CN113257718A - Stacking structure cavity equipment convenient for position calibration - Google Patents

Stacking structure cavity equipment convenient for position calibration Download PDF

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Publication number
CN113257718A
CN113257718A CN202110634714.8A CN202110634714A CN113257718A CN 113257718 A CN113257718 A CN 113257718A CN 202110634714 A CN202110634714 A CN 202110634714A CN 113257718 A CN113257718 A CN 113257718A
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hole
calibration
cavity
section
block
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CN113257718B (en
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武振刚
严俊
陈涛
宋维聪
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Bitong Semiconductor Equipment Suzhou Co ltd
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Bitong Semiconductor Equipment Suzhou Co ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67178Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568Transferring the substrates through a series of coating stations
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/54Apparatus specially adapted for continuous coating
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention provides stacked structure cavity equipment convenient for position calibration, and relates to the technical field of semiconductor high-end equipment manufacturing. Including upper and lower stacked structure cavity, interlayer platform dish, the sealed piece of platform dish, the bottom platform dish, calibration tool piece and alignment rod round pin, the sealed piece detachably of platform dish is installed in the platform dish through-hole, sealed piece alignment hole has been seted up on the sealed piece of platform dish, platform dish alignment hole has been seted up on the bottom platform dish, the sealed piece of platform dish can be replaced to the calibration tool piece is installed in the platform dish through-hole, tool piece alignment hole has been seted up on the calibration tool piece, the alignment rod round pin is used for inserting first alignment hole and sealed piece alignment hole, with the position of calibrating first mechanical tongs, still be used for inserting tool piece alignment hole, second alignment hole and platform dish alignment hole, with the position of calibrating second mechanical tongs. Like this, utilize the calibration bar round pin to run through interlayer bench plate, and do not exert an influence to the performance of cavity, combine the calibration tool piece realization again to the direct calibration of the mechanical gripper in the non-top layer chamber, convenient operation, and the precision is high.

Description

Stacking structure cavity equipment convenient for position calibration
Technical Field
The invention relates to the technical field of semiconductor high-end equipment manufacturing, in particular to stacked structure cavity equipment convenient for position calibration.
Background
Before the vapor deposition equipment carries out the process flow, the positioning and calibration of the position in the cavity are required to be carried out on the mechanical gripper for gripping and conveying the wafer so as to ensure the accuracy of the conveying position of the mechanical gripper and the uniformity of the film coating.
In the prior art, the arrangement positions of a high vacuum loading Chamber (LLC) and a high vacuum cooling Chamber (CDC) of a vapor deposition apparatus (including RiD, PVD, CVD) are generally mutually independent or mutually connected horizontal arrangement, that is, the arrangement positions are arranged in front of and behind or in the left and right of the same horizontal plane. The cavity distributed in the front-back or left-right positions can conveniently and independently calibrate the position of the mechanical hand grip, for example, a laser positioner is designed on the cavity cover right above the cavity to realize accurate calibration of the mechanical hand grip, the operation is simple and convenient, and the calibration of different cavities is not influenced.
The vertical layout design of the upper cavity and the lower cavity stacking structure saves the occupied area, improves the wafer transmission efficiency, and has very high application prospect. For the position calibration of the mechanical hand of the cavity with the stacked structure layered up and down, the cavity at the uppermost layer can still use the prior disclosed calibration mode, but for the cavity at the non-uppermost layer, the calibration process is not direct and the calibration result is not reliable because the cavity is vertically stacked.
Therefore, how to accurately calibrate the position of the mechanical hand grip of the lower cavity in the cavity with the vertically-arranged and vertically-designed upper and lower stacking structures is a technical problem which is urgently needed to be solved at present.
Disclosure of Invention
The invention aims to provide stacking structure cavity equipment convenient for position calibration, which can penetrate through an interlayer table plate between a top layer cavity and a non-top layer cavity by utilizing a calibration rod pin, does not influence the performance of the cavity, realizes direct calibration of a mechanical gripper in the non-top layer cavity by combining a calibration jig block, and is convenient in calibration operation and high in precision.
Embodiments of the invention may be implemented as follows:
the invention provides stacked structure cavity equipment convenient for position calibration, which comprises:
the upper and lower stacking structure cavities comprise a top layer cavity and at least one non-top layer cavity;
the top layer cavity cover is arranged at the top of the top layer cavity and is detachably connected with the upper and lower stacking structure cavities;
the first mechanical gripper is used for taking and placing the wafer in the top layer cavity, and a first calibration hole is formed in the first mechanical gripper and is a through hole;
the interlayer table plate is arranged between the top layer cavity and the non-top layer cavity, and a table plate through hole is formed in the interlayer table plate;
the table plate sealing block is detachably and hermetically arranged in the table plate through hole, a sealing block calibration hole is formed in the top surface of the table plate sealing block, and the sealing block calibration hole is a blind hole;
the bottom layer table plate is arranged at the bottom of the non-top layer cavity, and table plate calibration holes are formed in the bottom layer table plate and are blind holes;
the second mechanical gripper is used for taking and placing the wafer in the non-top layer cavity, and a second calibration hole is formed in the second mechanical gripper and is a through hole;
the replaceable table disc sealing block is arranged in the table disc through hole, a jig block calibration hole is formed in the calibration jig block, and the jig block calibration hole is a through hole;
and the calibration rod pin is inserted into the first calibration hole and the sealing block calibration hole to calibrate the position of the first mechanical gripper, and is also inserted into the jig block calibration hole, the second calibration hole and the table disc calibration hole to calibrate the position of the second mechanical gripper. Wherein the end of the aligning bar pin has a tapered structure by which the aligning bar pin is easily inserted into each hole, and the diameter of the aligning bar pin is equal to that of each hole, so that the aligning bar pin accurately determines the position of the robot arm.
In an alternative embodiment, the calibration jig block is made of a transparent material.
In an alternative embodiment, the length of the alignment bar pin is greater than the distance from the top tier cavity cover to the bottom tier platen.
In an optional embodiment, an isolation sealing ring is further arranged in the through hole of the table plate, and the isolation sealing ring is clamped between the interlayer table plate and the table plate sealing block.
In an optional embodiment, the platen through hole is a stepped hole, the platen through hole includes a first hole section, a second hole section and a third hole section which are sequentially communicated from top to bottom, and the hole diameters of the first hole section, the second hole section and the third hole section are gradually reduced.
In an optional embodiment, the platform disc sealing block is a stepped shaft, the platform disc sealing block comprises a first shaft section and a second shaft section which are sequentially connected from top to bottom, the diameters of the first shaft section and the second shaft section are gradually reduced, the first shaft section is matched with the first hole section, and the second shaft section is matched with the second hole section.
In an alternative embodiment, the isolation sealing ring is located between the third bore section and the second shaft section, the inner diameter of the isolation sealing ring being larger than the bore diameter of the third bore section, and the outer diameter of the isolation sealing ring being smaller than the diameter of the second shaft section.
In an optional embodiment, a first screw hole is formed in the edge of the first shaft section, a second screw hole is formed in the periphery of the second hole section, and the first screw hole and the second screw hole are connected through screws.
In an optional embodiment, cooling pipelines are arranged inside the interlayer table plate, and the cooling pipelines are arranged in parallel or in a cross mode. And the arrangement of the cooling pipeline can bypass the through holes of the platform disc, so that mutual interference is avoided.
In optional embodiment, the calibration jig piece is the step shaft, and the calibration jig piece includes from last third shaft section and the fourth shaft section that connects gradually down, and the diameter of third shaft section and fourth shaft section reduces gradually, and third shaft section and first hole section cooperation, fourth shaft section and the cooperation of third hole section.
In an optional embodiment, a third screw hole is formed in an edge of the third shaft section, and the third screw hole is connected with the second screw hole through a screw.
In an alternative embodiment, the calibration rod pin is made of an alloy material or a ceramic material.
In an alternative embodiment, the calibration rod pin is provided with a calibration mark according to the position of each layer of cavity to judge whether the calibration rod pin is completely inserted into the calibration hole of the sealing block of the table disc sealing block in the corresponding cavity.
The stacked structure cavity equipment convenient for position calibration provided by the embodiment of the invention has the beneficial effects that:
1. the platform disc sealing block is arranged in the platform disc through hole in a sealing mode, a top layer cavity and a non-top layer cavity can be isolated, the performance of the cavity is guaranteed not to be affected, meanwhile, the top layer cavity cover is opened, the calibrating rod pin penetrates through the first calibrating hole in the first mechanical gripper and is inserted into the sealing block calibrating hole in the platform disc sealing block, and therefore position calibration of the first mechanical gripper can be achieved;
2. replacing a platform disc sealing block with a calibration jig block to be installed in a platform disc through hole in the interlayer platform disc, sequentially penetrating a calibration rod pin through a jig block calibration hole in the calibration jig block and a second calibration hole in the second mechanical gripper, and inserting the calibration rod pin into a platform disc calibration hole in the bottom platform disc, so that the position calibration of the second mechanical gripper can be realized;
3. the calibration mode that the existing calibration of the non-top cavity and the mechanical gripper uses indirect relation calculation is changed into a direct relation calibration mode, the calibration operation is convenient, and the precision is high;
4. in the position calibration process of the second mechanical gripper, the calibration rod pin penetrates through the calibration holes of the jig blocks on the calibration jig blocks, and the problem of insufficient accuracy of the guide position caused by too deep and too long insertion of the calibration rod pin is solved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
FIG. 1 is a schematic cross-sectional view of a conventional state of a stacked configuration cavity apparatus for facilitating positional calibration provided by an embodiment of the present invention;
FIG. 2 is a schematic structural view of the platen seal block of FIG. 1;
FIG. 3 is a schematic cross-sectional view of the platen seal block of FIG. 1;
FIG. 4 is a schematic top view of the stacked configuration cavity apparatus of FIG. 1 for facilitating positional alignment;
FIG. 5 is a schematic cross-sectional view of a calibration state of a stacked configuration cavity apparatus for facilitating positional calibration according to an embodiment of the present invention;
FIG. 6 is a schematic view of another perspective of the stacked configuration cavity apparatus of FIG. 5 to facilitate positional alignment;
FIG. 7 is a schematic structural diagram of the calibration jig block shown in FIG. 5;
fig. 8 is a schematic cross-sectional view of the calibration jig block in fig. 5.
Icon: 1-stacked configuration cavity apparatus to facilitate positional calibration; 2-top layer cavity cover; 3-stacking the structural cavity up and down; 31-a top cavity; 32-first wafer access; 33-non-top layer cavity; 34-second wafer access; 4-a first mechanical gripper; 41-a first calibrated hole; 5-a first wafer tray; 6-interlayer table plate; 61-platen through holes; 611 — a first bore section; 612-a second bore section; 613-third hole section; 614-second screw hole; 62-isolating sealing ring; 63-a cooling pipe; 7-a platform disc sealing block; 71-sealing block alignment holes; 711-first shaft section; 712-a second shaft section; 713-a first screw hole; 8-bottom layer table plate; 81-plate alignment holes; 9-a second wafer tray; 10-a second mechanical gripper; 101-a second alignment aperture; 11-calibrating the jig block; 111-a third shaft segment; 112-a fourth shaft segment; 113-a third screw hole; 114-jig block alignment holes; 12-alignment of the bar pin.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that if the terms "upper", "lower", "inside", "outside", etc. indicate an orientation or a positional relationship based on that shown in the drawings or that the product of the present invention is used as it is, this is only for convenience of description and simplification of the description, and it does not indicate or imply that the device or the element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention.
Furthermore, the appearances of the terms "first," "second," and the like, if any, are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
It should be noted that the features of the embodiments of the present invention may be combined with each other without conflict.
In order to solve the technical problems in the prior art, research shows that:
1. the calibration mode of the mechanical hand in the existing non-top cavity is indirect calibration, namely the calibration position of the mechanical hand in the lower cavity refers to the calibration position of the mechanical hand in the upper cavity to indirectly obtain the calibration result, and the calibration result is indirect, visual and unreliable, so that the problem of the calibration of the position of the mechanical hand in the lower cavity of the vertically-arranged cavity with the vertically-stacked structure is solved, and the method has very important practical significance.
2. The vertical layout design of the cavity body with the upper and lower stacking structures and the calibration of the position of the mechanical gripper of the non-top cavity is realized by arranging a laser positioner at the top of the inner cavity, the technical scheme has the defects that the requirement on the manufacturing process of the interlayer table plate of the cavity body is very high, the interlayer table plate is not influenced by a cooling pipeline while the cooling pipeline in the interlayer table plate is not damaged, a circuit is arranged between the interlayer table plates, the laser positioner is arranged, the positioning precision can be changed along with the change of the cold and the heat of the interlayer table plate and the prolonging of the time, a laser receiving device is required to be arranged on the wafer table plate in the cavity body of the layer, the laser positioning can be completed by being assisted by powerful and efficient laser positioning control software, the requirement on the design of the cavity body is high, the auxiliary computer control is required, the manufacturing cost of equipment is increased, the operation is not convenient, and the laser positioner is required to be installed and configured in each non-top cavity, the requirement is too high, and the investment cost of equipment is increased. And therefore the improvement based on this solution is abandoned.
3. The vertical layout design's upper and lower stacked structure cavity, the mechanical tongs position calibration in non-top layer chamber uses the calibration lever pin from the calibration position in top layer chamber, from top to bottom run through to the locating hole of mechanical tongs and bottom stage dish, follows this angle and designs the following problem of need considering:
1) because high vacuum sealing is required to be kept between the upper and lower layered cavities during the process, the interlayer table plates must be absolutely sealed, and the top of the lower layer is the bottom of the upper layer; the right-up calibration mode passes through two high-vacuum chambers, which raises the problem of tightness between the two chambers, and therefore needs to be solved.
2) Cooling pipelines are distributed in the interlayer table disc, the arrangement mode of the existing cooling pipelines is circular or spiral, so that the wafers are uniformly cooled, and the original cooling effect cannot be damaged in the position calibration process of the mechanical gripper; the right-above calibration mode needs to pass through the cooling pipeline in the interlayer table plate, and brings interference between the calibration passing structure and the cooling pipeline as a problem, so that the problem that the calibration structure passes through the cooling pipeline in the interlayer table plate needs to be solved.
3) The mode of calibration directly above needs to pass through the mechanical hand grab calibration positioning structure of last cavity, and the mechanical hand grab calibration positioning structure who has taken out of last cavity needs to do the action of dismouting displacement, can produce the problem that cavity and mechanical hand grab calibration positioning can not satisfy the needs after the action of dismouting displacement, consequently needs to solve the dismouting action after, goes up the reliable and stable of cavity and mechanical hand grab position calibration.
4) In the upper calibration mode, when the lower chamber and the mechanical gripper are calibrated, the length of a required calibration rod pin is greatly lengthened through the chamber arranged above the upper chamber, and after the rod pin is lengthened, the original mode of confirming whether the manual direct insertion touch position is accurate or not is unreliable in calibrating and positioning the lower chamber and the mechanical gripper, so that the problems in the aspects are solved.
To the problem of above each aspect, this embodiment provides a stacked structure cavity equipment convenient to position calibration, has not only solved the problem of above each aspect, has still realized the direct calibration to the mechanical tongs in the non-top layer chamber, and calibration convenient operation, and the effect that the precision is high. The specific structure of the stacked structure cavity device that facilitates positional calibration is described below.
Referring to fig. 1, the present embodiment provides a stacked structure chamber apparatus 1 for facilitating position calibration, where the stacked structure chamber apparatus 1 for facilitating position calibration includes a Physical Vapor Deposition (PVD) apparatus, a Chemical Vapor Deposition (CVD) apparatus, and the like.
The stacking structure cavity equipment 1 convenient for position calibration comprises a top layer cavity cover 2, an upper stacking structure cavity 3, a lower stacking structure cavity 3, a first mechanical gripper 4, a first wafer tray 5, an interlayer table plate 6, a table plate sealing block 7, a bottom layer table plate 8, a second wafer tray 9 and a second mechanical gripper 10.
The upper and lower stacked structure cavities 3 include a top cavity 31 and at least one non-top cavity 33, and the top cavity 31 is the topmost cavity. The number of the non-top layer cavities 33 can be one or more, and is arranged below the top layer cavity 31 along the vertical direction.
The top layer cavity cover 2 is arranged at the center of the top layer cavity 31 and is detachably connected with the upper and lower stacking structure cavities 3. When the top cavity cover 2 is in a closed state, the top cavity 31 can be ensured to be in a high vacuum sealing state, and when the top cavity cover 2 is in an open state, a technician can perform position calibration work on the first mechanical hand grip 4 and the second mechanical hand grip 10.
A first wafer inlet and outlet 32 is formed in a symmetrical side wall of the top cavity 31, so that the first mechanical gripper 4 can conveniently extend into or extend out of the top cavity 31 through the first wafer inlet and outlet 32, and the wafer can be taken, placed and transported. The other symmetrical sidewall of the top chamber 31 is provided with a first wafer tray 5 for holding a wafer of a corresponding size, and at this time, the top chamber 31 can be used as a loading chamber.
A second wafer inlet and outlet 34 is formed on a symmetrical side wall of the non-top cavity 33, so that the second mechanical gripper 10 can conveniently extend into or out of the non-top cavity 33 through the second wafer inlet and outlet 34, and the wafer can be picked, placed and transported. The other symmetrical side wall of the non-top layer cavity 33 is provided with a second wafer tray 9 for holding the wafer with the corresponding size.
The interlayer table plate 6 is circular, the size of the interlayer table plate corresponds to the size of a wafer to be processed, the interlayer table plate 6 is arranged between the top layer cavity 31 and the non-top layer cavity 33, a clamping groove (not shown in the figure) for fixing the wafer is formed in the edge position of the interlayer table plate 6, and a table plate through hole 61 is formed in the center position of the interlayer table plate 6. Specifically, the platen through hole 61 is a stepped hole, the platen through hole 61 includes a first hole segment 611, a second hole segment 612, and a third hole segment 613 that are sequentially communicated from top to bottom, and the hole diameters of the first hole segment 611, the second hole segment 612, and the third hole segment 613 are gradually reduced.
Referring to fig. 4, cooling pipes 63 are disposed inside the interlayer table 6, and the cooling pipes 63 are arranged in parallel or in a cross manner. The cooling pipeline 63 can not only ensure the cooling effect on the interlayer table plate 6, but also does not influence the arrangement of the table plate through hole 61.
The table disc sealing block 7 is detachably and hermetically mounted in the table disc through hole 61, a sealing block calibration hole 71 is formed in the center of the top surface of the table disc sealing block 7, and the sealing block calibration hole 71 is a blind hole. The calibrating rod pin 12 penetrates through the calibrating hole 71 of the sealing block and the calibrating hole of the mechanical gripper in the corresponding chamber together, can be used for calibrating and positioning the position of the mechanical gripper in the corresponding chamber, and after calibration is finished, the platform disc sealing block 7 is installed in the platform disc through hole 61, so that high-pressure sealing between the upper chamber and the lower chamber can be realized.
Referring to fig. 1 to 3, the platform sealing block 7 is a stepped shaft, the platform sealing block 7 includes a first shaft section 711 and a second shaft section 712 sequentially connected from top to bottom, diameters of the first shaft section 711 and the second shaft section 712 gradually decrease, the first shaft section 711 is matched with the first hole section 611, the second shaft section 712 is matched with the second hole section 612, preferably, the diameters of the first shaft section 711 and the first hole section 611 are equal, and the diameters of the second shaft section 712 and the second hole section 612 are equal. The edge of the first shaft segment 711 is provided with a first screw hole 713, the periphery of the second hole segment 612 is provided with a second screw hole 614, and the first screw hole 713 and the second screw hole 614 are connected by screws. Of course, the platform sealing block 7 and the interlayer platform 6 can also adopt other connection modes, such as clamping connection, threaded connection and the like.
Referring to fig. 1, an isolation seal groove (not shown) is further formed in the platen through hole 61, an isolation seal ring 62 is disposed in the isolation seal groove, and the isolation seal ring 62 is clamped between the interlayer platen 6 and the platen seal block 7. Specifically, the isolation seal ring 62 is located between the third bore section 613 and the second bore section 712, the inner diameter of the isolation seal ring 62 is larger than the bore diameter of the third bore section 613, and the outer diameter of the isolation seal ring 62 is smaller than the diameter of the second bore section 712. Like this, isolated sealing ring 62 mounted position is stable, and can isolated upper and lower two-layer cavity, plays good sealed effect.
The bottom layer platform disc 8 is arranged at the bottom of the non-top layer cavity 33, the bottom layer platform disc 8 is circular, the size of the bottom layer platform disc corresponds to the size of a wafer to be processed, a clamping groove (not shown in the figure) for fixing the wafer is formed in the edge position of the bottom layer platform disc 8, a platform disc calibration hole 81 is formed in the center position of the bottom layer platform disc 8, the platform disc calibration hole 81 is a blind hole, and the platform disc calibration hole 81 is used for calibrating the position of the second mechanical gripper 10.
The first mechanical gripper 4 is used for taking and placing the wafer in the top layer cavity 31, a first calibration hole 41 is formed in the first mechanical gripper 4, and the first calibration hole 41 is a through hole. When the first mechanical gripper 4 is in the best position for gripping the wafer, the first alignment hole 41, the seal block alignment hole 71 and the platen alignment hole 81 are located in the same vertical direction. When the second mechanical gripper 10 is in the best position for gripping the wafer, the second alignment hole 101, the seal block alignment hole 71, and the platen alignment hole 81 are located in the same vertical direction.
The second mechanical gripper 10 is used for picking and placing the wafer in the non-top layer cavity 33, a second alignment hole 101 is formed in the second mechanical gripper 10, and the second alignment hole 101 is a through hole.
The height of the mechanical gripper (including the first mechanical gripper 4 and the second mechanical gripper 10) can be raised or lowered according to requirements to achieve taking and placing of the wafer, grooves and suckers corresponding to the positions of the wafer are arranged on the front side and the back side of the mechanical gripper, so that the front side and the back side of the mechanical gripper can adsorb the wafer, specifically, the front side of the first mechanical gripper 4 can adsorb the wafer on the first wafer tray 5, and the back side of the first mechanical gripper 4 can adsorb the wafer on the interlayer table plate 6. The front side of the second mechanical gripper 10 can absorb the wafer on the second wafer tray 9, and the back side of the second mechanical gripper 10 can absorb the wafer on the bottom layer platform tray 8.
Referring to fig. 1, 5 and 6, the stacked cavity apparatus 1 for facilitating position calibration further includes a calibration jig block 11 and a calibration rod pin 12, wherein the calibration jig block 11 is mounted in the platen through hole 61 in a manner of replacing the platen sealing block 7, a jig block calibration hole 114 is formed in the calibration jig block 11, and the jig block calibration hole 114 is a through hole. The alignment rod pins 12 are used to insert the first alignment holes 41 and the seal block alignment holes 71 to align the position of the first mechanical gripper 4, and also to insert the jig block alignment holes 114, the second alignment holes 101, and the table plate alignment holes 81 when the first mechanical gripper 4 is removed to align the position of the second mechanical gripper 10.
Specifically, referring to fig. 1, 5 to 8, the calibration jig block 11 is made of a transparent material, and may specifically be made of glass or resin. The calibration jig block 11 is a stepped shaft, the calibration jig block 11 includes a third shaft segment 111 and a fourth shaft segment 112 connected in sequence from top to bottom, the diameters of the third shaft segment 111 and the fourth shaft segment 112 are gradually reduced, the third shaft segment 111 is matched with the first hole segment 611, the fourth shaft segment 112 is matched with the third hole segment 613, preferably, the diameters of the third shaft segment 111 and the first hole segment 611 are equal, and the diameters of the fourth shaft segment 112 and the third hole segment 613 are equal. A third screw hole 113 is formed in the edge of the third shaft section 111, and the third screw hole 113 is connected with the second screw hole 614 through a screw. Of course, the calibration jig block 11 and the interlayer table plate 6 may also adopt other connection modes, such as clamping connection, threaded connection, and the like.
In this embodiment, the shapes of the calibration jig block 11 and the platform sealing block 7 are both two-stage stepped shafts, and the lengths of the two stepped shafts may be different or the same. The length of the calibration jig block 11 can be as large as possible, so that the length of the jig block calibration hole 114 is as large as possible, and thus, the jig block calibration hole 114 can play a good role in stably supporting the calibration rod pin 12.
The calibration bar pin 12 is made of a material that is not easily deformable, such as an alloy material or a ceramic material. The length of the alignment bar pin 12 is greater than the distance from the top cavity cover 2 to the bottom platen 8. The calibration rod pin 12 is provided with a calibration mark according to the position of each layer of cavity so as to judge whether the calibration rod pin 12 is completely inserted into the seal block calibration hole 71 of the platform disc seal block 7 in the corresponding cavity.
Referring to fig. 1, fig. 5 and fig. 6, the present embodiment provides a calibration process of a stacked cavity apparatus 1 for facilitating position calibration:
firstly, opening the top layer cavity cover 2, arranging the platform disc sealing block 7 in the platform disc through hole 61 of the interlayer platform disc 6, vertically inserting the calibration rod pin 12 into the top layer cavity 31 and penetrating through the first calibration hole 41 of the first mechanical gripper 4 until the calibration rod pin is inserted into the sealing block calibration hole 71 on the platform disc sealing block 7, and thus completing the calibration and positioning of the first mechanical gripper 4;
next, the first mechanical gripper 4 which has completed the calibration and positioning is moved out of the top layer cavity 31, the platform sealing block 7 in the platform through hole 61 is replaced by the calibration jig block 11, and then the calibration rod pin 12 is vertically inserted into the top layer cavity 31 and sequentially passes through the jig block calibration hole 114 on the calibration jig block 11 and the second calibration hole 101 of the second mechanical gripper 10 until being inserted into the platform calibration hole 81 on the bottom layer platform 8, thereby completing the calibration and positioning of the second mechanical gripper 10.
It will be appreciated that the present embodiment provides a stacked configuration chamber device 1 that facilitates positional alignment that exhibits only one non-top chamber 33 and, correspondingly, only one spacer platen 6 and one platen seal block 7. In other embodiments, a plurality of non-top cavities 33 may be shown, for example, the number of the non-top cavities 33 is two, correspondingly, one interlayer tray 6 is arranged between every two adjacent cavities in the stacked structure cavity apparatus 1 for facilitating the position calibration, one tray sealing block 7 is arranged on each interlayer tray 6, and the calibration process for the mechanical gripper in the top cavity 31 is the same as the calibration process for the first mechanical gripper 4; the calibration process for the mechanical gripper in the first non-top cavity 33 from top to bottom is similar to the calibration process for the second mechanical gripper 10, except that the bottom end of the calibration rod pin 12 is finally inserted into the seal block calibration hole 71 of the platform disc seal block 7 at the bottom of the first non-top cavity 33, instead of the platform disc calibration hole 81 on the bottom platform disc 8; the alignment of the mechanical grip in the second top non-top cavity 33 from top to bottom is the same as the alignment of the second mechanical grip 10 described above and will not be described further.
The stacked structure cavity device 1 convenient for position calibration provided by the embodiment has the advantages that:
1. the platform disc sealing block 7 is hermetically arranged in the platform disc through hole 61, the top layer cavity 31 and the non-top layer cavity 33 can be isolated, the performance of the cavity is guaranteed not to be affected, meanwhile, the top layer cavity cover 2 is opened, the calibrating rod pin 12 penetrates through the first calibrating hole 41 on the first mechanical gripper 4 and is inserted into the sealing block calibrating hole 71 on the platform disc sealing block 7, and the position calibration of the first mechanical gripper 4 can be achieved;
2. replacing the platform disc sealing block 7 with the calibration jig block 11, installing the calibration jig block 11 in the platform disc through hole 61 on the interlayer platform disc 6, sequentially passing the calibration rod pin 12 through the jig block calibration hole 114 on the calibration jig block 11 and the second calibration hole 101 on the second mechanical gripper 10, and inserting the calibration rod pin into the platform disc calibration hole 81 on the bottom layer platform disc 8, so that the position calibration of the second mechanical gripper 10 can be realized;
3. the calibration jig block 11 is made of a transparent material, and in the process of calibrating the second mechanical gripper 10, an operator can observe the second mechanical gripper 10 from the upper side to the lower side of the stacking structure cavity equipment 1 convenient for position calibration through the calibration jig block 11, so that the position of the second mechanical gripper 10 can be conveniently adjusted, and the second mechanical gripper 10 can be quickly calibrated;
4. the calibration mode that the existing non-top layer cavity 33 and mechanical gripper are calibrated by indirect relation calculation is changed into a direct relation calibration mode, so that the calibration operation is convenient and the precision is high;
5. in the process of calibrating the position of the second mechanical gripper 10, the calibration rod pin 12 passes through the jig block calibration hole 114 on the calibration jig block 11, so that the problem of insufficient accuracy of the guiding position caused by too deep and too long insertion of the calibration rod pin 12 is solved.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims (10)

1. A stacked configuration chamber device for facilitating positional calibration, comprising:
an upper and lower stacked structure cavity (3) comprising a top layer cavity (31) and at least one non-top layer cavity (33);
the top layer cavity cover (2) is arranged at the top of the top layer cavity (31) and is detachably connected with the upper and lower stacking structure cavity (3);
the first mechanical gripper (4) is used for taking and placing the wafer in the top layer cavity (31), a first calibration hole (41) is formed in the first mechanical gripper (4), and the first calibration hole (41) is a through hole;
the interlayer table plate (6) is arranged between the top layer cavity (31) and the non-top layer cavity (33), a table plate through hole (61) is formed in the interlayer table plate (6), a cooling pipeline (63) is formed in the interlayer table plate (6), and the cooling pipelines (63) are arranged in parallel or in a cross mode;
the platform disc sealing block (7) is detachably and hermetically mounted in the platform disc through hole (61), a sealing block calibration hole (71) is formed in the top surface of the platform disc sealing block (7), the sealing block calibration hole (71) is a blind hole, an isolation sealing ring (62) is further arranged in the platform disc through hole (61), and the isolation sealing ring (62) is clamped between the interlayer platform disc (6) and the platform disc sealing block (7);
the bottom layer table tray (8) is arranged at the bottom of the non-top layer cavity (33), a table tray calibration hole (81) is formed in the bottom layer table tray (8), and the table tray calibration hole (81) is a blind hole;
the second mechanical gripper (10) is used for taking and placing the wafer in the non-top layer cavity (33), a second calibration hole (101) is formed in the second mechanical gripper (10), and the second calibration hole (101) is a through hole;
the calibration jig block (11) can be arranged in the table disc through hole (61) in a replaceable manner for the table disc sealing block (7), a jig block calibration hole (114) is formed in the calibration jig block (11), and the jig block calibration hole (114) is a through hole;
the calibration rod pin (12) is used for being inserted into the first calibration hole (41) and the seal block calibration hole (71) to calibrate the position of the first mechanical hand grip (4), and is also used for being inserted into the jig block calibration hole (114), the second calibration hole (101) and the platform disc calibration hole (81) to calibrate the position of the second mechanical hand grip (10), and a calibration mark is arranged on the calibration rod pin (12) according to the position of each layer of cavity to judge whether the calibration rod pin (12) is completely inserted into the seal block calibration hole (71) of the platform disc seal block (7) in the corresponding cavity.
2. The stacked configuration cavity apparatus for facilitating position calibration as claimed in claim 1, wherein the calibration jig block (11) is made of transparent material.
3. The stacked configuration cavity apparatus for facilitating positional calibration according to claim 1, wherein the length of the calibration bar pin (12) is greater than the distance from the top layer cavity cover (2) to the bottom layer platen (8).
4. The stacked structure chamber device for facilitating position calibration according to claim 1, wherein the platen through hole (61) is a stepped hole, the platen through hole (61) comprises a first hole section (611), a second hole section (612) and a third hole section (613) which are sequentially communicated from top to bottom, and the hole diameters of the first hole section (611), the second hole section (612) and the third hole section (613) are gradually reduced.
5. The stacked structure cavity apparatus for facilitating position calibration according to claim 4, wherein the platen seal block (7) is a stepped shaft, the platen seal block (7) comprises a first shaft section (711) and a second shaft section (712) connected in sequence from top to bottom, the first shaft section (711) and the second shaft section (712) are successively reduced in diameter, the first shaft section (711) is matched with the first hole section (611), and the second shaft section (712) is matched with the second hole section (612).
6. The stacked configuration cavity apparatus for facilitating positional calibration of claim 5, wherein the isolating seal ring (62) is located between the third bore segment (613) and the second bore segment (712), an inner diameter of the isolating seal ring (62) being larger than a bore diameter of the third bore segment (613), an outer diameter of the isolating seal ring (62) being smaller than a diameter of the second bore segment (712).
7. The stacked structure cavity apparatus convenient for position alignment according to claim 5, wherein the first shaft section (711) has a first screw hole (713) opened at an edge thereof, the second hole section (612) has a second screw hole (614) opened at a periphery thereof, and the first screw hole (713) and the second screw hole (614) are connected by screws.
8. The stacked structure cavity apparatus convenient for position calibration according to claim 7, wherein the calibration jig block (11) is a stepped shaft, the calibration jig block (11) comprises a third shaft section (111) and a fourth shaft section (112) which are sequentially connected from top to bottom, the diameters of the third shaft section (111) and the fourth shaft section (112) are gradually reduced, the third shaft section (111) is matched with the first hole section (611), and the fourth shaft section (112) is matched with the third hole section (613).
9. The stacked structure cavity device for facilitating position calibration of claim 8, wherein the third shaft section (111) is provided with a third screw hole (113) at an edge thereof, and the third screw hole (113) is connected with the second screw hole (614) by a screw.
10. The stacked configuration cavity apparatus for facilitating positional alignment of claim 1, wherein said alignment bar pin (12) is made of an alloy material or a ceramic material.
CN202110634714.8A 2021-06-08 2021-06-08 Stacking structure cavity equipment convenient for position calibration Active CN113257718B (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114353618A (en) * 2022-03-22 2022-04-15 上海陛通半导体能源科技股份有限公司 PVD process cavity assembly auxiliary calibration jig and method

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040076505A1 (en) * 2001-07-13 2004-04-22 Kinnard David William Wafer transport apparatus
CN1160760C (en) * 1998-11-06 2004-08-04 佳能株式会社 Equipment and method for separating sample part and method for making substrate
CN101447406A (en) * 2007-11-30 2009-06-03 诺发系统有限公司 Loadlock designs and methods for using same
CN202323012U (en) * 2011-11-02 2012-07-11 沈阳拓荆科技有限公司 Heating plate and vacuum manipulator positioning device
CN105789091A (en) * 2016-03-16 2016-07-20 沈阳拓荆科技有限公司 Load chamber and a multi-chamber processing system applying the load chamber

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1160760C (en) * 1998-11-06 2004-08-04 佳能株式会社 Equipment and method for separating sample part and method for making substrate
US20040076505A1 (en) * 2001-07-13 2004-04-22 Kinnard David William Wafer transport apparatus
CN101447406A (en) * 2007-11-30 2009-06-03 诺发系统有限公司 Loadlock designs and methods for using same
CN202323012U (en) * 2011-11-02 2012-07-11 沈阳拓荆科技有限公司 Heating plate and vacuum manipulator positioning device
CN105789091A (en) * 2016-03-16 2016-07-20 沈阳拓荆科技有限公司 Load chamber and a multi-chamber processing system applying the load chamber

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114353618A (en) * 2022-03-22 2022-04-15 上海陛通半导体能源科技股份有限公司 PVD process cavity assembly auxiliary calibration jig and method

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