CN113238594B - TEC temperature automatic control circuit and electrical apparatus - Google Patents

TEC temperature automatic control circuit and electrical apparatus Download PDF

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Publication number
CN113238594B
CN113238594B CN202110517971.3A CN202110517971A CN113238594B CN 113238594 B CN113238594 B CN 113238594B CN 202110517971 A CN202110517971 A CN 202110517971A CN 113238594 B CN113238594 B CN 113238594B
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pin
voltage dividing
chip
dividing circuit
resistor
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CN113238594A (en
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程建民
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Shiqiang Xianjin Shenzhen Technology Co ltd
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Shiqiang Xianjin Shenzhen Technology Co ltd
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    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05DSYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00Control of temperature
    • G05D23/19Control of temperature characterised by the use of electric means
    • G05D23/20Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
    • G05D23/24Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature the sensing element having a resistance varying with temperature, e.g. a thermistor

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  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Control Of Temperature (AREA)

Abstract

The invention relates to a TEC temperature automatic control circuit and an electric appliance. The TEC temperature automatic control circuit comprises a double-path comparison chip, a direct current driving chip, a first voltage dividing circuit, a second voltage dividing circuit and a third voltage dividing circuit, wherein the third voltage dividing circuit comprises a thermistor, and the third voltage dividing circuit comprises a thermistor. The dual-path comparison chip and the direct current driving chip determine the working state of the TEC according to the voltages provided by the first voltage dividing circuit, the second voltage dividing circuit and the third voltage dividing circuit, and automatic control of refrigeration and heating is realized. The invention greatly simplifies the temperature control circuit, solves the application scenario that the temperature control cannot be performed because enough hardware resources cannot be provided, and ensures that the electronic element works in a reasonable temperature range.

Description

TEC temperature automatic control circuit and electrical apparatus
Technical Field
The invention relates to the field of temperature control, in particular to a TEC temperature automatic control circuit and an electric appliance.
Background
The electronic component can work normally only when working at a proper temperature, and the working state of the electronic component can be influenced by too high or too low temperature. In the prior art, a temperature control circuit based on a TEC (Thermo Electric Cooler, a semiconductor refrigerator) feeds back data through a temperature sensor, and a control MCU controls the TEC according to the temperature data to achieve a constant temperature effect, so that the complexity of the circuit is obviously increased, a plurality of temperature control applications cannot provide special MCU control resources, and automatic temperature control cannot be realized.
Disclosure of Invention
The invention aims to solve the technical problem of providing an automatic TEC temperature control circuit and an electric appliance aiming at the defects in the prior art.
The technical scheme adopted for solving the technical problems is as follows: constructing an automatic TEC temperature control circuit, which comprises a double-path comparison chip, a direct current driving chip, a first voltage dividing circuit, a second voltage dividing circuit and a third voltage dividing circuit, wherein the third voltage dividing circuit comprises a thermistor;
The pin 1 of the double-path comparison chip is connected with the pin 1 of the direct current driving chip, the pin 2 of the double-path comparison chip is connected with the voltage division output end of the first voltage division circuit, and the pin 3 of the double-path comparison chip is connected with the voltage division output end of the third voltage division circuit; the pin 4 of the two-way comparison chip is connected with the first end of the first voltage dividing circuit, and the second end of the first voltage dividing circuit is connected with the power supply end; the pin 4 of the two-way comparison chip is connected with the first end of the second voltage dividing circuit, and the second end of the second voltage dividing circuit is connected with the power supply end; the pin 5 of the two-way comparison chip is connected with the voltage division output end of the third voltage division circuit; the pin 6 of the two-way comparison chip is connected with the voltage division output end of the second voltage division circuit; the pin 7 of the two-way comparison chip is connected with the pin 2 of the direct current driving chip; the pin 8 of the two-way comparison chip is connected with a power supply end;
The pin 3 and the pin 4 of the direct current driving chip are connected with the first end of the third voltage dividing circuit, the first end of the third voltage dividing circuit is connected with a power supply end, and the second end of the third voltage dividing circuit is grounded; the pin 3 and the pin 4 of the direct current driving chip are connected with the pin 5 of the direct current driving chip; the pin 6 and the pin 7 of the direct current driving chip are respectively connected with two ends of the TEC, and the pin 8 of the direct current driving chip is grounded;
The output voltage of the voltage division output end of the first voltage division circuit is V2, the output voltage of the voltage division output end of the second voltage division circuit is V1, and the output voltage of the voltage division output end of the third voltage division circuit is VT, so that the control process of the TEC temperature automatic control circuit is as follows:
If VT is greater than V1 and greater than V2, the pin 7 of the double-path comparison chip outputs a low level, the pin 1 of the double-path comparison chip outputs a high level, the pin 6 of the direct current driving chip is a low level, the pin 7 of the direct current driving chip is a high level, and the TEC is heated;
If V1 is more than V2 is more than VT, the pin 7 of the double-path comparison chip outputs high level, the pin 1 of the double-path comparison chip outputs low level, the pin 6 of the direct current driving chip is high level, the pin 7 of the direct current driving chip is low level, and TEC is refrigeration;
If V1 is larger than VT and larger than V2, the pin 7 of the double-path comparison chip outputs a high level, the pin 1 of the double-path comparison chip outputs a high level, the pin 6 of the direct current driving chip is a low level, the pin 7 of the direct current driving chip is a low level, the TEC stops working, and the TEC does not refrigerate or heat.
Further, in the TEC temperature automatic control circuit of the present invention, the first voltage dividing circuit includes a resistor R4 and a resistor R5, the resistor R4 and the resistor R5 are connected in series, and a connection point between the resistor R4 and the resistor R5 is a voltage dividing output end of the first voltage dividing circuit.
Further, in the TEC temperature automatic control circuit according to the present invention, the second voltage dividing circuit includes a resistor R2 and a resistor R3, the resistor R2 and the resistor R3 are connected in series, and a connection point between the resistor R2 and the resistor R3 is a voltage dividing output end of the second voltage dividing circuit.
In the TEC temperature automatic control circuit of the present invention, the third voltage dividing circuit includes a resistor R1 and a thermistor, the resistor R1 and the thermistor are connected in series, and a connection point of the resistor R1 and the thermistor is a voltage dividing output end of the third voltage dividing circuit.
Further, in the TEC temperature automatic control circuit of the present invention, the thermistor is a negative temperature coefficient thermistor.
Further, in the TEC temperature automatic control circuit of the present invention, the model of the two-way comparison chip is SGM8770, and the model of the dc driving chip is AT8837.
In addition, the invention also provides an electric appliance which comprises the TEC temperature automatic control circuit. Alternatively, the appliance is a 5G communication base station.
The TEC temperature automatic control circuit and the electric appliance have the following beneficial effects: the invention greatly simplifies the temperature control circuit, solves the application scenario that the temperature control cannot be performed because enough hardware resources cannot be provided, and ensures that the electronic element works in a reasonable temperature range.
Drawings
The invention will be further described with reference to the accompanying drawings and examples, in which:
FIG. 1 is a schematic circuit diagram of a TEC temperature automatic control circuit according to an embodiment of the invention;
fig. 2 is a circuit diagram of a TEC temperature automatic control circuit according to an embodiment of the present invention.
Detailed Description
For a clearer understanding of technical features, objects and effects of the present invention, a detailed description of embodiments of the present invention will be made with reference to the accompanying drawings.
In a preferred embodiment, referring to fig. 1 and 2, the TEC temperature automatic control circuit of the present embodiment includes a dual comparison chip 10, a dc driving chip 20, a first voltage dividing circuit 30, a second voltage dividing circuit 40, and a third voltage dividing circuit 50, and the third voltage dividing circuit 50 includes a thermistor 501.
Pin 1 of the two-way comparison chip 10 is connected with pin 1 of the direct current driving chip 20, pin 2 of the two-way comparison chip 10 is connected with the voltage division output end of the first voltage division circuit 30, and pin 3 of the two-way comparison chip 10 is connected with the voltage division output end of the third voltage division circuit 50; the pin 4 of the two-way comparison chip 10 is connected with the first end of the first voltage dividing circuit 30, and the second end of the first voltage dividing circuit 30 is connected with the power supply end; the pin 4 of the two-way comparison chip 10 is connected with the first end of the second voltage dividing circuit 40, and the second end of the second voltage dividing circuit 40 is connected with the power supply end; pin 5 of the two-way comparison chip 10 is connected with the voltage division output end of the third voltage division circuit 50; the pin 6 of the two-way comparison chip 10 is connected with the voltage division output end of the second voltage division circuit 40; pin 7 of the two-way comparison chip 10 is connected with pin 2 of the direct current drive chip; pin 8 of the two-way comparison chip 10 is connected with the power supply end.
The pin 3 and the pin 4 of the direct current driving chip 20 are connected with the first end of the third voltage dividing circuit 50, the first end of the third voltage dividing circuit 50 is connected with the power supply end, and the second end of the third voltage dividing circuit 50 is grounded; pin 3 and pin 4 of the dc driver chip 20 are connected to pin 5 of the dc driver chip 20; the pin 6 and the pin 7 of the direct current driving chip 20 are respectively connected with two ends of the TEC, and the pin 8 of the direct current driving chip 20 is grounded.
The output voltage of the voltage division output end of the first voltage division circuit 30 is V2, the output voltage of the voltage division output end of the second voltage division circuit 40 is V1, and the output voltage of the voltage division output end of the third voltage division circuit 50 is VT, and then the control process of the TEC temperature automatic control circuit is as follows:
If VT > V1 > V2, the pin 7 of the dual-path comparison chip 10 outputs a low level, the pin 1 of the dual-path comparison chip 10 outputs a high level, the pin 6 of the DC driving chip 20 is a low level, and the pin 7 of the DC driving chip 20 is a high level. At this time, it is indicated that the temperature of the thermistor 501 is too low and the TEC is heating.
If V1 > V2 > VT, the pin 7 of the dual-path comparison chip 10 outputs a high level, the pin 1 of the dual-path comparison chip 10 outputs a low level, the pin 6 of the DC driving chip 20 is a high level, and the pin 7 of the DC driving chip 20 is a low level. At this time, it is indicated that the thermistor 501 detects an excessive temperature and the TEC is cooling.
If V1 > VT > V2, the pin 7 of the dual-path comparison chip 10 outputs a high level, the pin 1 of the dual-path comparison chip 10 outputs a high level, the pin 6 of the DC driving chip 20 is a low level, and the pin 7 of the DC driving chip 20 is a low level. At this time, it is indicated that the temperature detected by the thermistor 501 is within a reasonable range, and the TEC stops working, and neither cooling nor heating is performed.
The embodiment greatly simplifies the temperature control circuit, solves the problem of application scenes that the temperature control cannot be performed because enough hardware resources cannot be provided, and ensures that the electronic element works in a reasonable temperature range.
In the TEC temperature automatic control circuit of some embodiments, the first voltage dividing circuit 30 includes a resistor R4 and a resistor R5, where the resistor R4 and the resistor R5 are connected in series, and a connection point of the resistor R4 and the resistor R5 is a voltage dividing output terminal of the first voltage dividing circuit 30.
In the TEC temperature automatic control circuit of some embodiments, the second voltage dividing circuit 40 includes a resistor R2 and a resistor R3, where the resistor R2 and the resistor R3 are connected in series, and a connection point of the resistor R2 and the resistor R3 is a voltage dividing output terminal of the second voltage dividing circuit 40.
In the TEC automatic temperature control circuit of some embodiments, the third voltage dividing circuit 50 includes a resistor R1 and a thermistor 501, where the resistor R1 and the thermistor 501 are connected in series, and a connection point of the resistor R1 and the thermistor 501 is a voltage dividing output terminal of the third voltage dividing circuit 50. Alternatively, thermistor 501 is a negative temperature coefficient thermistor.
In the TEC temperature automatic control circuit of some embodiments, the model of the dual-path comparison chip 10 is SGM8770, and the model of the dc driving chip 20 is AT8837.
In a preferred embodiment, the appliance of this embodiment includes the TEC temperature automatic control circuit of the above-described embodiment. Alternatively, the appliance is a 5G communication base station.
In the present specification, each embodiment is described in a progressive manner, and each embodiment is mainly described in a different point from other embodiments, and identical and similar parts between the embodiments are all enough to refer to each other. For the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant points refer to the description of the method section.
Those of skill would further appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, computer software, or combinations of both, and that the various illustrative elements and steps are described above generally in terms of functionality in order to clearly illustrate the interchangeability of hardware and software. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the solution. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present invention.
The steps of a method or algorithm described in connection with the embodiments disclosed herein may be embodied directly in hardware, in a software module executed by a processor, or in a combination of the two. The software modules may be disposed in Random Access Memory (RAM), memory, read Only Memory (ROM), electrically programmable ROM, electrically erasable programmable ROM, registers, hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art.
The above embodiments are provided to illustrate the technical concept and features of the present invention and are intended to enable those skilled in the art to understand the content of the present invention and implement the same according to the content of the present invention, and not to limit the scope of the present invention. All equivalent changes and modifications made with the scope of the claims should be covered by the claims.

Claims (8)

1. The TEC temperature automatic control circuit is characterized by comprising a double-circuit comparison chip (10), a direct current driving chip (20), a first voltage dividing circuit (30), a second voltage dividing circuit (40) and a third voltage dividing circuit (50), wherein the third voltage dividing circuit (50) comprises a thermistor (501);
The pin 1 of the double-path comparison chip (10) is connected with the pin 1 of the direct current driving chip (20), the pin 2 of the double-path comparison chip (10) is connected with the voltage division output end of the first voltage division circuit (30), and the pin 3 of the double-path comparison chip (10) is connected with the voltage division output end of the third voltage division circuit (50); the pin 4 of the two-way comparison chip (10) is connected with the first end of the first voltage dividing circuit (30), and the second end of the first voltage dividing circuit (30) is connected with the power supply end; the pin 4 of the two-way comparison chip (10) is connected with the first end of the second voltage dividing circuit (40), and the second end of the second voltage dividing circuit (40) is connected with the power supply end; the pin 5 of the two-way comparison chip (10) is connected with the voltage division output end of the third voltage division circuit (50); the pin 6 of the two-way comparison chip (10) is connected with the voltage division output end of the second voltage division circuit (40); the pin 7 of the two-way comparison chip (10) is connected with the pin 2 of the direct current driving chip; the pin 8 of the two-way comparison chip (10) is connected with a power supply end;
The pin 3 and the pin 4 of the direct current driving chip (20) are connected with the first end of the third voltage dividing circuit (50), the first end of the third voltage dividing circuit (50) is connected with a power supply end, and the second end of the third voltage dividing circuit (50) is grounded; the pin 3 and the pin 4 of the direct current driving chip (20) are connected with the pin 5 of the direct current driving chip (20); the pin 6 and the pin 7 of the direct current driving chip (20) are respectively connected with two ends of the TEC, and the pin 8 of the direct current driving chip (20) is grounded;
The output voltage of the voltage division output end of the first voltage division circuit (30) is V2, the output voltage of the voltage division output end of the second voltage division circuit (40) is V1, the output voltage of the voltage division output end of the third voltage division circuit (50) is VT, and the control process of the TEC temperature automatic control circuit is as follows:
If VT is greater than V1 and greater than V2, the pin 7 of the double-path comparison chip (10) outputs a low level, the pin 1 of the double-path comparison chip (10) outputs a high level, the pin 6 of the direct current drive chip (20) is a low level, the pin 7 of the direct current drive chip (20) is a high level, and the TEC is heated;
If V1 is more than V2 is more than VT, the pin 7 of the double-path comparison chip (10) outputs a high level, the pin 1 of the double-path comparison chip (10) outputs a low level, the pin 6 of the direct current drive chip (20) is a high level, the pin 7 of the direct current drive chip (20) is a low level, and TEC is refrigeration;
If V1 is larger than VT and larger than V2, the pin 7 of the double-path comparison chip (10) outputs a high level, the pin 1 of the double-path comparison chip (10) outputs a high level, the pin 6 of the direct current driving chip (20) is a low level, the pin 7 of the direct current driving chip (20) is a low level, the TEC stops working, and the TEC does not refrigerate or heat.
2. The TEC temperature automatic control circuit according to claim 1, wherein the first voltage dividing circuit (30) comprises a resistor R4 and a resistor R5, the resistor R4 and the resistor R5 are connected in series, and a connection point of the resistor R4 and the resistor R5 is a voltage dividing output terminal of the first voltage dividing circuit (30).
3. The TEC temperature automatic control circuit according to claim 1, wherein the second voltage dividing circuit (40) includes a resistor R2 and a resistor R3, the resistor R2 and the resistor R3 are connected in series, and a connection point of the resistor R2 and the resistor R3 is a voltage dividing output terminal of the second voltage dividing circuit (40).
4. The TEC automatic temperature control circuit according to claim 1, wherein the third voltage dividing circuit (50) comprises a resistor R1 and a thermistor (501), the resistor R1 and the thermistor (501) are connected in series, and a connection point of the resistor R1 and the thermistor (501) is a voltage dividing output end of the third voltage dividing circuit (50).
5. The TEC temperature automatic control circuit according to claim 4, wherein the thermistor (501) is a negative temperature coefficient thermistor.
6. The TEC temperature automatic control circuit according to claim 1, wherein the two-way comparison chip (10) is of a type SGM8770 and the dc drive chip (20) is of a type AT8837.
7. An electrical appliance comprising the TEC temperature automatic control circuit as claimed in any one of claims 1 to 6.
8. The appliance of claim 7, wherein the appliance is a 5G communication base station.
CN202110517971.3A 2021-05-12 2021-05-12 TEC temperature automatic control circuit and electrical apparatus Active CN113238594B (en)

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CN105094173B (en) * 2015-09-16 2017-10-27 盐城工学院 A kind of temperature control system of semiconductor laser and its control method
CN206451976U (en) * 2017-02-08 2017-08-29 深圳市飞思卓科技有限公司 TEC controls circuit and TEC controllers
CN209803597U (en) * 2019-05-29 2019-12-17 惠州拓邦电气技术有限公司 Control circuit for improving detection precision of NTC thermistor and electronic equipment
CN111045466A (en) * 2019-12-04 2020-04-21 清华大学合肥公共安全研究院 Laser working temperature control circuit and control method thereof
CN111258351B (en) * 2020-03-17 2021-05-25 国开启科量子技术(北京)有限公司 Single photon detector TEC temperature control method and device

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