CN113239537B - 一种扩散片合金块的高周波加热功率确定方法 - Google Patents
一种扩散片合金块的高周波加热功率确定方法 Download PDFInfo
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- CN113239537B CN113239537B CN202110511688.XA CN202110511688A CN113239537B CN 113239537 B CN113239537 B CN 113239537B CN 202110511688 A CN202110511688 A CN 202110511688A CN 113239537 B CN113239537 B CN 113239537B
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- 239000000956 alloy Substances 0.000 title claims abstract description 101
- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 101
- 238000009792 diffusion process Methods 0.000 title claims abstract description 53
- 238000010438 heat treatment Methods 0.000 title claims abstract description 41
- 238000000034 method Methods 0.000 title claims abstract description 29
- 238000005476 soldering Methods 0.000 claims abstract description 14
- 238000012937 correction Methods 0.000 claims abstract description 12
- 238000002474 experimental method Methods 0.000 claims abstract description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 11
- 229910052710 silicon Inorganic materials 0.000 claims description 11
- 239000010703 silicon Substances 0.000 claims description 11
- 238000004364 calculation method Methods 0.000 claims description 4
- 239000012535 impurity Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 239000004065 semiconductor Substances 0.000 abstract description 4
- 239000000463 material Substances 0.000 abstract description 2
- 238000005245 sintering Methods 0.000 description 6
- 235000012431 wafers Nutrition 0.000 description 6
- 238000003466 welding Methods 0.000 description 6
- 238000013461 design Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 230000007547 defect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000012356 Product development Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/20—Design optimisation, verification or simulation
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- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
- G06F17/10—Complex mathematical operations
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2111/00—Details relating to CAD techniques
- G06F2111/10—Numerical modelling
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2119/00—Details relating to the type or aim of the analysis or the optimisation
- G06F2119/08—Thermal analysis or thermal optimisation
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2119/00—Details relating to the type or aim of the analysis or the optimisation
- G06F2119/18—Manufacturability analysis or optimisation for manufacturability
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CN202110511688.XA CN113239537B (zh) | 2021-05-11 | 2021-05-11 | 一种扩散片合金块的高周波加热功率确定方法 |
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CN202110511688.XA CN113239537B (zh) | 2021-05-11 | 2021-05-11 | 一种扩散片合金块的高周波加热功率确定方法 |
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CN113239537B true CN113239537B (zh) | 2023-10-27 |
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Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005056731A (ja) * | 2003-08-06 | 2005-03-03 | Matsushita Electric Ind Co Ltd | 高周波加熱装置 |
TW200510474A (en) * | 2003-07-18 | 2005-03-16 | Oji Paper Co | Foamed sheet and method for manufacturing thereof |
WO2012095799A2 (en) * | 2011-01-12 | 2012-07-19 | Worgas Bruciatori S.R.L. | High perimeter stability burner |
CN103769764A (zh) * | 2014-01-25 | 2014-05-07 | 嘉兴斯达半导体股份有限公司 | 一种软钎焊的焊片和功率模块组装结构 |
CN106803744A (zh) * | 2015-11-25 | 2017-06-06 | 中国科学院上海微系统与信息技术研究所 | 微蒸发器、振荡器集成微蒸发器结构及其频率修正方法 |
CN108051472A (zh) * | 2017-12-05 | 2018-05-18 | 中国空气动力研究与发展中心计算空气动力研究所 | 一种材料高温热物性参数的快速测量方法 |
CN110434330A (zh) * | 2019-06-28 | 2019-11-12 | 上海电气集团股份有限公司 | 一种铺粉式增材制造目标金属材料的工艺参数开发方法 |
CN110502842A (zh) * | 2019-08-26 | 2019-11-26 | 阳光电源股份有限公司 | 功率半导体模块的热模型建模方法及其应用方法和装置 |
CN111725144A (zh) * | 2020-05-22 | 2020-09-29 | 上海交通大学 | 基于气液相变的高温电子封装基板材料器件及其制备方法 |
CN112271141A (zh) * | 2020-10-23 | 2021-01-26 | 浙江大学 | 一种双面散热功率半导体模块及制造方法 |
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2021
- 2021-05-11 CN CN202110511688.XA patent/CN113239537B/zh active Active
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200510474A (en) * | 2003-07-18 | 2005-03-16 | Oji Paper Co | Foamed sheet and method for manufacturing thereof |
JP2005056731A (ja) * | 2003-08-06 | 2005-03-03 | Matsushita Electric Ind Co Ltd | 高周波加熱装置 |
WO2012095799A2 (en) * | 2011-01-12 | 2012-07-19 | Worgas Bruciatori S.R.L. | High perimeter stability burner |
CN103769764A (zh) * | 2014-01-25 | 2014-05-07 | 嘉兴斯达半导体股份有限公司 | 一种软钎焊的焊片和功率模块组装结构 |
CN106803744A (zh) * | 2015-11-25 | 2017-06-06 | 中国科学院上海微系统与信息技术研究所 | 微蒸发器、振荡器集成微蒸发器结构及其频率修正方法 |
CN108051472A (zh) * | 2017-12-05 | 2018-05-18 | 中国空气动力研究与发展中心计算空气动力研究所 | 一种材料高温热物性参数的快速测量方法 |
CN110434330A (zh) * | 2019-06-28 | 2019-11-12 | 上海电气集团股份有限公司 | 一种铺粉式增材制造目标金属材料的工艺参数开发方法 |
CN110502842A (zh) * | 2019-08-26 | 2019-11-26 | 阳光电源股份有限公司 | 功率半导体模块的热模型建模方法及其应用方法和装置 |
CN111725144A (zh) * | 2020-05-22 | 2020-09-29 | 上海交通大学 | 基于气液相变的高温电子封装基板材料器件及其制备方法 |
CN112271141A (zh) * | 2020-10-23 | 2021-01-26 | 浙江大学 | 一种双面散热功率半导体模块及制造方法 |
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Effective date of registration: 20240515 Address after: 272499 Factory Building 5, Science and Technology Innovation Park, Wanzhang High speed Railway Industrial Park, Jiaxiang Economic Development Zone, Jiaxiang County, Jining City, Shandong Province Patentee after: Jining Ruixin Semiconductor Co.,Ltd. Country or region after: China Address before: 225008 phase III of Jiangyang Pioneer Park, pingshantang North Road, Hanjiang District, Yangzhou City, Jiangsu Province Patentee before: YANGZHOU YANGJIE ELECTRONIC TECHNOLOGY Co.,Ltd. Country or region before: China |