CN113253552B - Heat radiation structure and projector - Google Patents

Abstract

The embodiment of the application provides a pair of heat radiation structure and projector, projector include ray apparatus subassembly, and ray apparatus subassembly includes a plurality of modules that generate heat towards different sides, and heat radiation structure includes shell, first heat-conducting piece and second heat-conducting piece. The shell is provided with a top plate, a bottom plate and a side plate, wherein the top plate, the bottom plate and the side plate are oppositely arranged, the side plate is connected between the top plate and the bottom plate in an enclosing mode, and the top plate, the bottom plate and the side plate are enclosed to form an inner cavity. The first heat conducting piece is arranged in the inner cavity and attached to the heating modules on at least two sides. The second heat conducting part is arranged in the inner cavity, the second heat conducting part is arranged at the periphery of the first heat conducting part in a bending mode and connected with the first heat conducting part, and at least part of the second heat conducting part is connected with or close to the bottom plate. The application provides a noise reduction, heat radiation structure and projecting apparatus that improve reliability.

Description

Heat radiation structure and projector

Technical Field

The application relates to the technical field of electronics, concretely relates to heat radiation structure and projecting apparatus.

Background

At present, a projector adopts a forced air cooling heat dissipation design, and a fan is matched with a heat radiator to dissipate heat generated by an optical machine. However, in a projector such as a portable projection product, a usage scene is closer to a user, and thus a control requirement for noise is stricter. The existence of the fan inevitably increases the wind noise of the product and reduces the user experience. Secondly, the portable projection product is more likely to vibrate, fall and the like in the use scene, thereby bringing higher requirements to the structural reliability of the product. The presence of moving parts such as fans can add a reliability risk to the overall projection system.

Disclosure of Invention

The application provides a noise reduction, heat radiation structure and projecting apparatus that improve reliability.

In a first aspect, a heat radiation structure of projector that this application embodiment provided, the projector includes ray apparatus subassembly, the ray apparatus subassembly includes a plurality of modules that generate heat towards different sides, includes:

the shell is provided with a top plate, a bottom plate and a side plate, wherein the top plate, the bottom plate and the side plate are oppositely arranged, and the side plate is enclosed between the top plate and the bottom plate to form an inner cavity;

the first heat conducting piece is arranged in the inner cavity and attached to the heating modules facing at least two sides; and

the second heat conducting piece is arranged in the inner cavity, the second heat conducting piece is arranged on the periphery of the first heat conducting piece in a bent mode and connected with the first heat conducting piece, and at least part of the second heat conducting piece is connected with or close to the bottom plate.

In one possible embodiment, the first heat-conducting member includes an L-shaped copper plate.

In a possible embodiment, the second heat conducting member includes a first heat conducting portion and a second heat conducting portion formed by bending integrally, one side of the first heat conducting portion is connected to a side of the first heat conducting member away from the heat generating module, and the other side of the first heat conducting portion is connected to the side plate; one side of the second heat conduction part is opposite to the bottom of the optical machine assembly, and the other side of the second heat conduction part is connected with the bottom plate.

In a possible embodiment, the side plate comprises a first sub-side plate and a second sub-side plate which are oppositely arranged, and the first heat conduction part is connected with the first sub-side plate;

the second heat conducting part comprises a first heat conducting part, a second heat conducting part and a third heat conducting part which are formed by bending integrally, the third heat conducting part is connected to one end, far away from the first heat conducting part, of the second heat conducting part, and the third heat conducting part is connected with the second sub-side plate.

In one possible embodiment, a heat conductive adhesive or a heat conductive gasket is disposed between the first heat conductive member and the first heat conductive portion.

In a possible embodiment, the heat dissipation structure further includes at least one elastic heat conduction layer, and two opposite sides of the at least one elastic heat conduction layer are respectively attached between the first sub-side plate and the first heat conduction portion, and/or between the bottom plate and the second heat conduction portion, and/or between the second sub-side plate and the third heat conduction portion.

In one possible embodiment, the elastic heat conduction layer is heat conduction foam.

In a possible embodiment, the housing further has a plurality of first heat dissipation holes and a plurality of second heat dissipation holes communicating with the inner cavity, the plurality of first heat dissipation holes are disposed at a position of the side plate close to the bottom plate or at the bottom plate, and the plurality of second heat dissipation holes are disposed at a position of the side plate close to the top plate or at the top plate.

In a possible embodiment, the second heat conducting member is a copper plate, or a temperature equalizing plate, or a copper plate and a graphene heat conducting sheet attached to an outer surface of the copper plate; the outer surface of the shell is provided with a heat radiation layer.

On the other hand, embodiments of the present application further provide a projector including the heat dissipation structure according to any one of claims 1 to 9.

The embodiment of the application provides a heat radiation structure and projector, locate the inner chamber of shell and laminate in the module that generates heat towards at least both sides through setting up first heat-conducting piece, the inner chamber of shell is located to the second heat-conducting piece, the second heat-conducting piece is to buckle and sets up in the periphery of first heat-conducting piece and connect first heat-conducting piece, at least part of second heat-conducting piece is connected or is close to near the bottom plate, above-mentioned design is so that first heat-conducting piece all conducts the second heat-conducting piece towards the heat on the different module that generates heat of difference, be the form of buckling through designing the second heat-conducting piece, increase the heat radiating area of second heat-conducting piece on the one hand, on the other hand can be near partial heat conduction to the bottom plate, so that the gas that is close to bottom plate department is expanded after the intensification of being heated, density reduces, upward movement under the buoyancy, natural heat dissipation rate is increased, the use of fan has been reduced, the noise, vibration and falling risk have still been reduced, heat radiation structure's reliability has been improved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a projector according to an embodiment of the present application.

FIG. 2 isbase:Sub>A cross-sectional view of the projector shown in FIG. 1 taken along line A-A;

fig. 3 is a structural exploded view of a heat dissipation structure in the projector shown in fig. 2;

FIG. 4 is a schematic diagram of the opto-mechanical assembly shown in FIG. 2;

FIG. 5 is a schematic structural view of the housing shown in FIG. 3;

fig. 6 is a schematic structural disassembly diagram of a heat conducting module in the heat dissipation structure shown in fig. 3;

FIG. 7 is a perspective view of the projector shown in FIG. 1;

FIG. 8 is a structurally exploded view of another embodiment of a heat dissipating structure;

fig. 9 is a front view of the heat dissipation structure shown in fig. 8.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. Furthermore, reference herein to "an embodiment" or "an implementation" means that a particular feature, structure, or characteristic described in connection with the embodiment or implementation can be included in at least one embodiment of the present application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.

The application provides a heat dissipation structure, which can be used for heat dissipation inside an air compressor, heat dissipation inside a host computer, chassis heat dissipation, CPU heat dissipation, display card heat dissipation, light source heat dissipation and the like. The present application describes a case where the heat dissipation structure is applied to a projector, and the heat dissipation of a light source module inside the projector is taken as an example. Of course, the heat dissipation structure for other electronic products can refer to the example of the embodiment, and the description of the present application is omitted.

Referring to fig. 1 and fig. 2, the projector 1000 includes an optical-mechanical assembly 200 and a heat dissipation structure 100.

Referring to fig. 2 and fig. 3, the heat dissipation structure 100 includes a housing 110, and a first heat conduction member 125 and a second heat conduction member 120 disposed in the housing 110.

Referring to fig. 4, the optical-mechanical assembly 200 is disposed in the housing 110. Specifically, the optical-mechanical assembly 200 includes a light source module 210, a light modulation module 220, and an optical lens module 230. The light source module 210 includes a plurality of light emitting units 211. The light emitting units 211 are located at least at both sides of the light modulation module 220. The plurality of light emitting units 211 are used to emit light from different directions toward the light modulation module 220. The light modulation module 220 is used for modulating light emitted from the light source module according to image information. The optical lens module 230 is used to project the light modulated by the light modulation module 220.

The opto-mechanical assembly 200 includes a plurality of heat generating modules facing different sides. Optionally, the light source module 210 or/and the light modulation module 220 is a heat generating module. The heat dissipation structure 100 is used for dissipating heat from the heat generating module. In this embodiment, the light emitting unit 211 is a heat generating module. The light emitting units 211 are all connected/contacted to the heat dissipation structure 100, and the heat dissipation structure 100 is used for dissipating heat of the light emitting units 211. Of course, in other embodiments, the heat dissipation structure 100 may also dissipate heat of the chip on the light modulation module 220, wherein the heat dissipation structure 100 is connected/in contact with the light modulation module 220.

The light-emitting unit 211 includes a substrate and a light-emitting lamp disposed (e.g., soldered) on the substrate, but is not limited to an LED lamp, a high-pressure mercury lamp, a metal halide, and the like. The light emitting lamps face the light modulation module 220. The substrate is positioned on one side of the light-emitting lamp, which is far away from the light adjusting module. The plurality of light emitting cells 211 are disposed at different sides, e.g., two sides, three sides, etc., of the light modulation module 220. The number of the light emitting units 211 is not specifically limited in the present application, and optionally, the number of the light emitting units 211 may be three, four, and the like.

In this embodiment, the light emitting units 211 are respectively disposed on two sides of the light modulation module 220. The substrates of the light emitting units 211 are directly attached to the heat dissipating structure 100 or attached to the heat dissipating structure 100 through an intermediate heat conducting member (such as a heat conducting adhesive or a heat conducting pad), so that the heat dissipating structure 100 dissipates heat of the light emitting units 211.

The structure of the heat dissipation structure 100 is specifically illustrated in the following description with reference to the drawings.

Optionally, referring to fig. 5, the housing 110 has a top plate 111, a bottom plate 112 and side plates (a first sub-side plate 114, a second sub-side plate 115, a third sub-side plate 116, and a fourth sub-side plate 117) surrounding between the top plate 111 and the bottom plate 112. The top plate 111, the bottom plate 112 and the side plates surround to form an inner cavity 113. The inner cavity 113 is used for accommodating a heat generating module. The heating module in this embodiment is a light emitting unit 211 of the optical mechanical assembly 200.

The side plates include a first sub-side plate 114 and a second sub-side plate 115 which are oppositely arranged, and a third sub-side plate 116 and a fourth sub-side plate 117 which are oppositely arranged. The first sub-side plate 114, the third sub-side plate 116, the second sub-side plate 115 and the fourth sub-side plate 117 are sequentially connected end to end.

For convenience of description, it is defined that a direction in which the bottom plate 112 points to the top plate 111 is a Z-axis forward direction, a direction in which the top plate 111 points to the bottom plate 112 is a Z-axis reverse direction, a direction in which the first sub-side plate 114 points to the second sub-side plate 115 is a Y-axis forward direction, a direction in which the second sub-side plate 115 points to the first sub-side plate 114 is a Y-axis reverse direction, a direction in which the third sub-side plate 116 points to the fourth sub-side plate 117 is an X-axis forward direction, and a direction in which the fourth sub-side plate 117 points to the third sub-side plate 116 is an X-axis reverse direction.

The first heat-conducting member 125 is disposed in the inner cavity 113 and attached to the heat-generating module (e.g., the light-emitting unit 211) facing at least two sides. Specifically, the first thermal conductive member 125 includes, but is not limited to, copper, graphene thermal conductive sheet, aluminum, and the like. The shape of the first heat-conducting member 125 includes, but is not limited to, a plate shape, a sheet shape, and the like. The surface of the first heat-conducting member 125 is attached to the surface of the heat generating module to increase the heat-conducting area and the heat-conducting rate.

The second heat-conducting member 120 is disposed in the inner cavity 113. The second heat conduction member 120 is disposed at the periphery of the first heat conduction member 125 and connected to the first heat conduction member 125, and at least a portion of the second heat conduction member 120 is connected to or close to the bottom plate 112. Optionally, the second thermal conduction member 120 is attached to the first thermal conduction member 125 through an interface thermal conduction material (e.g., a thermal pad or a thermal paste), or directly attached to the first thermal conduction member 125. The second thermal conductive member 120 includes, but is not limited to, copper, graphene thermal conductive sheet, aluminum, and the like. The shape of the second heat-conducting member 120 includes, but is not limited to, a plate shape, a sheet shape, and the like.

The second heat conduction member 120 is bent. Specifically, the second thermal conduction member 120 faces at least two sides, for example, the second thermal conduction member 120 faces the side plate and the bottom plate 112. Further, the area of the second heat conduction member 120 is larger than that of the first heat conduction member 125, so that the second heat conduction member 120 can increase the heat dissipation area and further increase the heat dissipation rate of the heat generating module; it is also possible to direct heat quickly to different sides so that heat can spread from different sides.

The heat dissipation structure 100 and the projector 1000 provided in the embodiment of the application, the first heat conducting member 125 is disposed in the inner cavity 113 of the housing and attached to the heat generating modules facing at least two sides, the second heat conducting member 120 is disposed in the inner cavity 113 of the housing, the second heat conducting member 120 is disposed at the periphery of the first heat conducting member 125 in a bending manner and connected to the first heat conducting member 125, at least a portion of the second heat conducting member 120 is connected to or close to the bottom plate 112, the above design enables the first heat conducting member 125 to conduct heat on different heat generating modules facing different directions to the second heat conducting member 120, and the second heat conducting member 120 is bent by design, so that on one hand, the heat dissipation area of the second heat conducting member 120 is increased, on the other hand, at least a portion of the heat can be conducted to the vicinity of the bottom plate 112, so that the gas near the bottom plate 112 expands after being heated, the density is reduced, and the gas moves upward under the buoyancy effect, the natural heat dissipation rate is increased, the use of the fan is reduced, thereby reducing noise, further reducing the vibration and the risk of falling, and improving the reliability of the heat dissipation structure 100.

The first heat-conducting member 125 is directly attached to the heating surface of the heating module. In this embodiment, the first thermal conductive member 125 is directly attached to the substrate of the light emitting unit 211. The first heat conduction member 125 may be fixed to the heat generating module by a screw connection or the like. All or a portion of a side of the first heat conduction member 125 facing away from the light emitting unit 211 is attached to the second heat conduction member 120 (or integrally formed with the second heat conduction member 120).

Referring to fig. 2 and 6, the projector 1000 further includes a thermal interface layer (not shown). The first heat conduction member 125 is connected to a heat generation surface of the heat generation module. Opposite sides of the thermal interface layer are attached between at least a portion of the first thermal conductive member 125 and the second thermal conductive member 120.

In this embodiment, referring to fig. 6, the light emitting units 211 are respectively located at two sides of the light modulation module 220. Further, the first heat conduction member 125 is L-shaped to be attached to the substrate of each light emitting unit 211. Optionally, the first heat-conducting member 125 includes an L-shaped copper plate.

In other embodiments, the light emitting units 211 are respectively located on three sides of the light modulation module 220, for example, the first heat conducting member 125 is U-shaped, so that the first heat conducting member 125 is attached to the substrate of each light emitting unit 211 to dissipate heat of each light emitting unit 211. Optionally, the first heat-conducting member 125 comprises a U-shaped copper plate.

Referring to fig. 6 and 7, the second heat-conducting member 120 includes a first heat-conducting portion 121 and a second heat-conducting portion 123 formed by bending integrally.

One side of the first heat conduction part 121 is connected to one side of the first heat conduction member 125 away from the heat generating module, and the other side of the first heat conduction part 121 is connected to the side plate, so that the heat of the heat generating module is conducted to the housing 110 through the first heat conduction member 125 and the first heat conduction part 121, and then is diffused through the housing 110. Alternatively, the first heat conduction part 121 is fixedly connected to the side plate by a screw or the like, so that the second heat conduction member 120 is fixed to the housing 110. Optionally, the second heat conducting portion 123 is fixedly connected to the first heat conducting element 125, and the second heat conducting element 125 is fixedly connected to the optical-mechanical assembly 200, so that the optical-mechanical assembly 200 is fixed to the housing 100.

One side of the second heat conducting portion 123 is opposite to the bottom of the optical-mechanical assembly 200, and the other side of the second heat conducting portion 123 is connected to the bottom plate 112, so that heat on the second heat conducting portion 123 is conducted to the housing 110.

Further, the second heat conduction member 120 includes the first heat conduction portion 121, the second heat conduction portion 123 and the third heat conduction portion 124 which are integrally bent. The third heat conducting portion 124 is connected to an end of the second heat conducting portion 123 far away from the first heat conducting portion 121. The first heat conduction portion 121, the second heat conduction portion 123 and the third heat conduction portion 124 are substantially U-shaped. The U-shaped heat conducting plate can increase the heat dissipation area on one hand, and increase the heat dissipation direction in the space on the other hand, that is, the U-shaped heat conducting plate can realize heat dissipation in multiple directions (multiple sides) in the space.

The first heat conduction portion 121 is connected to the first sub-side plate 114. The second heat conduction portion 123 is connected to the base plate 112. The third heat conduction portion 124 is connected to the second sub-side plate 115.

Specifically, the first heat conduction portion 121 has a plate shape. The first heat conduction portion 121 is disposed opposite to or attached to and stacked on the first sub-side plate 114. One side of the first heat conduction portion 121 is connected to the first sub-side plate 114, the other side of the first heat conduction portion 121 is connected to the first heat conduction member 125, and the first heat conduction portion 121 conducts heat of the first heat conduction member 125 to the first sub-side plate 114, even to the second sub-side plate 115, the third sub-side plate 116, the bottom plate 112, the top plate 111, and the like, so that the heat dissipation area is increased, and the heat dissipation efficiency is improved.

Alternatively, the first heat conduction portion 121 and the first sub-side plate 114 may be connected by screw fixation, welding, heat conduction glue (for example, the heat conduction substance between the first heat conduction portion 121 and the first sub-side plate 114 is heat conduction glue), snap connection, or the like. In this embodiment, the first heat conducting portion 121 and the first sub-side plate 114 are fixedly connected by screws, so as to fix the second heat conducting member 120 on the housing 110.

Alternatively, the area of the first heat conduction part 121 is larger than the area of the portion of the first heat conduction member 125 facing the first sub-side plate 114 and slightly smaller than the area of the first sub-side plate 114, so as to quickly conduct the heat of the first heat conduction member 125.

Optionally, a heat conductive adhesive or a heat conductive gasket is disposed between the first heat conducting member 125 and the first heat conducting portion 121.

Referring to fig. 2 and fig. 6, the heat dissipation structure 100 further includes at least one elastic heat conduction layer (shown as 122a, 122b, and 122 c). Opposite sides of at least one of the elastic heat conduction layers are respectively attached between the first sub-side plate 114 and the first heat conduction portion 121, and/or between the bottom plate 112 and the second heat conduction portion 123, and/or between the second sub-side plate 115 and the third heat conduction portion 124.

Specifically, the first heat conducting portion 121 and the first sub-side plate 114 are disposed at an interval, and the elastic heat conducting layer 122a is filled therebetween, so as to realize continuous heat conduction between the first heat conducting portion 121 and the first sub-side plate 114. The elastic thermal conductive layer 122a includes, but is not limited to, thermal conductive foam, thermal conductive silicone, thermal conductive rubber, and the like. The elastic heat conduction layer 122a not only has a heat conduction function, but also has a function of absorbing a tolerance between the first heat conduction portion 121 and the first sub-side plate 114, and when the first sub-side plate 114 is a curved surface structure or the first sub-side plate 114 is provided with a concave-convex structure, the elastic heat conduction layer 122a can be elastically filled between the first sub-side plate 114 and the first heat conduction portion 121, so that the space between the first sub-side plate 114 and the first heat conduction portion 121 is hermetically filled. Of course, when the first heat conduction portion 121 is provided with a curved surface structure or the first heat conduction portion 121 is provided with a concave-convex structure, the elastic heat conduction layer 122a can be elastically filled between the first sub-side plate 114 and the first heat conduction portion 121.

In this embodiment, the elastic heat conduction layer 122a is made of heat conduction foam. Thermal conductive foam (Thermal conductive foam) is a foam material with high Thermal conductivity.

Further, the material of the first sub-side plate 114 includes, but is not limited to, a material with a relatively high thermal conductivity, such as aluminum, aluminum alloy, and the like. The first heat conduction portion 121 is in contact with the first sub-side plate 114, so that heat of the first heat conduction portion 121 can be conducted to the first sub-side plate 114 or the entire housing 110, thereby increasing the heat dissipation area and improving the heat dissipation efficiency.

Of course, in other embodiments, the first heat conduction portion 121 may be directly attached to the first sub-side plate 114 to realize direct heat conduction.

In this embodiment, one surface of the first heat conduction member 125 is attached to the first heat conduction portion 121, but in other embodiments, two or three surfaces of the first heat conduction member 125 are attached to the second heat conduction member 120 to increase the heat dissipation area.

Optionally, the area of the first heat conducting member 125 corresponds to the area of the substrate of the light emitting units 211 (specifically, the area of the first heat conducting member is slightly larger than that of the second heat conducting member), so that the first heat conducting member 125, as an intermediate heat conducting member with a small space occupation area, quickly conducts the heat of the light emitting units 211 to the first heat conducting portion 121 with a large area, the first heat conducting portion 121 conducts the heat to the second heat conducting portion 123, the third heat conducting portion 124, and the like, and the first heat conducting portion 121, the second heat conducting portion 123, and the third heat conducting portion 124 conduct the heat to the housing 110, thereby realizing quick natural heat dissipation. A portion of the heat is conducted to the vicinity of the bottom plate 112 to form a flow direction of air from bottom to top, thereby improving the natural heat dissipation efficiency of the heat dissipation structure 100, eliminating the need for a fan, and reducing noise and internal structural components.

Similarly, the second heat conduction portion 123 has a plate shape. The second heat conduction portion 123 is disposed opposite to or laminated on the base plate 112. One side of the second heat conduction portion 123 is connected to the bottom plate 112, the other side of the second heat conduction portion 123 is disposed opposite to the bottom of the optical mechanical assembly 200, the second heat conduction portion 123 conducts heat to the bottom plate 112, and meanwhile, the heat of the bottom plate 112 heats air, so that the air at the bottom expands and rises to form an air flow direction.

Alternatively, the second heat conducting portion 123 and the bottom plate 112 may be connected by screw fastening, welding, heat conducting glue (for example, the heat conducting substance between the second heat conducting portion 123 and the bottom plate 112 is heat conducting glue), snap connection, or the like. In this embodiment, the second heat conducting portion 123 is fixedly connected to the bottom plate 112 by screws, so as to fix the second heat conducting member 120 to the housing 110.

Alternatively, the area of the second heat conduction portion 123 is slightly smaller than that of the base plate 112, and heat is rapidly conducted away.

Referring to fig. 2 and 6, the second heat conduction portion 123 is spaced apart from the bottom plate 112, and the elastic heat conduction layer 122b is filled between the second heat conduction portion 123 and the bottom plate 112 to realize continuous heat conduction between the second heat conduction portion 123 and the bottom plate 112. The elastic heat conducting layer 122b includes, but is not limited to, heat conducting foam, heat conducting silicone, heat conducting rubber, and the like. The elastic heat conduction layer 122b has not only a heat conduction function but also an action of absorbing a tolerance between the second heat conduction portion 123 and the base plate 112, and when the base plate 112 has a curved surface structure or the base plate 112 has a concave-convex structure, the elastic heat conduction layer 122b can be elastically filled between the base plate 112 and the second heat conduction portion 123, so that the space between the base plate 112 and the second heat conduction portion 123 is hermetically filled. Of course, when the second heat conduction portion 123 is provided with a curved surface structure or the second heat conduction portion 123 is provided with a concave-convex structure, the elastic heat conduction layer 122b can be elastically filled between the bottom plate 112 and the second heat conduction portion 123.

In this embodiment, the elastic heat conduction layer 122b is made of heat conductive foam. Thermal conductive foam (Thermal conductive foam) is a foam material with high Thermal conductivity.

Further, the material of the bottom plate 112 includes, but is not limited to, a material with a relatively high thermal conductivity, such as aluminum, aluminum alloy, and the like. The second heat conduction portion 123 is in contact with the bottom plate 112, so that heat of the second heat conduction portion 123 can be conducted to the bottom plate 112 or the whole housing 110, thereby increasing the heat dissipation area and improving the heat dissipation efficiency.

Of course, in other embodiments, the second heat conduction portion 123 may be directly attached to the bottom plate 112 to achieve direct heat conduction.

Similarly, the third heat conduction portion 124 has a plate shape. The third heat conduction portion 124 is disposed opposite to or laminated on the second sub-side plate 115. One side of the third heat conducting portion 124 is connected to the second sub-side plate 115, the other side of the third heat conducting portion 124 is opposite to the bottom of the optical-mechanical assembly 200, and the third heat conducting portion 124 conducts heat to the second sub-side plate 115 and diffuses out through the second sub-side plate 115.

Alternatively, the third heat conducting portion 124 and the second sub-side plate 115 may be connected by screw fixation, welding, heat conducting glue (for example, the heat conducting substance between the third heat conducting portion 124 and the second sub-side plate 115 is heat conducting glue), snap connection, or the like. In this embodiment, the third heat conduction portion 124 and the second sub-side plate 115 are fixedly connected by screws, so that the second heat conduction member 120 is fixed to the housing 110.

Optionally, the area of the third heat conduction portion 124 is slightly smaller than that of the second sub-side plate 115, so that heat is quickly conducted out.

Referring to fig. 2 and 6, the third heat conduction portion 124 and the second sub-side plate 115 are disposed at an interval, and the elastic heat conduction layer 122c is filled therebetween, so as to realize continuous heat conduction between the third heat conduction portion 124 and the second sub-side plate 115. The elastic heat conducting layer 122c includes, but is not limited to, heat conducting foam, heat conducting silicone, heat conducting rubber, and the like. The elastic heat conduction layer 122c not only has a heat conduction function, but also has a function of absorbing a tolerance between the third heat conduction portion 124 and the second sub-side plate 115, and when the second sub-side plate 115 has a curved surface structure or the second sub-side plate 115 is provided with a concave-convex structure, the elastic heat conduction layer 122c can be elastically filled between the second sub-side plate 115 and the third heat conduction portion 124, so that the space between the second sub-side plate 115 and the third heat conduction portion 124 is hermetically filled. Of course, when the curved surface structure is provided on the third heat conduction portion 124 or the concave-convex structure is provided on the third heat conduction portion 124, the elastic heat conduction layer 122c can be elastically filled between the second sub-side plate 115 and the third heat conduction portion 124.

In this embodiment, the elastic heat conduction layer 122c is made of heat conduction foam. Thermal conductive foam (Thermal conductive foam) is a foam material with a high Thermal conductivity.

Further, the material of the second sub-side plate 115 includes, but is not limited to, a material with a relatively high thermal conductivity, such as aluminum, aluminum alloy, and the like.

Of course, in other embodiments, the third heat conduction portion 124 may be directly attached to the second sub-side plate 115 to realize direct heat conduction.

The following embodiments will exemplify specific structures of the first and second heat- transfer members 125 and 120.

Optionally, the first heat conducting member 125 includes, but is not limited to, a heat conducting copper plate. The second heat conducting member 120 includes, but is not limited to, at least one of a heat conducting copper plate, a temperature equalizing plate, and a graphene heat conducting sheet.

In one embodiment, the first heat-conducting member 125 is a heat-conducting copper plate. The first heat conduction portion 121, the second heat conduction portion 123 and the third heat conduction portion 124 are heat conduction copper plates formed by bending integrally. The first heat-conducting member 125 can rapidly conduct heat of the light-emitting unit 211 to the first, second, and third heat-conducting portions 121, 123, and 124. The first heat conduction member 125 and the first heat conduction portion 121 may be integrally formed.

In another embodiment, the first heat conducting member 125 is a heat conducting copper plate, the first heat conducting portion 121, the second heat conducting portion 123 and the third heat conducting portion 124 are a U-shaped uniform temperature plate formed by bending integrally, and the uniform temperature plate can conduct heat conducted by the first heat conducting member 125 to the air at a very high speed, thereby improving heat dissipation efficiency very quickly. It can be understood that the inside of the Vapor Chamber (VC) is a vacuum cavity, which contains a capillary structure and a working medium, and the heat is rapidly diffused in the cavity by the phase change (evaporation and condensation) of the working medium, thereby achieving the effect of vapor chamber temperature equalization in a plane (two-dimensional).

In yet another embodiment, referring to fig. 8 and 9, the first heat conducting member 125 is a heat conducting copper plate, and the first, second and third heat conducting portions 121, 123 and 124 are U-shaped heat conducting copper plates (121 a, 123a and 124a in fig. 8) and three graphene heat conducting sheets (121 b, 123b and 124b in fig. 8) attached to the U-shaped heat conducting copper plate. Wherein, first heat-conducting piece 125 can conduct the heat of luminescence unit 211 to U-shaped heat conduction copper fast, and then enlarges heat radiating area, and U-shaped heat conduction copper conducts the heat to graphite alkene conducting strip, utilizes the high heat conductivity characteristic of graphite alkene conducting strip in the plane, realizes thermal quick scattering. In this embodiment, the first heat-conducting member 125 and the U-shaped heat-conducting plate can be integrally formed, so as to improve the heat-conducting efficiency between the first heat-conducting member 125 and the U-shaped heat-conducting plate.

Of course, the graphene thermal conductive sheet may also be shaped like a flat plate, an L, a U, or the like. As can be understood, the graphene sheet is a novel heat conducting and dissipating material with high heat conductivity coefficient, and can realize rapid heat diffusion.

Optionally, a thermal radiation layer is disposed on an outer surface of the outer shell 110, and a high thermal emissivity coating is sprayed on the surface of the outer shell 110, so that radiation and heat dissipation efficiency is improved.

In other embodiments, the first heat conduction member 125 is not limited to the L-shape, and the first heat conduction member 125 can also cover the bottom side and the top side of the optical-mechanical assembly 200. The first heat conducting element 125 is fixed to the first heat conducting portion 121, and the first heat conducting portion 121 is fixed to the housing 110, so that the optical-mechanical assembly 200 is fixed to the housing 110 through the first heat conducting element 125 and the first heat conducting portion 121. In other words, the first heat conducting element 125 and the first heat conducting portion 121 not only serve as a heat conducting structure of the optical-mechanical assembly 200, but also serve as a fixing structure for fixing the optical-mechanical assembly 200 on the housing 110.

In other embodiments, the first heat conducting portion 121 may have a groove, and at least a portion of the optical-mechanical assembly 200 or the first heat conducting member 125 is disposed in the groove to receive or position the optical-mechanical assembly 200.

Referring to fig. 5, the housing 110 further has a plurality of first heat dissipating holes 118 and a plurality of second heat dissipating holes 119 communicating with the inner cavity 113. The first heat dissipation hole 118 and the second heat dissipation hole 119 are connected to the inner cavity 113 and the outside air of the housing 110.

The shape, size and number of the first louvers 118 and the second louvers 119 are not limited in this application. Alternatively, the first louvers 118 may be arranged in an orthogonal matrix, or in a triangular matrix, and so on.

Referring to fig. 5, the first heat dissipation hole 118 is disposed at a position of the side plate close to the bottom plate 112 or disposed on the bottom plate 112. When the first heat dissipation hole 118 is disposed on the side plate, the present application does not limit which sub-side plate the first heat dissipation hole 118 is disposed on, in other words, the first heat dissipation hole 118 may be disposed on at least one of the first sub-side plate 114, the second sub-side plate 115, the third sub-side plate 116, and the fourth sub-side plate 117.

Referring to fig. 5, the second heat dissipation holes 119 are disposed at positions of the side plates close to the top plate 111 or disposed on the top plate 111. When the second heat dissipation hole 119 is disposed on the side plate, the specific sub-side plate on which the second heat dissipation hole 119 is disposed is not limited, in other words, the second heat dissipation hole 119 may be disposed on at least one of the first sub-side plate 114, the second sub-side plate 115, the third sub-side plate 116, and the fourth sub-side plate 117.

The second heat dissipation hole 119 and the first heat dissipation hole 118 may be disposed on the same sub-board or different sub-boards.

Optionally, the first heat dissipation hole 118 and the second heat dissipation hole 119 are respectively disposed at a position of the first sub-side plate 114 close to the bottom plate 112 and a position close to the top plate 111. Optionally, the first heat dissipation hole 118 is disposed at a position of the bottom plate 112 close to the first sub-side plate 114 (not limited thereto), and the second heat dissipation hole 119 is disposed at a position of the first sub-side plate 114 close to the top plate 111. Optionally, the first heat dissipation hole 118 is disposed at a position of the first sub-side plate 114 close to the bottom plate 112, and the second heat dissipation hole 119 is disposed at a position of the top plate 111 close to the first sub-side plate 114 (not limited thereto). Optionally, the first heat dissipation hole 118 is disposed at a position of the bottom plate 112 close to the first sub-side plate 114 (not limited thereto), and the second heat dissipation hole 119 is disposed at a position of the top plate 111 close to the first sub-side plate 114 (not limited thereto). Of course, the present application also includes a second sub-side plate 115, a third sub-side plate 116, and a fourth sub-side plate 117 instead of the first sub-side plate 114.

Referring to fig. 2 and 3, a first portion of the second heat-conducting member 120 is configured to contact the first heat-conducting member 125. A second portion of the second heat-conducting member 120 is disposed adjacent to the bottom plate 112 and spaced apart from the bottom plate 112, or a second portion of the second heat-conducting member 120 is connected to the bottom plate 112.

The principle of the second heat conduction member 120 for heat conduction includes, but is not limited to: the first portion of the second heat conducting member 120 is configured to absorb heat of the first heat conducting member 125 and the heat generating module and conduct the heat to the second portion of the second heat conducting member 120, the heat of the second portion of the second heat conducting member 120 is conducted to the gas (including but not limited to air) in the inner cavity 113, so that the gas in the inner cavity 113 is heated and expanded, the expanded gas rises under the action of buoyancy (positive Z-axis direction) and then flows out through the second heat dissipating hole 119, after the gas in the inner cavity 113 is reduced, the gas pressure outside the housing 110 is greater than the gas pressure in the inner cavity 113, so that the gas near the first heat dissipating hole 118 outside the housing 110 flows into the inner cavity 113 through the first heat dissipating hole 118 under the effect of the gas pressure difference, and thus a gas flow channel is formed, wherein the gas flows from the first heat dissipating hole 118 to the second heat dissipating hole 119 through the inner cavity 113. When this process continues, a dynamic air flow is created that flows in through the first louvers 118, flows in the cavity 113, and flows out through the second louvers 119. The temperature of the gas flowing in from the first heat dissipation hole 118 is relatively low, and after the gas is subjected to heat transfer with the second heat conduction member 120, part of the heat can be taken away, and the gas flows out from the second heat dissipation hole 119, and the circulation is performed, so that the heat dissipation of the second heat conduction member 120 is realized.

In the embodiment of the present invention, after the second heat conduction member 120 absorbs the heat of the heat generating module, the heat is used to heat the gas in the inner cavity 113, and since a portion of the second heat conduction member 120 is close to the bottom plate 112, the gas near the bottom plate 112 can be heated by the heat conducted by the second heat conduction member 120, and expands, and the density decreases, and then rises under the buoyancy to move out of the second heat dissipation hole 119. In other words, the heat of the heat generating module is the power source that forms the first heat dissipation hole 118, passes through the inner cavity 113 to the gas flow channel of the second heat dissipation hole 119, and it is not necessary to additionally set up the power source that lets the air circulation such as fan, so, the heat dissipation structure 100 that this application provided can realize noiseless (or minimum noise) heat dissipation, and the fan does not rotate, also can reduce vibrations etc. that the heat dissipation structure 100 caused because of the fan rotates, improve the installation stability or the placement stability of the projector 1000.

By arranging the first heat dissipation hole 118 and the second heat dissipation hole 119 on the housing 110 of the heat dissipation structure 100, the heat on the heat generation module is conducted to the position close to the bottom plate 112 through the second heat conduction member 120, and the gas at the position of the housing 110 close to the bottom plate 112 is heated, the gas expands after being heated and the density is reduced, and moves upwards (Z-axis positive direction) under the action of buoyancy so as to flow out from the second heat dissipation hole 119, the gas in the inner cavity 113 is reduced, and the gas outside the housing 110 flows into the inner cavity 113 of the housing 110 through the first heat dissipation hole 118 under the action of the air pressure difference, so that the gas flows to the second heat dissipation hole 119 from the first heat dissipation hole 118 through the inner cavity 113, the heat on the second heat-conducting piece 120 is taken away at the in-process that the gas flows, and then dispel the heat to the module that generates heat, the heat radiation structure 100 that this application provided has utilized the heat of second heat-conducting piece 120 for making the power supply that forms the air current flow direction, first louvre 118, through the formation of the gas flow direction of inner chamber 113 flow direction to second louvre 119, can improve the radiating efficiency effectively, and need not to use the fan to form first louvre 118, through the gas flow direction of inner chamber 113 flow direction to second louvre 119, the use of fan has been reduced, the noise has both been reduced, vibration and drop risk have still been reduced, the reliability of heat radiation structure 100 has been improved.

The size of the first heat conduction portion 121 is not particularly limited in the present application. Optionally, one end of the first heat conduction part 121 is close to the second heat dissipation hole 119, and the other end of the first heat conduction part 121 is close to the bottom plate 112. That is, two opposite ends of the first heat conduction part 121 along the Z-axis direction are respectively close to the second heat dissipation hole 119 and the bottom plate 112. Further, the other end of the first heat conduction portion 121 is close to the first heat dissipation hole 118, so that the air is heated by the heat dissipated from the first heat conduction portion 121 after entering from the first heat dissipation hole 118 and then rises to the second heat dissipation hole 119 to flow out, the air flow path is less blocked, the flow channel is smooth, and the air can be promoted to flow rapidly. Optionally, two opposite ends of the first heat conducting portion 121 along the X-axis direction are respectively close to the third sub-side plate 116 and the fourth sub-side plate 117, but are spaced apart from the third sub-side plate 116 and the fourth sub-side plate 117, so as to increase the heat dissipation area of the first heat conducting portion 121.

For convenience of description, the elastic heat conduction layer filled between the first heat conduction portion 121 and the first sub-side plate 114 is defined as a first elastic heat conduction layer 122a. The size of the first elastic heat conductive layer 122a is not limited in the present application. Alternatively, the first elastic heat conduction layer 122a and the first heat conduction portion 121 are similar in shape, for example, square, triangular, circular, etc. When the first sub-side plate 114 is square, the first elastic heat conduction layer 122a and the first heat conduction part 121 may be square in shape. Optionally, the four sides of the first elastic heat conduction layer 122a are slightly smaller than the first heat conduction portion 121, but not limited to this embodiment.

Referring to fig. 2 and 7, the first heat dissipation hole 118 is located between an end surface of the first elastic heat conduction layer 122a facing the bottom plate 112 and the bottom plate 112.

Referring to fig. 2 and fig. 6, the size of the second heat conduction portion 123 is not limited in detail. In this embodiment, opposite ends of the second heat conduction portion 123 in the Y-axis direction are respectively close to the first sub-side plate 114 and the second sub-side plate 115. Opposite ends of the second heat conduction portion 123 in the X-axis direction are respectively close to the third sub-side plate 116 and the fourth sub-side plate 117.

It should be noted that "close" is described herein with respect to the overall heat dissipation structure 100, and those skilled in the art can see that two objects are "close" to each other when looking at the structure of the heat dissipation structure 100. However, the present application does not limit the specific distance range of "close".

Optionally, referring to fig. 2 and fig. 7, the first heat dissipation holes 118 are disposed in a region of the first sub-side plate 114 close to the bottom plate 112. The plurality of first louvers 118 are arranged in a plurality of rows, each row is along the X-axis direction, the opposite ends of each row of first louvers 118 are respectively close to the third sub-side plate 116 and the fourth sub-side plate 117, so that the gas outside the first heat conducting portion 121 uniformly or approximately uniformly enters the inner cavity 113 along the X-axis direction, or so that the gas entering from the plurality of first louvers 118 forms a wide airflow along the X-axis direction, and further the contact area between the airflow and the first heat conducting portion 121 is increased, the heat exchange rate is increased, and the heat dissipation efficiency is improved.

Further, referring to fig. 2 and fig. 7, at least a portion of the plurality of first heat dissipation holes 118 is exposed to an area covered by the first heat conduction portion 121 on the first sub-side plate 114. Optionally, the first heat dissipation holes 118 are located between the end surface of the first elastic heat conduction layer 122a facing the bottom plate 112 and the bottom plate 112. Thus, the gas entering through the first heat dissipation holes 118 can flow to the bottom plate 112 through the gap between the first elastic heat conduction layer 122a and the bottom plate 112, and flow to the space surrounded by the first heat conduction portion 121 and the second heat conduction portion 123 from the gap between the first heat conduction portion 121 and the third sub-side plate 116.

Referring to fig. 2 and 7, the second heat dissipation holes 119 are disposed in a region of the first sub-side plate 114 close to the top plate 111. The plurality of second louvers 119 are arranged in a plurality of rows, each row is along the X-axis direction, the opposite ends of each row of second louvers 119 are close to the third sub-side plate 116 and the fourth sub-side plate 117, respectively, so that the gas entering from the plurality of first louvers 118 and the gas flowing out from the plurality of second louvers 119 form a wide airflow along the width of the X-axis direction, thereby increasing the contact area between the airflow and the first heat conducting part 121, increasing the heat exchange rate, and improving the heat dissipation efficiency.

Optionally, referring to fig. 2 and fig. 7, the second heat dissipation hole 119 is located outside the orthographic projection of the first heat conduction portion 121 on the first sub-side plate 114. In other words, the second heat dissipation holes 119 are exposed to the area of the first heat conduction portion 121 shielded by the first sub-side plate 114, so that the gas in the cavity 113 is not shielded by the first heat conduction portion 121 and flows out through the second heat dissipation holes 119 as soon as possible.

In this embodiment, the bottom plate 112, the second heat conduction portion 123 and the second elastic heat conduction layer 122b are all square. The four sides of the second elastic heat conduction layer 122b are slightly shorter than the four sides of the second heat conduction portion 123.

Referring to fig. 2 and fig. 6, in the present embodiment, the second sub-side plate 115, the third heat conducting portion 124 and the third elastic heat conducting layer 122c are all square. The lengths of the four sides of the third heat-conducting portion 124 are slightly shorter than the lengths of the four sides of the second sub-side plate 115. The lengths of the four sides of the third elastic heat conduction layer 122c are all slightly shorter than the lengths of the four sides of the third heat conduction portion 124.

As such, the ends of the first and second elastic heat conductive layers 122a and 122b that are adjacent are spaced apart. The ends of the third elastic heat conductive layer 122c that are adjacent to the second elastic heat conductive layer 122b are spaced apart.

Optionally, referring to fig. 2 and fig. 7, a portion of the first heat dissipation hole 118 is disposed in a region of the first sub-side plate 114 close to the bottom plate 112, and another portion of the first heat dissipation hole 118 is disposed in a region of the second sub-side plate 115 close to the bottom plate 112. A part of the second heat dissipation hole 119 is disposed in a region of the first sub-side plate 114 close to the top plate 111, and another part of the second heat dissipation hole 119 belongs to a region of the second sub-side plate 115 close to the top plate 111. Through the above-mentioned heat dissipation hole layout, the air outside the housing 110 can flow in from the first heat dissipation hole 118 of the first sub-side plate 114, and then flow out through the second heat dissipation hole 119 of the first sub-side plate 114 (this can be regarded as a longitudinal flow channel) or flow out from the second heat dissipation hole 119 on the second sub-side plate 115 (this can be regarded as a diagonal flow channel); the air outside the housing 110 can flow in through the first heat dissipation hole 118 on the second sub-side plate 115, and then flow out through the second heat dissipation hole 119 on the first sub-side plate 114 (this can be regarded as a diagonal flow channel) or flow out through the second heat dissipation hole 119 on the second sub-side plate 115 (this can be regarded as a longitudinal flow channel); thus, longitudinal air circulation can be realized on both sides of the shell 110, and diagonal air circulation can also be realized, so that the air circulation rate inside the shell 110 and the coverage range of the flow channel in the whole shell 110 are improved.

Optionally, the first heat conducting portion 121, the second heat conducting portion 123, and the third heat conducting portion 124 are all disposed along and close to the first sub-side plate 114, the bottom plate 112, and the second sub-side plate 115, so that on one hand, the first heat conducting portion 121, the second heat conducting portion 123, and the third heat conducting portion 124 are U-shaped, and a space surrounded by the first heat conducting portion 121, the second heat conducting portion 123, and the third heat conducting portion 124 is larger, and thus a larger space can be formed inside the first heat conducting portion 121, the second heat conducting portion 123, and the third heat conducting portion 124 to accommodate other devices, and the other devices can also be cooled.

In other embodiments, the second heat-conducting member 120 of the heat dissipation structure 100 may further include a heat-conducting plate disposed adjacent to the third sub-side plate 116 and opposite to the third sub-side plate 116, which may refer to the arrangement of the first heat-conducting portion 121 relative to the first sub-side plate 114. In other embodiments, the second heat conduction member 120 may further include a heat conduction plate disposed adjacent to and opposite to the fourth sub-side plate 117 in a manner that can refer to the disposition of the first heat conduction portion 121 with respect to the first sub-side plate 114. In other embodiments, the second heat-conducting member 120 may further include a heat-conducting plate disposed adjacent to the top plate 111 and opposite to the top plate 111, in a manner that can refer to the disposition of the first heat-conducting portion 121 with respect to the first sub-side plate 114. In other words, the present application does not specifically limit the specific shape of the heat conductive plate of the second heat conductive member 120 and on which sides the heat conductive plate is disposed.

According to the projector 1000 provided by the application, for example, the design of forced air cooling heat dissipation is mainly adopted for intelligent portable micro-projection products, desktop projection products and the like, heat generated by an optical machine is dissipated by matching a fan with a heat sink, and the existence of the fan inevitably increases the air noise of the product and reduces the user experience; the presence of moving parts such as fans can add a reliability risk to the overall projection system. For portable projection products, the use scene is closer to the user and the situations of vibration, falling and the like are easier to occur, so the control requirements on noise and the structural reliability of the products are stricter.

In order to reduce product noise and improve system structure reliability, the application provides a heat dissipation design scheme based on a natural heat dissipation principle, which comprises that an air inlet (a plurality of first heat dissipation holes 118) and an air outlet (a plurality of second heat dissipation holes 119) are respectively formed in the lower part and the upper part of two sides of a shell 110, so that natural convection from bottom to top can be formed in the air in the shell 110, a heat dissipation effect is enhanced, heat generated by an optical-mechanical assembly 200 is conducted to the shell 110 by canceling the design of a fan and a heat sink, and heat dissipation is performed by utilizing natural convection and heat radiation of the air; the light emitting units 211 of the optical-mechanical assembly 200 are connected by a first heat conducting member 125 (e.g., an L-shaped heat conducting copper plate), and the outer side of the first heat conducting member 125 is attached to a U-shaped soaking structure formed by the first heat conducting part 121, the second heat conducting part 123 and the third heat conducting part 124, so as to realize rapid diffusion of light source heat to a larger area; optionally, the U-shaped temperature equalization structure is composed of a double-layer structure, a part of the inner layer directly attached to the L-shaped heat-conducting copper plate of the optical-mechanical assembly 200 is a U-shaped heat-conducting copper plate, which plays a role in supporting the optical-mechanical assembly 200 and assisting in heat transfer, the outer layer is attached to the outer surface of the U-shaped heat-conducting copper plate in a close manner, and graphene heat-conducting fins are attached to the outer surface of the outer layer, so that rapid heat dissipation is realized by utilizing the high heat-conducting property of graphene in a plane; optionally, the U-shaped temperature equalizing structure is connected with the outer shell 110 through heat conducting foam, so that heat is finally conducted to the outer shell 110 to be dissipated, the heating effect of the bottom can be enhanced, and the natural convection heat exchange efficiency is improved; the surface of the shell 110 is sprayed with high-emissivity paint, so that the radiation heat dissipation efficiency is improved. The natural heat dissipation structure scheme provided by the application has a completely silent hot spot, and can improve user experience. In addition, because a fan and a radiator are eliminated, the reliability of the whole structure is improved to a certain extent.

The foregoing is a partial description of the present application, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present application, and these modifications and decorations are also regarded as the protection scope of the present application.

Claims (8)

1. The utility model provides a heat radiation structure of projector, the projector includes ray apparatus subassembly, ray apparatus subassembly includes a plurality of modules that generate heat towards different sides, a serial communication port, includes:

the shell is provided with a top plate, a bottom plate and a side plate, wherein the top plate, the bottom plate and the side plate are oppositely arranged, the side plate is enclosed between the top plate and the bottom plate, an inner cavity is formed by the top plate, the bottom plate and the side plate, and the side plate comprises a first sub-side plate and a second sub-side plate which are oppositely arranged;

the first heat conducting piece is arranged in the inner cavity and attached to the heating modules facing to at least two sides; and

the second heat conducting piece is arranged in the inner cavity, is arranged at the periphery of the first heat conducting piece in a bent mode and is connected with the first heat conducting piece, and at least part of the second heat conducting piece is connected with or close to the bottom plate; the second heat conducting piece comprises a first heat conducting portion, a second heat conducting portion and a third heat conducting portion, wherein the first heat conducting portion, the second heat conducting portion and the third heat conducting portion are formed by bending integrally; one side of the second heat conduction part is opposite to the bottom of the optical-mechanical assembly, and the other side of the second heat conduction part is connected with the bottom plate; the third heat conduction part is connected to one end, far away from the first heat conduction part, of the second heat conduction part, and the third heat conduction part is connected with the second sub-side plate.

2. The heat dissipation structure of claim 1, wherein the first heat conductive member comprises an L-shaped copper plate.

3. The heat dissipating structure of claim 1, wherein a thermally conductive adhesive or a thermally conductive gasket is disposed between the first heat conducting member and the first heat conducting portion.

4. The heat dissipating structure of claim 1, further comprising at least one elastic heat conducting layer, wherein opposite sides of the at least one elastic heat conducting layer are respectively attached between the first sub-side plate and the first heat conducting portion, and/or between the bottom plate and the second heat conducting portion, and/or between the second sub-side plate and the third heat conducting portion.

5. The heat dissipation structure of claim 4, wherein the elastic heat conduction layer is a heat conduction foam.

6. The heat dissipation structure of any one of claims 1 to 5, wherein the housing further has a plurality of first heat dissipation holes and a plurality of second heat dissipation holes communicating with the inner cavity, the plurality of first heat dissipation holes are disposed at positions of the side plates close to the bottom plate or at the bottom plate, and the plurality of second heat dissipation holes are disposed at positions of the side plates close to the top plate or at the top plate.

7. The heat dissipation structure according to any one of claims 1 to 5, wherein the second heat conduction member is a copper plate, a temperature equalization plate, or a copper plate and a graphene heat conduction sheet attached to an outer surface of the copper plate; the outer surface of the shell is provided with a heat radiation layer.

8. A projector, characterized by comprising the heat dissipation structure according to any one of claims 1 to 7.

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