CN113245275B - Epitaxial wafer belt cleaning device - Google Patents

Epitaxial wafer belt cleaning device Download PDF

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Publication number
CN113245275B
CN113245275B CN202110525530.8A CN202110525530A CN113245275B CN 113245275 B CN113245275 B CN 113245275B CN 202110525530 A CN202110525530 A CN 202110525530A CN 113245275 B CN113245275 B CN 113245275B
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Prior art keywords
cleaning
epitaxial wafer
sliding
sliding frame
support
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CN202110525530.8A
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Chinese (zh)
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CN113245275A (en
Inventor
王武汉
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Sichuan Yajixin Electronic Technology Co ltd
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Sichuan Yajixin Electronic Technology Co ltd
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Publication of CN113245275A publication Critical patent/CN113245275A/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02Cleaning by the force of jets or sprays
    • B08B3/022Cleaning travelling work
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B13/00Accessories or details of general applicability for machines or apparatus for cleaning
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04Cleaning involving contact with liquid
    • B08B3/08Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26DRYING
    • F26BDRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B21/00Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
    • F26B21/001Drying-air generating units, e.g. movable, independent of drying enclosure
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26DRYING
    • F26BDRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B21/00Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
    • F26B21/004Nozzle assemblies; Air knives; Air distributors; Blow boxes

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

The invention discloses an epitaxial wafer cleaning device which comprises a cleaning pool, a sliding frame, a cleaning mechanism, a rotating mechanism and a drying mechanism, wherein the cleaning pool is provided with a partition plate to divide the cleaning pool into a primary cleaning area and a fine cleaning area, screw rods are arranged at the tops of two cleaning sides, the sliding frame capable of sliding on the cleaning pool is arranged on the screw rods, sliding blocks placed on the screw rods are arranged at two ends of the sliding frame, threads are machined on the bottom surface of each sliding block, the cleaning mechanism is arranged above the sliding frame, the rotating mechanism is arranged below the sliding frame, and the drying mechanism is arranged at one end, far away from the primary cleaning area, of the fine cleaning area. According to the invention, the screw rod is arranged on the cleaning pool, the sliding frame is arranged on the screw rod, the rotating screw rod is used for driving the sliding frame to move, the epitaxial wafer arranged on the sliding frame is cleaned by the cleaning device arranged on the cleaning pool, and the epitaxial wafer is driven to rotate on the sliding frame by matching with the rotating mechanism, so that the cleaning dead angle is reduced, the cleaning quality is ensured, and meanwhile, the drying device is matched for timely removing water stains remained on the epitaxial wafer so as to prevent secondary pollution.

Description

Epitaxial wafer belt cleaning device
Technical Field
The invention relates to the field of epitaxial wafer production equipment, in particular to an epitaxial wafer cleaning device.
Background
The epitaxial wafer is formed by the cutting of the single crystal silicon rod that the processing was accomplished, the easy residual pollutant in epitaxial wafer surface that the cutting was accomplished, these pollutants can influence the quality of epitaxial wafer, thereby influence the performance of chip, consequently, need wash the epitaxial wafer, current cleaning methods mainly have two kinds, one kind is manual cleaning, another kind is cleaning machine washing, manual cleaning efficiency is lower, and some washing liquids can produce harm to artificial health, and machine washing efficiency improves to some extent, but can have the condition emergence of wasing not thorough, for this reason need one kind can rinse the equipment of epitaxial wafer thoroughly, guarantee cleaning quality.
Disclosure of Invention
The invention aims to provide an epitaxial wafer cleaning device, which can improve the cleaning quality on the premise of ensuring the cleaning efficiency of an epitaxial wafer.
The purpose of the invention is realized by the following technical scheme:
an epitaxial wafer cleaning device comprises a cleaning pool, a sliding frame, a cleaning mechanism, a rotating mechanism and a drying mechanism, wherein the cleaning pool is rectangular, a partition plate is arranged in the middle of the cleaning pool along the length direction of the cleaning pool to separate the cleaning pool into a primary cleaning area and a fine cleaning area, a horizontal and rotatable screw rod is arranged at the top of the side wall of the cleaning pool along the two sides of the length direction of the cleaning pool, the screw rod is provided with the sliding frame capable of sliding on the cleaning pool, the sliding frame comprises U-shaped frames, connecting rods, rubber sleeves, separating strips and sliding blocks, the U-shaped frames are provided with two groups, the bottoms of the two groups of U-shaped frames are provided with avoiding grooves protruding upwards, the two sides of the two groups of U-shaped frames are connected through a plurality of connecting rods, the connecting rods are provided with a plurality of separating strips at intervals, the connecting rods between the adjacent separating strips are sleeved with the rubber sleeves, the two ends of the U-shaped frames are provided with the sliding blocks placed on the screw rod, semicircular through grooves aligned with the screw rod are processed on the bottom surface of the sliding block, the processing of logical inslot has the screw with the lead screw hugging closely, and the balladeur train top is equipped with and washs the pond lateral wall and connect wiper mechanism, be equipped with the rotary mechanism that sets up along wasing pond length direction on the washing pond of balladeur train below, and rotary mechanism is located dodging of U type frame inslot, the primary wash district one end is kept away from in the essence washing district is equipped with drying mechanism.
The wiper mechanism includes support, flushing pipe, liquid pump and high-pressure pump, the support is the type of falling U, and the support both sides are fixed on the lateral wall in the washing pond outside, hang on the support of just washing district top and install the flushing pipe, the end of intaking of flushing pipe is connected with the liquid pump, the liquid pump is installed in the essence district, and the processing of the flushing pipe bottom of installing on the support has a plurality of delivery ports, install the flushing pipe that is the setting of S type on the support of essence district top, the end of intaking of flushing pipe is connected with the high-pressure pump, in the washing liquid is arranged in to the high-pressure pump, install a plurality of shower heads that are V type and distribute in the flushing pipe bottom on the support.
And a liquid supply pipe is arranged in the fine washing area.
And the bottom of the primary washing area is connected with a liquid discharge pipe.
The rotary mechanism comprises lifting frames, rotating shafts, a silica gel sleeve and a motor, the lifting frames are respectively installed on the inner walls of the two ends of the cleaning pool, the rotating shafts horizontally arranged are installed on the two lifting frames, the rotating shafts are located in the avoiding grooves of the U-shaped frames, the silica gel sleeve is sleeved on the outer wall of each rotating shaft, and one end of each rotating shaft penetrates through the cleaning tank and then is connected with an output shaft of the motor.
The drying mechanism comprises an air heater, a hot air pipeline, an air compressor and an injection pipe, the air heater is connected with the air compressor through the hot air pipeline, an outlet of the air compressor is connected with the injection pipe, the injection pipe is S-shaped and wound on the bottom surface of the support, and a plurality of air nozzles distributed in a V shape are installed at the bottom of the injection pipe.
The epitaxial wafer cleaning device provided by the invention has the beneficial effects that:
(1) the lead screw is arranged on the cleaning pool, the sliding frame is arranged on the lead screw, the rotating lead screw is utilized to drive the sliding frame to move, the epitaxial wafer arranged on the sliding frame is cleaned by the cleaning device arranged on the cleaning pool, and the rotating mechanism is matched to drive the epitaxial wafer to rotate on the sliding frame, so that the cleaning dead angle is reduced, the cleaning quality is ensured, and meanwhile, the drying device is matched to timely remove water stains remained on the epitaxial wafer so as to prevent secondary pollution;
(2) by arranging the flushing pipe and the flushing pipe, the flushing pipe firstly flushes pollutants on the surface of the epitaxial wafer by using cleaning liquid sprayed by the flushing pipe to finish primary cleaning, and then flushes the epitaxial wafer by using the flushing pipe, so that the cleaning efficiency of the epitaxial wafer can be improved, and the flushing effect is ensured;
(3) the rotating mechanism is arranged to drive the epitaxial wafer to rotate on the sliding frame, the side edge of the epitaxial wafer can be exposed in the working range of the cleaning mechanism, the epitaxial wafer can be prevented from having a cleaning dead angle, and the cleaning quality is guaranteed.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic structural diagram provided in an embodiment of the present invention.
Fig. 2 is a schematic diagram of a right-view structure according to an embodiment of the present invention.
Fig. 3 is a schematic structural diagram of a carriage according to an embodiment of the present invention.
Reference numerals: 1. a cleaning tank; 11. a partition plate; 12. a primary washing area; 13. a liquid discharge pipe; 14. a fine washing area; 15. a liquid supply tube; 16. a screw rod; 2. a carriage; 21. a U-shaped frame; 22. an avoidance groove; 23. a connecting rod; 24. a rubber sleeve; 25. a dividing strip; 26. a slider; 27. a through groove; 3. a cleaning mechanism; 31. a support; 32. a flush tube; 33. a water outlet; 34. flushing the pipe; 35. a shower head; 36. a liquid pump; 37. a high pressure pump; 4. a rotation mechanism; 41. a lifting frame; 42. a rotating shaft; 43. a silica gel sleeve; 44. a motor; 5. a drying mechanism; 51. a hot air blower; 52. a hot air duct; 53. an air compressor; 54. a blowing pipe; 55. an air nozzle.
Detailed Description
Examples
As shown in fig. 1 to fig. 3, the epitaxial wafer cleaning apparatus provided in this embodiment includes a cleaning tank 1, a carriage 2, a cleaning mechanism 3, a rotating mechanism 4, and a drying mechanism 5, the cleaning tank 1 is rectangular, a partition plate 11 is provided in the middle of the cleaning tank 1 along the length direction thereof to separate the cleaning tank 1 into a primary cleaning area 12 and a fine cleaning area 14, the bottom of the primary cleaning area 12 is connected with a liquid discharge pipe 13, a liquid supply pipe 15 is installed in the fine cleaning area 14, a horizontal and rotatable screw rod 16 is provided at the top of the side wall of the cleaning tank 1 along the two sides of the length direction thereof, the screw rod 16 is provided with the carriage 2 capable of sliding on the cleaning tank 1, the carriage 2 includes two sets of U-shaped frames 21, connecting rods 23, rubber sleeves 24, separating strips 25, and sliding blocks 26, the U-shaped frames 21 are provided with two sets, an upward convex avoiding groove 22 is processed at the bottom of the two sets of U-shaped frames 21, the two sets of U-shaped frames 21 are connected by a plurality of connecting rods 23, a plurality of separating strips 25 are arranged on the connecting rod 23 at intervals, a rubber sleeve 24 is sleeved on the connecting rod 23 between the adjacent separating strips 25, an epitaxial wafer is vertically placed on the rubber sleeve 24 between the adjacent separating strips 25, the rubber sleeve 24 is utilized to prevent the edge of the epitaxial wafer from being damaged due to friction, the safety of the epitaxial wafer is ensured, two ends of the U-shaped frame 21 are provided with sliding blocks 26 placed on the screw rod 16, a semicircular through groove 27 aligned with the screw rod 16 is processed on the bottom surface of the sliding block 26, threads abutted to the screw rod 16 are processed in the through groove 27, the U-shaped frame 21 is placed on the screw rod 16 through the sliding blocks 26 during use, the screw rod 16 is mutually screwed with the threads on the sliding blocks 26 during rotation to push the sliding frame 2 to move from the primary washing area 12 to the fine washing area 14 on the washing pool 1, a washing mechanism 3 connected with the side wall of the washing pool 1 is arranged above the sliding frame 2, and comprises a bracket 31, The washing device comprises a washing pipe 32, a flushing pipe 34, a liquid pump 36 and a high-pressure pump 37, wherein the support 31 is in an inverted U shape, two sides of the support 31 are fixed on the side wall of the outer side of the washing pool 1, the washing pipe 32 is mounted on the support 31 above the primary washing area 12 in a hanging manner, the water inlet end of the washing pipe 32 is connected with the liquid pump 36, the liquid pump 36 is mounted in the fine washing area 14 and used for conveying washing liquid in the fine washing area 14 to the washing pipe 32, a plurality of water outlets 33 are formed in the bottom of the washing pipe 32 mounted on the support 31, the flushing pipe 34 arranged in an S shape is mounted on the support 31 above the fine washing area 14, the water inlet end of the flushing pipe 34 is connected with the high-pressure pump 37, the high-pressure pump 37 is arranged in the washing liquid, a plurality of spray heads 35 distributed in a V shape are mounted at the bottom of the flushing pipe 34 mounted on the support 31, the washing liquid sprayed out through the spray heads 35 is equal to the impulsive force of a household shower head, and large impulsive force cannot be generated, can prevent the epitaxial wafer from damaging, be equipped with the rotary mechanism 4 that sets up along wasing pond 1 length direction on wasing the pond 1 below the balladeur train 2, and rotary mechanism 4 is located the groove 22 of dodging of U type frame 21, rotary mechanism 4 includes crane 41, pivot 42, silica gel cover 43 and motor 44, crane 41 installs respectively on the inner wall of wasing pond 1 both ends, installs the pivot 42 that the level set up on two crane 41, pivot 42 is located the groove 22 of dodging of U type frame 21, and the cover is equipped with silica gel cover 43 on the outer wall of pivot 42, the one end of pivot 42 passes behind the washing tank and is connected with the output shaft of motor 44, and motor 44 drives the pivot 42 rotation during the use, utilizes the silica gel cover 43 on the pivot 42 to jack up the epitaxial wafer from balladeur train 2 slightly to utilize the frictional force of silica gel cover 43 to drive the epitaxial wafer to rotate on balladeur train 2, make the all-round coverage that exposes in wiper mechanism 3 of epitaxial wafer, in order to achieve the purpose of thorough cleaning, one end of the fine cleaning area 14, which is far away from the primary cleaning area 12, is provided with a drying mechanism 5, the drying mechanism 5 comprises a hot air blower 51, a hot air pipeline 52, an air compressor 53 and an injection pipe 54, the hot air blower 51 is connected with the air compressor 53 through the hot air pipeline 52, the outlet of the air compressor 53 is connected with the injection pipe 54, the injection pipe 54 is wound on the bottom surface of the bracket 31 in an S shape, a plurality of air nozzles 55 distributed in a V shape are installed at the bottom of the injection pipe 54, the hot air heated by the hot air blower 51 blown out by the air nozzles 55 dries the cleaned epitaxial wafer, and dries the residual water stain on the epitaxial wafer to prevent the watermark from being left after the water stain is dried, and the effect of the epitaxial wafer is ensured.
The using method of the invention is as follows:
when the device is used, an epitaxial wafer to be cleaned is vertically placed on the rubber sleeve 24 between the adjacent separation strips 25, then the carriage 2 is placed on the cleaning pool 1, the sliding blocks 26 on the two sides of the carriage 2 are aligned with the screw rod 16 on the cleaning pool 1, the carriage 2 is prevented from being on the screw rod 16, the bottom of the epitaxial wafer on the carriage 2 is contacted with the silica gel sleeve 43 on the rotating shaft 42, then the screw rod 16 and the rotating shaft 42 are controlled to rotate, the carriage 2 is enabled to move from the initial cleaning area 12 to the fine cleaning area 14 of the cleaning pool 1, the rotating shaft 42 drives the epitaxial wafer to rotate on the carriage 2 through the silica gel sleeve 43 in the moving process, then the cleaning liquid in the fine cleaning area 14 is pumped to the flushing pipe 32 by the liquid pump 36, the surface of the epitaxial wafer is flushed by the water outlet 33 at the bottom of the flushing pipe 32, the carriage 2 moves to the fine cleaning area 14 after the flushing is completed, at the moment, the high-pressure pump 37 sprays the cleaning liquid through the spray head 35 on the flushing pipe 34, and further cleaning the epitaxial wafer by using the sprayed cleaning liquid, conveying the epitaxial wafer to the lower part of the drying mechanism 5 after cleaning, generating hot air by the hot air blower 51 at the moment, conveying the hot air to the air compressor 53 through the hot air pipeline 52, pressing the hot air frame by the air compressor 53, spraying the hot air out of the air spray nozzle 55 through the spray pipe 54, drying the residual cleaning liquid on the epitaxial wafer, and finishing the cleaning of the epitaxial wafer.
The above description is only a preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any modification and replacement based on the technical solution and the inventive concept provided by the present invention should be covered within the scope of the present invention. It should be noted that structures or components illustrated in the drawings are not necessarily drawn to scale, and descriptions of well-known components and processing techniques and procedures are omitted to avoid unnecessarily limiting the invention.

Claims (4)

1. The utility model provides an epitaxial wafer belt cleaning device which characterized in that: the cleaning tank is rectangular, a partition plate is arranged in the middle of the cleaning tank along the length direction of the cleaning tank, the cleaning tank is divided into a primary cleaning area and a fine cleaning area by the partition plate, horizontal and rotatable lead screws are arranged at the tops of the side walls of the cleaning tank along the two sides of the cleaning tank along the length direction of the cleaning tank, the lead screws are provided with sliding racks capable of sliding on the cleaning tank, each sliding rack comprises U-shaped racks, connecting rods, rubber sleeves, separating strips and sliding blocks, the U-shaped racks are divided into two groups, the bottoms of the two groups of U-shaped racks are provided with upwards-protruding avoiding grooves, the two sides of the two groups of U-shaped racks are connected through the connecting rods, the connecting rods are provided with the separating strips at intervals, the rubber sleeves are sleeved on the connecting rods between the adjacent separating strips, the two ends of each U-shaped rack are provided with the sliding blocks arranged on the lead screws, and the bottom surfaces of the sliding blocks are provided with semicircular through grooves aligned with the lead screws, the screw thread which is connected with the screw rod in an abutting mode is processed in the through groove, a cleaning mechanism which is connected with the side wall of the cleaning pool is arranged above the sliding frame and comprises a support, a flushing pipe, a liquid pump and a high-pressure pump, the support is inverted U-shaped, two sides of the support are fixed on the side wall outside the cleaning pool, the flushing pipe is mounted on the support above the initial cleaning area in a hanging mode, the water inlet end of the flushing pipe is connected with the liquid pump, the liquid pump is mounted in the fine cleaning area, a plurality of water outlets are processed at the bottom of the flushing pipe mounted on the support, the flushing pipe which is arranged in an S shape is mounted on the support above the fine cleaning area, the water inlet end of the flushing pipe is connected with the high-pressure pump, the high-pressure pump is arranged in cleaning liquid, a plurality of spray heads which are distributed in a V shape are mounted at the bottom of the flushing pipe mounted on the support, and a rotating mechanism which is arranged along the length direction of the cleaning pool is arranged below the sliding frame, and rotary mechanism is located dodging the inslot of U type frame, rotary mechanism includes crane, pivot, silica gel cover and motor, the crane is installed respectively on the inner wall that washs the pond both ends, installs the pivot that the level set up on two cranes, the pivot is located dodging the inslot of U type frame, and the cover is equipped with the silica gel cover on the outer wall of pivot, the one end of pivot pass behind the washing tank with the output shaft of motor, the washing district keeps away from just washing district one end and is equipped with stoving mechanism.
2. The epitaxial wafer cleaning apparatus of claim 1, wherein: and a liquid supply pipe is arranged in the fine washing area.
3. The epitaxial wafer cleaning apparatus of claim 1, wherein: the bottom of the initial washing area is connected with a liquid discharge pipe.
4. The epitaxial wafer cleaning apparatus of claim 1, wherein: the drying mechanism comprises an air heater, a hot air pipeline, an air compressor and an injection pipe, the air heater is connected with the air compressor through the hot air pipeline, the outlet of the air compressor is connected with the injection pipe, the injection pipe is S-shaped and wound on the bottom surface of the support, and a plurality of air nozzles distributed in a V shape are installed at the bottom of the injection pipe.
CN202110525530.8A 2021-05-12 2021-05-12 Epitaxial wafer belt cleaning device Active CN113245275B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110525530.8A CN113245275B (en) 2021-05-12 2021-05-12 Epitaxial wafer belt cleaning device

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Application Number Priority Date Filing Date Title
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CN113245275B true CN113245275B (en) 2022-07-26

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CN118788671A (en) * 2024-09-09 2024-10-18 浙江丽水中欣晶圆半导体科技有限公司 Epitaxial wafer surface pretreatment device and treatment method

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