CN113234274A - 一种交联聚乙烯电缆料 - Google Patents
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- 239000000463 material Substances 0.000 title claims abstract description 24
- 229920003020 cross-linked polyethylene Polymers 0.000 title claims abstract description 14
- 239000004703 cross-linked polyethylene Substances 0.000 title claims abstract description 14
- 238000002156 mixing Methods 0.000 claims abstract description 26
- 239000004594 Masterbatch (MB) Substances 0.000 claims abstract description 16
- 238000001125 extrusion Methods 0.000 claims abstract description 10
- 229920001903 high density polyethylene Polymers 0.000 claims abstract description 10
- 239000004700 high-density polyethylene Substances 0.000 claims abstract description 10
- 239000003381 stabilizer Substances 0.000 claims abstract description 10
- 230000003197 catalytic effect Effects 0.000 claims abstract description 8
- 239000012744 reinforcing agent Substances 0.000 claims abstract description 8
- 239000003963 antioxidant agent Substances 0.000 claims abstract description 6
- 230000003078 antioxidant effect Effects 0.000 claims abstract description 6
- 238000004132 cross linking Methods 0.000 claims abstract description 6
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims abstract description 4
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 claims abstract description 4
- 238000009835 boiling Methods 0.000 claims abstract description 4
- 238000000748 compression moulding Methods 0.000 claims abstract description 4
- 239000003431 cross linking reagent Substances 0.000 claims abstract description 4
- 230000007062 hydrolysis Effects 0.000 claims abstract description 4
- 238000006460 hydrolysis reaction Methods 0.000 claims abstract description 4
- 238000002844 melting Methods 0.000 claims abstract description 4
- 230000008018 melting Effects 0.000 claims abstract description 4
- 238000009740 moulding (composite fabrication) Methods 0.000 claims abstract description 4
- 150000001282 organosilanes Chemical class 0.000 claims abstract description 4
- 229910000077 silane Inorganic materials 0.000 claims abstract description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229920000092 linear low density polyethylene Polymers 0.000 claims abstract 2
- 239000004707 linear low-density polyethylene Substances 0.000 claims abstract 2
- 238000002360 preparation method Methods 0.000 claims abstract 2
- 239000002994 raw material Substances 0.000 claims abstract 2
- 239000006229 carbon black Substances 0.000 claims description 2
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical group CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 claims description 2
- 239000004718 silane crosslinked polyethylene Substances 0.000 abstract description 5
- 239000004698 Polyethylene Substances 0.000 abstract description 4
- -1 polyethylene Polymers 0.000 abstract description 4
- 229920000573 polyethylene Polymers 0.000 abstract description 4
- 230000032683 aging Effects 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 230000007547 defect Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
- C08K13/02—Organic and inorganic ingredients
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- C—CHEMISTRY; METALLURGY
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5425—Silicon-containing compounds containing oxygen containing at least one C=C bond
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C08L2203/00—Applications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2207/00—Properties characterising the ingredient of the composition
- C08L2207/06—Properties of polyethylene
- C08L2207/062—HDPE
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Abstract
本发明属于聚乙烯电缆材料的技术领域，具体涉及一种交联聚乙烯电缆料。电缆料包括以下重量份的原料：高密度聚乙烯70‑90份；线性低密度聚乙烯10‑30份；硅烷交联剂5‑10份；抗氧剂1‑3份；稳定剂1‑3份；补强剂1‑3份；其制备方法包括以下步骤：(1)将高密度聚乙烯、有机硅烷、不同组份稳定剂在常温下进行混合，然后挤出、造粒，挤出温度为160℃‑215℃，得到可交联母料。(2)将高密度聚乙烯、补强剂、抗氧剂1010在常温下进行混合，然后挤出、造粒，挤出温度为160℃‑195℃，得到催化母料。(3)将可交联母料、催化母料，组份混合比例为95：5常温下混合，挤出、造粒，挤出温度为160℃‑215℃，熔融混炼出片，开炼温度160℃，模压成型，最后水煮交联，水解时间12h。本申请的交联聚乙烯电缆料可用于制作电缆，能改善硅烷交联聚乙烯电缆老化的问题。
Description
技术领域
本发明属于聚乙烯电缆材料的技术领域，具体涉及一种交联聚乙烯电缆料。
背景技术
随着现代科学技术的发展，人们对电线电缆的质量要求越来越高，硅烷交联聚乙烯的出现，弥补了普通聚乙烯电线电缆的不足。硅烷交联聚乙烯电缆料能提高线路的传输容量、过载能力，且该材料在制造交联电线电缆时，与过氧化物交联和辐照交联相比，具有所需制造设备简单，操作方便，综合成本低等优点，作为主要的低压电力电缆的绝缘材料。然而，目前所使用的硅烷交联聚乙烯电缆料的耐老化性能不佳，长时间使用后，容易老化导致电缆损毁，甚至发生危险。
发明内容
为了解决上述现有技术存在的不足和缺点，本发明首要目的在于提供一种交联聚乙烯电缆料。
本发明的目的通过下述技术方案来实现:
本发明属于聚乙烯电缆的材料领域，具体涉及一种交联聚乙烯电缆料。所述交联聚乙烯电缆料是包括以下步骤(1)将高密度聚乙烯、有机硅烷、不同组份稳定剂在常温下进行混合，然后挤出、造粒，挤出温度为160℃-215℃，得到可交联母料。(2)将高密度聚乙烯、补强剂、抗氧剂1010在常温下进行混合，然后挤出、造粒，挤出温度为160℃-195℃，得到催化母料。(3)将可交联母料、催化母料，组份混合比例为95：5常温下混合，挤出、造粒，挤出温度为160℃-215℃，熔融混炼出片，开炼温度160℃，模压成型，最后水煮交联，水解时间12h。
优选地，所述硅烷交联剂为乙烯基三乙氧基硅烷。
优选地，所述的抗氧剂为抗氧剂BHT。
优选地，所述的补强剂为炭黑。
优选地，所述的稳定剂为有机锡稳定剂。
与现有技术相比，本发明具有以下有益效果:
(1)具有良好的耐热性和耐寒性，化学稳定性好，还具有较高的刚性和韧性，机械强度好，不溶于任何有机溶剂，耐酸碱和各种盐类的腐蚀；
(2)具有良好的柔软性、延展性和电绝缘性，作为电缆外包材时，起到绝缘作用，且化学稳定性好，耐老化性能强，在长期使用时，不易老化；
具体实施方式
下面结合具体实施例进一步说明本发明的内容，但不应理解为对本发明的限制。
实施例1:
(1)将700g高密度聚乙烯、70g有机硅烷、30g稳定剂在常温下进行混合，然后挤出、造粒，挤出温度为160℃-215℃，得到可交联母料。
(2)将700g高密度聚乙烯、20g补强剂、20g抗氧剂1010在常温下进行混合，然后挤出、造粒，挤出温度为160℃-195℃，得到催化母料。
(3)将可交联母料、催化母料，组份混合比例为95：5常温下混合，挤出、造粒，挤出温度为160℃-215℃，熔融混炼出片，开炼温度160℃，模压成型，最后水煮交联，水解时间12h。
Claims (6)
1.一种交联聚乙烯电缆料，其特征在于，交联聚乙烯包括以下重量份的原料：
高密度聚乙烯70-90份；
线性低密度聚乙烯10-30份；
硅烷交联剂5-10份；
抗氧剂1-3份；
稳定剂1-3份；
补强剂1-3份；
2.根据权利要求1所述的交联聚乙烯电缆料，其特征在于，所述的硅烷交联剂为乙烯基三乙氧基硅烷。
3.根据权利要求1所述的交联聚乙烯电缆料，其特征在于，所述的抗氧剂为为抗氧剂BHT。
4.根据权利要求1所述的交联聚乙烯电缆料，其特征在于，所述稳定剂为有机锡稳定剂。
5.根据权利要求1所述的交联聚乙烯电缆料，其特征在于，所述补强剂为炭黑。
6.根据权利要求1所述的交联聚乙烯电缆料，其特征在于，制备方法包括以下步骤：(1)将高密度聚乙烯、有机硅烷、不同组份稳定剂在常温下进行混合，然后挤出、造粒，挤出温度为160℃-215℃，得到可交联母料。(2)将高密度聚乙烯、补强剂、抗氧剂1010在常温下进行混合，然后挤出、造粒，挤出温度为160℃-195℃，得到催化母料。(3)将可交联母料、催化母料，组份混合比例为95：5常温下混合，挤出、造粒，挤出温度为160℃-215℃，熔融混炼出片，开炼温度160℃，模压成型，最后水煮交联，水解时间12h。
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| CN113861543A (zh) * | 2021-10-18 | 2021-12-31 | 光惠（上海）激光科技有限公司 | 一种抗冲击绝缘光缆及其制备方法 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113861543A (zh) * | 2021-10-18 | 2021-12-31 | 光惠（上海）激光科技有限公司 | 一种抗冲击绝缘光缆及其制备方法 |
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