CN209731917U - A kind of logic control device facilitating heat dissipation - Google Patents
A kind of logic control device facilitating heat dissipation Download PDFInfo
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- CN209731917U CN209731917U CN201920241301.1U CN201920241301U CN209731917U CN 209731917 U CN209731917 U CN 209731917U CN 201920241301 U CN201920241301 U CN 201920241301U CN 209731917 U CN209731917 U CN 209731917U
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- shell
- control unit
- heat sink
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- cpu control
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Abstract
The utility model discloses a kind of logic control devices for facilitating heat dissipation, shell including being in body structure, the both ends open of shell and its opening passes through cover closure respectively, the 10G CPU Control Unit for being provided perpendicular to two cover boards in shell and being parallel to each other, I/O control panel and power control board, the heat sink of cooperation corresponding with 10G CPU Control Unit is provided on one lateral surface of shell, heat sink is to be detachably connected with shell, heat sink is provided with the radiating block of cooperation corresponding with the nucleus module of 10G CPU Control Unit close to one end of 10G CPU Control Unit, the first through hole matched with radiating block is provided on shell.For the utility model by the way that detachable heat sink and radiating block is arranged, thermal diffusivity is good, can guarantee that the device is stable, work well, to improve the stability of the device, reliability and service life.
Description
Technical field
The utility model relates to control equipment technical field more particularly to a kind of logic control device for facilitating heat dissipation.
Background technique
PLC control system, that is, programmable logic controller (PLC), also referred to as logic control device, it is a kind of digital operation
Electronic device, it is used to storage inside it and is executed logical operation, sequential operation, meter using the memory that can be programmed
When, the operations such as counting and arithmetical operation instruction, and can be output and input by digital or analog, control various types
Machinery or production process.Can logic control device usually by central processing unit (i.e. CPU) unit, storage unit, input/output
The module assembleds such as (i.e. I/O) unit, power supply form, it has high reliability, strong antijamming capability, powerful, flexible, easy to learn
Easy-to-use, small in size, light-weight, cheap feature has been widely used for steel, petroleum, chemical industry, electric power, building materials, machinery
The various industries such as manufacture, automobile, light textile, communications and transportation, environmental protection and entertainment.Logic control device is as closely control member
Device can generate certain heat in use, still, existing some logic control devices, due to being deposited in its design
Cause thermal diffusivity poor in certain defect, to influence the stability and service life of logic control device.
Utility model content
The utility model above-mentioned existing logic control device there are aiming at the problem that, propose a kind of logic control for facilitating heat dissipation
Device processed.
In order to solve the above-mentioned technical problem, the utility model proposes following technical solutions:
A kind of logic control device facilitating heat dissipation, including be in body structure shell, the both ends open of shell and its open
For mouth respectively by cover closure, two cover boards are parallel and are respectively to be detachably connected with shell, are provided perpendicular in shell
Two cover boards and the 10G CPU Control Unit being parallel to each other, I/O control panel and power control board, be provided on a lateral surface of shell with
The heat sink of the corresponding cooperation of 10G CPU Control Unit, heat sink and shell are to be detachably connected, 10G CPU Control Unit be located at I/O control panel and
Between heat sink, between 10G CPU Control Unit and power control board, heat sink is set I/O control panel close to one end of 10G CPU Control Unit
It is equipped with the radiating block of cooperation corresponding with the nucleus module of 10G CPU Control Unit, is provided with first matched with radiating block on shell
Through-hole.
The beneficial effects of the utility model are: two cover boards are respectively to be detachably connected with shell, heat sink is with shell
It is detachably connected, installation, convenient disassembly, easy to repair and replacement interior of shell associated components, and by heat sink and dissipates
Heat block can preferably radiate to the 10G CPU Control Unit of interior of shell, I/O control panel and power control board, and thermal diffusivity is good, protect
It demonstrate,proves device stabilization, work well, to improve the stability of the device, reliability and service life.
In some embodiments, multiple and 10G CPU Control Unit, I/O control panel and power supply are provided on a cover board to control
The second through-hole that the interface of plate matches is provided with several buckles connecting with other equipment on the outside of another cover board.
In some embodiments, heat sink and radiating block are integrally machined molding.
In some embodiments, heat sink is provided with multiple first radiating grooves far from one end of 10G CPU Control Unit, shell
Outside is provided with multiple second radiating grooves.
In some embodiments, it is provided with the first groove body for disposing heat sink on shell, first through hole is located at the
The bottom surface of one groove body, the bottom surface of the first groove body are provided with several the first mounting holes matched with heat sink, are arranged on heat sink
There are several the second mounting holes matched with the first mounting hole.
In some embodiments, the bottom surface of the first groove body is respectively arranged with close to the both ends of two cover boards and controls with CPU
The stop screw that plate matches, two stop screws can limit 10G CPU Control Unit inside the shell.
In some embodiments, be provided in shell respectively with 10G CPU Control Unit, I/O control panel and power control board
The slot that two sides match, the both ends of 10G CPU Control Unit, I/O control panel and power control board compress with two cover boards connect respectively
Touching.
In some embodiments, it is respectively arranged on the two sides of 10G CPU Control Unit, I/O control panel and power control board
Several spring leafs matched with slot.
In some embodiments, radiating block is provided with the nucleus module with 10G CPU Control Unit close to one end of 10G CPU Control Unit
The protection block matched.
In some embodiments, the material of protection block is thermally conductive foam or heat conductive silica gel.
It is all to be not specifically noted in addition, in technical solutions of the utility model, it can be by using normal in this field
Rule means realize the technical program.
Detailed description of the invention
Fig. 1 is a kind of first perspective view of the logic control device for facilitating heat dissipation of the utility model.
Fig. 2 is a kind of second perspective view of the logic control device for facilitating heat dissipation of the utility model.
Fig. 3 is a kind of cross-sectional view for the logic control device for facilitating heat dissipation of the utility model.
Fig. 4 is the partial enlarged view in the utility model Fig. 3 at A.
Fig. 5 is the schematic perspective view of the utility model shell.
Fig. 6 is the top view of the utility model shell.
Fig. 7 is the schematic perspective view of the utility model heat sink.
Numbering in the drawing explanation, shell 1, first through hole 11, the second radiating groove 12, the first groove body 13, the first mounting hole
131, the 5th mounting hole 132, stop screw 14, slot 15, thickening part 16, third mounting hole 17, cover board 2, the second through-hole 21, the
Four mounting holes 22, third through-hole 23,10G CPU Control Unit 3, first row needle 31, I/O control panel 4, mother row 41, power control board 5, the
Two row's needles 51, heat sink 6, radiating block 61, the first radiating groove 62, the second mounting hole 63, protection block 64, buckle 7, spring leaf 8, shape
State indicator light 9.
Specific embodiment
In order to make the purpose of the utility model, technical solutions and advantages more clearly understood, below in conjunction with attached drawing and implementation
Example, the present invention will be further described in detail.It should be appreciated that specific embodiment described herein is only to explain this
Utility model is not used to limit the utility model.Furthermore it should be noted that term " vertical ", " parallel ", " one end ", " two
The orientation or positional relationship of the instructions such as end ", " bottom surface ", " inside ", " outside " is to be based on the orientation or positional relationship shown in the drawings,
It is merely for convenience of describing the present invention and simplifying the description, rather than the element of indication or suggestion meaning must have specifically
Orientation is constructed and operated in a specific orientation, therefore should not be understood as limiting the present invention, term " first ",
" second " etc. is used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance.
Embodiment:
A kind of logic control device facilitating heat dissipation, as shown in Fig. 1~3,5~7, the shell 1 including being in body structure, outside
The both ends open of shell 1 and its opening pass through cover board 2 respectively and close, and two cover boards 2 are parallel and are respectively detachably to connect with shell 1
It connects, for example is spirally connected, hinged or clamping etc., specifically, two cover boards 2 are connect with shell 1 using screw respectively, the end angle of shell 1
Place is respectively arranged with thickening part 16, this spline structure is more firm, and the third installation matched with cover board 2 is provided on thickening part 16
Hole 17, usual third mounting hole 17 be threaded hole, is respectively arranged on two cover boards 2 and several matches with third mounting hole 17
Cover board 2 is connect, operation side by the 4th mounting hole 22 using screw by the 4th mounting hole 22 and third mounting hole 17 with shell 1
Just, stability is good.10G CPU Control Unit 3, I/O control panel 4 and the electricity for being provided perpendicular to two cover boards 2 in shell 1 and being parallel to each other
Source control panel 5, usual 10G CPU Control Unit 3 and I/O control panel 4 connects by first row needle 31, are provided on I/O control panel 4 and the
Mother row 41 that one row's needle 31 matches is provided with and arranges the second row needles 51 that mother 41 matches on power control board 5, shell 1
The heat sink 6 of cooperation corresponding with 10G CPU Control Unit 3 is provided on one lateral surface, usual heat sink 6 is parallel to 10G CPU Control Unit 3,
Preferably cooperate convenient for heat sink 6 with 10G CPU Control Unit 3 in this way, and easy for installation, heat sink 6 is detachably to connect with shell 1
It connects, for example is spirally connected, hinged or clamping etc., between I/O control panel 4 and heat sink 6, I/O control panel 4 is located at 10G CPU Control Unit 3
Between 10G CPU Control Unit 3 and power control board 5, heat sink 6 is provided with the core with 10G CPU Control Unit 3 close to one end of 10G CPU Control Unit 3
The radiating block 61 of the corresponding cooperation of core module can preferably radiate to 10G CPU Control Unit 3 in this way, be provided on shell 1 with
The first through hole 11 that radiating block 61 matches, such radiating block 61 are more stable, reliable.
The utility model in use, 10G CPU Control Unit 3, I/O control panel 4 and power control board 5 inside shell 1
The heat of generation can be discharged by shell 1 and heat sink 6, radiating block 61 can also nucleus module to 10G CPU Control Unit 3 it is more preferable
Ground radiates, and thermal diffusivity is good, to guarantee that the device is stable, work well, improves stability, the reliability of the device
And service life, and two cover boards 2 are respectively to be detachably connected with shell 1, heat sink 6 is to be detachably connected with shell 1, is pacified
Dress, convenient disassembly, the associated components easy to repair with inside replacement shell 1.
Further, as shown in Figures 1 to 3, be provided on a cover board 2 it is multiple with 10G CPU Control Unit 3, I/O control panel 4 and
The second through-hole 21 that the interface of power control board 5 matches, in this way convenient for being connect with external circuit, the outside of another cover board 2
Several buckles 7 connecting with other equipment are provided with, are usually symmetrical arranged there are two buckling 7, convenient for the device is installed on electricity
Control cabinet is medium, and easy to operate, stability is good.
Further, as shown in Fig. 3, Fig. 7, heat sink 6 and radiating block 61 are integrally machined molding, stable structure, processing, group
Dress is convenient, to improve the stability and reliability of heat sink 6.
Further, as shown in Figure 1, Figure 2, shown in Fig. 5~7, heat sink 6 is provided with multiple the far from one end of 10G CPU Control Unit 3
One radiating groove 62, the outside of shell 1 are provided with multiple second radiating grooves 12, are increased by the first radiating groove 62 and the second radiating groove 12
It is big to guarantee that the device is more stable, reliably carries out work to improve the thermal diffusivity of the device with extraneous contact surface
Make.
Further, as shown in figs. 3 and 5, it is provided with the first groove body 13 for disposing heat sink 6 on shell 1, first
Through-hole 11 is located at the bottom surface of the first groove body 13, and the bottom surface of the first groove body 13 is provided with several the first peaces matched with heat sink 6
Hole 131 is filled, is provided with several the second mounting holes 63 matched with the first mounting hole 131, usual second mounting hole on heat sink 6
63 be threaded hole, and heat sink 6 is placed in the first of shell 1 by the first mounting hole 131 and the second mounting hole 63 using screw
Easy to operate in groove body 13, the placement of heat sink 6 is more firm, and structure is more compact, to improve the stability of the device
And reliability.
Further, as shown in figs. 3 and 5, the bottom surface of the first groove body 13 is respectively arranged with close to the both ends of two cover boards 2
The stop screw 14 matched with 10G CPU Control Unit 3, the bottom surface of the first groove body 13, which is provided with, to be matched with two stop screws 14
10G CPU Control Unit 3 can be limited in shell 1 by the 5th mounting hole 132, two stop screws 14.In assembling, first CPU is controlled
Making sheet 3, I/O control panel 4 and power control board 5 place in shell 1, it is good then to install two stop screws 14, then will dissipate
Hot plate 6 is placed in the first groove body 13 of shell 1, and 10G CPU Control Unit 3 can be limited in shell 1 by two such stop screw 14
It is interior, and only first dismounting heat sink 6 could remove two stop screws 14, thus more stable, safe and reliable.
Further, as illustrated in figures 3-6, be provided in shell 1 respectively with 10G CPU Control Unit 3, I/O control panel 4 and power supply
The slot 15 that the two sides of control panel 5 match, it is easy to operate by the way of inserting connection, and 10G CPU Control Unit 3, I/O
The both ends of control panel 4 and power control board 5 compress with two cover boards 2 contact respectively, thus by 10G CPU Control Unit 3, I/O control panel 4
And power control board 5 be firmly positioned in shell 1.
Further, as illustrated in figures 3-6, divide on the two sides of 10G CPU Control Unit 3, I/O control panel 4 and power control board 5
It is not provided with several spring leafs 8 matched with slot 15, usual spring leaf 8 is V-shaped, length of multiple spring leafs 8 along slot 15
Spend direction arrangement, after slot 15 is inserted into the two sides of 10G CPU Control Unit 3, I/O control panel 4 and power control board 5 respectively, spring leaf 8
By natural resiliency restoring force, keep 10G CPU Control Unit 3, I/O control panel 4 and power control board 5 more firm in card slot, thus
Keep the placement of 10G CPU Control Unit 3, I/O control panel 4 and power control board 5 stable, reliable.
Further, as shown in Fig. 3, Fig. 7, radiating block 61 is provided with and 10G CPU Control Unit 3 close to one end of 10G CPU Control Unit 3
The protection block 64 that matches of nucleus module, protection block 64 contacts with the nucleus module of 10G CPU Control Unit 3, with buffer protection
Effect, prevents the damage of the nucleus module of 10G CPU Control Unit 3.Preferably, the material of protection block 64 is thermally conductive foam or thermal conductive silicon
Glue, thermally conductive foam and heat conductive silica gel are while the nucleus module of buffer protection 10G CPU Control Unit 3, additionally it is possible to preferably carry out heat
Amount conduction, thermal diffusivity is more preferable, and heat conductive silica gel has thermally conductive stabilization, good compression property, insulation, damping sound-absorbing, reusable etc.
Advantage, and its two sides has natural tack, and operability and maintainability are strong.
Further, as shown in Fig. 2, the interface of 10G CPU Control Unit 3 and power control board 5 is additionally provided with several states refers to
Show lamp 9, such as operating status, power supply status, the state that reports an error etc., is provided with and several is matched with status indicator lamp 9 on cover board 2
Third through-hole 23 is convenient for judging the working condition of the device by status indicator lamp 9, safer and more reliable.
Above-described is only some embodiments of the utility model, it should be appreciated that the common skill of this field
For art personnel, without departing from the concept of the present invention, it can also be improved according to the above description or be handed over
It changes, and all these improvement and exchange all should belong to the protection scope of the appended claims for the utility model.
Claims (10)
1. a kind of logic control device for facilitating heat dissipation, which is characterized in that the shell (1) including being in body structure, the shell
(1) both ends open and its opening is closed by cover board (2) respectively, two cover boards (2) it is parallel and respectively with it is described outer
Shell (1) is to be detachably connected, the CPU control for being provided perpendicular to two cover boards (2) in the shell (1) and being parallel to each other
Plate (3), I/O control panel (4) and power control board (5), are provided on a lateral surface of the shell (1) and the CPU is controlled
The heat sink (6) of plate (3) corresponding cooperation, the heat sink (6) are to be detachably connected with the shell (1), the CPU control
For plate (3) between the I/O control panel (4) and the heat sink (6), the I/O control panel (4) is located at CPU control
Between plate (3) and the power control board (5), the heat sink (6) close to the 10G CPU Control Unit (3) one end be provided with
The radiating block (61) of the corresponding cooperation of nucleus module of the 10G CPU Control Unit (3) is provided on the shell (1) and dissipates with described
The first through hole (11) that heat block (61) matches.
2. a kind of logic control device for facilitating heat dissipation according to claim 1, which is characterized in that a cover board
(2) multiple interface phases with the 10G CPU Control Unit (3), the I/O control panel (4) and the power control board (5) are provided on
The second through-hole (21) of cooperation is provided with several buckles (7) connecting with other equipment on the outside of another described cover board (2).
3. a kind of logic control device for facilitating heat dissipation according to claim 1, which is characterized in that the heat sink (6)
Molding is integrally machined with the radiating block (61).
4. a kind of logic control device for facilitating heat dissipation according to claim 1, which is characterized in that the heat sink (6)
One end far from the 10G CPU Control Unit (3) is provided with multiple first radiating grooves (62), is provided on the outside of the shell (1) more
A second radiating groove (12).
5. a kind of logic control device for facilitating heat dissipation according to claim 1, which is characterized in that on the shell (1)
It is provided with the first groove body (13) for disposing the heat sink (6), the first through hole (11) is located at first groove body
(13) bottom surface, the bottom surface of first groove body (13) are provided with several the first mounting holes matched with the heat sink (6)
(131), several the second mounting holes (63) matched with first mounting hole (131) are provided on the heat sink (6).
6. a kind of logic control device for facilitating heat dissipation according to claim 5, which is characterized in that first groove body
(13) bottom surface is respectively arranged with the limit spiral shell matched with the 10G CPU Control Unit (3) close to the both ends of two cover boards (2)
It follows closely (14), the 10G CPU Control Unit (3) can be limited in the shell (1) by two stop screws (14).
7. a kind of logic control device for facilitating heat dissipation according to claim 1, which is characterized in that in the shell (1)
It is provided with and matches respectively with the two sides of the 10G CPU Control Unit (3), the I/O control panel (4) and the power control board (5)
The slot (15) of conjunction, the both ends of the 10G CPU Control Unit (3), the I/O control panel (4) and the power control board (5) respectively with
Two cover boards (2) compress contact.
8. a kind of logic control device for facilitating heat dissipation according to claim 7, which is characterized in that the 10G CPU Control Unit
(3), several and the slot (15) are respectively arranged on the two sides of the I/O control panel (4) and the power control board (5)
The spring leaf (8) matched.
9. existing according to claim 1 to a kind of logic control device for facilitating heat dissipation, feature described in any claim in 8
In the radiating block (61) is provided with the nucleus module with the 10G CPU Control Unit (3) close to the one end of the 10G CPU Control Unit (3)
The protection block (64) matched.
10. a kind of logic control device for facilitating heat dissipation according to claim 9, which is characterized in that the protection block
(64) material is thermally conductive foam or heat conductive silica gel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920241301.1U CN209731917U (en) | 2019-02-26 | 2019-02-26 | A kind of logic control device facilitating heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920241301.1U CN209731917U (en) | 2019-02-26 | 2019-02-26 | A kind of logic control device facilitating heat dissipation |
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| Publication Number | Publication Date |
|---|---|
| CN209731917U true CN209731917U (en) | 2019-12-03 |
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ID=68684104
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920241301.1U Active CN209731917U (en) | 2019-02-26 | 2019-02-26 | A kind of logic control device facilitating heat dissipation |
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| CN (1) | CN209731917U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113253552A (en) * | 2021-04-29 | 2021-08-13 | 深圳市火乐科技发展有限公司 | Heat radiation structure and projector |
| CN113747712A (en) * | 2021-09-01 | 2021-12-03 | 北京恒润安科技有限公司 | Integrated form integration data acquisition device |
-
2019
- 2019-02-26 CN CN201920241301.1U patent/CN209731917U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113253552A (en) * | 2021-04-29 | 2021-08-13 | 深圳市火乐科技发展有限公司 | Heat radiation structure and projector |
| CN113747712A (en) * | 2021-09-01 | 2021-12-03 | 北京恒润安科技有限公司 | Integrated form integration data acquisition device |
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