CN113253776A - Temperature control system for detecting semiconductor device - Google Patents
Temperature control system for detecting semiconductor device Download PDFInfo
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- CN113253776A CN113253776A CN202110510058.0A CN202110510058A CN113253776A CN 113253776 A CN113253776 A CN 113253776A CN 202110510058 A CN202110510058 A CN 202110510058A CN 113253776 A CN113253776 A CN 113253776A
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/20—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
Abstract
The invention discloses a temperature control system for detecting a semiconductor device, which comprises a central processing unit, a high-temperature monitoring module and a low-temperature monitoring module, wherein the output end of the central processing unit is electrically connected with the input end of a temperature rising system through a lead, the input end of the central processing unit is electrically connected with the output end of a control panel through a lead, the output end of the central processing unit is electrically connected with the input end of a temperature lowering system through a lead, and the central processing unit is bidirectionally connected with an information analysis module through a lead. This semiconductor device detects uses temperature control system can compare the difference in temperature that records and the difference in temperature threshold value of setting for through information analysis module to carry out the pre-adjustment before the temperature reaches the highest and minimum, make the testing process be in reasonable temperature range all the time, be favorable to improving the accuracy of testing result, and can prolong control system's life.
Description
Technical Field
The invention relates to the technical field of control systems, in particular to a temperature control system for detecting a semiconductor device.
Background
The semiconductor is a substance with conductivity between an insulator and a conductor, the conductivity of the substance is easy to control, the substance can be used as an element material for information processing, the semiconductor device is an electronic device with conductivity between a good conductor and an insulator, and the specific function can be completed by utilizing the special electrical characteristics of the semiconductor material, and the semiconductor device can be used for generating, controlling, receiving, converting, amplifying signals and carrying out energy conversion. The semiconductor material of the semiconductor device is silicon, germanium or gallium arsenide, and can be used as a material for a rectifier, an oscillator, a light emitter, an amplifier, a photodetector, or the like.
In the process of processing a semiconductor device, the semiconductor device needs to be detected, and in order to improve the accuracy of a detection result, the detected temperature needs to be controlled in the detection process, but the temperature is difficult to pre-adjust by the conventional temperature control system, the temperature can be adjusted only when the temperature is higher than a high-temperature threshold or lower than a low-temperature threshold, and the temperature is always in an unreasonable state before being adjusted to a proper interval, so that the accuracy of the detection result is influenced, and the use reliability is poor.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides a temperature control system for detecting a semiconductor device, which solves the problems that the prior temperature control system is difficult to pre-adjust the temperature and is always in an unreasonable state before the temperature is adjusted to be within a proper interval, so that the accuracy of a detection result is influenced, and the use reliability is poor.
(II) technical scheme
In order to achieve the purpose, the invention is realized by the following technical scheme: the utility model provides a semiconductor device detects uses temperature control system, includes central processing unit, still includes high temperature monitoring module and low temperature monitoring module, central processing unit's output passes through wire and the input electric connection of intensification system, central processing unit's input passes through wire and control panel's output electric connection to central processing unit's output passes through wire and the input electric connection of cooling system, central processing unit passes through the wire and realizes both way junction with the information analysis module.
The information analysis module comprises a temperature judgment module, a temperature difference calculation module, a difference value comparison module, a result analysis module and a result feedback module.
Preferably, the output end of the temperature judgment module is electrically connected with the input end of the temperature difference calculation module through a wire, and the output end of the temperature difference calculation module is electrically connected with the input end of the difference comparison module through a wire.
Preferably, the output end of the difference comparison module is electrically connected with the input end of the result analysis module through a wire, and the output end of the result analysis module is electrically connected with the input end of the result feedback module through a wire.
Preferably, the high temperature monitoring module includes a first temperature sensor, a first comparison module and a first feedback module, an output end of the first temperature sensor is electrically connected to an input end of the first comparison module through a wire, and an output end of the first comparison module is electrically connected to an input end of the first feedback module through a wire.
Preferably, the output end of the first feedback module is electrically connected to the input end of the central processing unit through a wire, and the output end of the central processing unit is electrically connected to the first temperature sensor and the input end of the first comparison module through wires, respectively.
Preferably, the low-temperature monitoring module includes a second temperature sensor, a second comparison module and a second feedback module, an output end of the second temperature sensor is electrically connected to an input end of the second comparison module through a wire, and an output end of the second comparison module is electrically connected to an input end of the second feedback module through a wire.
Preferably, the output end of the second feedback module is electrically connected to the input end of the central processing unit through a wire, and the output end of the central processing unit is electrically connected to the second temperature sensor and the input end of the second comparison module through wires, respectively.
Preferably, the control panel comprises an identity information input module, an identity verification module, a temperature difference threshold setting module, a low temperature threshold setting module and a high temperature threshold setting module, wherein the output end of the identity information input module is electrically connected with the input end of the identity verification module through a lead, and the output end of the identity verification module is electrically connected with the input ends of the temperature difference threshold setting module, the low temperature threshold setting module and the high temperature threshold setting module through leads respectively.
(III) advantageous effects
The invention provides a temperature control system for detecting a semiconductor device. Compared with the prior art, the method has the following beneficial effects:
(1) the temperature control system for detecting the semiconductor device is electrically connected with the input end of a temperature rising system through a lead by the output end of a central processing unit, the output end of the central processing unit is electrically connected with the input end of a temperature lowering system through a lead, the central processing unit is bidirectionally connected with an information analysis module through a lead, the information analysis module comprises a temperature judgment module, a temperature difference calculation module, a difference value comparison module, a result analysis module and a result feedback module, the output end of the temperature judgment module is electrically connected with the input end of the temperature difference calculation module through a lead, the output end of the temperature difference calculation module is electrically connected with the input end of the difference value comparison module through a lead, the output end of the difference value comparison module is electrically connected with the input end of the result analysis module through a lead, and the output end of the result analysis module is electrically, the information analysis module can compare the measured temperature difference with a set temperature difference threshold value, so that the temperature is pre-adjusted before reaching the highest temperature and the lowest temperature, the detection process is always within a reasonable temperature range, and the accuracy of the detection result is improved.
(2) The temperature control system for detecting the semiconductor device comprises a first temperature sensor, a first comparison module and a first feedback module through a high-temperature monitoring module, wherein the output end of the first temperature sensor is electrically connected with the input end of the first comparison module through a lead, the output end of the first comparison module is electrically connected with the input end of the first feedback module through a lead, the low-temperature monitoring module comprises a second temperature sensor, a second comparison module and a second feedback module, the output end of the second temperature sensor is electrically connected with the input end of the second comparison module through a lead, and the output of second contrast module passes through wire and second feedback module's input electric connection, and high temperature monitoring module and low temperature monitoring module can monitor high temperature and low temperature respectively, reduce single monitoring system's operating pressure to be favorable to prolonging control system's life.
(3) This semiconductor device detects uses temperature control system, the input through central processing unit passes through wire and control panel's output electric connection, control panel includes identity information input module, the authentication module, the difference in temperature threshold value sets up the module, low temperature threshold value sets up module and high temperature threshold value setting module, the output of identity information input module passes through wire and authentication module's input electric connection, and the output of authentication module pass through the wire respectively with difference in temperature threshold value setting module, the input electric connection of low temperature threshold value setting module and high temperature threshold value setting module, the visitor needs to carry out authentication, thereby this control system's safety in utilization has been improved.
Drawings
FIG. 1 is a functional block diagram of the present invention;
FIG. 2 is a functional block diagram of an information analysis module according to the present invention;
FIG. 3 is a functional block diagram of the control panel of the present invention;
fig. 4 is a schematic view of the working process of the present invention.
In the figure, 1 a central processing unit, 2 a high temperature monitoring module, 21 a first temperature sensor, 22 a first comparison module, 23 a first feedback module, 3 a low temperature monitoring module, 31 a second temperature sensor, 32 a second comparison module, 33 a second feedback module, 4 a heating system, 5 a control panel, 51 an identity information input module, 52 an identity verification module, 53 a temperature difference threshold value setting module, 54 a low temperature threshold value setting module, 55 a high temperature threshold value setting module, 6 a cooling system, 7 an information analysis module, 71 a temperature judgment module, 72 a temperature difference calculation module, 73 a difference comparison module, 74 a result analysis module and 75 a result feedback module.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-4, an embodiment of the present invention provides a technical solution: the utility model provides a semiconductor device detects uses temperature control system, including central processing unit 1, still include high temperature monitoring module 2 and low temperature monitoring module 3, central processing unit 1's output passes through wire and the input electric connection of heating system 4, heating system 4 can promote the detection temperature, central processing unit 1's input passes through wire and control panel 5's output electric connection, and central processing unit 1's output passes through wire and cooling system 6's input electric connection, cooling system 6 can reduce the detection temperature, central processing unit 1 realizes both way junction through wire and information analysis module 7.
In the embodiment of the present invention, the information analysis module 7 includes a temperature determination module 71, a temperature difference calculation module 72, a difference comparison module 73, a result analysis module 74, and a result feedback module 75, an output end of the temperature determination module 71 is electrically connected to an input end of the temperature difference calculation module 72 through a wire, an output end of the temperature difference calculation module 72 is electrically connected to an input end of the difference comparison module 73 through a wire, an output end of the difference comparison module 73 is electrically connected to an input end of the result analysis module 74 through a wire, and an output end of the result analysis module 74 is electrically connected to an input end of the result feedback module 75 through a wire, and the information analysis module 7 can calculate the detected temperature, so as to adjust the temperature before reaching the lowest value and the highest value.
In the embodiment of the present invention, the high temperature monitoring module 2 includes a first temperature sensor 21, a first comparison module 22 and a first feedback module 23, an output end of the first temperature sensor 21 is electrically connected to an input end of the first comparison module 22 through a wire, an output end of the first comparison module 22 is electrically connected to an input end of the first feedback module 23 through a wire, an output end of the first feedback module 23 is electrically connected to an input end of the central processing unit 1 through a wire, and an output end of the central processing unit 1 is electrically connected to the first temperature sensor 21 and the input end of the first comparison module 22 through wires, respectively.
In the embodiment of the present invention, the low temperature monitoring module 3 includes a second temperature sensor 31, a second comparison module 32 and a second feedback module 33, an output end of the second temperature sensor 31 is electrically connected to an input end of the second comparison module 32 through a wire, an output end of the second comparison module 32 is electrically connected to an input end of the second feedback module 33 through a wire, an output end of the second feedback module 33 is electrically connected to an input end of the central processing unit 1 through a wire, and an output end of the central processing unit 1 is electrically connected to the input ends of the second temperature sensor 31 and the second comparison module 32 through wires, respectively.
In the embodiment of the present invention, the control panel 5 includes an identity information input module 51, an identity verification module 52, a temperature difference threshold setting module 53, a low temperature threshold setting module 54 and a high temperature threshold setting module 55, an output end of the identity information input module 51 is electrically connected to an input end of the identity verification module 52 through a wire, and an output end of the identity verification module 52 is electrically connected to input ends of the temperature difference threshold setting module 53, the low temperature threshold setting module 54 and the high temperature threshold setting module 55 through wires, and the control panel 5 can verify visitor information, thereby improving the use safety of the system.
When the device is used, the identity information of an accessor is input through an identity information input module 51 in a control panel 5, after the identity information passes the verification of an identity verification module 52, a temperature difference threshold value, a low temperature threshold value and a high temperature threshold value are respectively set through a temperature difference threshold value setting module 53, a low temperature threshold value setting module 54 and a high temperature threshold value setting module 55, in the process of detecting a semiconductor device, a central processing unit 1 controls a first temperature sensor 21 and a second temperature sensor 31 to work simultaneously to measure a temperature value, then a first comparison module 22 compares the measured temperature with the high temperature threshold value, a second comparison module 32 compares the measured temperature with the low temperature threshold value, and then the temperature is fed back to the central processing unit 1 through a first feedback module 23 and a second feedback module 33 respectively, the central processing unit 1 transmits the measured temperature value to an information analysis module 7, a temperature judgment module 71 in the information analysis module 7 judges whether the measured temperature is low temperature or high temperature according to a feedback result, then the information is transmitted to a temperature difference calculation module 72, if the measured temperature is high temperature, the temperature difference calculation module 72 calculates the difference between the measured temperature and the high temperature threshold, if the measured temperature is low temperature, the temperature difference calculation module 72 calculates the difference between the measured temperature and the low temperature threshold, then a difference comparison module 73 compares the calculated temperature difference with a set temperature difference threshold, then a result analysis module 74 analyzes the comparison result and feeds back the analysis result to the central processing unit 1, if the comparison result shows that the difference between the measured temperature and the set temperature is greater than the set temperature difference threshold, the central processing unit 1 controls the heating system 4 to heat up or the cooling system 6 to cool down, the purpose of adjusting the temperature is achieved, until the difference between the measured temperature and the set temperature is not greater than the set temperature difference threshold, thereby the detection process is always within a reasonable temperature range, the temperature control is more accurate, and the accuracy of the detection result is improved.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. A temperature control system for semiconductor device inspection, comprising a central processing unit (1), characterized in that: the system is characterized by further comprising a high-temperature monitoring module (2) and a low-temperature monitoring module (3), wherein the output end of the central processing unit (1) is electrically connected with the input end of the temperature rising system (4) through a lead, the input end of the central processing unit (1) is electrically connected with the output end of the control panel (5) through a lead, the output end of the central processing unit (1) is electrically connected with the input end of the temperature lowering system (6) through a lead, and the central processing unit (1) is in bidirectional connection with the information analysis module (7) through a lead;
the information analysis module (7) comprises a temperature judgment module (71), a temperature difference calculation module (72), a difference value comparison module (73), a result analysis module (74) and a result feedback module (75).
2. The temperature control system for semiconductor device inspection according to claim 1, characterized in that: the output end of the temperature judgment module (71) is electrically connected with the input end of the temperature difference calculation module (72) through a lead, and the output end of the temperature difference calculation module (72) is electrically connected with the input end of the difference value comparison module (73) through a lead.
3. The temperature control system for semiconductor device inspection according to claim 2, characterized in that: the output end of the difference value comparison module (73) is electrically connected with the input end of the result analysis module (74) through a lead, and the output end of the result analysis module (74) is electrically connected with the input end of the result feedback module (75) through a lead.
4. The temperature control system for semiconductor device inspection according to claim 1, characterized in that: the high-temperature monitoring module (2) comprises a first temperature sensor (21), a first comparison module (22) and a first feedback module (23), wherein the output end of the first temperature sensor (21) is electrically connected with the input end of the first comparison module (22) through a lead, and the output end of the first comparison module (22) is electrically connected with the input end of the first feedback module (23) through a lead.
5. The temperature control system for semiconductor device inspection according to claim 4, characterized in that: the output end of the first feedback module (23) is electrically connected with the input end of the central processing unit (1) through a lead, and the output end of the central processing unit (1) is electrically connected with the input ends of the first temperature sensor (21) and the first comparison module (22) through leads respectively.
6. The temperature control system for semiconductor device inspection according to claim 1, characterized in that: the low-temperature monitoring module (3) comprises a second temperature sensor (31), a second comparison module (32) and a second feedback module (33), wherein the output end of the second temperature sensor (31) is electrically connected with the input end of the second comparison module (32) through a lead, and the output end of the second comparison module (32) is electrically connected with the input end of the second feedback module (33) through a lead.
7. The temperature control system for semiconductor device inspection according to claim 6, characterized in that: the output end of the second feedback module (33) is electrically connected with the input end of the central processing unit (1) through a lead, and the output end of the central processing unit (1) is electrically connected with the input ends of the second temperature sensor (31) and the second comparison module (32) through leads respectively.
8. The temperature control system for semiconductor device inspection according to claim 1, characterized in that: control panel (5) include identity information input module (51), authentication module (52), temperature difference threshold value set up module (53), low temperature threshold value set up module (54) and high temperature threshold value set up module (55), the output of identity information input module (51) passes through the wire and the input electric connection of authentication module (52) to the output of authentication module (52) passes through the wire respectively with the input electric connection of temperature difference threshold value set up module (53), low temperature threshold value set up module (54) and high temperature threshold value set up module (55).
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| CN202110510058.0A CN113253776A (en) | 2021-05-11 | 2021-05-11 | Temperature control system for detecting semiconductor device |
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| CN202110510058.0A CN113253776A (en) | 2021-05-11 | 2021-05-11 | Temperature control system for detecting semiconductor device |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08137557A (en) * | 1994-11-04 | 1996-05-31 | Fuji Koki Seisakusho:Kk | Temperature and differential temperature controller |
| CN206002982U (en) * | 2016-09-14 | 2017-03-08 | 淮阴师范学院 | A kind of conductor temperature control system based on analog control technique |
| CN107599890A (en) * | 2017-08-30 | 2018-01-19 | 北京新能源汽车股份有限公司 | A kind of temprature control method of driving motor for electric automobile, device and electric automobile |
| CN110736545A (en) * | 2018-07-20 | 2020-01-31 | 大族激光科技产业集团股份有限公司 | laser head temperature monitoring device and method |
| CN111443749A (en) * | 2020-03-26 | 2020-07-24 | 九江历源整流设备有限公司 | Temperature adjusting method, device, equipment and computer storage medium |
-
2021
- 2021-05-11 CN CN202110510058.0A patent/CN113253776A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08137557A (en) * | 1994-11-04 | 1996-05-31 | Fuji Koki Seisakusho:Kk | Temperature and differential temperature controller |
| CN206002982U (en) * | 2016-09-14 | 2017-03-08 | 淮阴师范学院 | A kind of conductor temperature control system based on analog control technique |
| CN107599890A (en) * | 2017-08-30 | 2018-01-19 | 北京新能源汽车股份有限公司 | A kind of temprature control method of driving motor for electric automobile, device and electric automobile |
| CN110736545A (en) * | 2018-07-20 | 2020-01-31 | 大族激光科技产业集团股份有限公司 | laser head temperature monitoring device and method |
| CN111443749A (en) * | 2020-03-26 | 2020-07-24 | 九江历源整流设备有限公司 | Temperature adjusting method, device, equipment and computer storage medium |
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