CN113257725B

CN113257725B - Semiconductor wafer box with cleaning function

Info

Publication number: CN113257725B
Application number: CN202110332602.7A
Authority: CN
Inventors: 钱诚; 李刚; 童建
Original assignee: Wuxi Aelsystem Intelligent Equipment Co ltd
Current assignee: Wuxi Aelsystem Intelligent Equipment Co ltd
Priority date: 2021-03-29
Filing date: 2021-03-29
Publication date: 2022-10-18
Anticipated expiration: 2041-03-29
Also published as: CN113257725A

Abstract

The application relates to a semiconductor wafer box with cleaning function, including curb plate and stay tube, set up support column and one side on the stay tube and set up the joint, fluid such as air or nitrogen gas after washing liquid, water, normal atmospheric temperature or the heating is from connecting through the stay tube and spout from the support column. Because the supporting columns are used as the dividing parts of the wafers and correspond to the wafers one to one, each wafer can be cleaned, and the problem that the wafers are difficult to clean when a plurality of wafers are arranged in the wafer box is solved.

Description

Semiconductor wafer box with cleaning function

Technical Field

The application belongs to the technical field of wafer cleaning equipment, and particularly relates to a semiconductor wafer box with a cleaning function.

Background

Semiconductor wafers need to be cleaned during the production process to achieve the effects of removing photoresist, removing etching solution, cleaning the surface and the like. When semiconductor wafers are cleaned, two cleaning modes are adopted, wherein one cleaning mode is that the semiconductor wafers are cleaned by one piece, and the other cleaning mode is that the semiconductor wafers are placed in a semiconductor wafer box for transportation and cleaning.

The manner of pod transport and cleaning is increasingly adopted by wafer manufacturers due to their high efficiency. However, since the wafers are placed in the wafer cassette in a row, the smaller the gap between the wafers is, the more wafers can be accommodated, but when the gap is too small, the flow of the cleaning liquid is blocked, and the cleaning becomes difficult, and thus a wafer cleaning method capable of improving the cleaning effect is required.

Disclosure of Invention

The technical problem to be solved by the invention is as follows: in order to solve the above-mentioned deficiency in the prior art, thus provide a semiconductor wafer cassette with cleaning function.

The technical scheme adopted by the invention for solving the technical problems is as follows:

a semiconductor wafer cassette with a cleaning function, comprising:

the side plates are parallel to each other;

the supporting tubes are connected with the two side plates, 4 supporting tubes are arranged in a circumferential mode, the supporting tubes are hollow flow channels for fluid to pass through, the distance between the two supporting tubes positioned at the bottom is smaller than the diameter of the wafer, the distance between the two supporting tubes positioned in the middle is equal to the diameter of the wafer, and the distance between the two supporting tubes positioned at the top is larger than or equal to the diameter of the wafer;

the supporting columns are arranged on the supporting tubes in rows, are hollow and provided with openings, are communicated with the flow channels of the supporting tubes, are used for placing wafers between two adjacent supporting columns, and are clamped and fixed by the side surfaces of the supporting columns;

one end or two ends of the supporting pipe are provided with joints which can be communicated with pipelines.

Preferably, the semiconductor wafer cassette with a cleaning function of the present invention has a partition plate at the opening of the support column to divide the opening in half and face both sides.

Preferably, the semiconductor wafer cassette with a cleaning function of the present invention has the opening opened on the side wall of the supporting column.

Preferably, the two supporting tubes at the bottom of the semiconductor wafer box with the cleaning function are positioned at a position 3/4 pi to 4/5 pi from a wafer point as a starting point; the two supporting tubes in the middle are positioned at the position from the wafer point as the starting point from 1/2 pi to 2/3 pi; the two supporting tubes at the top are positioned at the position from the wafer point as the starting point from 1/4 pi to 1/3 pi.

Preferably, in the semiconductor wafer cassette with a cleaning function of the present invention, an included angle α between openings of the support columns on the two support tubes at the bottom and a horizontal plane is 50 ° to 60 °; the included angle beta between the openings of the support columns on the two support tubes in the middle and the horizontal plane is +/-10 degrees; the included angle gamma between the openings of the support columns on the two support tubes at the top and the horizontal plane is-10 degrees to-20 degrees, the inclined upward direction of the openings in the included angle is positive, and the inclined downward direction is negative.

Preferably, in the semiconductor wafer cassette with a cleaning function of the present invention, the side surface of the supporting column has a flat surface, so that the contact surface of the supporting column and the wafer is in surface-to-surface contact, and the contact surface is improved to prevent damage.

Preferably, the semiconductor wafer box with the cleaning function of the invention, the fluid comprises cleaning liquid, water and gas.

Preferably, the semiconductor wafer cassette with the cleaning function of the invention has a hollow middle side plate, hook grooves on two sides and supporting legs on the bottom.

The beneficial effects of the invention are:

according to the semiconductor wafer box with the cleaning function, cleaning fluid, water, air or nitrogen and other fluids at normal temperature or after heating pass through the supporting tube from the joint and are sprayed out from the supporting column. Because the supporting columns are used as the dividing parts of the wafers and correspond to the wafers one to one, each wafer can be cleaned, and the problem that the wafers are difficult to clean when a plurality of wafers are arranged in the wafer box is solved.

Drawings

The technical solution of the present application is further explained below with reference to the drawings and the embodiments.

FIG. 1 is a schematic structural diagram of a semiconductor wafer cassette with a cleaning function according to an embodiment of the present application;

FIG. 2a is a longitudinal cross-sectional view of FIG. 1;

FIG. 2b is the view of FIG. 2a after a wafer has been placed therein;

FIG. 2c is a schematic view of the support post arrangement position and angle of FIG. 2 a;

FIG. 3 is a block diagram of adjacent support columns in one embodiment of the present application;

FIG. 4 is a block diagram of adjacent support columns in another embodiment of the present application;

FIG. 5 is a perspective view of a support post in one embodiment of the present application;

the reference numbers in the figures are:

1. a side plate;

2. supporting a tube;

3. a support pillar;

11. a hook groove;

12. supporting legs;

21. a joint;

31. an opening;

32. a partition plate;

33. a plane;

9. and (5) a wafer.

Detailed Description

It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.

In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientation or positional relationship indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and are not to be considered limiting of the scope of the present application. In the description of the invention, "a plurality" means two or more unless otherwise specified.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art through specific situations.

The technical solutions of the present application will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.

Examples

The present embodiment provides a semiconductor wafer cassette with a cleaning function, as shown in fig. 1, including:

the side plate comprises a side plate 1 and two parallel side plates, as shown in fig. 2a and 2b, the side plate 1 is hollow in the middle (for reducing the material usage amount), and is provided with hook grooves 11 at two sides for being conveniently matched with a manipulator, and the bottom of the side plate is provided with supporting legs 12;

the supporting tubes 2 are connected with the two side plates 1, as shown in fig. 2, the number of the supporting tubes 2 is 6, 4 of the supporting tubes 2 (the bottom and the middle 4) are arranged in a circumference mode, the supporting tubes 2 are hollow flow channels so as to pass through cleaning liquid, water, gas and other fluids, the distance between the two supporting tubes 2 at the bottom is smaller than the diameter of the wafer 9, the distance between the two supporting tubes 2 at the middle is equal to the diameter of the wafer 9, and the distance between the two supporting tubes 2 at the top is greater than or equal to the diameter of the wafer 9, so that the wafer 9 can enter or leave a space formed by the supporting tubes 2 from the upper end;

the supporting columns 3 are arranged in rows in the supporting tube 2, as shown in fig. 3, the supporting columns 3 are hollow and have openings 31, and are communicated with the flow channels of the supporting tube 2, the wafer 9 is to be placed between two adjacent supporting columns 3, and the wafer 9 is clamped and fixed by the side surfaces of the supporting columns 3, it should be noted that, in the drawings, in order to better show the supporting columns 3, the distance between two adjacent supporting columns 3 is exaggerated, and in fact, the distance between the supporting columns 3 is determined by the thickness of the wafer;

one or both ends of the support tube 2 are provided with a joint 21 capable of communicating with a pipeline, and cleaning fluid, water, air or nitrogen gas at normal temperature or after heating, and other fluids are supplied through the pipeline.

In the semiconductor wafer cassette with a cleaning function of the present embodiment, a cleaning liquid, water, air or nitrogen gas at normal temperature or after heating, or other fluid is ejected from the supporting column 3 through the supporting tube 2 from the connector 21. Because the support columns 3 are used as the dividing parts of the wafers and correspond to the wafers one to one, each wafer can be cleaned, and the problem that the wafers are difficult to clean when a plurality of wafers are arranged in the wafer box is solved.

The opening of the support column 3 has a partition plate 32 to divide the opening into two halves as shown in fig. 5, so that the fluid ejected from the opening of the support column 3 can be directed toward the wafer on both sides of the opening of the support column 3. Of course, the openings of the support posts 3 at both ends need not be arranged in two halves, but only need to face the wafer.

As an alternative embodiment, the openings of the support columns 3 face both sides, or the openings open directly into the side walls of the support columns 3.

As a preferred embodiment, as shown in fig. 2C, the two bottom support tubes 2 are located at 3/4 pi to 4/5 pi (C in the figure) from the wafer point as the starting point, and the openings of the support columns 3 on the two bottom support tubes 2 form an angle α of 50 ° to 60 ° with the horizontal plane; the two middle support tubes 2 are positioned at the positions from the wafer point as the starting points 1/2 pi to 2/3 pi (B in the figure), and the included angle beta between the openings of the support columns 3 on the two middle support tubes 2 and the horizontal plane is +/-10 degrees; the two supporting tubes 2 at the top are positioned at the position from the wafer point as the starting point from 1/4 pi to 1/3 pi (A in the figure), the included angle gamma between the openings of the supporting columns 3 on the two supporting tubes 2 at the top and the horizontal plane is-10 degrees to-20 degrees, the included angle is that the opening inclines upwards to be positive and the opening inclines downwards to be negative.

The support tube 2 is arranged around the wafer and is inclined at an angle so that the blown fluid can reach the whole disk surface of the wafer as far as possible.

The side surface of the supporting column 3 is provided with a plane 33, so that the contact surface of the supporting column 3 and the wafer is in surface-to-surface contact, and the contact surface is improved to prevent damage.

In light of the foregoing description of the preferred embodiments according to the present application, it is to be understood that various changes and modifications may be made by those skilled in the art without departing from the scope of the invention as defined by the appended claims. The technical scope of the present application is not limited to the content of the specification, and must be determined according to the scope of the claims.

Claims

1. A semiconductor wafer cassette having a cleaning function, comprising:

the side plates (1) are parallel to each other;

the supporting tubes (2) are connected with the two side plates (1), 4 supporting tubes (2) are arranged in a circumferential mode, the supporting tubes (2) are hollow flow channels for fluid to pass through, the distance between the two supporting tubes (2) positioned at the bottom is smaller than the diameter of the wafer (9), the distance between the two supporting tubes (2) in the middle is equal to the diameter of the wafer (9), and the distance between the two supporting tubes (2) at the top is larger than or equal to the diameter of the wafer (9);

the supporting columns (3) are arranged on the supporting tubes (2) in rows, the supporting columns (3) are hollow and provided with openings (31) and are communicated with flow channels of the supporting tubes (2), a wafer (9) is placed between every two adjacent supporting columns (3), and the wafer is clamped and fixed by the side surfaces of the supporting columns (3);

one end or two ends of the supporting pipe (2) are provided with joints (21) which can be communicated with a pipeline, and fluid can pass through the supporting pipe (2) from the joints (21) and be sprayed out from the supporting columns (3);

the two support tubes (2) at the bottommost are positioned at the positions 3/4 pi to 4/5 pi from the wafer point as the starting point; the two support tubes (2) in the middle are positioned at the positions from the wafer point as the starting points of 1/2 pi to 2/3 pi; the two supporting tubes (2) at the top are positioned at the positions from the wafer point as the starting point to 1/4 pi to 1/3 pi;

the openings of the support columns (3) on the two support tubes (2) at the bottommost part form an included angle alpha of 50-60 degrees with the horizontal plane; the included angle beta between the openings of the support columns (3) on the two support tubes (2) in the middle and the horizontal plane is +/-10 degrees; the included angle gamma between the openings of the support columns (3) on the two support tubes (2) at the top and the horizontal plane is-10 degrees to-20 degrees, the inclined upward of the openings in the included angle is positive, and the inclined downward is negative;

the opening of the supporting column (3) is provided with a partition plate (32) to divide the opening into two halves and face to two sides.

2. The semiconductor wafer cassette with cleaning function according to claim 1, wherein the opening is opened on a side wall of the support column (3).

3. The semiconductor wafer cassette with a cleaning function according to claim 1, wherein the side surface of the supporting column (3) has a flat surface (33) so that the contact surface of the supporting column (3) with the wafer is a surface-to-surface contact, and the contact surface is raised to prevent damage.

4. The semiconductor wafer cassette with cleaning function according to claim 1, wherein the fluid comprises a cleaning liquid, water, gas.

5. The semiconductor wafer cassette with the cleaning function according to claim 1, wherein the side plate (1) is hollow in the middle, and has hook grooves (11) on both sides and a supporting leg (12) on the bottom.