmitting pad,
115-fifth operating signal transmitting pad, 116-sixth operating signal transmitting pad,
121-a first destination signal transfer pad, 122-a second destination signal transfer pad,
123-a third target signal transfer pad, 13-an extension,
21-a first target signal transmission line, 22-a second target signal transmission line,
23-shield line, D1-first protection diode,
d2-second protection diode, C1-first capacitor,
c2-second capacitance, C3-third capacitance,
c4-fourth capacitance, PAE 1-first magnetic bead device,
PAE 2-second magnetic bead device, PAE 3-third magnetic bead device,
30-touch signal line leads, 40-bonding regions,
50-third layer conductive pattern.
Detailed Description
In order to further explain the circuit board and the display device provided by the embodiment of the invention, the following detailed description is made in conjunction with the accompanying drawings of the specification.
Referring to fig. 1 to 4, an embodiment of the invention provides a circuit board, including: the conductive structure comprises a first conductive layer and a second conductive layer which are arranged in different layers, wherein an insulating layer is arranged between the first conductive layer and the second conductive layer;
the first conductive layer includes a plurality of device pads including fixed signal transmission pads (e.g., second to sixth fixed signal transmission pads 102 to 106) and target signal transmission pads (e.g., first to third target signal transmission pads 121 to 123) adjacent to the target signal transmission pads;
the second conductive layer includes a first target signal transmission line 21, and the first target signal transmission line 21 is coupled to the corresponding target signal transmission pad.
Illustratively, the Circuit board includes a Main Flexible Printed Circuit (MFPC). The circuit board includes a bonding area 40, and the bonding area 40 of the circuit board is used for bonding with the display panel. The circuit board can also be coupled with a mainboard through a connector, and the mainboard realizes signal transmission between the circuit board and the display panel.
Illustratively, the circuit board comprises a two-layer board, namely a first conducting layer and a second conducting layer which are arranged in different layers, an insulating layer is arranged between the first conducting layer and the second conducting layer, and a part of structure in the first conducting layer and a part of structure between the second conducting layers can be electrically connected through a via hole penetrating through the insulating layer.
Illustratively, the first conductive layer comprises a first metal layer and the second conductive layer comprises a second metal layer.
Illustratively, the first conductive layer includes a plurality of device pads for soldering respective devices. Illustratively, the plurality of device pads include a fixed signal transfer pad for transferring a fixed signal having a stable potential, such as a GND signal, and a target signal transfer pad. The target signal transmission pad is used for transmitting a target signal.
Illustratively, the fixed signal transmission pad is adjacent to the target signal transmission pad, the fixed signal transmission pad is spaced apart from the target signal transmission pad, and no other pad is included between the fixed signal transmission pad and the target signal transmission pad. Illustratively, the fixed signal transmission pad is arranged adjacent to the target signal transmission pad, and the fixed signal transmission pad is arranged between the high-frequency signal transmission line and the target signal transmission pad, so as to shield the target signal transmission pad from the high-frequency signal from the first conductive layer; and simultaneously can shield the interference of the second conductive layer to the target signal transmission pad.
Illustratively, the second conductive layer includes first target signal transmission lines 21, the target signal transmission pads of the first target signal transmission lines 21 are in one-to-one correspondence, and the first target signal transmission lines 21 are coupled with the corresponding target signal transmission pads.
As shown in fig. 2 and 4, in some embodiments, an orthographic projection of the first target signal transmission line 21 on the first conductive layer at least partially overlaps the fixed signal transmission pads (e.g., the third to sixth fixed signal transmission pads 103 to 106).
Illustratively, the first target signal transmission line 21 is used for transmitting the target signal.
Illustratively, the orthographic projection of the first target signal transmission line 21 on the first conductive layer passes through the area where the partial pad included in the first conductive layer is located.
Illustratively, the orthographic projection of the first target signal transmission line 21 on the first conductive layer is at least partially overlapped with the fixed signal transmission pad, so that the influence of an alternating electromagnetic field generated by the change of other signals on the first conductive layer and the second conductive layer on the target signal can be effectively avoided, and meanwhile, the fixed signal transmission pad provides a metal shielding layer for the target signal, so that the interference of other external signals can be effectively isolated.
It should be noted that the MFPC is a bridge connecting the main board and the display panel, there are many power lines and signal lines related to display and touch in the MFPC, and corresponding routing lines are also increased to support more functions, and the layout space of the MFPC is further compressed by the overall compression.
According to the specific structure of the circuit board, the circuit board provided by the embodiment of the invention comprises the first conductive layer and the second conductive layer; the first conductive layer includes a fixed signal transmission pad and a target signal transmission pad that are oppositely disposed. When the circuit board is in practical application, the fixed signal transmission bonding pad transmits a fixed signal with a stable potential, so that the interference of an external signal on a target signal transmitted on the target signal transmission bonding pad can be effectively shielded, and the stability of the target signal transmitted on the target signal transmission bonding pad is ensured. In addition, the circuit board only comprises two conductive layers, so that the manufacturing process difficulty and the manufacturing cost of the circuit board are effectively reduced. Therefore, the circuit board provided by the embodiment of the invention can effectively shield the interference of the external environment to the target signal while overcoming the problems of the manufacturing process level, high manufacturing cost, poor stability and the like.
In the circuit board provided by the embodiment of the present invention, by optimizing the layout of the first conductive layer and the second conductive layer, the orthographic projection of the first target signal transmission line 21 on the first conductive layer is set to be at least partially overlapped with the fixed signal transmission pad, so that in a limited layout space, the first target signal transmission line 21 can effectively shield interference of an external signal on a target signal transmitted on the first target signal transmission line 21 by using the fixed signal transmission pad.
As shown in fig. 2 and 3, in some embodiments, the plurality of device pads includes: a fixed signal transfer pad group Z1 and a target signal transfer pad group Z2, the fixed signal transfer pad group Z1 including a plurality of fixed signal transfer pads, the plurality of fixed signal transfer pads being arranged in a first direction; the target signal transfer pad group Z2 includes a plurality of target signal transfer pads arranged in a first direction; the fixed signal transfer pad group Z1 and the target signal transfer pad group Z2 are arranged along a second direction, which intersects the first direction.
Illustratively, the fixed signal transmission pad group Z1 includes a plurality of fixed signal transmission pads arranged along a first direction, the plurality of fixed signal transmission pads being coupled. Illustratively, the plurality of fixed signal transmission pads are formed as a unitary structure. Illustratively, at least two of the plurality of fixed signal transmission pads are different in size.
Illustratively, the target signal transmission pad group Z2 includes a plurality of target signal transmission pads arranged along the first direction, and the plurality of target signal transmission pads are arranged at intervals and are independent of each other.
Illustratively, the first direction includes a Y direction and the second direction includes an X direction.
The fixed signal transmission pad group Z1 and the target signal transmission pad group Z2 are arranged along the second direction, and no other structure is arranged between the fixed signal transmission pads and the target signal transmission pads, so that the fixed signal transmission pads can effectively shield interference of external signals on target signals transmitted on the target signal transmission pads, and stability of the target signals transmitted on the target signal transmission pads is ensured.
As shown in fig. 2 to 4, in some embodiments, the second conductive layer includes a plurality of first target signal transmission lines 21, and the plurality of first target signal transmission lines 21 are coupled to the plurality of target signal transmission pads in a one-to-one correspondence;
the first target signal transmission line 21 includes a portion extending in the first direction, and orthographic projections of the first target signal transmission line 21 on the first conductive layer at least partially overlap the plurality of fixed signal transmission pads, respectively.
Illustratively, the second conductive layer includes a plurality of first target signal transmission lines 21, the plurality of first target signal transmission lines 21 are sequentially disposed, and the plurality of first target signal transmission lines 21 are insulated from each other. Illustratively, the target signal transmission pad includes an extension portion 13, an orthographic projection of the first target signal transmission line 21 on the first conductive layer overlaps the corresponding extension portion 13, and the first target signal transmission line 21 and the extension portion 13 are coupled at the overlap by a via penetrating through an insulating layer.
Illustratively, the orthographic projection of each of the first target signal transmission lines 21 on the first conductive layer at least partially overlaps the plurality of fixed signal transmission pads, respectively.
In the circuit board provided by the above embodiment, by setting the orthographic projection of the first target signal transmission line 21 on the first conductive layer to at least partially overlap with the plurality of fixed signal transmission pads, the first target signal transmission line 21 can utilize the fixed signal transmission pads to more effectively shield the interference of the external signal on the target signal transmitted on the first target signal transmission line 21.
As shown in fig. 2-4, in some embodiments, the second conductive layer further comprises: a shield line 23, the shield line 23 forming a semi-enclosed structure, an end of the first target signal transmission line 21 coupled to the target signal transmission pad being located inside the semi-enclosed structure.
Illustratively, the shield line 23 transmits a signal having a fixed potential. Illustratively, the shield line 23 transmits a GND signal thereon.
As shown in fig. 4, for example, the shielding line 23 is disposed around an end of the first target signal transmission line 21 coupled to the target signal transmission pad, the shielding line 23 is a non-closed curve, an opening is formed between two ends of the non-closed curve, so that the shielding line 23 is formed into a semi-enclosed structure, an end of the first target signal transmission line 21 coupled to the target signal transmission pad is located inside the semi-enclosed structure, a portion of the first target signal transmission line 21 coupled to the end protrudes from the opening out of the semi-enclosed structure, and the shielding line 23 is insulated from the first target signal transmission line 21.
Illustratively, the orthographic projection of the shielding wire 23 on the first conductive layer at least partially overlaps the target signal transmission pad.
In the circuit board provided in the above embodiment, the shielding line 23 is arranged to surround the end of the first target signal transmission line 21 coupled to the target signal transmission pad, so that interference of other signals in the second conductive layer on the target signal transmitted by the first target signal transmission line 21 is effectively shielded, and stability of the target signal transmitted by the first target signal transmission line 21 is further ensured.
In some embodiments, the shield wire 23 is electrically connected to the fixed signal transfer pad.
Illustratively, the shield line 23 transmits the same signal, having the same potential, as the fixed signal transmission pad.
Illustratively, the shield wire 23 is electrically connected to the fixed signal transmission pad directly or indirectly.
In the circuit board provided by the above embodiment, by arranging the shielding wire 23 to be electrically connected with the fixed signal transmission pad, the number of signal wires in the circuit board is reduced, which is beneficial to better improving the stability of the circuit board.
As shown in fig. 2 to 4, in some embodiments, the destination signal transmission pads include a first pad P1 and a second pad P2, the first pad P1 being coupled with the corresponding first destination signal transmission line 21;
the circuit board further comprises a touch chip and an electronic device; the touch chip is coupled with the second pad P2; the electronic device includes a first pin coupled with a corresponding first pad P1 and a second pin coupled with a corresponding second pad P2.
Illustratively, the first pad P1 and the second pad P2 are arranged along the second direction, and a target signal transmission pad includes a first pad P1 and a second pad P2 corresponding to an electronic device, a first lead of the electronic device is soldered to the corresponding first pad P1, and a second lead of the electronic device is soldered to the corresponding second pad P2.
Illustratively, the first pad P1 includes an extension 13, and the extension 13 is coupled to the first target signal transmission line 21 corresponding to the first pad P1 through a via.
Illustratively, the second pads P2 are coupled to corresponding pins in the touch chip.
For example, the circuit board is bound to a display panel, and the touch chip can receive a touch signal provided by the display panel.
In some embodiments, the plurality of first target signal transmission lines 21 include at least one of a MISO (Master Input Slave Output, chinese) signal transmission line, a MOSI (Master Output Slave Input, chinese) signal transmission line, and a clock signal line.
It should be noted that the touch chip in the circuit board receives the touch signal fed back by the display panel, and transmits the touch signal through the SPI bus after performing corresponding processing on the touch signal. The SPI signal transmitted by the SPI bus is a signal which meets an SPI protocol and is related to the touch signal.
As shown in fig. 3, 5, 6 and 9, in some embodiments, the circuit board further comprises: a protection circuit and a first filter circuit;
the protection circuit includes: a first protection diode D1 and a second protection diode D2;
the first filter circuit includes: a first capacitor C1, a second capacitor C2, a third capacitor C3 and a fourth capacitor C4;
the circuit board includes: first to sixth fixed signal transfer pads (not shown) 106 arranged in this order in the first direction; and first to sixth operating signal transmitting pads 116 arranged in sequence in the first direction; the first to sixth working signal transmission pads 116 and the first to sixth fixed signal transmission pads 106 are arranged in a second direction; the first to third operation signal transmission pads 113 to 113 are formed in an integral structure, and the fourth to sixth operation signal transmission pads 114 to 116 are formed in an integral structure; the first to sixth fixed signal transfer pads 106 are formed as an integral structure;
a first pin of the first protection diode D1 is coupled with the first operating signal transmission pad, and a second pin of the first protection diode D1 is coupled with the first fixed signal transmission pad;
a first pin of the first capacitor C1 is coupled to the second operating signal transmission pad 112, and a second pin of the first capacitor C1 is coupled to the second fixed signal transmission pad 102;
a first pin of the second capacitor C2 is coupled to the third operating signal transmission pad 113, and a second pin of the second capacitor C2 is coupled to the third fixed signal transmission pad 103;
a first pin of the third capacitor C3 is coupled to the fourth operating signal transmitting pad 114, and a second pin of the third capacitor C3 is coupled to the fourth fixed signal transmitting pad 104;
a first pin of the fourth capacitor C4 is coupled to the fifth operating signal transmission pad 115, and a second pin of the fourth capacitor C4 is coupled to the fifth fixed signal transmission pad 105;
a first pin of the second protection diode D2 is coupled to the sixth operating signal transmitting pad 116, and a second pin of the second protection diode D2 is coupled to the sixth fixed signal transmitting pad 106.
Illustratively, the protection circuit includes an ESD protection circuit.
Illustratively, the first and second protection diodes D1 and D2 comprise TVS diodes (i.e., transient voltage suppression diodes).
Illustratively, the first to third operating signal transfer pads 113 transfer a low level signal VGL _ REG. The fourth through sixth operating signal transmitting pads 114 through 116 transmit a high level signal VRGH. The first to sixth fixed signal transfer pads 106 transfer GND signals.
As shown in fig. 3, 7 and 9, in some embodiments, the circuit board includes: a first target signal transfer pad 121, a second target signal transfer pad 122, and a third target signal transfer pad 123 arranged in this order along the first direction;
the circuit board further includes a second filter circuit, the second filter circuit including: the magnetic bead device comprises a first magnetic bead device PAE1, a second magnetic bead device PAE2 and a third magnetic bead device PAE 3;
a first pin of the first magnetic bead device PAE1 is coupled with the first pad P1 of the first target signal transmission pad 121, and a second pin of the first magnetic bead device PAE1 is coupled with the second pad P2 of the first target signal transmission pad 121;
a first pin of the second magnetic bead device PAE2 is coupled with the first pad P1 of the second target signal transmission pad 122, and a second pin of the second magnetic bead device PAE2 is coupled with the second pad P2 of the second target signal transmission pad 122;
the first pin of the third magnetic bead device PAE3 is coupled with the first pad P1 of the third target signal transfer pad 123, and the second pin of the third magnetic bead device PAE3 is coupled with the second pad P2 of the third target signal transfer pad 123.
Illustratively, the orthographic projection of the first target signal transmission line 21 coupled to the first target signal transmission pad 121 on the first conductive layer partially overlaps the third fixed signal transmission pad 103, the fourth fixed signal transmission pad 104, the fifth fixed signal transmission pad 105 and the sixth fixed signal transmission pad 106, respectively.
Illustratively, the orthographic projection of the first target signal transmission line 21 coupled to the second target signal transmission pad 122 on the first conductive layer partially overlaps the fourth fixed signal transmission pad 104, the fifth fixed signal transmission pad 105 and the sixth fixed signal transmission pad 106, respectively.
Illustratively, the orthographic projection of the first target signal transmission line 21 coupled to the third target signal transmission pad 123 on the first conductive layer partially overlaps the fifth fixed signal transmission pad 105 and the sixth fixed signal transmission pad 106, respectively.
Illustratively, the first target signal transmission line 21 to which the first target signal transmission pad 121 is coupled transmits a clock signal (e.g., TSP _ CLK _1), the first target signal transmission line 21 to which the second target signal transmission pad 122 is coupled transmits a MOSI signal (e.g., TSP _ MOSI _1), and the first target signal transmission line 21 to which the third target signal transmission pad 123 is coupled transmits a MISO signal (e.g., TSP _ MISO _ 1). TSP _ CLK, TSP _ MOSI, and TSP _ MISO illustrated in fig. 7 are signals received from the touch chip terminal.
It should be noted that the circuit board provided in the above embodiments is applicable to a two-layer board scheme and a bridging scheme, where the two-layer board scheme is that the touch signal leads in the circuit board and the MIPI lines in the circuit board are arranged in different layers, and the touch signal leads directly cross over the MIPI lines. As shown in fig. 8, the bridging scheme means that the touch signal line lead 30 in the circuit board crosses over the MIPI line through the locally disposed third layer of conductive pattern 50.
It is noted that the touch signal lead is coupled to a touch signal line in the display panel. Namely the first functional trace or the second functional trace mentioned later.
The embodiment of the invention also provides a display device, which comprises the circuit board provided by the embodiment, and further comprises a display panel, a connector and a mainboard, wherein the display panel is electrically connected with the circuit board, and the circuit board is connected with the mainboard through the connector.
Illustratively, the display panel includes an organic light emitting diode display panel, a liquid crystal display panel, and the like. And the display panel is bound with a driving chip.
Illustratively, the circuit board is bound at the edge of the display panel, the circuit board is connected with the motherboard through the connector, and the display panel can realize signal transmission with the motherboard through the circuit board and the connector.
The circuit board provided by the above embodiment includes the first conductive layer and the second conductive layer; the first conductive layer includes a fixed signal transmission pad and a target signal transmission pad that are oppositely disposed. When the circuit board is in practical application, the fixed signal transmission bonding pad transmits a fixed signal with a stable potential, so that the interference of an external signal on a target signal transmitted on the target signal transmission bonding pad can be effectively shielded, and the stability of the target signal transmitted on the target signal transmission bonding pad is ensured. In addition, the circuit board only comprises two conductive layers, so that the manufacturing process difficulty and the manufacturing cost of the circuit board are effectively reduced. Therefore, the circuit board provided by the embodiment can effectively shield the interference of the external environment to the target signal while overcoming the problems of the manufacturing process level, high manufacturing cost, poor stability and the like.
Therefore, the display device provided by the embodiment of the invention has the beneficial effects when the display device comprises the circuit board, and the description is omitted.
The display device may be: any product or component with a display function, such as a television, a display, a digital photo frame, a mobile phone, a tablet computer and the like.
In some embodiments, the display panel includes a touch layer comprising: the touch control device comprises a plurality of first touch control electrodes, a plurality of second touch control electrodes, a first function wire electrically connected with the first touch control electrodes, and a second function wire electrically connected with the second touch control electrodes; the first functional wire and the second functional wire are respectively coupled with a touch chip in the circuit board;
the touch control chip is also respectively coupled with a second bonding pad in the circuit board; the first pad in the circuit board is coupled to a first target signal transmission line 21 in the circuit board, and the first target signal transmission line 21 is connected to the motherboard through the connector.
Illustratively, the display panel adopts FMLOC (Flexible Multi-Layer On Cell) technology, and the display panel includes a touch Layer, where the touch Layer includes a first touch electrode and a second touch electrode, the first touch electrode is one of a driving electrode and a sensing electrode, and the second touch electrode is the other of the driving electrode and the sensing electrode. The touch layer further comprises a first functional wire electrically connected with the first touch electrode and a second functional wire electrically connected with the second touch electrode. For example, the first touch electrode includes a driving electrode, the second touch electrode includes a sensing electrode, the first functional trace is used for transmitting a driving signal to the first touch electrode, and the second functional trace is used for transmitting a sensing signal sensed by the second touch electrode to a touch chip in a circuit board.
As shown in fig. 1 to 3, for example, the circuit board includes the touch chip TIC, and a part of pins of the touch chip TIC are electrically connected to the second pads of the circuit board in a one-to-one correspondence manner. For example, some pins of the touch chip TIC are electrically connected to the second pads of the circuit board through corresponding second target signal transmission lines 22 in a one-to-one correspondence manner.
Illustratively, the first pads in the circuit board are coupled to the first target signal transmission lines 21 in the circuit board in a one-to-one correspondence, and the first target signal transmission lines 21 are connected to the motherboard through the connector.
It should be noted that "same layer" in the embodiments of the present invention may refer to a film layer on the same structural layer. Or, for example, the film layer on the same layer may be a layer structure formed by forming a film layer for forming a specific pattern by using the same film forming process and then patterning the film layer by using the same mask plate through a one-time patterning process. Depending on the specific pattern, one patterning process may include multiple exposure, development or etching processes, and the specific pattern in the formed layer structure may be continuous or discontinuous. These specific patterns may also be at different heights or have different thicknesses.
In the embodiments of the methods of the present invention, the sequence numbers of the steps are not used to limit the sequence of the steps, and for those skilled in the art, the sequence of the steps is not changed without creative efforts.
It should be noted that, in the present specification, all the embodiments are described in a progressive manner, and the same and similar parts among the embodiments are referred to each other, and each embodiment focuses on the differences from the other embodiments. In particular, as for the method embodiments, since they are substantially similar to the product embodiments, they are described simply, and reference may be made to the partial description of the product embodiments for relevant points.
Unless defined otherwise, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this invention belongs. The use of "first," "second," and similar terms in this disclosure is not intended to indicate any order, quantity, or importance, but rather is used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that the element or item listed before the word covers the element or item listed after the word and its equivalents, but does not exclude other elements or items. The terms "connected," "coupled," or "connected," and the like, are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships may also be changed accordingly.
It will be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "under" another element, it can be "directly on" or "under" the other element or intervening elements may be present.
In the foregoing description of embodiments, the particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.

Claims (11)

1. A circuit board, comprising: the conductive structure comprises a first conductive layer and a second conductive layer which are arranged in different layers, wherein an insulating layer is arranged between the first conductive layer and the second conductive layer;
the first conductive layer comprises a plurality of device pads comprising a fixed signal transmission pad and a target signal transmission pad, the fixed signal transmission pad being adjacent to the target signal transmission pad;
the second conductive layer includes a first target signal transmission line coupled with the corresponding target signal transmission pad;
an orthographic projection of the first target signal transmission line on the first conductive layer at least partially overlaps the fixed signal transmission pad.
2. The circuit board of claim 1, wherein the plurality of device pads comprise: the signal transmission device comprises a fixed signal transmission welding disc group and a target signal transmission welding disc group, wherein the fixed signal transmission welding disc group comprises a plurality of fixed signal transmission welding discs which are arranged along a first direction; the target signal transmission pad group comprises a plurality of target signal transmission pads which are arranged along a first direction; the fixed signal transmission pad group and the target signal transmission pad group are arranged along a second direction, and the second direction is intersected with the first direction.
3. The circuit board of claim 2, wherein the second conductive layer comprises a plurality of first target signal transmission lines coupled in one-to-one correspondence with the plurality of target signal transmission pads;
the first target signal transmission line includes a portion extending in the first direction, and orthographic projections of the first target signal transmission line on the first conductive layer at least partially overlap the plurality of fixed signal transmission pads, respectively.
4. The circuit board of claim 2 or 3, wherein the second conductive layer further comprises: a shield line forming a semi-enclosed structure, an end of the first target signal transmission line coupled with the target signal transmission pad being located inside the semi-enclosed structure.
5. The circuit board of claim 4, wherein the shield wire is electrically connected to the fixed signal transmission pad.
6. The circuit board of claim 2 or 3, wherein the destination signal transmission pads comprise first pads and second pads, the first pads being coupled with the corresponding first destination signal transmission lines;
the circuit board further comprises a touch chip and an electronic device; the touch chip is coupled with the second bonding pad; the electronic device comprises a first pin and a second pin, the first pin of the electronic device is coupled with the corresponding first bonding pad, and the second pin of the electronic device is coupled with the corresponding second bonding pad.
7. The circuit board of claim 6, wherein the plurality of first target signal transmission lines comprise at least one of a MISO signal transmission line, a MOSI signal transmission line, and a clock signal line.
8. The circuit board of claim 7, further comprising: a protection circuit and a first filter circuit;
the protection circuit includes: a first protection diode and a second protection diode;
the first filter circuit includes: a first capacitor, a second capacitor, a third capacitor and a fourth capacitor;
the circuit board includes: first to sixth fixed signal transmission pads arranged in sequence in a first direction; first to sixth operating signal transmission pads arranged in sequence along the first direction; the first working signal transmission pad to the sixth working signal transmission pad and the first fixed signal transmission pad to the sixth fixed signal transmission pad are arranged along a second direction; the first to third operating signal transmission pads are formed into an integral structure, and the fourth to sixth operating signal transmission pads are formed into an integral structure; the first to sixth fixed signal transmission pads are formed as an integral structure;
a first pin of the first protection diode is coupled with the first working signal transmission pad, and a second pin of the first protection diode is coupled with the first fixed signal transmission pad;
a first pin of the first capacitor is coupled with the second working signal transmission bonding pad, and a second pin of the first capacitor is coupled with the second fixed signal transmission bonding pad;
the first pin of the second capacitor is coupled with the third working signal transmission bonding pad, and the second pin of the second capacitor is coupled with the third fixed signal transmission bonding pad;
a first pin of the third capacitor is coupled with the fourth working signal transmission pad, and a second pin of the third capacitor is coupled with the fourth fixed signal transmission pad;
a first pin of the fourth capacitor is coupled with the fifth working signal transmission pad, and a second pin of the fourth capacitor is coupled with the fifth fixed signal transmission pad;
a first pin of the second protection diode is coupled to the sixth operating signal transmission pad, and a second pin of the second protection diode is coupled to the sixth fixed signal transmission pad.
9. The circuit board of claim 8, wherein the circuit board comprises: a first target signal transmission pad, a second target signal transmission pad and a third target signal transmission pad arranged in sequence along a first direction;
the circuit board further includes a second filter circuit, the second filter circuit including: a first magnetic bead device, a second magnetic bead device and a third magnetic bead device;
a first pin of the first magnetic bead device is coupled with a first pad of the first target signal transmission pad, and a second pin of the first magnetic bead device is coupled with a second pad of the first target signal transmission pad;
a first pin of the second magnetic bead device is coupled with a first pad of the second target signal transmission pad, and a second pin of the second magnetic bead device is coupled with a second pad of the second target signal transmission pad;
a first pin of the third magnetic bead device is coupled to a first pad of the third target signal transmission pad, and a second pin of the third magnetic bead device is coupled to a second pad of the third target signal transmission pad.
10. A display device comprising the circuit board according to any one of claims 1 to 9, the display device further comprising a display panel, a connector, and a main board, wherein the display panel is electrically connected to the circuit board, and the circuit board is connected to the main board through the connector.
11. The display device according to claim 10,
the display panel includes a touch layer including: the touch control device comprises a plurality of first touch control electrodes, a plurality of second touch control electrodes, a first function wire electrically connected with the first touch control electrodes, and a second function wire electrically connected with the second touch control electrodes; the first functional wire and the second functional wire are respectively coupled with a touch chip in the circuit board;
the touch control chip is also respectively coupled with a second bonding pad in the circuit board; a first pad in the circuit board is coupled to a first target signal transmission line in the circuit board, which is connected to the motherboard through the connector.
CN202110576517.5A 2021-05-26 2021-05-26 Circuit board and display device Pending CN113260147A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110576517.5A CN113260147A (en) 2021-05-26 2021-05-26 Circuit board and display device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110576517.5A CN113260147A (en) 2021-05-26 2021-05-26 Circuit board and display device

Publications (1)

Publication Number Publication Date
CN113260147A true CN113260147A (en) 2021-08-13

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202110576517.5A Pending CN113260147A (en) 2021-05-26 2021-05-26 Circuit board and display device

Country Status (1)

Country Link
CN (1) CN113260147A (en)

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