CN113245545A - Diamond composite sheet inner synthesis mold packaging structure and packaging method - Google Patents
Diamond composite sheet inner synthesis mold packaging structure and packaging method Download PDFInfo
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- CN113245545A CN113245545A CN202110407229.7A CN202110407229A CN113245545A CN 113245545 A CN113245545 A CN 113245545A CN 202110407229 A CN202110407229 A CN 202110407229A CN 113245545 A CN113245545 A CN 113245545A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/10—Sintering only
- B22F3/1003—Use of special medium during sintering, e.g. sintering aid
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Abstract
The invention relates to a diamond composite sheet inner synthetic mould packaging structure and a packaging method, comprising the following steps: a metal cup; diamond powder assembled in the metal cup; the hard alloy matrix is assembled in the metal cup and is positioned on one side of the diamond powder; and the packaging body is positioned at the opening of the metal cup, and the packaging body seals the interior of the metal cup. According to the encapsulating structure and the encapsulating method for the synthetic die in the diamond composite sheet, disclosed by the invention, impurities, gas and water are not easy to enter the metal cup from the opening of the metal cup due to the internal die encapsulation, so that the cleanliness of diamond powder can be obviously improved, and the quality problem of 'sinter scars' is improved; the internal mold packaging high-temperature heat treatment can also realize pre-graphitization of diamond powder, and promote the D-D bonding densification of diamond, thereby improving the comprehensive performance of products.
Description
Technical Field
The invention relates to the technical field of superhard materials, in particular to a structure and a method for packaging a synthetic die in a diamond composite sheet.
Background
At present, the diamond composite sheet has been widely applied to cutting teeth of PDC drill bits due to the excellent wear resistance, and is mainly applied to the fields of drilling of petroleum and natural gas and the like.
In the related technology, an inner synthesis module assembly is prepared in the process of manufacturing the diamond compact, and the diamond compact is formed by reprocessing the inner synthesis module assembly; but interior synthetic mould subassembly is inside at the in-process of depositing, and impurity, gas and moisture are inside entering interior synthetic mould subassembly easily, cause the pollution to the inside composition of interior synthetic mould subassembly, and the interior synthetic mould subassembly after the pollution is processing into the in-process of diamond compact piece, and impurity, gas and moisture that get into in the interior synthetic mould subassembly can discharge the diamond compact piece surface to influence diamond compact piece's appearance quality.
Therefore, there is a need to design a new package structure of the diamond composite wafer to overcome the above problems.
Disclosure of Invention
The embodiment of the invention provides a packaging structure and a packaging method for a synthetic die in a diamond composite sheet, and aims to solve the problem that impurities, gas and moisture in the related technology easily enter an internal synthetic die assembly to pollute components in the internal synthetic die assembly and influence the appearance quality of the diamond composite sheet.
In a first aspect, a diamond composite sheet inner synthesis mold packaging structure is provided, which includes: a metal cup; diamond powder assembled in the metal cup; the hard alloy matrix is assembled in the metal cup and is positioned on one side of the diamond powder; and the packaging body is positioned at the opening of the metal cup, and the packaging body seals the interior of the metal cup.
In some embodiments, the package is a solder, and the package is one or more of a copper alloy, a nickel alloy, and a silver alloy.
In some embodiments, a package cup is sleeved outside the metal cup, the package body is located between the opening of the metal cup and the package cup, and the package body connects the package cup and the metal cup.
In some embodiments, the material of the encapsulation cup is one or more of titanium, niobium, zirconium, molybdenum, and tungsten.
In some embodiments, the package cup includes a first package cup sleeved outside the metal cup and a second package cup sleeved outside the first package cup, and an opening direction of the second package cup is opposite to an opening direction of the first package cup.
In a second aspect, a method for encapsulating a diamond composite sheet synthesis die is provided, which comprises the following steps: sequentially assembling diamond powder and a hard alloy matrix in a metal cup, and enabling the hard alloy matrix to be positioned on one side of the diamond powder to form an inner synthetic die; and fixing the packaging body at the opening of the metal cup, and sealing the interior of the metal cup by the packaging body to obtain a packaged inner synthetic mold.
In some embodiments, before assembling the diamond powder and the hard alloy matrix in the metal cup in sequence, and making the hard alloy matrix be positioned at one side of the diamond powder to form the inner synthetic mould, the method further comprises the following steps: and carrying out hydrogen burning on the diamond powder and the packaging body at the temperature of 600-900 ℃ for 0.5-2 hours.
In some embodiments, before the step of fixing the package body to the opening of the metal cup and allowing the package body to seal the inside of the metal cup, the method further includes: and placing a packaging body at the opening of the metal cup, and sleeving the packaging cup outside the metal cup to enable the inner wall of the packaging cup to contact the packaging body.
In some embodiments, an encapsulation cup is further sleeved outside the metal cup, and the package body is fixed at the opening of the metal cup, so that the package body seals the inside of the metal cup to obtain an encapsulated inner synthetic mold, including: and heating the combination of the metal cup, the packaging cup and the packaging body in a vacuum induction heating furnace to melt the packaging body and then connecting the metal cup and the packaging cup to obtain a packaged inner synthetic mold.
In some embodiments, the vacuum degree in the vacuum induction heating furnace is 1 × 10-2～1×10-1Pa, heating temperatureThe temperature is 600-1500 ℃, and the heating time is 10-100 min.
The technical scheme provided by the invention has the beneficial effects that:
the embodiment of the invention provides a packaging structure and a packaging method for a synthetic die in a diamond composite sheet, wherein diamond powder and a hard alloy matrix are assembled inside a metal cup, a packaging body is arranged at an opening of the metal cup, the interior of the metal cup can be sealed through the packaging body to form the packaged internal synthetic die, so that impurities, gas and water are not easy to enter the interior of the metal cup from the opening of the metal cup, the diamond powder and the hard alloy matrix inside the metal cup are not easy to be polluted, the cleanliness of the diamond powder and the hard alloy matrix can be obviously improved, the comprehensive performance of a product is improved, meanwhile, the packaged internal synthetic die can be stored for a long time, and the arrangement and coordinated production of the diamond composite sheet are facilitated.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a diamond composite sheet inner synthetic mold packaging structure according to an embodiment of the present invention;
fig. 2 is a flowchart of a method for encapsulating a diamond composite wafer according to an embodiment of the present invention.
In the figure:
1. a metal cup; 2. diamond powder; 3. a cemented carbide substrate; 4. a package body; 5. and (6) packaging the cup.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
The embodiment of the invention provides a packaging structure and a packaging method for a synthetic die in a diamond composite sheet, which can solve the problem that impurities, gas and moisture in the related technology easily enter an internal synthetic die assembly to pollute components in the internal synthetic die assembly and influence the appearance quality of the diamond composite sheet.
Referring to fig. 1, a diamond composite sheet inner synthesis mold packaging structure provided for an embodiment of the present invention may include: the metal cup 1, wherein the metal cup 1 may have a cavity inside, and one end of the metal cup 1 may have an opening, which may allow external air to enter the cavity inside the metal cup 1, in this embodiment, the metal cup 1 is preferably a cylinder, in other embodiments, the metal cup 1 may be designed into other shapes according to the shape of the diamond compact; the diamond powder 2 can be assembled in the cavity of the metal cup 1; the hard alloy matrix 3 is also assembled in the cavity of the metal cup 1 and can be positioned on one side of the diamond powder 2, and in the embodiment, the hard alloy matrix 3 is positioned on the upper side or the lower side of the diamond powder 2; and the packaging body 4 can be positioned at the opening of the metal cup 1, the packaging body 4 seals the interior of the metal cup 1, that is, the packaging body 4 can block the communication between the cavity and the outside air, in the storage process, the outside impurities, gas and moisture are not easy to enter the cavity of the metal cup 1 from the opening of the metal cup 1, the diamond powder 2 and the hard alloy matrix 3 are not polluted, the packaged internal synthetic mold formed by the metal cup 1, the diamond powder 2, the hard alloy matrix 3 and the packaging body 4 can be stored for a long time, simultaneously the cleanliness of the diamond powder 2 and the hard alloy matrix 3 is high, in the process of processing the packaged internal synthetic mold into the diamond composite sheet, because the packaged internal synthetic mold almost has no impurities, gas and moisture, the appearance quality of the diamond composite sheet is not affected, the comprehensive performance of the diamond compact is improved.
Referring to fig. 1, further, the metal cup 1 may include a first metal cup 1, the first metal cup 1 may be cylindrical, and an inner cavity of the first metal cup 1 forms the cavity, one end of the first metal cup 1 may have a first opening, and the other end may have a bottom, the diamond powder 2 may be put into the bottom of the first metal cup 1 through the first opening, the cemented carbide substrate 3 may be put into the first metal cup 1 through the first opening and placed above the diamond powder 2, the metal cup 1 may further include a first metal cup 1 sleeved outside the first metal cup 1, wherein the second metal cup 1 may have a shape identical to that of the first metal cup 1, the diameter of the second metal cup 1 is slightly larger than that of the first metal cup 1, one end of the second metal cup 1 has a second opening, and when the first opening of the first metal cup 1 faces upwards, the second opening of the second metal cup 1 may face downwards, the first metal cup 1, together with the diamond powder 2 and the cemented carbide substrate 3 inside the first metal cup 1, may be inserted into the second metal cup 1 through a second opening, so that the second metal cup 1 surrounds the first metal cup 1, and at the same time, the first opening faces the bottom of the second metal cup 1, the metal cup 1 may further include a third metal cup 1, the third metal cup 1 may have a shape identical to that of the second metal cup 1, the diameter of the third metal cup 1 is slightly larger than that of the second metal cup 1, one end of the third metal cup 1 has a third opening, when the second opening of the second metal cup 1 faces downward, the third opening of the third metal cup 1 may face upward, so that the second metal cup 1, together with the first metal cup 1, the diamond powder 2 and the cemented carbide substrate 3, may be inserted into the third metal cup 1 through the third opening, thereby forming an internal synthesis mold, in this embodiment, the metal cup 1 comprises three cups, namely a first metal cup 1, a second metal cup 1 and a third metal cup 1, and in other embodiments, the metal cup 1 may be one cup, two cups or more than three cups.
Referring to fig. 1, in some embodiments, the package 4 may be a solder, and the package 4 may be one or more of a copper alloy, a nickel alloy, and a silver alloy, that is, the solder may be a pure copper alloy, a pure nickel alloy, or a pure silver alloy, or a combination of any of these alloys, and the solder may be a circular ring shape and covers the third metal cup 1 along the edge of the third opening, so as to seal the gap between the third metal cup 1 and the second metal cup 1, or a circular sheet shape, that is, no hole is provided in the center of the solder, and the entire solder covers the third opening, so as to completely seal the third opening; in this embodiment, the length of the third metal cup 1 in the axial direction may be greater than the length of the second metal cup 1 in the axial direction, so that after the second metal cup 1 is placed in the third metal cup 1, the end of the third metal cup 1 having the third opening may extend beyond the bottom of the second metal cup 1, at this time, the end of the third metal cup 1 may be bent toward the axis direction, and the end of the third metal cup 1 is fixed to the second metal cup 1 by the packaging body 4, so as to seal the gap between the third metal cup 1 and the second metal cup 1, so that the cavity inside the first metal cup 1 is sealed, and is not easily communicated with the outside air, in other embodiments, the packaging body 4 may also be a sealant or other substance capable of sealing the opening of the metal cup 1.
Referring to fig. 1, in some embodiments, an encapsulation cup 5 may be sleeved outside a metal cup 1, an encapsulation body 4 may be located between an opening of the metal cup 1 and the encapsulation cup 5, and the encapsulation body 4 connects the encapsulation cup 5 and the metal cup 1, that is, the encapsulation cup 5 may also be a cylindrical cup, an inner composite mold is placed in the encapsulation cup 5, the encapsulation body 4 is sandwiched between the opening of the metal cup 1 and the encapsulation cup 5, one end of the metal cup 1 having the opening may be fixed to an inner wall surface of the encapsulation cup 5 through the encapsulation body 4, so that the encapsulation body 4 or the encapsulation body 4 together with the inner wall surface of the encapsulation cup 5 seals the opening of the metal cup 1, by disposing the encapsulation cup 5 outside the metal cup 1, the end of the metal cup 1 having the opening may be connected to the encapsulation cup 5 through the encapsulation body 4, on the basis of the encapsulation body 4, the encapsulation cup 5 is additionally disposed at the opening of the metal cup 1 to seal the metal cup 1, further enhancing the sealing effect and avoiding the poor contact between the edge of the packaging body 4 and the metal cup 1 to cause the insufficient tightness of the internal sealing of the metal cup 1.
Referring to fig. 1, by arranging the packaging cup 5, the pollution of external impurities to the internal hard alloy substrate 3 and the diamond powder 2 can be shielded, the material of the packaging cup 5 is preferably one or more of titanium, niobium, zirconium, molybdenum and tungsten, and the melting point of the materials of titanium, niobium, zirconium, molybdenum and tungsten is higher, so that the packaging cup is not easy to melt, meanwhile, the packaging cup has certain air suction and impurity absorption properties, impurities and gas in the packaging cup can be absorbed, and the cleanliness of the hard alloy substrate 3 and the diamond powder 2 is further improved.
Referring to fig. 1, in some embodiments, the encapsulation cup 5 may include a first encapsulation cup sleeved outside the metal cup 1 and a second encapsulation cup sleeved outside the first encapsulation cup, an opening direction of the second encapsulation cup is opposite to an opening direction of the first encapsulation cup, each of the first encapsulation cup and the second encapsulation cup may be cylindrical, one end of the first encapsulation cup may have a fourth opening, the inner mold may be inserted into the first encapsulation cup through the fourth opening, an opening of the metal cup 1 (i.e., an opening of the outermost third metal cup 1) faces a bottom of the first encapsulation cup, the encapsulation body 4 is disposed between the bottom of the first encapsulation cup and the metal cup 1, the fourth opening may face downward when the opening of the metal cup 1 faces upward, one end of the second encapsulation cup may have a fifth opening, and the fifth opening may face downward when the fourth opening faces upward, make interior synthetic mould and first packaging body 4 can insert in second packaging body 4 through the fifth opening, through setting up first encapsulation cup and the second encapsulation cup that opening direction is opposite, when reinforcing synthetic mould bulk strength in the encapsulation back, the air need can get into first encapsulation cup bottom and metal cup 1 contact around a plurality of bendings from the fifth opening part, and can further reduce the air that gets into in encapsulation cup 5 in the narrow and small clearance between first encapsulation cup and second encapsulation cup, further avoid diamond powder 2 and carbide base member 3 to be contaminated.
Referring to fig. 2, an embodiment of the present invention further provides a method for encapsulating a diamond composite sheet in a composite die, which may include the following steps:
step 201: the diamond powder 2 and the hard alloy substrate 3 are sequentially assembled in the metal cup 1, so that the hard alloy substrate 3 is positioned at one side of the diamond powder 2 to form an inner synthetic die.
In some embodiments, before step 201, the method may further include: and (2) carrying out hydrogen burning on the diamond powder 2 and the packaging body 4 at the temperature of 600-900 ℃ for 0.5-2 hours, and specifically: placing the diamond powder 2 and the packaging body 4 which need to be assembled subsequently in a hydrogen atmosphere, and heating at the temperature of 600-900 ℃ for 0.5-2 hours to clean the diamond powder 2 and the packaging body 4 and remove impurity gas and moisture adsorbed on the surfaces of the diamond powder 2 and the packaging body 4, so that the cleanliness of the diamond powder 2 and the packaging body 4 is improved, the surface activity of the diamond powder 2 is enhanced, and the subsequent activation sintering is facilitated.
In some alternative embodiments, in step 201, the assembling the diamond powder 2 and the cemented carbide substrate 3 into the metal cup 1 in sequence, so that the cemented carbide substrate 3 is located on one side of the diamond powder 2 to form the internal synthetic mould, may include: firstly, the hydrogen-fired diamond powder 2 is assembled with the bottom of a metal cup 1, then a hard alloy matrix 3 is placed in the metal cup 1 and is placed above the diamond powder 2 to form an inner synthetic die, and meanwhile, the metal cup 1 can comprise a first metal cup 1, a second metal cup 1 and a third metal cup 1.
Step 202: and fixing the packaging body 4 at the opening of the metal cup 1, and sealing the interior of the metal cup 1 by the packaging body 4 to obtain a packaged inner synthetic mold.
In some embodiments, before step 202, the method may further include: placing a packaging body 4 at an opening of the metal cup 1, and sleeving the packaging cup 5 outside the metal cup 1, so that the inner wall of the packaging cup 5 contacts the packaging body 4, that is, the packaging body 4 is positioned at one end of the metal cup 1, and the packaging body 4 is clamped between the packaging cup 5 and the metal cup 1; meanwhile, the package 4 may include a first package 4 and a second package 4, the first package 4 is sleeved outside the metal cup 1, and the second package 4 is sleeved outside the first package 4.
In some embodiments, in step 202, the fixing the package 4 to the opening of the metal cup 1 to seal the package 4 inside the metal cup 1 to obtain the encapsulated inner mold may include: putting the combination of the metal cup 1 and the packaging body 4 into a vacuum induction heating furnace for heating, so that the packaging body 4 and the metal cup 1 are fixed to obtain a packaged inner synthetic mold, in the embodiment, the packaging body 4 is preferably solder, in the heating process in the vacuum induction heating furnace, on one hand, along with the rise of temperature and vacuum degree, impurities are decomposed, gas is gradually discharged from the diamond powder 2 to the outside of the inner synthetic mold, the solder is gradually melted, along with the reduction of temperature, the solder is cooled into solid, the welding sealing of the metal cup 1 is completed, because the inner synthetic mold is sealed, the diamond powder 2 can not adsorb any impurities and gas from the outside, the cleanliness of the diamond powder 2 is obviously improved, the problem of 'sintering scars' of the diamond composite sheet is improved, the storage time of the inner synthetic mold is effectively prolonged, on the other hand, the high temperature in the vacuum induction heating furnace can also realize the pre-graphitization of the diamond powder 2 in the packaging process, the method is beneficial to the improvement of the sintering quality of the powder material at high temperature and high pressure and the densification of the diamond D-D bonding, thereby improving the comprehensive performance of the product.
Furthermore, a packaging cup 5 can be further sleeved outside the metal cup 1, the packaging body 4 is clamped between the opening of the metal cup 1 and the packaging cup 5, the assembly formed by assembling the packaging cup 5, the packaging body 4 and the metal cup 1 can be placed into a vacuum induction heating furnace together for heating, the packaging body 4 is melted, the packaging cup 5 is connected with one end, provided with the opening, of the metal cup 1 through the packaging body 4, meanwhile, the melted packaging body 4 and the packaging cup 5 jointly seal the opening of the metal cup 1, and the packaged inner synthetic die is obtained.
In some embodiments, the degree of vacuum in the vacuum induction heating furnace is preferably 1 × 10-2～1×10-1Pa, the heating temperature is preferably 600-1500 ℃, and the heating time is preferably 10-100 min.
In some optional embodiments, after step 202, the encapsulated inner mold may be subjected to external assembly (i.e., a plurality of external assembly elements such as salt material, carbon material, metal gasket, pyrophyllite, etc. are added outside the encapsulated inner mold), and then the encapsulated inner mold is subjected to high-temperature and high-pressure sintering to obtain the diamond compact.
When the packaging cup 5 is made of a titanium cup and the packaging body 4 is made of silver alloy, the comparison result of the first diamond compact prepared by the method is shown in table 1 compared with the conventional compact:
TABLE 1
The test results in the table 1 show that compared with the conventional composite sheet, the first diamond composite sheet has the advantages that the powder cleanliness is improved by 27.7%, the surface of the sintered composite sheet has no sintering scars, the effective storage time of the inner synthetic mold is prolonged by 257%, the wear resistance is improved by 26.5%, the impact resistance is improved by 85.7%, and the service life is prolonged by 50%.
When the packaging cup 5 is made of niobium and the packaging body 4 is made of copper alloy, the comparison result of the second diamond compact prepared by the method is shown in table 2 compared with the conventional compact:
TABLE 2
The test results of the table 2 show that compared with the conventional composite sheet, the second diamond composite sheet has the advantages that the powder cleanliness is improved by 43.8%, the surface of the sintered composite sheet has no sintering scars, the effective storage time of the inner synthetic film is prolonged by 328%, the wear resistance is improved by 43.6%, the impact resistance is improved by 78.6%, and the service life is prolonged by 50%.
The principles of the diamond composite sheet inner synthesis mold packaging structure and the packaging method provided by the embodiment of the invention are as follows:
because the diamond powder 2 and the hard alloy matrix 3 are assembled inside the metal cup 1, the opening of the metal cup 1 is provided with the packaging body 4, the interior of the metal cup 1 can be sealed through the packaging body 4 to form a packaged inner synthetic die, so that impurities, gas and moisture are not easy to enter the metal cup 1 from the opening of the metal cup 1, the diamond powder 2 and the hard alloy matrix 3 inside the metal cup 1 can not be polluted, therefore, the cleanliness of the diamond powder 2 and the hard alloy matrix 3 can be obviously improved, the packaged inner synthetic die can be stored for a long time without reducing the performance, the flexible arrangement and the coordinated production are very practical, meanwhile, the impurities, the gas and the moisture are not easy to enter the diamond powder 2 and the hard alloy matrix 3, and in the process of forming the diamond composite sheet by high-temperature and high-pressure sintering, the impurities in the diamond powder 2 and the hard alloy matrix 3 are hardly discharged to the surface of the diamond, the surface quality problem of the 'sintering scars' of the diamond composite sheet is improved, and the comprehensive performance of the diamond composite sheet is improved.
In the description of the present invention, it should be noted that the terms "upper", "lower", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, which are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and operate, and thus, should not be construed as limiting the present invention. Unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are intended to be inclusive and mean, for example, that they may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
It is to be noted that, in the present invention, relational terms such as "first" and "second", and the like, are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The foregoing are merely exemplary embodiments of the present invention, which enable those skilled in the art to understand or practice the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. A diamond composite sheet inner synthetic mould packaging structure is characterized by comprising:
a metal cup (1);
a diamond powder (2) assembled in the metal cup (1);
a hard alloy substrate (3) assembled in the metal cup (1) and positioned on one side of the diamond powder (2);
and the packaging body (4) is positioned at the opening of the metal cup (1), and the packaging body (4) seals the interior of the metal cup (1).
2. The diamond composite sheet internal mold package structure according to claim 1, wherein:
the packaging body (4) is solder, and the packaging body (4) is one or more of copper alloy, nickel alloy and silver alloy.
3. The diamond composite sheet internal mold package structure according to claim 1, wherein:
the metal cup (1) is sleeved with a packaging cup (5), the packaging body (4) is positioned between the opening of the metal cup (1) and the packaging cup (5), and the packaging body (4) is connected with the packaging cup (5) and the metal cup (1).
4. The diamond composite sheet internal mold package according to claim 3, wherein:
the packaging cup (5) is made of one or more of titanium, niobium, zirconium, molybdenum and tungsten.
5. The diamond composite sheet internal mold package according to claim 3, wherein:
the packaging cup (5) comprises a first packaging cup sleeved outside the metal cup (1) and a second packaging cup sleeved outside the first packaging cup, and the opening direction of the second packaging cup is opposite to that of the first packaging cup.
6. A method for encapsulating a synthetic die in a diamond composite chip is characterized by comprising the following steps:
sequentially assembling diamond powder (2) and a hard alloy matrix (3) in a metal cup (1) to enable the hard alloy matrix (3) to be positioned on one side of the diamond powder (2) to form an inner synthetic die;
and fixing the packaging body (4) at the opening of the metal cup (1), and sealing the interior of the metal cup (1) by the packaging body (4) to obtain a packaged inner synthetic die.
7. The method for encapsulating a diamond composite sheet inner synthetic mould according to claim 6, wherein before the diamond powder (2) and the hard alloy matrix (3) are assembled in the metal cup (1) in sequence, and the hard alloy matrix (3) is positioned at one side of the diamond powder (2) to form the inner synthetic mould, the method further comprises the following steps:
and (3) carrying out hydrogen burning on the diamond powder (2) and the packaging body (4) at the temperature of 600-900 ℃ for 0.5-2 hours.
8. The method for encapsulating a composite die in a diamond compact according to claim 6, wherein before the step of fixing the package body (4) to the opening of the metal cup (1) and sealing the interior of the metal cup (1) with the package body (4), the method for encapsulating an encapsulated inner composite die further comprises:
an encapsulation body (4) is placed at the opening of the metal cup (1), and an encapsulation cup (5) is sleeved outside the metal cup (1), so that the inner wall of the encapsulation cup (5) is in contact with the encapsulation body (4).
9. The method for encapsulating the synthesis die in the diamond composite sheet according to claim 6, wherein an encapsulating cup (5) is further sleeved outside the metal cup (1), and the encapsulating body (4) is fixed at the opening of the metal cup (1) so that the encapsulating body (4) seals the inside of the metal cup (1) to obtain the encapsulated inner synthesis die, comprising the following steps:
and (3) putting the combination of the metal cup (1), the packaging cup (5) and the packaging body (4) into a vacuum induction heating furnace for heating, so that the packaging body (4) is connected with the metal cup (1) and the packaging cup (5) after being melted, and an inner synthetic die after packaging is obtained.
10. The method of encapsulating a composite die in a diamond composite wafer as claimed in claim 9, wherein:
the vacuum degree in the vacuum induction heating furnace is 1 multiplied by 10-2～1×10-1Pa, the heating temperature is 600-1500 ℃, and the heating time is 10-100 min.
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| CN112647852A (en) * | 2020-12-25 | 2021-04-13 | 武汉新锐合金工具有限公司 | Hard alloy matrix material for polycrystalline diamond compact and application thereof |
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