CN113241312A - Process chamber of semiconductor process equipment and semiconductor process equipment - Google Patents
Process chamber of semiconductor process equipment and semiconductor process equipment Download PDFInfo
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- CN113241312A CN113241312A CN202110481774.0A CN202110481774A CN113241312A CN 113241312 A CN113241312 A CN 113241312A CN 202110481774 A CN202110481774 A CN 202110481774A CN 113241312 A CN113241312 A CN 113241312A
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- positioning groove
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- 238000000034 method Methods 0.000 title claims abstract description 116
- 230000008569 process Effects 0.000 title claims abstract description 115
- 239000004065 semiconductor Substances 0.000 title claims abstract description 59
- 239000000872 buffer Substances 0.000 claims abstract description 40
- 230000003139 buffering effect Effects 0.000 claims abstract description 36
- 238000012545 processing Methods 0.000 claims description 18
- 230000002093 peripheral effect Effects 0.000 claims description 14
- 238000010926 purge Methods 0.000 claims description 11
- 230000006835 compression Effects 0.000 claims description 3
- 238000007906 compression Methods 0.000 claims description 3
- 238000007664 blowing Methods 0.000 abstract 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 22
- 229910052721 tungsten Inorganic materials 0.000 description 22
- 239000010937 tungsten Substances 0.000 description 22
- 239000007789 gas Substances 0.000 description 17
- 238000001125 extrusion Methods 0.000 description 13
- 238000004140 cleaning Methods 0.000 description 10
- 230000000694 effects Effects 0.000 description 10
- 238000010438 heat treatment Methods 0.000 description 8
- 230000009471 action Effects 0.000 description 6
- 230000008859 change Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000002000 scavenging effect Effects 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000011086 high cleaning Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000005019 vapor deposition process Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
The invention provides a process chamber of semiconductor process equipment and the semiconductor process equipment, wherein a bearing part for bearing a wafer is arranged in the process chamber, a baffle ring assembly is arranged on the bearing part, the baffle ring assembly and the bearing part are matched to form a blowing gas channel capable of guiding gas to the edge of the wafer, the baffle ring assembly comprises a first ring body, a second ring body and a buffer part, the first ring body is arranged around the bearing part, a gap is formed between the first ring body and the bearing part, a positioning groove is arranged on the first ring body, a positioning part is arranged at the bottom of the second ring body, the positioning part is detachably inserted with the positioning groove, the second ring body shields the gap to form the blowing gas channel, and the buffer part is arranged between the positioning part and the surface opposite to the positioning groove and used for buffering the opposite acting force between the positioning part and the positioning groove. The technical scheme provided by the invention can avoid the damage of the baffle ring assembly and improve the stability and safety of the equipment.
Description
Technical Field
The invention relates to the technical field of semiconductor equipment, in particular to a process chamber of semiconductor process equipment and the semiconductor process equipment.
Background
The tungsten plug (W-plug) process is a semiconductor process in which metal tungsten is filled in openings such as a Via (Via) or a Trench (Trench), and reliable electrical conduction between a front device and a back metal is achieved by utilizing good electrical conductivity and anti-electromigration characteristics of the metal tungsten. At present, the semiconductor industry usually adopts a covering type tungsten Chemical vapor deposition (W-CVD) method to deposit tungsten, wherein the tungsten is not selectively deposited on the surface and the opening of the Wafer (Wafer), and then the tungsten deposited on the surface of the Wafer is removed by Chemical Mechanical Polishing (CMP), so that only the tungsten deposited in the opening is remained. Because the edge of the wafer has an arc-shaped chamfer (also called as "blank holder"), in order to avoid that tungsten deposited on the edge of the wafer cannot be completely removed by chemical mechanical polishing and affects the subsequent process, when the tungsten plug process is performed, the tungsten cannot be deposited within the width range of about 2mm of the edge of the wafer, namely the "blank holder" is required to be left. In the prior art, a baffle ring assembly is usually matched with a base for bearing a wafer in a tungsten plug process, a purge air channel is formed between the baffle ring assembly and the base, so that gas is guided to the edge of the wafer by the purge air channel, the edge of the wafer is blown, process gas in a vapor deposition process cannot reach the edge of the wafer, and the process requirement that a 'blank holder' is left in the tungsten plug process by the wafer is met.
The existing baffle ring assembly comprises a first ring body and a second ring body, wherein the first ring body surrounds the base at intervals, a positioning part arranged on the second ring body is inserted into a positioning groove of the first ring body, the second ring body and the base are used for bearing the wafer, the bearing surface of the wafer is shielded at intervals above the edge of the bearing surface, a gap between the inner peripheral wall of the first ring body and the outer peripheral wall of the base is reserved, and a scavenging gas channel for guiding gas is formed by the gap between the lower surface of the second ring body and the bearing surface. In the tungsten plug process, a substrate bearing wafer rises to a high position, a first ring body is inserted with a second ring body, after a tungsten film in a process chamber is accumulated to a certain thickness, the process chamber needs to be cleaned by a Remote Plasma System (RPS) to remove the accumulated tungsten film, in the cleaning process, "high position cleaning" is firstly carried out, namely, the substrate rises to the high position, the first ring body is inserted with the second ring body to efficiently remove the tungsten film on the inner surface of the process chamber, and then, "low position cleaning" is carried out, namely, the substrate is lowered to the low position, the second ring body is overlapped on a step surface in the process chamber to be separated from the first ring body, and the tungsten film between the first ring body and the second ring body is removed.
However, in the "high cleaning" stage, the first ring body and the second ring body are bombarded by plasma, so that the temperatures of the first ring body and the second ring body are sharply increased, the positioning portion of the second ring body is heated to expand, the positioning groove of the first ring body is heated to contract, and mutual extrusion force is generated between the positioning portion and the positioning groove.
Disclosure of Invention
The invention aims to at least solve one of the technical problems in the prior art, and provides a process chamber of semiconductor process equipment and the semiconductor process equipment, which can avoid the damage of a baffle ring assembly, improve the use stability and safety of the process chamber and improve the stability and effect of a semiconductor process.
The invention provides a process chamber of semiconductor process equipment, which is provided with a bearing part for bearing a wafer, wherein a baffle ring assembly is arranged on the bearing part and is matched with the bearing part to form a purge air channel capable of guiding gas to the edge of the wafer, wherein,
keep off the ring subassembly and include first ring body, second ring body and buffering part, first ring body encircles the bearing part sets up, just first ring body with the clearance has between the bearing part, be provided with the constant head tank on the first ring body, the bottom of second ring body is provided with location portion, location portion with the separable grafting of constant head tank, the second ring body shelters from the clearance forms the air flue is blown, buffering part sets up location portion with between the relative surface of constant head tank, be used for right location portion with relative effort cushions between the constant head tank.
Optionally, the buffering component includes a first buffering member, and the first buffering member is disposed between the outer circumferential wall of the positioning portion and the inner circumferential wall of the positioning groove.
Optionally, the number of the first buffer members is multiple, and the first buffer members are distributed at intervals along the circumferential direction of the positioning portion.
Optionally, the number of the first buffer members is even, and the first buffer members are arranged in pairs.
Optionally, the radial dimensions of the positioning portion and the positioning groove are gradually reduced from top to bottom, the plurality of first buffer members are arranged in the positioning groove, and the distance between two oppositely arranged first buffer members is gradually reduced from top to bottom;
the radial size of the top end of the positioning part is larger than a first preset size of the distance between the top ends of the two first buffer parts which are oppositely arranged, and the radial size of the bottom end of the positioning part is larger than a second preset size of the distance between the bottom ends of the two first buffer parts which are oppositely arranged and is smaller than the distance between the top ends of the two first buffer parts which are oppositely arranged;
the size of the first buffer piece in the radial direction of the positioning groove is larger than the larger one of the first preset size and the second preset size.
Optionally, the value ranges of the first preset size and the second preset size are the same, and are both greater than 0mm and less than or equal to 2 mm.
Optionally, the buffering component further includes a second buffering member, and the second buffering member is disposed between the bottom surface of the positioning portion and the bottom surface of the positioning groove.
Optionally, the first and second bumpers each include a compression spring.
Optionally, the buffer member is bonded to an inner wall of the positioning groove.
The invention also provides semiconductor processing equipment comprising the processing chamber provided by the invention.
The invention has the following beneficial effects:
according to the process chamber of the semiconductor process equipment, the buffering component is arranged between the opposite surfaces of the positioning part and the positioning groove, so that when the positioning part expands due to heating and/or the positioning groove contracts due to heating to generate relative extrusion force between the positioning part and the positioning groove, the buffering component is used for buffering the relative action force between the positioning part and the positioning groove, the situation that the positioning part is clamped in the positioning groove due to the relative extrusion force between the positioning part and the positioning groove is avoided, the situation that the positioning part is broken in the positioning groove when the first ring body and the second ring body are separated is avoided, the damage of the retaining ring assembly is avoided, and the use stability and the safety of the process chamber are improved. And, if the tolerance between the positioning part and the positioning groove is only increased to avoid the situation that the positioning part is clamped in the positioning groove, which can cause the relative movement between the first ring body and the second ring body in the semiconductor process, and cause the change of the scavenging channel formed by the matching between the baffle ring assembly and the bearing part, and influence on the semiconductor process result, the process chamber of the semiconductor process equipment provided by the invention buffers the relative acting force between the positioning part and the positioning groove by the buffer part, which can not only avoid the situation that the positioning part is clamped in the positioning groove, but also can realize the tight splicing between the positioning part and the positioning groove, so as to reduce the distance that the first ring body and the second ring body generate the relative movement in the semiconductor process, reduce the change degree of the scavenging channel formed by the matching between the baffle ring assembly and the bearing part, and improve the use stability of the process chamber, and the stability and effect of the semiconductor process can be improved.
According to the semiconductor process equipment provided by the invention, the damage of the baffle ring assembly can be avoided by virtue of the process chamber of the semiconductor process equipment, the use stability and safety of the process chamber are improved, and the stability and effect of a semiconductor process can be improved.
Drawings
Fig. 1 is a schematic structural view of a process chamber of semiconductor processing equipment and the semiconductor processing equipment in a "high-position cleaning" state according to an embodiment of the present invention;
FIG. 2 is a schematic structural view of a process chamber of a semiconductor processing apparatus and the semiconductor processing apparatus in a "low-level cleaning" state according to an embodiment of the present invention;
fig. 3 is a schematic structural view illustrating a positioning portion of a process chamber of semiconductor processing equipment according to an embodiment of the present invention being plugged into a positioning groove;
fig. 4 is a schematic structural view illustrating a process chamber of a semiconductor processing apparatus according to an embodiment of the present invention when a positioning portion is separated from a positioning groove;
FIG. 5 is a schematic top view of a positioning groove for a resilient member of a process chamber of a semiconductor processing apparatus according to an embodiment of the present invention;
description of reference numerals:
1-a retainer ring assembly; 11-a first ring body; 111-a positioning slot; 12-a second ring; 121-a positioning section; 13-a cushioning component; 131-a first buffer; 132-a second buffer; 2-a purge gas path; 31-a top cover; 32-an upper ring body; 33-lower ring body; 34-a support structure; 35-an exhaust port; 4-a carrier member; 41-supporting protrusions; 42-bearing surface.
Detailed Description
In order to make those skilled in the art better understand the technical solution of the present invention, the process chamber of the semiconductor processing apparatus and the semiconductor processing apparatus provided by the present invention will be described in detail below with reference to the accompanying drawings.
As shown in fig. 1-2, the present embodiment provides a process chamber of a semiconductor processing apparatus, a carrier 4 for carrying a wafer is disposed in the process chamber, a baffle ring assembly 1 is disposed on the carrier 4, the baffle ring assembly 1 and the carrier 4 cooperate to form a purge gas channel 2 capable of guiding gas to the edge of the wafer, wherein, the baffle ring component 1 comprises a first ring body 11, a second ring body 12 and a buffer part 13, the first ring body 11 is arranged around the bearing part 4, and have the clearance between first ring body 11 and the carrier part 4, be provided with constant head tank 111 on the first ring body 11, the bottom of second ring body 12 is provided with location portion 121, the separable grafting of location portion 121 and constant head tank 111, second ring body 12 shelters from above-mentioned clearance, forms the purge air flue 2, and buffer unit 13 sets up between the relative surface of location portion 121 and constant head tank 111 for cushion the relative effort between location portion 121 and the constant head tank 111.
In the process chamber of semiconductor process equipment provided by the embodiment of the invention, the buffer component 13 is arranged between the surfaces of the positioning part 121 opposite to the positioning groove 111, so that when the positioning part 121 expands due to heating and/or the positioning groove 111 contracts due to heating, and a relative extrusion force is generated between the positioning part 121 and the positioning groove 111, the buffer component 13 is used for buffering the relative action force between the positioning part 121 and the positioning groove 111, the situation that the positioning part 121 is clamped in the positioning groove 111 due to the relative extrusion force between the positioning part 121 and the positioning groove 111 is avoided, the situation that the positioning part 121 is broken in the positioning groove 111 when the first ring body 11 is separated from the second ring body 12 is avoided, the damage of the retainer ring assembly 1 is avoided, and the use stability and the safety of the process chamber are improved. Moreover, if the tolerance between the positioning portion 121 and the positioning slot 111 is increased to avoid the situation that the positioning portion 121 is clamped in the positioning slot 111, which may cause the first ring body 11 and the second ring body 12 to move relatively in the semiconductor process, causing the change of the purge air channel 2 formed by the matching between the retainer ring assembly 1 and the carrier 4, and causing the influence on the semiconductor process result, the process chamber of the semiconductor process equipment provided by the embodiment of the invention buffers the relative acting force between the positioning portion 121 and the positioning slot 111 by the buffer component 13, which can not only avoid the situation that the positioning portion 121 is clamped in the positioning slot 111, but also can realize the tight insertion between the positioning portion 121 and the positioning slot 111, so as to reduce the distance that the first ring body 11 and the second ring body 12 move relatively in the semiconductor process, and reduce the degree that the purge air channel 2 formed by the matching between the retainer ring assembly 1 and the carrier 4 changes, therefore, the use stability of the process chamber is improved, and the stability and the effect of the semiconductor process can be improved.
As shown in fig. 1, when a semiconductor process such as a tungsten plug process is performed, a wafer supported by a supporting member 4 for supporting the wafer is raised to a high position, at this time, a first ring body 11 surrounds the supporting member 4 and has a gap with the supporting member 4, a positioning portion 121 at the bottom of a second ring body 12 is inserted into a positioning groove 111 of the first ring body 11 to position a relative position of the first ring body 11 and the second ring body 12 by the positioning portion 121 and the positioning groove 111, the second ring body 12 shields the gap between the first ring body 11 and the supporting member 4 and also shields an edge region of an upper surface of the supporting member 4, and a buffering member 13 is located between the positioning portion 121 and a surface of the positioning groove 111 opposite to each other. The clearance between the inner peripheral wall of the first ring body 11 and the outer peripheral wall of the bearing part 4 and the clearance between the annular lower surface of the second ring body 12 and the edge area of the upper surface of the bearing part 4 jointly form a purge gas channel 2 capable of guiding gas to the edge of the wafer, the gas firstly rises to the annular lower surface of the second ring body 12 along the clearance between the inner peripheral wall of the first ring body 11 and the outer peripheral wall of the bearing part 4 in the purge gas channel 2 and is blocked by the annular lower surface of the second ring body 12, and then flows to the edge of the upper surface of the bearing part 4 along the clearance between the annular lower surface of the second ring body 12 and the edge area of the upper surface of the bearing part 4, therefore, the process gas can flow to the edge of the wafer carried on the bearing part 4, so that the process gas in the semiconductor process such as tungsten plug process can not reach the annular edge of the wafer, and the thin layer is prevented from being deposited on the arc chamfer (also called as 'blank edge') of the annular edge of the wafer.
As shown in fig. 1, when a deposited film layer such as a tungsten film is accumulated to a certain thickness in a process chamber of a semiconductor process such as a tungsten plug process, and a remote plasma system is required to clean the process chamber to remove the accumulated deposited film layer, "high position cleaning" is performed first, that is, the bearing member 4 is raised to a high position, at this time, the first ring body 11 surrounds the bearing member 4 and has a gap with the bearing member 4, the positioning portion 121 at the bottom of the second ring body 12 is inserted into the positioning groove 111 of the first ring body 11, the second ring body 12 is shielded above the gap between the first ring body 11 and the bearing member 4, the buffer member 13 is located between the positioning portion 121 and the surface opposite to the positioning groove 111, and the purpose of "high position cleaning" is to efficiently remove the deposited film layer on the inner surface of the process chamber. As shown in fig. 2, after the "high-position cleaning", the "low-position cleaning" is performed, that is, the bearing part 4 is lowered to the low position, during the process of lowering the bearing part 4, the second ring body 12 is overlapped on the supporting structure 34 disposed in the process chamber, and the first ring body 11 is lowered along with the bearing part 4, so that the first ring body 11 is separated from the second ring body 12, and the purpose of the "low-position cleaning" is to remove the deposited film between the first ring body 11 and the second ring body 12.
As shown in fig. 1 and fig. 2, in a preferred embodiment of the present invention, the process chamber may include a top cover 31, an upper ring 32, a lower ring 33, and a bottom plate (not shown), wherein the lower ring 33 is disposed on the bottom plate, the upper ring 32 is disposed on the lower ring 33, the top cover 31 is disposed on the upper ring 32, a gas outlet 35 for exhausting the process gas is opened on the lower ring 33, the lower ring 33 protrudes toward the inside of the process chamber relative to the upper ring 32, a portion of the lower ring 33 protruding toward the inside of the process chamber relative to the upper ring 32 forms a support structure 34 capable of supporting the second ring 12, and the supporting member 4 is disposed on the bottom plate in a lifting manner. However, the structure of the process chamber is not limited thereto, and the supporting structure 34 may be formed in any manner, and for example, the supporting structure 34 capable of supporting the second ring body 12 may be separately provided on the upper ring body 32, the lower ring body 33, or in the process chamber.
As shown in fig. 1 and 2, in a preferred embodiment of the present invention, a supporting protrusion 41 may be disposed around the carrier 4, an upper surface of the supporting protrusion 41 is lower than a carrying surface 42 of the carrier 4 for carrying a wafer, and the first ring 11 may be disposed on the supporting protrusion 41, so that the retainer ring assembly 1 can be disposed on the carrier 4.
Alternatively, the carrier part 4 may comprise a base.
Optionally, the gas directed to the edge of the wafer may include an inert gas.
As shown in fig. 5, in a preferred embodiment of the present invention, a radial cross section of the positioning groove 111 may be circular, a radial cross section of the positioning portion 121 may be circular, the first ring body 11 may be provided with a plurality of positioning grooves 111, the plurality of positioning grooves 111 are circumferentially spaced apart along the first ring body 11, the bottom of the second ring body 12 may be provided with a plurality of positioning portions 121, the plurality of positioning portions 121 are circumferentially spaced apart along the second ring body 12, the plurality of positioning portions 121 and the plurality of positioning grooves 111 are detachably inserted in a one-to-one correspondence manner, so as to position a relative position between the first ring body 11 and the second ring body 12 by means of the plurality of positioning portions 121. However, the shape of the radial cross section of the positioning groove 111, the shape of the radial cross section of the positioning portion 121, the number of the positioning portions 121, and the number of the positioning grooves 111 are not limited to these, and for example, the radial cross section of the positioning groove 111 may be an ellipse, the radial cross section of the positioning portion 121 may be an ellipse, one positioning groove 111 may be provided on the first ring body 11, and one positioning portion 121 may be provided at the bottom of the second ring body 12.
As shown in fig. 3, 4 and 5, in a preferred embodiment of the present invention, the buffering member 13 may include a first buffering member 131, and the first buffering member 131 is disposed between an outer circumferential wall of the positioning portion 121 and an inner circumferential wall of the positioning groove 111.
With the help of the first cushion member 131, the positioning portion 121 can expand due to heating and/or the positioning groove 111 can contract due to heating, and when a relative extrusion force is generated between the outer peripheral wall of the positioning portion 121 and the inner peripheral wall of the positioning groove 111, the relative action force between the outer peripheral wall of the positioning portion 121 and the inner peripheral wall of the positioning groove 111 is buffered, thereby avoiding the situation that the positioning portion 121 is blocked in the positioning groove 111 due to the relative extrusion force between the outer peripheral wall of the positioning portion 121 and the inner peripheral wall of the positioning groove 111, and further avoiding the situation that the positioning portion 121 is broken in the positioning groove 111 when the first ring body 11 is separated from the second ring body 12, and further avoiding the damage of the retainer ring assembly 1, and improving the use stability and safety of the process chamber.
As shown in fig. 5, in a preferred embodiment of the present invention, the number of the first cushion members 131 is four, and four first cushion members 131 are spaced apart from each other along the circumferential direction of the positioning portion 121, but the number of the first cushion members 131 is not limited thereto, for example, the number of the first cushion members 131 may be two, three or more, and a plurality of the first cushion members 131 are spaced apart from each other along the circumferential direction of the positioning portion 121. Such design can increase the quantity that can receive the position of the buffering of first bolster 131 between the periphery wall of location portion 121 and the internal perisporium of constant head tank 111 to can further avoid leading to the circumstances of location portion 121 blocked in constant head tank 111 to take place owing to relative extrusion force between the periphery wall of location portion 121 and the internal perisporium of constant head tank 111, further avoid keeping off the damage of ring subassembly 1, improve process chamber's stability in use and security, and can improve semiconductor technology's stability and effect.
Optionally, the plurality of first buffers 131 are uniformly spaced along the circumferential direction of the positioning portion 121. The homogeneity that receives the buffering of first bolster 131 between the periphery wall that can improve location portion 121 and the internal perisporium of constant head tank 111 like this to also can further avoid leading to location portion 121 to be blocked the condition emergence in constant head tank 111 because relative extrusion force between the periphery wall of location portion 121 and the internal perisporium of constant head tank 111, further avoid keeping off the damage of ring subassembly 1, improve the stability in use and the security of process chamber, and can improve semiconductor technology's stability and effect.
In a preferred embodiment of the present invention, the number of the first buffer members 131 may be an even number, and the plurality of first buffer members 131 may be disposed opposite to each other. As shown in fig. 5, taking the number of the first cushion members 131 as four as an example, two first cushion members 131 of the four first cushion members 131 are disposed opposite to each other, and the other two first cushion members 131 of the four first cushion members 131 are disposed opposite to each other. However, the number of the first cushion members 131 is not limited to this, and for example, the number of the first cushion members 131 may be six, two first cushion members 131 of the six first cushion members 131 are disposed to face each other, the other two first cushion members 131 of the six first cushion members 131 are disposed to face each other, and the other two first cushion members 131 of the six first cushion members 131 are disposed to face each other.
By making the number of the first cushion members 131 even, and by arranging the plurality of first cushion members 131 in pairs, when the positioning portion 121 expands due to heat and/or the positioning groove 111 contracts due to heat, resulting in a relative extrusion force between the outer circumferential wall of the positioning portion 121 and the inner circumferential wall of the positioning groove 111, with the aid of the two first cushion members 131 arranged in pairs, the relative action force between the outer circumferential wall of the positioning portion 121 and the inner circumferential wall of the positioning groove 111 is buffered from the two opposite sides of the positioning portion 121, so as to improve the capability of buffering the relative action force between the outer circumferential wall of the positioning portion 121 and the inner circumferential wall of the positioning groove 111, further avoid the positioning portion 121 from being stuck in the positioning groove 111 due to the relative extrusion force between the outer circumferential wall of the positioning portion 121 and the inner circumferential wall of the positioning groove 111, further avoid the damage of the retainer ring assembly 1, and improve the use stability and safety of the process chamber, and the stability and effect of the semiconductor process can be improved.
As shown in fig. 3 to 5, in a preferred embodiment of the present invention, the radial dimensions of the positioning portion 121 and the positioning groove 111 may be gradually reduced from top to bottom, the plurality of first buffering members 131 may be disposed in the positioning groove 111, and the distance between the two first buffering members 131 disposed oppositely may be gradually reduced from top to bottom; the radial dimension of the top end of the positioning part 121 is greater than a first preset dimension of the distance between the top ends of the two oppositely arranged first buffering parts 131, and the radial dimension of the bottom end of the positioning part 121 is greater than a second preset dimension of the distance between the bottom ends of the two oppositely arranged first buffering parts 131 and is smaller than the distance between the top ends of the two oppositely arranged first buffering parts 131; the size of the first cushion 131 in the radial direction of the positioning groove 111 is larger than the larger one of the first predetermined size and the second predetermined size.
As shown in fig. 4, taking the radial dimension of the top end of the positioning portion 121 as a, the radial dimension of the bottom end as b, the distance between the top ends of the two oppositely disposed first cushion members 131 as d, the distance between the bottom ends as e, and the dimension of the first cushion member 131 in the radial direction of the positioning slot 111 as c as an example, the radial dimension of the top end of the positioning portion 121 is greater than the first predetermined dimension of the distance between the top ends of the two oppositely disposed first cushion members 131, that is, the dimension a is the distance d + the first predetermined dimension, the radial dimension of the bottom end of the positioning portion 121 is greater than the second predetermined dimension of the distance between the bottom ends of the two oppositely disposed first cushion members 131, and is less than the distance between the top ends of the two oppositely disposed first cushion members 131, that is the dimension b is the distance e + the second predetermined dimension, the dimension of the first cushion member 131 in the radial direction of the positioning slot 111 is greater than the larger one of the first predetermined dimension and the second predetermined dimension, that is, the dimension c is larger than the larger one of the first preset dimension and the second preset dimension.
Since the size of the first cushion 131 in the radial direction of the positioning groove 111 is larger than the larger one of the first and second preset sizes, therefore, with such a design, when the positioning portion 121 is inserted into the positioning groove 111, the first cushion member 131 disposed between the outer circumferential wall of the positioning portion 121 and the inner circumferential wall of the positioning groove 111 is always pressed by the relative pressing force between the outer circumferential wall of the positioning portion 121 and the inner circumferential wall of the positioning groove 111, so that the first cushion member 131 is always in a compressed state, thereby, the first cushion member 131 simultaneously generates a reaction force to the outer circumferential wall of the positioning portion 121 and the inner circumferential wall of the positioning groove 111, so as to prevent the positioning portion 121 from moving in the positioning groove 111 relative to the positioning groove 111, thereby improving the stability of the retainer ring assembly 1, further improving the use stability of the process chamber and improving the stability and effect of the semiconductor process.
In a preferred embodiment of the present invention, the first preset size and the second preset size may have the same value range, and both may be greater than 0mm and less than or equal to 2 mm.
Optionally, the first preset size and the second preset size may both be 1 mm. In this case, the dimension a is the pitch d +1mm, the dimension b is the pitch e +1mm, and the dimension c is greater than 1 mm.
As shown in fig. 3 and 4, in a preferred embodiment of the present invention, the buffering member 13 may further include a second buffering member 132, and the second buffering member 132 is disposed between the bottom surface of the positioning portion 121 and the bottom surface of the positioning groove 111.
With the help of the second cushion member 132, the positioning portion 121 can expand due to heating and/or the positioning groove 111 can contract due to heating, and when a relative extrusion force is generated between the bottom surface of the positioning portion 121 and the bottom surface of the positioning groove 111, the relative action force between the bottom surface of the positioning portion 121 and the bottom surface of the positioning groove 111 is buffered, so that the situation that the positioning portion 121 is clamped in the positioning groove 111 due to the relative extrusion force between the bottom surface of the positioning portion 121 and the bottom surface of the positioning groove 111 is avoided, thereby avoiding the situation that the positioning portion 121 is broken in the positioning groove 111 when the first ring body 11 is separated from the second ring body 12, further avoiding the damage of the baffle ring assembly 1, and improving the use stability and the safety of the process chamber.
In a preferred embodiment of the present invention, the first and second buffers 131 and 132 may each include a compression spring.
In a preferred embodiment of the present invention, the buffer member 13 may be adhered to the inner wall of the positioning groove 111. For example, the first ring body 11 may be made of a ceramic material, and the buffer member 13 may be bonded to the inner wall of the positioning groove 111 by a ceramic paste.
As another technical solution, as shown in fig. 1 and fig. 2, an embodiment of the present invention further provides a semiconductor processing apparatus including a process chamber according to an embodiment of the present invention.
According to the semiconductor process equipment provided by the embodiment of the invention, the damage of the baffle ring assembly 1 can be avoided by virtue of the process chamber of the semiconductor process equipment provided by the embodiment of the invention, the use stability and the safety of the process chamber are improved, and the stability and the effect of a semiconductor process can be improved.
In summary, the process chamber of the semiconductor process equipment and the semiconductor process equipment provided by the embodiment of the invention can avoid the damage of the baffle ring assembly 1, improve the use stability and safety of the process chamber, and improve the stability and effect of the semiconductor process.
It is to be understood that the above embodiments are merely exemplary embodiments that have been employed to illustrate the principles of the present invention, and that the present invention is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.
Claims (10)
1. A process chamber of semiconductor process equipment is characterized in that a bearing part for bearing a wafer is arranged in the process chamber, a baffle ring assembly is arranged on the bearing part, the baffle ring assembly and the bearing part are matched to form a purge gas channel capable of guiding gas to the edge of the wafer, wherein,
keep off the ring subassembly and include first ring body, second ring body and buffering part, first ring body encircles the bearing part sets up, just first ring body with the clearance has between the bearing part, be provided with the constant head tank on the first ring body, the bottom of second ring body is provided with location portion, location portion with the separable grafting of constant head tank, the second ring body shelters from the clearance forms the air flue is blown, buffering part sets up location portion with between the relative surface of constant head tank, be used for right location portion with relative effort cushions between the constant head tank.
2. The process chamber of claim 1, wherein the buffer member comprises a first buffer disposed between an outer peripheral wall of the positioning portion and an inner peripheral wall of the positioning slot.
3. The process chamber of claim 2, wherein the number of the first buffering members is plural, and the plural first buffering members are distributed at intervals along a circumferential direction of the positioning portion.
4. The processing chamber of claim 3, wherein the number of the first buffering members is an even number, and the first buffering members are arranged opposite to each other two by two.
5. The process chamber of claim 4, wherein the radial dimensions of the positioning portion and the positioning slot are gradually reduced from top to bottom, the plurality of first buffering members are disposed in the positioning slot, and the distance between two oppositely disposed first buffering members is gradually reduced from top to bottom;
the radial size of the top end of the positioning part is larger than a first preset size of the distance between the top ends of the two first buffer parts which are oppositely arranged, and the radial size of the bottom end of the positioning part is larger than a second preset size of the distance between the bottom ends of the two first buffer parts which are oppositely arranged and is smaller than the distance between the top ends of the two first buffer parts which are oppositely arranged;
the size of the first buffer piece in the radial direction of the positioning groove is larger than the larger one of the first preset size and the second preset size.
6. The process chamber of claim 5, wherein the first predetermined dimension and the second predetermined dimension have the same range, both being greater than 0mm and less than or equal to 2 mm.
7. The processing chamber of semiconductor processing equipment according to any one of claims 2 to 6, wherein the buffer member further comprises a second buffer member disposed between a bottom surface of the positioning portion and a bottom surface of the positioning groove.
8. The process chamber of claim 7, wherein the first and second buffers each comprise a compression spring.
9. The process chamber of semiconductor processing equipment according to any one of claims 1 to 6, wherein the buffer member is bonded to an inner wall of the positioning groove.
10. A semiconductor processing apparatus comprising the process chamber of any of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110481774.0A CN113241312A (en) | 2021-04-30 | 2021-04-30 | Process chamber of semiconductor process equipment and semiconductor process equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110481774.0A CN113241312A (en) | 2021-04-30 | 2021-04-30 | Process chamber of semiconductor process equipment and semiconductor process equipment |
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| CN113241312A true CN113241312A (en) | 2021-08-10 |
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| CN202110481774.0A Pending CN113241312A (en) | 2021-04-30 | 2021-04-30 | Process chamber of semiconductor process equipment and semiconductor process equipment |
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